JPH05833B2 - - Google Patents

Info

Publication number
JPH05833B2
JPH05833B2 JP62122464A JP12246487A JPH05833B2 JP H05833 B2 JPH05833 B2 JP H05833B2 JP 62122464 A JP62122464 A JP 62122464A JP 12246487 A JP12246487 A JP 12246487A JP H05833 B2 JPH05833 B2 JP H05833B2
Authority
JP
Japan
Prior art keywords
circuit
wiring member
circuit wiring
manufacturing
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62122464A
Other languages
Japanese (ja)
Other versions
JPS63289784A (en
Inventor
Naoshi Kato
Nobuhito Nakazato
Juichi Nishama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Cable Industries Ltd
Original Assignee
Ryosei Electro Circuit Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ryosei Electro Circuit Systems Ltd filed Critical Ryosei Electro Circuit Systems Ltd
Priority to JP62122464A priority Critical patent/JPS63289784A/en
Publication of JPS63289784A publication Critical patent/JPS63289784A/en
Publication of JPH05833B2 publication Critical patent/JPH05833B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、例えば自動車用ジヨイントボツクス
等に使用する回路配線部材の製造方法に関するも
のである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method of manufacturing a circuit wiring member used, for example, in a joint box for an automobile.

[従来の技術] 従来、自動車用ジヨイントボツクスに使用され
ている回路配線部材は、例えば第4図、第5図に
示すように銅又は黄銅板から成る金属板体1をプ
レスによる打ち抜き・曲げ加工を施して、ブスバ
ー2とタブ端子3を形成している場合が殆どであ
る。この場合の回路配線部材は平板状の金属板体
1から回路を構築しているので、多くの端子を所
定空間内に如何に効率的に収納するかの設計に多
くの時間を費やすことになる。
[Prior Art] Circuit wiring members conventionally used in joint boxes for automobiles are produced by punching and bending a metal plate 1 made of copper or brass using a press, as shown in FIGS. 4 and 5, for example. In most cases, the bus bar 2 and tab terminal 3 are formed by processing. In this case, since the circuit wiring member is constructed from a flat metal plate 1, a lot of time is spent designing how to efficiently accommodate many terminals within a given space. .

しかしながら、その設計によつても端子3の配
列には限度があり、例えばブスバー2を挟んで同
じ個所に上下対称にタブ端子を配置することはで
きない。従つて、高密度に配列した端子3の実現
は困難であり、或る程度の容積が犠牲になること
は避けられない。そして、第5図に示すようにこ
の場合の材料取りの歩留まりは悪く、多くの場合
は50〜70%が抜きかすとなりスクラツプとなる。
更には、曲げ加工を行うための曲げ加工用プレス
金型が不可欠となる。
However, there is a limit to the arrangement of the terminals 3 due to the design, and for example, it is not possible to arrange the tab terminals vertically symmetrically at the same location with the bus bar 2 in between. Therefore, it is difficult to realize terminals 3 that are arranged in high density, and it is inevitable that a certain amount of volume will be sacrificed. As shown in FIG. 5, the material removal yield in this case is poor, and in many cases, 50 to 70% of the material becomes scrap.
Furthermore, a press die for bending is indispensable.

[発明の目的] 本発明の目的は、上述の欠点を解消し、複雑な
回路を簡便な工程により製造することができる回
路配線部材の製造方法を提供することにある。
[Object of the Invention] An object of the present invention is to provide a method for manufacturing a circuit wiring member that eliminates the above-mentioned drawbacks and can manufacture a complicated circuit through a simple process.

[発明の概要] 上述の目的を達成するための本発明の要旨は、
必要個所にタブ端子を植立した平板状の基板を鋳
造手段により形成する第1の工程と、該基板の所
定個所を打ち抜いて回路を形成する第2の工程と
から成ることを特徴とする回路配線部材の製造方
法である。
[Summary of the invention] The gist of the present invention for achieving the above object is as follows:
A circuit characterized by comprising a first step of forming a flat board with tab terminals planted in necessary locations by casting means, and a second step of punching out predetermined locations of the board to form a circuit. This is a method for manufacturing a wiring member.

[発明の実施例] 本発明に係る方法を第1図〜第3図に図示の実
施例に基づいて詳細に説明する。
[Embodiments of the Invention] The method according to the present invention will be explained in detail based on the embodiments illustrated in FIGS. 1 to 3.

第1図は亜鉛合金又はアルミ合金等を材料とし
た鋳造手段による第1の工程で製造された基板1
1の斜視図であり、平面状の基板11から例えば
上方及び下方にそれぞれ複数個のタブ端子12が
突出されている。
Figure 1 shows a substrate 1 manufactured in the first step by casting means made of zinc alloy, aluminum alloy, etc.
1, in which a plurality of tab terminals 12 protrude upward and downward from a planar substrate 11, respectively.

このように第1の工程により製造した基板11
に対し、第2の工程においてプレス金型を用い
て、第2図に示すように不要個所を打ち抜くと、
所定の回路構成とした回路配線部材13が得られ
る。また、この第2の工程によつて第1の工程で
発生したバリを同時に除去することができる。
The substrate 11 manufactured by the first step in this way
On the other hand, if a press mold is used in the second step to punch out unnecessary parts as shown in Figure 2,
A circuit wiring member 13 having a predetermined circuit configuration is obtained. Moreover, the burrs generated in the first step can be removed at the same time by this second step.

第3図は他の回路構成であり、第1、第2の工
程により製造した回路配線部材13′の斜視図で
ある。
FIG. 3 shows another circuit configuration, and is a perspective view of a circuit wiring member 13' manufactured by the first and second steps.

なお、この第3図に示す回路配線部材13′は、
第4図に示す従来例と回路的には同じ構成であ
り、タブ端子12の大きさも同じ倍率で図示して
いるが、全体的には回路配線部材13′が必要と
する周囲空間を含めた容積は約60%に縮少されて
いる。
Note that the circuit wiring member 13' shown in FIG.
The circuit configuration is the same as the conventional example shown in FIG. The volume has been reduced by approximately 60%.

また、他の形状の場合であつても、概して30〜
40%程度その容積を小さくすることができる。鋳
造は溶融した金属を金型等に流し込むものである
から、その過程で生ずるスプールやランナが発生
し、第2の工程で生ずる打ち抜き部分はスクラツ
プとなるが、従来例よりもスクラツプが発生する
率は少ない。なお、これらのスプール、ランナ、
スクラツプはリサイクルで鋳造時に有効利用がで
きる。
Also, even in the case of other shapes, generally 30~
Its volume can be reduced by about 40%. Casting involves pouring molten metal into a mold, etc., so spools and runners are generated in the process, and the punched parts generated in the second process become scrap, but the rate of scrap generation is lower than in conventional methods. There are few. In addition, these spools, runners,
Scrap can be recycled and effectively used in casting.

なお、第2の工程で打ち抜く部分のうち、大き
な打ち抜き部分は予め第1の工程において切欠部
として形成しておいてもよい。
Note that among the parts to be punched out in the second step, a large punched part may be previously formed as a notch in the first step.

[発明の効果] 以上説明した本発明に係る回路配線部材の製造
方法は、従来のプレスによる打ち抜き方法に比べ
て回路設計が容易であり、曲げ代を殆ど必要とせ
ず、多数のタブ端子を高密度に配列することがで
き、更には従来の回路配線部材に比べて小形化す
ることができる。更に、回路変更があつても基板
をそのまま使用し、打ち抜き用プレス金型だけを
変更して対処することができる。また、回路部ま
でを鋳造手段により成型する場合に比較して、回
路の末端までも金属材料が均等に行き渡り、機械
的及び電気的な特性が良好となる。
[Effects of the Invention] The method for manufacturing a circuit wiring member according to the present invention described above allows easier circuit design than the conventional punching method using a press, requires almost no bending allowance, and allows a large number of tab terminals to be formed at high heights. They can be arranged densely, and furthermore, they can be made smaller than conventional circuit wiring members. Furthermore, even if the circuit needs to be changed, the circuit board can be used as is and only the punching press die can be changed. Furthermore, compared to the case where the circuit portion is molded by casting means, the metal material is evenly distributed even to the ends of the circuit, resulting in better mechanical and electrical characteristics.

【図面の簡単な説明】[Brief explanation of the drawing]

図面第1図〜第3図は本発明に係る回路配線部
材の製造方法により製造した部材の実施例であ
り、第1図は第1の工程による基板の斜視図、第
2図は第2の工程による回路配線部材の斜視図、
第3図は他の実施例による回路配線部材の斜視図
であり、第4図は従来の回路配線部材の斜視図、
第5図はその材料取りの説明図である。 符号11は基板、12はタブ端子、13,1
3′は回路配線部材である。
Drawings 1 to 3 show examples of members manufactured by the method for manufacturing circuit wiring members according to the present invention. A perspective view of a circuit wiring member according to the process,
FIG. 3 is a perspective view of a circuit wiring member according to another embodiment, and FIG. 4 is a perspective view of a conventional circuit wiring member.
FIG. 5 is an explanatory diagram of the material removal process. Reference numeral 11 is a board, 12 is a tab terminal, 13,1
3' is a circuit wiring member.

Claims (1)

【特許請求の範囲】 1 必要個所にタブ端子を植立した平板状の基板
を鋳造手段により形成する第1の工程と、該基板
の所定個所を打ち抜いて回路を形成する第2の工
程とから成ることを特徴とする回路配線部材の製
造方法。 2 前記第1の工程において、前記基板の一部に
切欠部を設けるようにした特許請求の範囲第1項
に記載の回路配線部材の製造方法。
[Claims] 1. A first step of forming a flat board with tab terminals planted in necessary locations by casting means, and a second step of punching out predetermined locations of the board to form a circuit. A method of manufacturing a circuit wiring member, characterized in that: 2. The method of manufacturing a circuit wiring member according to claim 1, wherein in the first step, a notch is provided in a part of the substrate.
JP62122464A 1987-05-21 1987-05-21 Manufacture of circuit wiring member Granted JPS63289784A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62122464A JPS63289784A (en) 1987-05-21 1987-05-21 Manufacture of circuit wiring member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62122464A JPS63289784A (en) 1987-05-21 1987-05-21 Manufacture of circuit wiring member

Publications (2)

Publication Number Publication Date
JPS63289784A JPS63289784A (en) 1988-11-28
JPH05833B2 true JPH05833B2 (en) 1993-01-06

Family

ID=14836503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62122464A Granted JPS63289784A (en) 1987-05-21 1987-05-21 Manufacture of circuit wiring member

Country Status (1)

Country Link
JP (1) JPS63289784A (en)

Also Published As

Publication number Publication date
JPS63289784A (en) 1988-11-28

Similar Documents

Publication Publication Date Title
US6748651B2 (en) Method of manufacturing a bus-bar wiring board to reduce the amount of waste
JPH05833B2 (en)
JPH0348638B2 (en)
JPH06283338A (en) Inductance parts and their manufacture
EP1016173A1 (en) Process for producing a flat connector comb which can be moulded into an enclosure
JPH05198225A (en) Method for manufacturing circuit wiring member
JP2681562B2 (en) Terminal structure and its manufacturing method
JPS5910898Y2 (en) Assembly type busbar circuit
JPH0348640B2 (en)
JPS63175359A (en) Joint box for wiring
JPH0348639B2 (en)
JP2684247B2 (en) Lead frame manufacturing method
JPH08215774A (en) Punching method, and method of manufacturing current circuit conductor using the above-mentioned processing method
JPH0236502A (en) Molded coil and manufacture thereof
JPH0228963A (en) Mold for cutting and shaping semiconductor
JP2605822Y2 (en) Connector structure
JP4999492B2 (en) Manufacturing method of lead frame for semiconductor device and semiconductor device using the same
JPH0774301A (en) Narrow-pitch lead frame manufacturing method
JP2005278286A (en) Method of manufacturing junction box for automobile and junction box for automobile manufactured by method
JP2714002B2 (en) Method for manufacturing resin-encapsulated semiconductor device
JPH03110858A (en) Lead frame
JP2563611Y2 (en) Pin jack unit
JP2001015664A (en) Machining method of lead frame
JPH04184966A (en) Lead frame of semiconductor device
JPH05292629A (en) Electrical joint box

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees