JPH0586643B2 - - Google Patents

Info

Publication number
JPH0586643B2
JPH0586643B2 JP58231805A JP23180583A JPH0586643B2 JP H0586643 B2 JPH0586643 B2 JP H0586643B2 JP 58231805 A JP58231805 A JP 58231805A JP 23180583 A JP23180583 A JP 23180583A JP H0586643 B2 JPH0586643 B2 JP H0586643B2
Authority
JP
Japan
Prior art keywords
susceptor
growth
reaction
movable
chambers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58231805A
Other languages
Japanese (ja)
Other versions
JPS60123022A (en
Inventor
Kazumi Kasai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58231805A priority Critical patent/JPS60123022A/en
Publication of JPS60123022A publication Critical patent/JPS60123022A/en
Publication of JPH0586643B2 publication Critical patent/JPH0586643B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2907Materials being Group IIIA-VA materials
    • H10P14/2911Arsenides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202Materials thereof
    • H10P14/3214Materials thereof being Group IIIA-VA semiconductors
    • H10P14/3221Arsenides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3421Arsenides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3438Doping during depositing
    • H10P14/3441Conductivity type
    • H10P14/3442N-type

Landscapes

  • Recrystallisation Techniques (AREA)

Description

【発明の詳細な説明】 (a) 発明の技術分野 本発明は、反応管と、反応管内に延びて反応管
内を複数の反応室に分割する仕切壁と、その上に
複数の異なる半導体層が気相成長される基板と、
前記複数の成長室に相互に種類の異なる反応ガス
を供給するガス管と、前記反応管内の反応ガスを
吸気するガス吸気管とを有する複数の異なる半導
体層の気相成長装置の分野に属する。
Detailed Description of the Invention (a) Technical Field of the Invention The present invention relates to a reaction tube, a partition wall that extends inside the reaction tube and divides the inside of the reaction tube into a plurality of reaction chambers, and a plurality of different semiconductor layers on the partition wall. a substrate to be vapor-phase grown;
It belongs to the field of a vapor phase growth apparatus for a plurality of different semiconductor layers, which includes gas pipes that supply different types of reaction gases to the plurality of growth chambers, and gas intake pipes that take in the reaction gas in the reaction tubes.

(b) 従来の技術 従来、この種の複数の異なる半導体層の気相成
長装置は、例えば特開昭52−96865号公報に記載
されている。
(b) Prior Art Conventionally, this type of vapor phase growth apparatus for forming a plurality of different semiconductor layers has been described, for example, in Japanese Patent Laid-Open No. 52-96865.

この気相成長装置は、反応管内部が、仕切壁に
よつて複数の成長室に分割された領域と、基板移
動のために、ガス流の下流側であつて分割されな
い領域とで構成されている。また、基板を保持す
る基板ホルダは、ガス流の下流側から挿抜自在に
設けられた棒状部材の先端に設けられている。
This vapor phase growth apparatus consists of an area in which the interior of the reaction tube is divided into a plurality of growth chambers by a partition wall, and an undivided area on the downstream side of the gas flow for substrate movement. There is. Further, the substrate holder that holds the substrate is provided at the tip of a rod-shaped member that is freely inserted and removed from the downstream side of the gas flow.

この気相成長装置は、上記棒状部材を操作して
一方の成長室に挿入されている基板ホルダを上記
分割されない領域にまで一度引き抜き、続いて他
方の成長室にこれを挿入することで、各成長室間
の基板移動を行うものである。
This vapor phase growth apparatus operates the rod-shaped member to pull out the substrate holder inserted into one of the growth chambers to the undivided area, and then inserts it into the other growth chamber. This is used to move substrates between growth chambers.

(c) 発明が解決しようとする課題 上記従来の複数の異なる半導体層の気相成長装
置では、上記分割されない領域は、、異なる種類
の反応ガスが混在する領域であるため、基板を移
動する時は、一時的にせよ基板上には所望しない
半導体層が成長してしまう。
(c) Problems to be Solved by the Invention In the above-mentioned conventional vapor phase growth apparatus for forming a plurality of different semiconductor layers, the undivided region is a region where different types of reaction gases coexist. In this case, an undesired semiconductor layer grows on the substrate, even if only temporarily.

この所望しない半導体層が、ヘテロ接合界面あ
るいは不純物ドーピングの変調界面に形成されて
しまうと、ヘテロ接合界面のあるいはドーピング
変調界面の急峻性が失われるため、半導体デバイ
スの特性が劣化してしまう。
If this undesired semiconductor layer is formed at a heterojunction interface or an impurity doping modulation interface, the steepness of the heterojunction interface or doping modulation interface is lost, resulting in deterioration of the characteristics of the semiconductor device.

また、上記した複数の異なる半導体層の気相成
長装置では、基板を基板ホルダにより、挿入、引
き抜き、別成長室へ挿入するという操作が不可欠
で、装置の取り扱い作業が面倒である。
Furthermore, in the above-mentioned vapor phase growth apparatus for forming a plurality of different semiconductor layers, operations such as inserting and pulling out the substrate using a substrate holder, and inserting it into a separate growth chamber are essential, which makes handling of the apparatus cumbersome.

これらの問題は、従来の複数の異なる半導体層
の気相成長装置においては、反応管内部を複数の
成長室に分割している仕切壁が、反応管の長手方
向に長く延出しており、一つの成長室から他の成
長室に前記基板ホルダを移動する際にこの長く延
出した仕切壁の端部を通過しなければならないこ
とに起因するものである。
These problems can be solved by the fact that in conventional vapor phase growth equipment for producing multiple different semiconductor layers, the partition wall that divides the inside of the reaction tube into multiple growth chambers extends long in the longitudinal direction of the reaction tube. This is due to the fact that when moving the substrate holder from one growth chamber to another, it must pass through the end of this long partition wall.

本発明が解決しようとする課題は、基板ホルダ
が一つの成長室から他の成長室へ移動する際、反
応管内部を複数の反応室に分割している仕切壁の
端部を通過せずに済むようにすることである。
The problem to be solved by the present invention is that when a substrate holder is moved from one growth chamber to another, it does not pass through the end of the partition wall that divides the interior of the reaction tube into a plurality of reaction chambers. The goal is to make it happen.

(d) 課題を解決するための手段 上記課題を解決するため、本発明は、反応管
と、反応管内に延びて反応管内を複数の反応室に
分割する仕切壁と、その上に複数の異なる半導体
層が気相成長される基板と、前記複数の成長室に
相互に種類の異なる反応ガスを供給するガス管
と、前記反応管内の反応ガスを吸気するガス吸気
管とを有する複数の異なる半導体層の気相成長装
置において、 イ 前記仕切壁に連続して設けられ、前記仕切壁
と同様に前記分割された反応管内に延びて前記
反応管内を複数の反応室に分割すると共に、前
記複数の成長室を連通する窓が設けられた、高
周波電力の印加によつて発熱する固定サセプタ
と、 ロ 基板を保持する凹部を備え且つ前記窓を介し
て前記複数の成長室間をスライド移動可能に設
けられた、高周波電力の印加によつて発熱する
可動サセプタと、 ハ 前記固定サセプタと一体に形成され、前記複
数の成長室に跨がつて張り出して前記可動サセ
プタを支承し、高周波電力の印加によつて発熱
する支承部と、 ニ 前記固定サセプタ、可動サセプタおよび支承
部を高周波加熱するための高周波コイルとを設
ける、という手段を講じた。
(d) Means for Solving the Problems In order to solve the above problems, the present invention provides a reaction tube, a partition wall that extends inside the reaction tube and divides the inside of the reaction tube into a plurality of reaction chambers, and a plurality of different A plurality of different semiconductors having a substrate on which a semiconductor layer is grown in a vapor phase, a gas pipe that supplies different types of reaction gas to the plurality of growth chambers, and a gas intake pipe that takes in the reaction gas in the reaction tube. In the layer vapor phase growth apparatus, (a) is provided continuously to the partition wall and extends into the divided reaction tube like the partition wall to divide the inside of the reaction tube into a plurality of reaction chambers; a fixed susceptor that is provided with a window that communicates with the growth chambers and that generates heat upon application of high-frequency power; (b) a fixed susceptor that is provided with a recessed portion for holding a substrate and that is slidably movable between the plurality of growth chambers via the window; a movable susceptor that generates heat upon application of high-frequency power; (c) formed integrally with the fixed susceptor, extending across the plurality of growth chambers to support the movable susceptor; and (d) a high-frequency coil for high-frequency heating the fixed susceptor, the movable susceptor, and the support.

(e) 作用 本発明では、上記手段を講じたため、基板を保
持した可動サセプタ(基板ホルダとしても機能す
る)は、仕切壁としても機能する固定サセプタに
設けられた複数の成長室間を連通する窓を介して
各成長室の成長位置へ直接送り込みできる様にス
ライド移動できる。したがつて、基板を基板ホル
ダ(可動サセプタ)によつて一つの成長室から他
の成長室へ移動する際に、反応管内部に複数の成
長室に分割している仕切壁(固定サセプタ)の端
部を通過しなくて済む。
(e) Effect In the present invention, since the above measures are taken, the movable susceptor holding the substrate (which also functions as a substrate holder) communicates between the plurality of growth chambers provided in the fixed susceptor which also functions as a partition wall. It can be slid so that it can be fed directly to the growth position in each growth chamber through the window. Therefore, when moving a substrate from one growth chamber to another using a substrate holder (movable susceptor), the partition wall (fixed susceptor) that divides the reaction tube into multiple growth chambers must be removed. No need to pass through the edge.

(f) 発明の実施例 以下、本発明に関する実施例を第1図〜第6図
を参照しながら詳細に説明する。
(f) Embodiments of the Invention Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 6.

第1実施例 本実施例は、縦型反応管からなる複数の異なる
半導体層の気相成長装置に本発明を適用したもの
である。
First Example In this example, the present invention is applied to a vapor phase growth apparatus for forming a plurality of different semiconductor layers, which comprises a vertical reaction tube.

本実施例を説明するための第1図における気相
成長装置の各部は次のとおりである。
Each part of the vapor phase growth apparatus in FIG. 1 for explaining this embodiment is as follows.

1は石英製の反応管、2は反応管1と同軸配置
され、反応管内部を画定する石英製のライナ管3
はライナ管2の中央部に位置し、ライナ管2の内
部を分割する石英製の仕切壁である。
1 is a reaction tube made of quartz, and 2 is a liner tube 3 made of quartz that is arranged coaxially with the reaction tube 1 and defines the inside of the reaction tube.
is a partition wall made of quartz that is located in the center of the liner tube 2 and divides the inside of the liner tube 2.

上記仕切壁3は、ライナ管2によつて画定され
た反応管1の内部を二室の成長室に分割する役割
をもつている。
The partition wall 3 has the role of dividing the interior of the reaction tube 1 defined by the liner tube 2 into two growth chambers.

また、4は仕切壁3と連続してその下方に設け
られ、仕切壁3と同様にライナ管2の内部を二室
の成長室に分割するカーボン製の固定サセプタ、
5は固定サセプタ4に開口された二室の成長室に
跨がる窓、6は複数の異なる半導体層の気相成長
対象の基板、7は基板6を収納する凹部を備えて
基板6の表面の高さがその表面を越えない様にな
されたカーボン製の可動サセプタ、8は可動サセ
プタ7に接続されてこれを回転する石英製の回転
軸、9は固定サセプタ4と一体的に形成され、分
割された二室の成長室に跨がつて可動サセプタ7
を支承する支承部である。
Further, 4 is a fixed susceptor made of carbon, which is provided continuously with and below the partition wall 3, and divides the inside of the liner tube 2 into two growth chambers like the partition wall 3;
5 is a window spanning two growth chambers opened in the fixed susceptor 4; 6 is a substrate on which a plurality of different semiconductor layers are to be grown in vapor phase; and 7 is a concave portion for accommodating the substrate 6; A movable susceptor made of carbon whose height does not exceed the surface of the movable susceptor, 8 a rotating shaft made of quartz that is connected to the movable susceptor 7 and rotates it, 9 integrally formed with the fixed susceptor 4, A movable susceptor 7 straddles the two divided growth chambers.
This is the support part that supports the.

上記の固定サセプタ4や基板6が収納される可
動サセプタ7、支承部9などはカーボン製であ
り、図示しない高周波コイルからの高周波電力の
印加によつて発熱する。カーボン素材は加工が容
易なため、仕切壁構造などが精密に作成でき、分
割された二室の成長空間のガス洩れを非常に小さ
くし得る。また、可動サセプタ7と支承部9の間
のスライド潤滑性も良好であるので、基板6の二
室の成長室間での移動を繰り返すことも容易であ
る。
The fixed susceptor 4, the movable susceptor 7 in which the substrate 6 is housed, the support portion 9, etc. are made of carbon, and generate heat when high frequency power is applied from a high frequency coil (not shown). Since carbon materials are easy to process, partition wall structures and the like can be created precisely, and gas leakage from the two divided growth spaces can be minimized. Furthermore, since the sliding lubricity between the movable susceptor 7 and the support portion 9 is good, it is easy to repeatedly move the substrate 6 between the two growth chambers.

また、10と11は仕切壁3にて分割された二
室それぞれに異なる原料ガスを流すガス管、13
はステンレス製のマニホールド、14はガス吸気
管、15は回転軸8に接続されて可動サセプタ7
に収納された基板6の移動を制御する基板移動制
御部、16はマニホールド13は反応管1とを締
結する締結リングである。
Further, 10 and 11 are gas pipes that flow different source gases into the two chambers divided by the partition wall 3, and 13
1 is a stainless steel manifold, 14 is a gas intake pipe, and 15 is a movable susceptor 7 connected to the rotating shaft 8.
16 is a fastening ring that fastens the manifold 13 to the reaction tube 1.

マニホールド13は、二室に分割された成長室
内のガスをガス吸気管14に送出しており、マニ
ホールド13の上下の締結リング16を緩めれ
ば、反応管1内のライナ管2を下方に引き出すと
共に、ライナ管2から固定サセプタ4や可動サセ
プタ7、支承部9などのサセプタ組み立て体を反
応管の管軸に沿つて引き出して基板6を取り出す
ことができる。
The manifold 13 sends the gas inside the growth chamber, which is divided into two chambers, to the gas intake pipe 14, and by loosening the upper and lower fastening rings 16 of the manifold 13, the liner tube 2 inside the reaction tube 1 can be pulled out downward. At the same time, the substrate 6 can be taken out by pulling out the susceptor assembly including the fixed susceptor 4, the movable susceptor 7, and the support part 9 from the liner tube 2 along the tube axis of the reaction tube.

第2図は第1図における固定サセプタ4、可動
サセプタ7、支承部9などのサセプタ組み立て体
の要部構成を示す側面図、第3図はその上面図で
ある。図中、第1図と同一部位には同一の参照番
号が付与されている。
FIG. 2 is a side view showing the configuration of main parts of the susceptor assembly such as the fixed susceptor 4, movable susceptor 7, and support part 9 in FIG. 1, and FIG. 3 is a top view thereof. In the figure, the same parts as in FIG. 1 are given the same reference numbers.

17が可動サセプタ7に設けられて基板6を収
納する凹部である。
Reference numeral 17 denotes a recess provided in the movable susceptor 7 to accommodate the substrate 6.

可動サセプタ7は、基板移動制御部15に制御
された回転軸8にて駆動され、固定サセプタ4に
設けられた窓5を経て左右の成長室の間をスライ
ド移動できる。
The movable susceptor 7 is driven by a rotating shaft 8 controlled by the substrate movement control section 15, and can slide between the left and right growth chambers through a window 5 provided in the fixed susceptor 4.

つぎに、本実施例の複数の異なる半導体層の気
相成長装置を用いて、GaAsよりなる基板上にノ
ンドーブGaAsよりなるFETバツフア層と、n−
GaAsよりなるFET動作層を連続して成長する例
を説明する。
Next, an FET buffer layer made of non-doped GaAs and an n-
An example in which a FET active layer made of GaAs is continuously grown will be explained.

まず、二室に分割された成長室の一方側には、
ガス管10を介してFETバツフア層を形成する
ための原料ガスを導入する。
First, on one side of the growth chamber, which is divided into two,
Raw material gas for forming the FET buffer layer is introduced through the gas pipe 10.

ガス管10に導入される原料ガスは、ノンドー
プGaAsを成長するためのものであり、水素、ア
ルシン(AsH3)、トリメチルガリユウムTMG
〔GaCH33〕からなつている。
The raw material gases introduced into the gas pipe 10 are for growing non-doped GaAs, and include hydrogen, arsine (AsH 3 ), trimethylgallium TMG
It consists of [GaCH 3 ) 3 ].

また、二室に分割された成長室の他方側には、
ガス管11を介してFET動作層を形成するため
の原料ガスを導入する。
In addition, on the other side of the growth chamber divided into two rooms,
Raw material gas for forming the FET operating layer is introduced through the gas pipe 11.

ガス管11に導入される原料ガスは、n−
GaAsを成長するものであり、水素、アルシン、
トリメチルガリユウムTMG、硫化水素(H2S)
からなつている。
The raw material gas introduced into the gas pipe 11 is n-
It grows GaAs, hydrogen, arsine,
Trimethylgallium TMG, hydrogen sulfide (H 2 S)
It is made up of

反応管1内で、ライナ管2によつて画定された
成長室1の内部を二室に分割する固定サセプタ
4、GaAsよりなる基板6を収容する可動サセプ
タ7および支承部9は、図示しない高周波コイル
によつて約700℃に加熱される。
In the reaction tube 1, a fixed susceptor 4 that divides the inside of the growth chamber 1 defined by the liner tube 2 into two chambers, a movable susceptor 7 that accommodates a substrate 6 made of GaAs, and a support section 9 are equipped with a high-frequency wave (not shown). It is heated to approximately 700°C by a coil.

かかる状態で時間をコントロールし、前記一方
側の成長室で先ず、FETバツフア層となるノン
ドープGaAsを成長した後、基板移動制御部15
にて回転軸8を回転し、可動サセプタ7を半回転
して基板6を他方側の成長室に移動し、FET動
作層となるn−GaAsを成長する。
In this state, time is controlled to first grow non-doped GaAs which will become the FET buffer layer in the growth chamber on one side, and then the substrate movement control section 15
The rotary shaft 8 is rotated, the movable susceptor 7 is rotated by half a rotation, the substrate 6 is moved to the growth chamber on the other side, and n-GaAs, which will become the FET operating layer, is grown.

第2実施例 第4図は本発明の横型反応管に適用した第2実
施例を説明するための斜視図である。
Second Embodiment FIG. 4 is a perspective view for explaining a second embodiment of the present invention applied to a horizontal reaction tube.

同図中、第1図と同一機能部は同一参照番号が
付与してある。ただし、第1図における反応管1
は図示されていない。
In the figure, the same functional parts as in FIG. 1 are given the same reference numbers. However, reaction tube 1 in Figure 1
is not shown.

本実施例では、第4図に示されるように、ライ
ナ管2の内部が、石英製の仕切壁3と、それに連
接するカーボン製の固定サセプタ4にて分割され
て二室の成長室が形成されている。
In this embodiment, as shown in FIG. 4, the inside of the liner tube 2 is divided by a partition wall 3 made of quartz and a fixed susceptor 4 made of carbon connected to the partition wall 3 to form two growth chambers. has been done.

また固定サセプタ4には二室の成長室間を連通
する窓5と、固定サセプタ4に一体に形成された
支承部9とが設けられており、支承部9の面上に
は基板6を収納する可動サセプタ7が回転可能に
配置されている。
Furthermore, the fixed susceptor 4 is provided with a window 5 that communicates between the two growth chambers, and a support part 9 that is integrally formed with the fixed susceptor 4, and a substrate 6 is stored on the surface of the support part 9. A movable susceptor 7 is rotatably arranged.

第1図の縦型反応管の構造との主たる相違は、
可動サセプタ7の駆動部、即ち、回転軸8はカー
ボン製のギヤー18を介して水平駆動軸19によ
り駆動されることにある。
The main difference from the structure of the vertical reaction tube in Figure 1 is:
The driving portion of the movable susceptor 7, that is, the rotating shaft 8 is driven by a horizontal driving shaft 19 via a gear 18 made of carbon.

本実施例においても、第1実施例と同様に可動
サセプタ7は固定サセプタ4に設けられた窓5を
経て2つの成長室の間をスライド移動できる。
In this embodiment, as in the first embodiment, the movable susceptor 7 can slide between the two growth chambers through the window 5 provided in the fixed susceptor 4.

第3実施例 以上説明した第1、第2の実施例では基板の反
応室間の移動は何れも可動サセプタの回転による
スライド移動であつたが、これに代えて水平面内
のスライド移動を採用することもできる。
Third Embodiment In the first and second embodiments described above, the substrate was moved between the reaction chambers by sliding movement due to the rotation of the movable susceptor, but instead of this, sliding movement in a horizontal plane is adopted. You can also do that.

第5図は基板を水平面内でスライド移動する複
数の異なる半導体層の気相成長装置の要部断面図
であり、第6図は第5図の斜視図である。
FIG. 5 is a sectional view of a main part of a vapor phase growth apparatus for a plurality of different semiconductor layers in which a substrate is slid in a horizontal plane, and FIG. 6 is a perspective view of FIG. 5.

第5図と第6図において、二室の成長室を形成
する仕切壁3或いは固定サセプタ4、固定サセプ
タ4と一体に形成される支承部9などの基本的構
造は、第1図と同じである。
In FIGS. 5 and 6, the basic structures such as the partition wall 3 forming the two growth chambers, the fixed susceptor 4, and the support part 9 formed integrally with the fixed susceptor 4 are the same as in FIG. 1. be.

図中、20は固定サセプタ4の窓5内を左右方
向に摺動する可動サセプタであり、これには基板
6を収納する凹部が設けられている。21は支承
部9上面に設けられたスライドガイドをなすレー
ル、22は前記可動サセプタ20の底面側の一側
面に設けられたラツクギヤー、23はラツクギヤ
ー22と噛み合うピニオンギヤーである。
In the figure, 20 is a movable susceptor that slides in the left-right direction within the window 5 of the fixed susceptor 4, and is provided with a recessed portion in which the substrate 6 is accommodated. Reference numeral 21 indicates a rail serving as a slide guide provided on the upper surface of the support portion 9, 22 a rack gear provided on one side of the bottom surface of the movable susceptor 20, and 23 a pinion gear meshing with the rack gear 22.

ピニオンギヤー23はライナ管2の中心の回転
軸8を経て、図示しない基板移動制御部(第1図
参照)で駆動される。そして、回転軸8の正負回
転方向を変えることにより、可動サセプタ7は固
定サセプタ4に設けられた窓5を経て2つの成長
室の間をスライド移動できる。
The pinion gear 23 is driven by a substrate movement control section (not shown) (see FIG. 1) via a rotating shaft 8 at the center of the liner tube 2. By changing the positive and negative rotation directions of the rotating shaft 8, the movable susceptor 7 can slide between the two growth chambers through the window 5 provided in the fixed susceptor 4.

(g) 発明の効果 本発明によれば、固定サセプタおよび固定サセ
プタと一体に形成されている支承部が、可動サセ
プタと共に高周波コイルからの電力印加によつて
発熱するため、可動サセプタの発熱量が変化して
も(可動サセプタは、その移動によつて高周波コ
イルとの相対的な位置関係が変動し、その発熱量
が変動する恐れがあるのであるが)、基板を加熱
するための総発熱量は殆ど変化せず、このため、
基板の加熱温度は常にほぼ一定に保持され、温度
変動に起因する所望しない半導体層の成長が防止
できるという効果を生じる。
(g) Effects of the Invention According to the present invention, the fixed susceptor and the supporting part formed integrally with the fixed susceptor generate heat together with the movable susceptor by applying power from the high-frequency coil, so that the amount of heat generated by the movable susceptor is reduced. Even if the movable susceptor changes its position relative to the high-frequency coil due to its movement, the amount of heat generated by it may vary), the total amount of heat generated to heat the substrate remains almost unchanged, and therefore,
The heating temperature of the substrate is always maintained substantially constant, resulting in the effect that undesired growth of the semiconductor layer due to temperature fluctuations can be prevented.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明を縦型反応管に適用した第1
実施例を説明するための簡略斜視図、第2図は第
1図の要部構成をしめす側面図、第3図は第2図
の上面図、第4図は本発明を横型反応管に適用し
た第2実施例を説明するための簡略斜視図、第5
図はスライド機構によつて可動サセプタの移動を
なす第3実施例を説明するための断面図、第6図
は第5図の斜視図である。 図中、1は反応管、2はライナ管、3は仕切
壁、4は固定サセプタ、5は窓、6は基板、7は
可動サセプタ、8は回転軸、9は支承部、10と
11はガス管、13はマニホールド、14はガス
吸気管、15は基板移動制御部、16は締結リン
グ、17は凹部、18はギヤー、19は水平駆動
軸、20はスライド式である可動サセプタ、21
はレール、22はラツクギヤー、23はピニオン
ギヤーである。
Figure 1 shows a first example in which the present invention is applied to a vertical reaction tube.
FIG. 2 is a side view showing the main structure of FIG. 1, FIG. 3 is a top view of FIG. 2, and FIG. 4 is a simplified perspective view for explaining the embodiment. A simplified perspective view for explaining the second embodiment, No. 5
This figure is a sectional view for explaining a third embodiment in which a movable susceptor is moved by a slide mechanism, and FIG. 6 is a perspective view of FIG. 5. In the figure, 1 is a reaction tube, 2 is a liner tube, 3 is a partition wall, 4 is a fixed susceptor, 5 is a window, 6 is a substrate, 7 is a movable susceptor, 8 is a rotating shaft, 9 is a support part, 10 and 11 are 13 is a manifold, 14 is a gas intake pipe, 15 is a substrate movement control unit, 16 is a fastening ring, 17 is a recessed part, 18 is a gear, 19 is a horizontal drive shaft, 20 is a sliding movable susceptor, 21
is a rail, 22 is a rack gear, and 23 is a pinion gear.

Claims (1)

【特許請求の範囲】 1 反応管と、 反応ガスの上流側から延在し反応管内を複数の
成長室に分割する仕切壁と、 前記複数の成長室に相互に種類の異なる反応ガ
スを供給するガス管と、 前記反応管内の反応ガスを吸気するガス吸気管
と、 前記仕切壁に連続して設けられ、前記仕切壁と
同様に前記分割された反応管内に延びて前記反応
管内を複数の反応室に分割すると共に、前記複数
の成長室を連通する窓が設けられた、高周波電力
の印加によつて発熱する固定サセプタと、 その上に複数の異なる半導体層が気相成長され
る基板を保持する凹部を備え且つ前記窓を介して
前記複数の成長室間をスライド移動可能に設けら
れた、高周波電力の印加によつて発熱する可動サ
セプタと、 前記固定サセプタと一体に形成され、前記複数
の成長室に跨がつて張り出して前記可動サセプタ
を支承し、高周波電力の印加によつて発熱する支
承部と、 前記固定サセプタ、可動サセプタおよび支承部
を高周波加熱するための高周波コイルとを有する
ことを特徴とする複数の異なる半導体層の気相成
長装置。
[Scope of Claims] 1. A reaction tube, a partition wall extending from the upstream side of the reaction gas and dividing the interior of the reaction tube into a plurality of growth chambers, and supplying different types of reaction gases to the plurality of growth chambers. a gas pipe; a gas intake pipe that takes in the reaction gas in the reaction tube; and a gas intake pipe that is provided continuously to the partition wall and extends into the divided reaction tubes similarly to the partition wall to carry out a plurality of reactions in the reaction tubes. A fixed susceptor that is divided into chambers and provided with a window that communicates the plurality of growth chambers and that generates heat when high frequency power is applied, and holds a substrate on which a plurality of different semiconductor layers are grown in a vapor phase. a movable susceptor that generates heat upon application of high-frequency power and is provided with a recessed portion and is slidably movable between the plurality of growth chambers via the window; The present invention further comprises: a support portion extending over the growth chamber to support the movable susceptor and generating heat upon application of high-frequency power; and a high-frequency coil for high-frequency heating the fixed susceptor, the movable susceptor, and the support portion. A vapor phase growth apparatus for producing multiple different semiconductor layers.
JP58231805A 1983-12-08 1983-12-08 Vapor growth method Granted JPS60123022A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58231805A JPS60123022A (en) 1983-12-08 1983-12-08 Vapor growth method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58231805A JPS60123022A (en) 1983-12-08 1983-12-08 Vapor growth method

Publications (2)

Publication Number Publication Date
JPS60123022A JPS60123022A (en) 1985-07-01
JPH0586643B2 true JPH0586643B2 (en) 1993-12-13

Family

ID=16929292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58231805A Granted JPS60123022A (en) 1983-12-08 1983-12-08 Vapor growth method

Country Status (1)

Country Link
JP (1) JPS60123022A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5051875B2 (en) * 2006-12-25 2012-10-17 東京エレクトロン株式会社 Film forming apparatus and film forming method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5350973A (en) * 1976-10-20 1978-05-09 Matsushita Electric Ind Co Ltd Vapor phase growth method and vapor phase growth apparatus
JPS53110366A (en) * 1977-03-04 1978-09-27 Gnii Pi Redkometa Device for epitaxially growing semiconductor period structure from gaseous phase

Also Published As

Publication number Publication date
JPS60123022A (en) 1985-07-01

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