JPH0585624A - Separation method for stacked electronic-parts trays - Google Patents

Abstract

PURPOSE:To reliably separate from a next stage tray the uppermost stage empty tray among the stacked trays for electronic parts. CONSTITUTION:Of the trays 2, 2',...2'' stacked each with a large number of electronic parts such as IC 1 being received therein, the uppermost stage tray 2 has its internal parts taken out. When, thereafter, the empty tray 2 is sequentially moved by a transfer means such as an attraction head 14, a high pressure air is supplied between the empty tray 2 and the next stage tray 2'.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for separating stack trays for electronic parts used in IC handlers and the like.

[0002]

2. Description of the Related Art Mass-produced ICs in a factory are subjected to an aging test in order to maintain a certain quality and sorted into good products and defective products. To be inspected.

As shown in FIG. 2, the IC handler includes a tray 2 for accommodating a large number of ICs 1, a vacuum type supply head 3, an IC carrying walking beam 4, a preheating heater 5, a hand 6, a pusher 7, and a hand 8. Equipped with a walking beam 9 and a vacuum-type storage head 10,
A socket 12 is arranged below the pusher 7 and on the base 11. As shown in FIG. 3, the trays 2 are stacked on the carrier 13 with the IC 1 housed therein, and the empty trays are once sent to the intermediate carrier 15 by the vacuum suction head 14. Then, they are sequentially stacked on the right carrier 17 by the suction head 16.

Therefore, each IC in the tray 2 at the left position in FIG.
Is first placed on the walking beam 4 in rows of five by the supply head 3, fed one pitch at a time in the direction of the arrow, and preheated by the preheater 5 on the way. When these ICs reach the end of the walking beam 4, they are sent to the socket 12 one by one by the hand 6.

Subsequently, when the pusher 7 above the socket descends to press the IC 1 against the socket 12, the terminals of the IC are connected to the contacts in the socket, and the IC data is measured by a predetermined tester (not shown). It If the IC is judged to be non-defective in this inspection, the walking beam 9 with the hand 8
It is placed on the top and is conveyed by the beam in the direction of the arrow by one pitch. Further, the IC judged to be defective is discharged in the direction of the dotted arrow in FIG.

[0006]

However, in recent IC handlers, since the resin tray 2 is considerably thin, the trays may be distorted and meshed with each other.
The suction force of the suction head 14 has a drawback that the upper tray 2 cannot be peeled off. Since the tray 2 merely accommodates the IC, if the wall thickness is increased or a rigid material is used, the cost becomes considerably high, and if the tray 2 is formed thick, it can be stacked on the carriers 13 and 17. The number also decreases.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a method for separating a stack tray for electronic parts, which can surely separate an empty uppermost tray.

[0008]

In order to achieve the above object, in the separating method of the present invention, after the parts in the uppermost tray among the trays stacked with a large number of ICs and the like stored therein are extracted. When the empty trays are sequentially moved by the transport means such as the suction head, high-pressure air is supplied between the empty trays and the next tray.

[0009]

When the above-mentioned high-pressure air is supplied between the trays, the empty tray at the uppermost stage is light, so even if it is bite with the tray at the next stage, it is easily separated by this air. Moves an empty tray to the next position.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a sectional view showing a tray separating method of the present invention. Each of the trays 2, 2 ', 2 "is made of thin resin in a frame shape, and has partitions 2b equidistant from the high peripheral edge 2a.
And are stacked on the carrier 13. A large number of ICs 1 are placed on the trays 2 ′ and 2 ″, and the ICs on the tray 2 have already been extracted and emptied for inspection.

A high-pressure air nozzle 18 is arranged between the tray 2 and the tray 2 ', and a normally closed electromagnetic valve SV is provided in each of the nozzles 18 and is opened only when a predetermined signal is sent. It is supposed to do. Although there are two nozzles 18 in the figure, they are actually installed at the four corners of the tray 2 so that the air pressure acts evenly.

A vacuum type suction head 14 stands by above the tray 2, and the head 14 can be moved vertically and horizontally by an air cylinder or the like. Further, the suction head 14 has a bifurcated shape in the direction orthogonal to the drawing, and the suction surface does not contact the partition of the tray 2, and the tray 2 can be sucked in a well-balanced manner.

In the vicinity of the suction head 14, three sensors S are provided at locations corresponding to the positions L ₁ , L ₂ and L ₃ at the lower end of the head.
₁ , S ₂ , S ₃ are installed, and the protrusion 14a is provided at a position corresponding to these on the head 14. The sensor S ₁ is
When the head 14 reaches the position of L ₁ , this is detected and an open signal is sent to the solenoid valve SV of the nozzle 18. The sensor S ₂ detects when the head 14 reaches the upper surface L ₂ of the tray, and sends a signal to the air circuit on the head side to cause the head 14 to perform a suction operation. In the sensor S ₃ , the head 14 moves up to L
When it reaches the position ₃ , the head 14 is laterally moved (or swung) by detecting this. The sensors S ₁ , S ₂ , S ₃ are
Although not shown, the arm may be extended from the side and fixed to this, and a proximity switch or an optical sensor can be used as the sensor.

Next, the transport order of the tray 2 will be described. First, when the uppermost tray 2 becomes empty, the suction head 14
Moves laterally (or turns) and stops at the central position of the tray 2. Subsequently, when the suction head 14 descends and reaches the position of L ₁ , the sensor S ₁ detects this, the head 14 is temporarily stopped, and the solenoid valve SV of each nozzle 18 is opened for 3 seconds. As a result, the empty tray 2 floats upward by the high pressure air and is reliably separated from the tray 2 of the next stage.

Next, when the suction head 14 descends to the position of the tray upper surface L ₂ , the head 14 is sent by the signal from the sensor S _2.
Stops, the tray 2 is adsorbed, and the head 14 rises.
When the head 14 reaches the position of L _3, the sensor S ₃ detects this, and the head 14 moves laterally to place the tray 2 on the intermediate carrier 15 (see FIG. 3). Then, another suction head 16 (see FIG. 3) moves the tray 2 to the intermediate carrier 1.
The transfer from 5 to the carrier 17 is the same as the conventional one.
In this case, the intermediate carrier 15 may be omitted and the tray 2 may be directly conveyed to the carrier 17.

These series of operations are performed by each sensor S ₁ ,
This is performed by the microcomputer opening and closing each solenoid valve of the air circuit according to the detection signals from S ₂ and S ₃ .

[0017]

As described above in detail, when the tray separating method of the present invention is used, even if the empty tray in the upper stage is biting the tray in the next stage, it is possible to easily separate both trays by the high pressure air. is there. Also, since this type of IC handler originally uses an air circuit such as an air cylinder,
It is very easy to install air nozzles around the tray.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a tray separating method of the present invention.

FIG. 2 is a simplified plan view of an IC handler.

FIG. 3 is a schematic view of a tray transport mechanism.

[Explanation of symbols]

1IC 2,2 ', 2 "nozzle S ₁ of the tray 14, 16 the suction head 18 high-pressure air, _S 2, _{S 3} sensor SV solenoid valve 13, 15, 17 carrier

Claims (1)

[Claims] 1. When, when trays stacked in a state where a large number of ICs and the like are stored, parts which are in the uppermost tray are extracted and then empty trays are sequentially moved by a conveying means such as a suction head, etc. A method for separating a stacking tray for electronic parts, characterized in that high-pressure air is supplied between an empty tray and a next-stage tray.