JPH0583581B2 - - Google Patents

Info

Publication number
JPH0583581B2
JPH0583581B2 JP2132643A JP13264390A JPH0583581B2 JP H0583581 B2 JPH0583581 B2 JP H0583581B2 JP 2132643 A JP2132643 A JP 2132643A JP 13264390 A JP13264390 A JP 13264390A JP H0583581 B2 JPH0583581 B2 JP H0583581B2
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
laser
copper oxalate
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2132643A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0428758A (ja
Inventor
Shoji Sasai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Sumitomo Durez Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Sumitomo Durez Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd, Sumitomo Durez Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2132643A priority Critical patent/JPH0428758A/ja
Publication of JPH0428758A publication Critical patent/JPH0428758A/ja
Publication of JPH0583581B2 publication Critical patent/JPH0583581B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2132643A 1990-05-24 1990-05-24 レーザー印字に適したエポキシ樹脂組成物 Granted JPH0428758A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2132643A JPH0428758A (ja) 1990-05-24 1990-05-24 レーザー印字に適したエポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2132643A JPH0428758A (ja) 1990-05-24 1990-05-24 レーザー印字に適したエポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPH0428758A JPH0428758A (ja) 1992-01-31
JPH0583581B2 true JPH0583581B2 (fr) 1993-11-26

Family

ID=15086123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2132643A Granted JPH0428758A (ja) 1990-05-24 1990-05-24 レーザー印字に適したエポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPH0428758A (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006191724A (ja) * 2005-01-05 2006-07-20 Tokyo Micro:Kk 小型ステッピングモータ及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8204604A (nl) * 1982-11-26 1984-06-18 Wavin Bv Kunststofmateriaal.
JPS63239059A (ja) * 1986-11-14 1988-10-05 Mitsubishi Electric Corp レ−ザマ−キング方法
JPS63179921A (ja) * 1987-01-21 1988-07-23 Toshiba Corp 封止用樹脂組成物およびそれを用いた樹脂封止型半導体装置
JP2734087B2 (ja) * 1988-05-31 1998-03-30 大日本インキ化学工業株式会社 レーザーマーキング方法およびレーザーマーキング用樹脂組成物
JPH0211438A (ja) * 1988-06-27 1990-01-16 Clarion Co Ltd 車外情報読取装置
JPH0618987B2 (ja) * 1989-07-20 1994-03-16 住友ベークライト株式会社 レーザー印字用エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPH0428758A (ja) 1992-01-31

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees