JPH0582603A - Probe card alignment - Google Patents

Abstract

PURPOSE:To control probe pressure, align a probe card in a short time and improve the reliability of measurement. CONSTITUTION:A CPU 7 calculates a judging range from the number of an inputted resistor, previously inputted target value of trimming data and an initial test limit. When the CPU 7 calculates the judging range, a probe switch 5 and a measuring equipment 6 are controlled and the resistances of the resistor are successively measured. The CPU 7 judges whether the measured resistance is within the judging range or not, and when it is judged not within the range, a probe card 1 is descended by a probe top limit driving device 9. When the measured resistance is judged within the judging range, the probe card 1 is descended by an over driven quantity to allow the appointed probe pressure using the probe vertically driving device 9 and the alignment is completed.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a probe card positioning method, and more particularly to a positioning method for adjusting the height of a probe card.

[0002]

2. Description of the Related Art Conventionally, as a method of positioning a probe card, measured values from all the probes of the probe card are C
A position where all the measured values of one block are empirically considered normal by displaying them on a display device such as RT and visually checking the displayed contents to lower the probe card every time one block is measured. There is a method in which all blocks of the substrate to be measured are measured and the final position is set when all measured values are normal.

There is also a method in which a probe for edge sensing is provided on the probe card separately from the probe for measuring, and stylus pressure is applied with the position at which the probe for edge sensing contacts the substrate to be measured as 0. Among the above methods, the former method is mainly used for thick film printed boards, and the latter method is mainly used for thin film substrates and wafers.

In such a conventional probe card positioning method, the needle pressure cannot be controlled in the former method, so that the life of the probe card can be shortened and the measurement reliability can be improved. There is a problem that you can not. Further, since it is necessary to check all the measured values of the substrate to be measured, there is a problem that it takes time to position the probe card.

In the case of the latter method, the probe card is provided with the edge sensing probe in addition to the measurement probe, so that there is a problem in that an extra cost is required for the edge sensing circuit. Further, if the height of the probe for measurement and the height of the probe for edge sensing are slightly different, there is a problem that the measurement of the substrate to be measured may not be possible in some cases.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to eliminate the above-mentioned problems of the prior art, and enables the probe needle pressure to be controlled, and the probe card to be positioned in a short time for measurement. It is an object of the present invention to provide a probe card positioning method capable of improving the reliability of the probe card.

[0007]

A probe card positioning method according to the present invention is a probe card positioning method having a plurality of probes provided in correspondence with measurement points of a substrate to be measured, the direction being orthogonal to the substrate to be measured. A moving means for moving the probe card, a switching means for switching the plurality of probes to select a probe to be measured, and a measurement for measuring a measurement point corresponding to the probe selected as the measuring object by the switching means. Means and a comparing means for comparing the measurement result of the measuring means with a preset predetermined value, and by moving the probe card by the moving means from the measurement result of the measuring means, the probe card and the measured object It is possible to recognize the contact with the substrate and measure the parallelism between the probe card and the substrate to be measured. When two or more preset probes of the plurality of probes are switched by the switching means, when the comparison results of the comparison means for all the measurement results obtained continuously in the measurement means are coincident with each other, It is characterized in that the distance between the plurality of probes and the measurement point is set to zero.

[0008]

An embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a block diagram showing an embodiment of the present invention. In the figure, when the probe 2 attached to the probe card 1 is brought into contact with the resistor (not shown) of the substrate 3 to be measured placed on the XY table 4, a signal from the probe 2 is transmitted to the probe switcher 5. Is input to the measuring device 6 via. The measuring device 6 samples the signal from the probe 2 to measure the resistance value of the resistor of the substrate 3 to be measured, and sends the measurement result to the CPU 7. The CPU 7 controls the laser light source (Nd: YAG laser) 10 and the scanning optical system 11 based on the measurement result of the measuring device 6, and cuts off a part of the resistor with the laser light 100, whereby the substrate 3 to be measured is cut. The resistance value of the resistor is adjusted to a desired resistance value.

Normally, the probes 2 of the probe card 1 are arranged so that the resistance values of all the resistors in one row can be measured simultaneously, and the resistors are trimmed while sequentially switching the numbers of the probes 2 by the probe selector 5. It is supposed to be done.

FIG. 2 is a diagram showing the substrate 3 to be measured in FIG. In the figure, a resistor 3a, and a high probe side electrode 3b and a low probe side electrode 3c connected to the resistor 3a are mounted on a substrate 3 to be measured. Numbers R1 to R10 are given to the resistors 3a, and they are arranged in a line on the substrate 3 to be measured.

FIG. 3 is a diagram showing an example of trimming data according to an embodiment of the present invention. In the drawing, the trimming data are high probe numbers 1, 3, 5, 7, 9, 11, 13, 15, 17, for each of the numbers R1 to R10 of the resistor 3a.
19 and raw probe numbers 2, 4, 6, 8, 10, 1
2,14,16,18,20 and target value (10KΩ)
And the upper limit value (+ 0.5%) of the initial test limit and the lower limit value (−50%) of the initial test limit.

FIG. 4 is a flowchart showing a processing procedure of a probe card positioning method according to an embodiment of the present invention. A processing procedure of the probe card positioning method according to the embodiment of the present invention will be described with reference to FIGS. Here, the height of the probe card 1 holding the probe 2 is such that all the high probe side electrodes 3b and the low probe side electrodes 3c corresponding to the numbers R1 to R10 of the resistor 3a have a specified needle pressure. It is the height to contact with.

First, the probe 2 is the high probe side electrode 3
In order to confirm that it is in contact with the electrode 3b and the electrode 3c on the row probe side, the number R1 of the preset resistor 3a,
Input R5 and R10 to the CPU 7 (step 2 in FIG. 4).
1). The number of the resistor 3a at this time needs to be set so that the parallelism between the probe card 1 and the substrate 3 to be measured can be confirmed. Therefore, the numbers of the resistors 3a are set so as not to be adjacent to each other. To do. However, when there are two resistors 3a and two locations are measured, or when the resistor 3a is three
This does not apply to the case of measuring 3 points for each piece.

The CPU 7 receives the number R of the input resistor 3a.
The judgment range is calculated from 1, R5, R10 and the target value of trimming data and the initial test limit as shown in FIG. In this case, the set resistor 3
The target value corresponding to the numbers a of R1, R5, and R10 is 1
Since 0 KΩ, the upper limit of the initial test limit is + 0.5%, and the lower limit of the initial test limit is −50%, the determination range is 10.05 KΩ ≧ R ≧ 5 KΩ.

When the CPU 7 calculates the judgment range, it controls the probe switching device 5 and the measuring device 6 so that the numbers R1, R5,
The resistance value of the resistor 3a of R10 is sequentially measured (FIG. 4, step 22). The CPU 7 determines whether or not the measured resistance value is within the determination range (step 23 in FIG. 4).

When the CPU 7 determines that the measured resistance value is not within the determination range, it controls the probe controller 8 to drive the probe vertical drive device 9, and the probe vertical drive device 9 lowers the probe card 1 (FIG. 4). Step 24). After this, the CPU 7 again controls the probe switching device 5 and the measuring device 6 to sequentially measure the resistance values of the resistors 3a having the numbers R1, R5 and R10 (step 2 in FIG. 4).
2). The above operation is repeated until the measured resistance value falls within the judgment range.

On the other hand, when the CPU 7 determines that the measured resistance value is within the determination range, the probe vertical drive device 9 lowers the probe card 1 by the amount of overdrive corresponding to the designated stylus pressure, and finishes the positioning (FIG. 4 step 25).

Here, when there is little variation in the height of the probe 2 of the probe card 1, the resistance value 3a to be selected is selected.
2 is sufficient, but it seems that the probe card 1 itself is held diagonally, or the probes 2 at both ends are low and become higher toward the center like the probe card 1 that has been used up. In such a case, the resistance values 3a corresponding to the three positions at both ends and the center of the probe card 1
By selecting the number of, it becomes possible to position at a height at which all the probes 2 come into contact with each other.

In this way, the probe card 1 is gradually lowered while measuring at least two points on the substrate 3 to be measured, and the position where those measured values fall within the preset judgment range is set as the reference position. By applying the necessary stylus pressure from there to position the probe card 1, it is possible to manage the stylus pressure without the conventional edge sensing probe or circuit. Therefore, the life of the probe card 1 can be extended and positioning can be completed in a short time.

Further, even if the height of the probe 2 of the probe card 1 varies, the measurement can be performed with high reliability by selecting the measurement point according to the variation.

Although the positioning of the probe card 1 used in the trimming device has been described in the embodiment of the present invention, it is obvious that the invention can be applied to the case where the probe card 1 is used in another device, and the present invention is not limited to this. ..

[0023]

As described above, according to the present invention, it is possible to measure the parallelism between the probe card and the substrate to be measured so that the measurement points corresponding to the two or more probes selected as the measurement object can be measured. By setting the distance between the multiple probes and the measurement point to be zero when all the measurement results match the preset predetermined value, it is possible to manage the probe needle pressure, and the probe can be used in a short time. There is an effect that the card can be positioned and the reliability of measurement can be improved.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an embodiment of the present invention.

FIG. 2 is a diagram showing the substrate to be measured of FIG.

FIG. 3 is a diagram showing an example of trimming data according to an embodiment of the present invention.

FIG. 4 is a flowchart showing a processing procedure of a probe card positioning method according to an embodiment of the present invention.

[Explanation of symbols]

 1 probe card 2 probe 3 substrate to be measured 3a resistor 5 probe switching device 6 measuring device 7 CPU 8 probe controller 9 probe vertical drive device

Claims (1)

[Claims] 1. A positioning method of a probe card having a plurality of probes provided corresponding to measurement points on a substrate to be measured, comprising a moving means for moving the probe card in a direction orthogonal to the substrate to be measured. Switching means for switching the plurality of probes to select a probe to be measured, measuring means for measuring a measurement point corresponding to the probe selected as the measuring object by the switching means, and a measurement result of the measuring means. Provided with a comparing means for comparing with a predetermined value set in advance, it is recognized from the measurement result of the measuring means that the probe card and the substrate to be measured are contacted by the movement of the probe card by the moving means, And two preset ones of the plurality of probes so that the parallelism between the probe card and the substrate to be measured can be measured. The distance between the plurality of probes and the measurement location is zero when the comparison results of all the measurement results continuously obtained by the measuring means by switching the above probes by the switching means match. A positioning method characterized in that the positioning is performed.