JPH0587876A - Printed substrate for electronic part evaluation test and test method using thereof - Google Patents

Abstract

(57) [Abstract] [Purpose] The life test of electronic parts such as ICs and LSIs, which can be shared by many kinds by devising a print pattern, greatly reduce the circuit mounting and assembling time, and have high connection reliability. To realize a printed circuit board for use. [Construction] One lead hole for electronic component 2 and one lead hole 3
And a connection hole 4 electrically connected to the lead hole 3,
Electrically isolated near the connection hole 4, power supply, ground,
Three types of holes, which are the wiring holes 5 connected to the wiring for signals and the like, are provided. The wiring holes 5 are electrically connected to the wiring holes 5 corresponding to the same pin positions of other electronic components on the same printed circuit board, respectively, and a large number of components are mounted in a matrix. .. An electronic component is mounted in the lead hole 3, and a circuit component electric component such as a resistor, a capacitor, and a zero ohm resistor is mounted in the connection hole 4 and the wiring hole 5 to form a circuit. A mounting position display mark (not shown) for these components is provided on the printed circuit board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board used in an electronic component evaluation test and an electronic component evaluation test method using the same.

[0002]

2. Description of the Related Art For example, there are a high temperature operation life test and a high temperature and high humidity life test as typical evaluation tests for conducting a reliability test of electronic parts such as LSI. When performing these tests,
A DC voltage or AC signal is applied to each pin of the electronic component to be tested, or a resistor is connected as a load. Specifically, these electronic components and electric components such as resistors are mounted on a printed circuit board, and a DC voltage and an AC signal are supplied by wiring to perform load connection. However, it is difficult to share the printed circuit board because the circuit, the circuit constant, or the lead position differs depending on the product name and type of the electronic component.

For this reason, conventionally, a universal substrate having a minimum common portion common to various components is used, and electronic components and circuit components are mounted on the universal substrate and assembled by manual wiring for use. However, since such printed circuit boards place importance on versatility, it is necessary to route the power supply and signal wiring each time depending on the individual application, and in electronic parts with a large number of pins such as LSI, wiring locations are also considerable. Therefore, it took a considerable time to configure the circuit. In particular, when a large number of electronic components having a large number of pins are mounted on the same substrate, the mounting and wiring locations of the components are very large, and the assembly may take a long time of 1 to 2 weeks. In order to cope with this kind of product difference, for example, an input / output pin switching unit is provided adjacent to an IC mounting socket,
It has also been proposed that a circuit such as a desired resistor or a jumper wire is appropriately replaced in the pin switching unit as a pin pull-out structure and mounted on a printed circuit board to form a predetermined circuit.

[0004] Examples of the printed circuit board of this type include, for example, JP-A-61-34482 and JP-A-3-10175.

[0005]

However, there are merits and demerits in each of the above-mentioned conventional techniques, and it has been earnestly desired to realize a practical printed circuit board. That is, in the printed circuit board in which the input / output pin switching section is provided adjacent to the IC mounting socket, the IC socket is fixed, so that the IC to be measured satisfies the number of pins of the socket and has a low space. (Width of IC package,
In detail, the pin row spacing is limited to a specific one that matches the socket. In addition, there is a problem in the assemblability of the components for the circuit configuration, and sufficient consideration has not been given to the automation of the component assembly, which requires a considerable amount of time.

Therefore, an object of the present invention is to solve the problems of the prior art, and the first object thereof is an improvement that can shorten the circuit preparation time for evaluating electronic parts, which took a long time. A printed circuit board having a printed circuit board on which electronic components and electric components for circuit configuration are mounted and connected, and a third purpose is a method of mounting a component on the printed circuit board. The purpose of is to provide an evaluation test method for electronic components mounted on such a printed circuit board.

[0007]

In order to achieve the above objects, the inventors have paid attention to the following knowledge. That is,
Focusing on each pin of the electronic component to be tested, the pin arrangement varies according to the type, but is arranged according to a certain rule. In other words, it is left and right 2 symmetrically with a predetermined pin interval.
They are provided separately for each line and used for either the power supply, ground, or signal wiring, or 2 for resistors, capacitors, etc.
In most cases, it is connected to any of the power supply, ground, and signal wirings through an electric component having a circuit structure. From this, by devising the printed wiring pattern and changing the position of the electrode terminal (hole or pad) for inserting the electrical component for the specified circuit configuration for each pin of each electronic component I made it so that I could connect and use the necessary things.

When it is desired to directly connect an electronic component to the wiring of power supply, ground, signal, etc., the purpose can be achieved by using a zero ohm resistor (jumper resistor). In an actual test, several tens of samples are mounted on one printed circuit board and tested at one time. Therefore, the same pattern is provided on the same board. further,
For a plurality of identical patterns, printed wiring patterns were connected so that the same power source, ground, and signal were connected to the same pin positions of each electronic component.

The specific means for achieving the respective objects of the present invention will be described below. The first object of the present invention is as follows.
A plurality of lead electrodes are arranged at a predetermined interval and symmetrically on the left and right 2
A printed circuit board comprising a plurality of electronic components under test provided separately in a series, arranged in a matrix at predetermined intervals and mounted, and having these common input / output terminals on the periphery thereof. A first electrode terminal to which each of the lead electrodes is electrically connected, and a second electrode terminal electrically connected to the first electrode terminal and electrically connecting one terminal of a circuit component electrical component. And a wiring of three systems of a signal line, a power supply line and a ground is arranged adjacent to the second electrode terminal, and the circuit is arranged on each of these wirings at a predetermined distance from the second electrode terminal. The third electrode terminal for electrically connecting the other terminal of the constituent electric component is provided on the same substrate, and the first electrode is provided on the component mounting surface of the substrate.
By a printed circuit board for evaluation test of an electronic component, which is provided with a mounting position display mark of an electronic component under test surrounding a part or all of the electrode terminal group, and a mounting position display mark of the circuit component electric component. Is achieved. Also, (2)
A plurality of lead electrodes are arranged at a predetermined interval and symmetrically on the left and right 2
A printed circuit board comprising a plurality of electronic components under test provided separately in a series, arranged in a matrix at predetermined intervals and mounted, and having these common input / output terminals on the periphery thereof. A first electrode terminal to which each of the lead electrodes is electrically connected, and a second electrode terminal electrically connected to the first electrode terminal and electrically connecting one terminal of a circuit component electrical component. And a wiring of three systems of a signal line, a power supply line and a ground is arranged adjacent to the second electrode terminal, and the circuit is arranged on each of these wirings at a predetermined distance from the second electrode terminal. A third electrode terminal for electrically connecting the other terminal of the constituent electric component is provided on the same substrate, and the first electrode terminal is provided for one lead electrode of the at least one lead electrode row. Multiple at a specified interval By electronic components PCB evaluation test made by arranging, it is achieved.

Also in the above (1), a plurality of the first electrode terminals are electrically connected to one lead electrode of at least one of the lead electrode rows at a predetermined interval. It is desirable to do.

Further, part or all of the first to third electrode terminals may have a hole structure, and the lead electrode may have a pin structure so that mounting components can be freely attached or detached. A pad structure that can be mounted separately may be used.

Further, in the above (1) and (2), preferably, a plurality of the second electrode terminals are electrically connected to one lead electrode of the electronic component at a predetermined interval. It is desirable that the second electrode terminals be arranged so as to be aligned with the third electrode terminals on substantially the same straight line. Similarly, a plurality of the third electrode terminals are also electrically connected to each other at a predetermined interval, and the third electrode terminals are connected to the second electrode terminals.
It is desirable to electrically connect the third electrode terminals, which are arranged so as to be aligned with the electrode terminals on the same straight line and correspond to the same lead electrode of another electronic component on the same substrate. Furthermore, a plurality of the second electrode terminals and the third electrode terminals are arranged at predetermined intervals, and the same electrode terminals are arranged so as to be electrically connected to each other.
It is also possible to arrange these second and third electrode terminals so as to be aligned at positions on substantially the same straight line. Further, in this case, in order to facilitate the connection of the circuit components, the plurality of second electrode terminals and the plurality of third electrode terminals are arranged on the same straight line, and each of them is opposed to each other. It is desirable to dispose the electrodes at the same intervals as any of the electrode terminals on the side.

In a further different preferred embodiment, one lead electrode is provided with a plurality of the third electrode terminals at a predetermined interval, and each of the same electronic component units is insulated from each other and adjacent to another electron. The components are electrically connected to each other at the same relative position, and are arranged so as to be aligned with the second electrode terminals on substantially the same straight line, and the same lead electrode of another electronic component on the same substrate. It is also possible to electrically connect the third electrode terminals to each other corresponding to.

A second object of the present invention is to provide a first printed circuit board which can achieve the first object.
This is achieved by the printed circuit board for evaluation test in which the lead electrode of the electronic component under test is connected and mounted on the electrode terminal of, and the lead electrode of the measurement circuit component is connected and mounted on the second and third electrode terminals. It

A third object of the present invention is to mount an electronic device under test and a circuit component for measurement at predetermined electrode terminal positions of a printed circuit board which can achieve the first object. This is achieved by a method for mounting an evaluation test printed circuit board, which includes a step and a step of solder-connecting each of the components to the electrode terminal.

A fourth object of the present invention is to connect an input / output terminal of a printed circuit board capable of achieving the second object to an evaluation test control system, and to establish an electronic component according to a predetermined test item. This is achieved by an electronic component evaluation test method for performing an evaluation test.

[0017]

In the invention described in the above (1), a mounting position display mark of the electronic component under test surrounding a part or all of the first electrode terminal group on the component mounting surface of the substrate, and the circuit configuration. Since the mounting position display mark of the electric component is provided, the mounting position of the component is determined in advance. Therefore, reliable mounting is possible, and the study time required for mounting positions of components, routing of wiring, etc. as in the past is unnecessary. That is, the mounting area of the electronic component having the first electrode terminal and the mounting area of the circuit component electric component having the second and third electrode terminals are designated by the display marks, and the pattern of these electrode terminals is also designated. By standardizing, it becomes easy to apply an automatic insertion machine to insert parts. As a result, it has become possible to significantly reduce the number of assembly steps.

The component mounting display mark is printed, for example, with ink on the substrate, or the surface shape of the electrode terminal appearing on the substrate is devised so that the shape of the first electrode terminal is changed to the second and third shapes. The areas may be distinguished from each other by, for example, making the shape different from that.

Further, in the invention described in (2) above,
By disposing a plurality of first electrode terminals at a predetermined interval for one lead electrode of at least one of the lead electrode rows, it is possible to cope with the difference in the shape and size of the package of the electronic component. This is also the case when a plurality of at least one of the second and third electrode terminals is provided for the circuit component electric component.

Further, the printed circuit board of the present invention is constructed so that various kinds of electronic components can be mounted, but it is practical to mount the same type on one board. That is, wiring patterns for electrode terminals, power supplies, grounds, signals, etc. are repeatedly formed on a single substrate according to a certain rule so that many electronic components can be mounted in a matrix. Therefore, electronic components mounted on the same substrate are preferably the same type, and it is not preferable to mount different types of electronic components on the same substrate due to the restriction of the structure of the wiring pattern.

[0021]

Embodiments of the present invention will be described below with reference to the drawings. The present invention is characterized only by the position of the printed pattern and the electrode terminals (holes or pads) associated with it, and the materials used and the processing means thereof are the same as those of general printed circuit boards, so explanations thereof are omitted. To do.

<First Embodiment> FIG. 1 shows a first embodiment.
This figure shows an enlarged perspective view of a main part in which only the electronic component under test is mounted on the product common use printed circuit board for the life evaluation test of the electronic component of the present invention.

Here, paying attention to the lead electrode 2a of the electronic component 2 such as an LSI, the lead hole 3a and the lead hole 3a to be the first electrode terminal are provided at the lead position of the electronic component.
Wiring that is electrically insulated from the connection hole 4a, the lead hole 3a, and the connection hole 4a that are electrically connected to the second electrode terminal and that is connected to the wiring 6 to be the third electrode terminal. The hole 5a is provided. Further, these three types of electrode terminals (both holes in this example) are provided corresponding to the lead electrodes of individual electronic components. The wiring holes 5a are electrically connected to each other at the same pin position of each electronic component.

Next, two examples will be described below as to the actual method of use in which a circuit configuration electric component is also mounted and a wiring circuit is formed. As an example, the lead electrode 2a of the electronic component 2
Will be described with respect to the case where the + 5V power source, the lead 2b and the lead electrode 2c are connected to the + 5V power source, the ground and the + 10V power source respectively through the resistance of 1 kΩ. First, a 1 kΩ resistor, which is a circuit component, is inserted between the connection hole 4a serving as the second electrode terminal and the wiring hole 5a serving as the third electrode terminal, and the connection hole 4b serving as the second electrode terminal and the Zero ohm resistors, which are circuit components, are inserted between the wiring holes 5b serving as the third electrode terminal and between the connection hole 4c serving as the second electrode terminal and the wiring hole 5c serving as the third electrode terminal. The same mounting is performed for the adjacent electronic components 7. The connection between the lead electrode of each component and the electrode terminal of the board is fixed by solder reflow on the back surface of the board to improve reliability. Next, the wiring 6a
To + 5V power supply, wire 6b to ground, wire 6c to +1
The purpose can be achieved by connecting to a 0V power supply. Although not shown at the end of the substrate, each wiring 6
Is connected to an external test control system. In this way, this printed circuit board can be used for various applications with the same circuit board.

As another example, the lead electrode 2 of the electronic component 2
a is grounded through a 100Ω resistor, and lead electrode 2b
Is grounded, and the lead electrode 2c is + via a 10Ω resistor.
The case of connecting to a 5V power source will be described. First, a 100 Ω resistor, which is a circuit component, is inserted between the connection hole 4a and the wiring hole 5a, a zero ohm resistor which is also a circuit component is inserted between the connection hole 4b and the wiring hole 5b, and the connection hole 4c and the wiring hole. A resistor of 10Ω, which is also a circuit component, is inserted between 5c. The same mounting is performed for the adjacent electronic components 7. The connection between the lead electrode of the component and the electrode terminal of the board is fixed by soldering on the back surface of the board. Next, the wiring 6a
The purpose can be achieved by connecting the wiring 6b to the ground and the wiring 6c to the + 5V power source.

The surface pattern of this printed circuit board is shown in FIG. In the same figure (a), since the wiring pattern 6 is arranged in the laminated plate constituting the substrate, it does not appear on the surface, and the above-mentioned three types of electrode terminals 3, 4, 5 and the component mounting position display mark ( M1, M2) are displayed. The mark M1 indicates a mounting area for electronic components such as LSI, and the mark M2 indicates a mounting area for circuit components such as resistors. Within the mark M1, four types of marks M1a to M1d of different types are further provided. These marks were formed by screen printing. FIG. 2B shows a schematic view of the surface of the board. On the main surface, a large number of component mounting position display marks (M1, M2) are regularly arranged in a matrix, and the marks are placed at the ends. An output terminal P is provided.

By using the printed circuit board of this embodiment,
31-pin 48-pin shrink DIP type IC
The effect of creating a high temperature operation life test jig that can be mounted is as follows. It takes about 1/3 for 31h (4 days), which took 120h (2 weeks) in the past. I was able to confirm.

<Second Embodiment> FIG. 3 shows a second embodiment.
The difference from the embodiment shown in FIG. 1 is that a lead 1 of an electronic component is used.
This is because a plurality of lead holes (first electrode terminals 3) per book are provided and are connected by a print pattern. As shown in the figure, for the lead electrode 2a, two lead holes 3a, 3
a'corresponds. Similarly, 3b, 3b 'and 3c, 3c' correspond to the other lead electrodes 2b, 2c, respectively. As a result, various electronic components having different low spaces (package widths) can be mounted on the same printed circuit board. In this figure, for convenience of explanation,
Although the two lead electrodes of the electronic component 2 are shown on the left and right, several tens of lead electrodes are actually arranged.
As shown in the surface pattern, the lead holes 3 are also provided in a large number so as to accommodate them.

<Third Embodiment> FIG. 4 shows a third embodiment.
The difference from the embodiment shown in FIG. 1 is that a lead 1 of an electronic component is used.
Providing a plurality of connection holes (second electrode terminals 4) per book,
It is connected by a print pattern. The connection holes 4a and 4a 'correspond to the lead 2a. Similarly for the other leads, 4b, 4b 'and 4c, 4 respectively.
c'corresponds. As a result, it becomes possible to mount circuit-structured electric parts having different terminal intervals in the connection holes 4 and the wiring holes 5. The plurality of connection holes 4 and the wiring holes 5 are arranged in a straight line in consideration of automatic insertion of parts into the same lead as shown in the surface pattern of FIG. To array.

<Embodiment 4> A fourth embodiment is shown in FIG.
The difference from the embodiment shown in FIG. 1 is that a lead 1 of an electronic component is used.
Provide a plurality of wiring holes (third electrode terminal 5) per book,
It was connected with a print pattern. The wiring holes 5a and 5a 'correspond to the leads 2a. Similarly for the other leads, 5b, 5b 'and 5c, 5 respectively.
c'corresponds. As a result, it becomes possible to mount circuit-structured electric parts having different terminal intervals in the connection holes 4 and the wiring holes 5. For the purpose of reducing the lead capacitance of the electronic component, the wiring distance on the lead side (between the terminals 3 and 4) is shorter than that of the embodiment shown in FIG. Also in this case, the connection holes 4 and the plurality of wiring holes 5 are arranged in a straight line in consideration of automatic insertion of parts into the same lead as shown in the surface pattern of FIG. Arranged in a shape.

<Embodiment 5> FIG. 6 shows a fifth embodiment.
The difference from the embodiment shown in FIG. 1 is that a lead 1 of an electronic component is used.
Provide a plurality of wiring holes (third electrode terminal 5) per book,
This is electrically isolated from each other in the same component connection area,
The respective wiring holes at the same relative positions of other electronic components on the same board are connected to each other by a printed pattern.
FIG. 1 is not suitable for the case where the pattern width of the wiring connecting the wiring holes is thin and a large amount of current is required. Therefore, in FIG. 6, in addition to the wiring holes 5a and 5b per lead, wiring holes 5a ′ and 5b ′, 5b and 5b are provided as an additional wiring system (auxiliary system).
By connecting a ″ and 5b ″, the pattern width is widened and used for power supply, grounding, etc. The wiring holes 5a, 5a ', 5a''correspond to the leads 2a. For example, wiring hole 5a 'is + 5V and 5a''is grounded in advance.
If a is determined as a signal, by connecting each wiring hole to the power supply, ground, and signal, the mounting position on the wiring hole side of the circuit component electric component to be mounted in the connection hole 4 and the wiring hole 5 corresponding to each lead. By changing, it is possible to select the required power source.

For convenience of explanation, FIG. 6 shows the case where the additional wiring hole and the wiring are connected by using the jumper wires 9, but these jumper wires 9 are actually double-sided printed circuit boards. It is placed in the backside pattern without any manual wiring. The wiring holes 5 and the connection holes 4 to be added are arranged in a straight line in consideration of automatic insertion of parts into the same lead as shown in the surface pattern of FIG. Arrange in a matrix.

<Sixth Embodiment> FIG. 7 shows a sixth embodiment.
The difference from the embodiment shown in FIG. 6 is that a lead 1 of an electronic component is used.
Connection hole (second electrode terminal 4) per wire, wiring hole (third electrode)
A plurality of electrode terminals 5) are provided together, and connection holes 4 and wiring holes 5 are provided.
That is, they are provided so that they are equidistant from each other. The connection holes 4a, 4a 'and the wiring holes 5a, 5a', 5a '' correspond to the leads 2a. As a result, it becomes possible to share the electric components for circuit configuration. For example, when it is desired to connect one lead electrode of the circuit component to the wiring hole 5a ″ with respect to the lead hole 3a, the other lead electrode may be inserted into the connection hole 4a ′. That is, the electric component may be inserted between the connection hole 4a 'and the wiring hole 5a''. In this case, the distance between both holes is A. When it is desired to connect the lead hole 3a to the wiring hole 5a ', an electric component is inserted between the connection hole 4a' and the wiring hole 5a '. The distance in this case is B. When it is desired to connect the lead hole 3a to the wiring hole 5a, an electric component is inserted between the connection hole 4a and the wiring hole 5a. The distance in this case is C.
As a result, A = B = C, so that electric components having the same outer shape can be used, and it becomes easy to adopt an automatic machine when automatically inserting electric components.

<Embodiment 7> FIG. 8 shows a seventh embodiment.
The difference from the embodiment shown in FIG. 1 lies in that the lead hole (first electrode terminal 3), the connection hole (second electrode terminal 4), and the wiring hole (third electrode terminal 5) are respectively formed from the hole structure to the surface. It is a pad for mounting attached parts. As a result, it becomes possible to use surface mount type electronic components and electric components.

<Embodiment 8> An eighth embodiment is shown in FIG.
The difference from the embodiment shown in FIG. 1 is that the lead holes 3 of the electronic component are provided in combination with the leads of the electronic component mounting socket 10. That is, the leads of the socket 10 are soldered to the lead holes 3 of the board, and other circuit components are also mounted and connected to the board in the same manner. If you insert and connect the pins of electronic parts, the same type of LSI
In the case of the life test of, the board can be repeatedly used only by replacing the pins.

<Embodiment 9> FIG. 11 shows an example in which the circuit of FIG. 10 is mounted using the printed circuit board of FIG. 6 to facilitate understanding. The electronic component 2 is mounted at the position of the lead hole 3 for mounting the electronic component in FIG. Next, from the circuit diagram of FIG. 10, electrical components are mounted using the connection holes 4 and the wiring holes 5 corresponding to the leads of the electronic components on the substrate, and the same wiring as the circuit diagram is performed on the substrate.

As shown in FIG. 11, first, the electronic component 1
For the pin No. 1 (1 pin), a resistor 8 is provided by using a wiring hole 5 ′ and a connection hole 4 which are electrically connected to a printed pattern of the wiring 11 (used for power supply) via a jumper wire 9. Implement. The wiring holes 5 ′ are electrically connected to each other by the printed pattern of the wiring 11.

Wiring 1 for the 2nd pin (2pin)
The zero ohm resistor 9a is mounted using the wiring hole 5 ″ and the connection hole 4 which are electrically connected to the printed pattern 2 (used for grounding) via the jumper wire 9. The wiring holes 5 ″ are electrically connected to each other by a printed pattern of the wiring 12.

Wiring 1 for pin 3 (3 pin)
The zero ohm resistor 9a is mounted using the wiring hole 5 and the connection hole 4 which are connected to the printed pattern 5 (used for signals). Pin 4 has the same wiring 1 as pin 1.
A zero ohm resistor is mounted by using the wiring hole 5 ′ and the connection hole 4 which are electrically connected to the printed pattern 1 of FIG.

Next, a power supply terminal is provided on the printed pattern of the wiring 11, and a ground terminal is provided on the printed pattern of the wiring 12.
The circuit of FIG. 10 is completed on the substrate by connecting the signal terminals to the printed pattern of the wiring 15. The actual test is performed by connecting to an external test control system via an input / output terminal (not shown) provided at the end of the substrate.

The following Examples 10 to 14 all show examples of print patterns prepared for integrated circuits.

<Embodiment 10> FIG. 12 shows the invention of FIG. 1 in which the package shape of the integrated circuit is a standard DIP (DualInl).
It shows an example applied to a part of in package). 1A shows the component mounting surface of the printed circuit board, and FIG. 1B shows the solder connection surface which is the back surface thereof. The lead holes 3 that can be used for evaluation are provided so that a low space of a standard DIP integrated circuit socket (hereinafter simply referred to as an IC socket) and a pin having a different number of pins can be mounted. The low space of the IC socket can be mounted from 300 mils to 600 mils and the maximum number of pins is 48 pins by patterning the center distance of the circular land as 100 mils.
In the figure, M1 is a package mounting area, M1a is a left and right pin arrangement separation mark, M2a and M2b are mounting area display marks for circuit components, respectively, and 4 is a connection hole serving as a second electrode terminal. Reference numeral 5 denotes a wiring hole which becomes a third electrode terminal, respectively.

<Embodiment 11> FIG. 13 shows the invention of FIG. 1 in which the package shape of the integrated circuit is a shrink DIP (Shri).
nk DIP) is shown as an example applied to parts. 1A shows the component mounting surface of the printed circuit board, and FIG. 1B shows the solder connection surface which is the back surface thereof. Lead holes 3 that can be used for evaluation
Are arranged so that a low space of the IC socket of the shrink DIP and a pin having a different number of pins can be mounted. The low space of the IC socket can be mounted from 300 mils to 900 mils and the maximum number of pins is 64 by patterning the center distance of the circular land to 100 mils.

In the figure, M1 is a mounting area display mark of the package, M2a and M2b are mounting area display marks of circuit components respectively, 4 is a connection hole to be a second electrode terminal, and 5 is a connection hole. Wiring holes to be the third electrode terminals are shown.

<Embodiment 12> FIG. 14 shows an embodiment of the invention of FIG. 1 in which the package shape of the integrated circuit is SOP (SmallOutl).
It shows an example applied to a part of in package). 1A shows the component mounting surface of the printed circuit board, and FIG. 1B shows the solder connection surface which is the back surface thereof. The lead holes 3 that can be used for the evaluation are arranged so that the SOP IC sockets having different numbers of pins can be mounted. IC socket 1
It was possible to implement by patterning 4, 16, 24, and 28 pins.

In the figure, M1 is a mounting area display mark of the package, M2a and M2b are mounting area display marks of circuit components respectively, 4 is a connection hole to be a second electrode terminal, and 5 is a connection hole. Wiring holes to be the third electrode terminals are shown.

<Embodiment 13> FIG. 15 shows the invention of FIG. 1 in which the package shape of the integrated circuit is PGA (Pin Grid A).
In this example, the pattern is applied to the component mounting surface of the printed circuit board. Also,
FIG. 16 shows the solder connection surface which is the back surface. The lead holes 3 that can be used for the evaluation are arranged so that the PGA IC sockets having different numbers of pins can be mounted. By patterning a 100-pin IC socket, an IC socket with 100 pins or less can be mounted.

In the figure, M1 is a mounting area display mark of the package, M2a and M2b are mounting area display marks of circuit components respectively, 4 is a connection hole to be a second electrode terminal, and 5 is a connection hole. Wiring holes to be the third electrode terminals are shown.

In the figure, M1 is a mounting area display mark of the package, M2a and M2b are mounting area display marks of circuit components respectively, 4 is a connection hole to be a second electrode terminal, and 5 is a connection hole. Wiring holes to be the third electrode terminals are shown.

<Embodiment 14> FIG. 17 is a circuit diagram of an integrated circuit according to the invention of FIG. 1 in which the package shape is QFP (QuadFlat).
This is an example of application to parts of Package). 1A shows the component mounting surface of the printed circuit board, and FIG. 1B shows the solder connection surface which is the back surface thereof. Lead holes 3 that can be used for evaluation
Are arranged so that QFP IC sockets having different numbers of pins can be mounted. IC socket 44, 6
It was possible to mount it by patterning the 4-pin type.

In the figure, M1 is a mounting area display mark of the package, M2a and M2b are mounting area display marks of circuit component parts, 4 is a connection hole to be a second electrode terminal, and 5 is a connection hole. Wiring holes to be the third electrode terminals are shown.

[0052]

As described above, according to the present invention, the initial object can be achieved. The printed circuit board for evaluating electronic components of the present invention enables mounting of various types of electronic components, and further, the time required for circuit configuration by mounting and connecting electrical components is shortened, facilitating automatic mounting of components. In other words, since the mounting areas for electronic components and circuit components and electrical components are displayed on the same substrate and these areas are regularly arranged in a matrix, the mounting of many electronic components can be automated by a robot or the like. Easy to do. Solder connection to the electrode terminals can be easily made by well-known automatic soldering.

[Brief description of drawings]

FIG. 1 is an enlarged perspective view of a main part schematically showing a printed circuit board according to an embodiment.

FIG. 2 is an enlarged plan view of a main part of a surface pattern of a printed circuit board according to an embodiment.

FIG. 3 is an enlarged perspective view of a main part schematically showing a printed circuit board according to another embodiment (having a plurality of lead holes).

FIG. 4 is an enlarged perspective view of a main part schematically showing a printed circuit board according to another embodiment (having a plurality of connection holes).

FIG. 5 is an enlarged perspective view of a main part schematically showing a printed circuit board according to another embodiment (having a plurality of wiring holes).

FIG. 6 is an enlarged perspective view of a main part schematically showing a printed circuit board according to still another embodiment (a plurality of wiring holes are electrically independent from each other).

FIG. 7 schematically shows a pattern of a printed circuit board according to still another embodiment (a plurality of connection holes and a plurality of wiring holes are provided, and the distances from the connection holes to the wiring holes are equal distances). FIG.

FIG. 8 is an enlarged perspective view of a main part schematically showing a printed circuit board according to still another embodiment (used as an electrode pattern for surface mounting).

FIG. 9 is an enlarged perspective view of a main part schematically showing a printed circuit board according to still another embodiment (on which an electronic component mounting socket is mounted).

FIG. 10 is a physical wiring circuit diagram of another embodiment.

11 is an enlarged plan view of the substantial wiring main part of the printed circuit board in which the circuit of FIG. 10 is realized on the printed circuit board of FIG.

FIG. 12 is a pattern configuration diagram of the printed circuit board of the present invention applied to mounting electronic components for standard DIP such as IC and LSI.

FIG. 13 is a pattern configuration diagram of a printed circuit board of the present invention which is also applied to mounting electronic components for shrink DIP.

FIG. 14 is a pattern configuration diagram of the printed circuit board of the present invention which is also applied to mounting an electronic component for SOP.

FIG. 15 is a pattern configuration diagram of the printed circuit board of the present invention which is also applied to mounting an electronic component for PGA.

16 is a pattern configuration diagram of the back surface (solder surface) of FIG.

FIG. 17 is a pattern configuration diagram of the printed circuit board of the present invention which is also applied to mounting an electronic component for QFP.

[Explanation of symbols]

1 ... Printed circuit board, 2, 7 ... Electronic component, 2a, 2b, 2c ... Electronic component lead, 3, 3a, 3b, 3c ... Lead hole (first electrode terminal), 4, 4a, 4b, 4c ... Connection Hole (second electrode terminal), 5, 5a, 5b, 5c ... Wiring hole (third electrode terminal), 6a, 6b, 6c ... Printed wiring pattern, 8 ... Resistor, 9 ... Jumper wire, 9a ... Zero ohm resistance , 10 ... Socket for mounting electronic parts, 11 ... Print pattern for power supply, 12 ... Print pattern for ground, 13, 14, 15, 16 ... Print pattern for signals, L1, L2, L3 ... Mounting position of circuit component electric parts, M1 ... Electronic component mounting area display mark, M2 ... Circuit component mounting area display mark.

Claims (13)

[Claims] 1. A plurality of electronic components under test, each of which is provided with a plurality of lead electrodes at predetermined intervals and symmetrically divided into two right and left series, and arranged in a matrix at predetermined intervals.
A printed circuit board, which is mounted and has these common input / output terminals on its periphery, wherein a first electrode terminal electrically connected to each of the lead electrodes and an electrical connection to the first electrode terminal are provided. Electrically connected and electrically connecting one terminal of the circuit component electric component, and three lines of a signal line, a power line and a ground are arranged adjacent to the second electrode terminal. And third electrode terminals which are provided on the respective wirings and electrically connect the other terminal of the circuit component electric component at a predetermined distance from the second electrode terminal on the same substrate. At the same time, a mounting position display mark for the electronic component under test, which surrounds a part or all of the first electrode terminal group, and a mounting position display mark for the circuit component electric component are arranged on the component mounting surface of the substrate. Evaluation test of electronic components Printed circuit board. 2. A plurality of electronic components under test, each of which is provided with a plurality of lead electrodes at a predetermined interval and symmetrically divided into two right and left series, arranged in a matrix at a predetermined interval,
A printed circuit board, which is mounted and has these common input / output terminals on its periphery, wherein a first electrode terminal electrically connected to each of the lead electrodes and an electrical connection to the first electrode terminal are provided. Electrically connected and electrically connecting one terminal of the circuit component electric component, and three lines of a signal line, a power line and a ground are arranged adjacent to the second electrode terminal. And third electrode terminals which are provided on the respective wirings and electrically connect the other terminal of the circuit component electric component at a predetermined distance from the second electrode terminal on the same substrate. At the same time, a printed circuit board for evaluation test of an electronic component, wherein a plurality of the first electrode terminals are arranged at a predetermined interval for one lead electrode of the at least one lead electrode row. 3. A plurality of the first electrode terminals are electrically connected to each other at a predetermined interval with respect to one lead electrode of the at least one lead electrode row. A printed circuit board for evaluation test of the electronic component according to 1. 4. The mounting parts are detachable when the lead electrodes have a pin structure and some or all of the first to third electrode terminals have a hole structure.
4. A printed circuit board for evaluation test of an electronic component according to any one of 3 to 3. 5. The printed board for evaluation test of an electronic component according to claim 1, which has a pad structure capable of mounting part or all of the first to third electrode terminals by surface mounting. 6. A plurality of the second electrode terminals are electrically connected to one lead electrode at a predetermined interval, and the second electrode terminals are connected to each other. Three
The printed circuit board for evaluation test of an electronic component according to any one of claims 1 to 3, wherein the printed circuit board is arranged so as to be lined up in a position substantially on the same straight line as the electrode terminal. 7. A plurality of the third electrode terminals are arranged to be electrically connected to one lead electrode at a predetermined interval, and the third electrode terminals are arranged to be electrically connected to each other. Two
A third electrode terminal corresponding to the same lead electrode of another electronic component on the same substrate is electrically connected to the third electrode terminal. A printed circuit board for an electronic component evaluation test according to any one of 1 to 3. 8. A plurality of the third electrode terminals are spaced apart from each other by a predetermined distance with respect to one lead electrode, and are insulated from each other in the same electronic component unit, and have the same relative distance from other adjacent electronic components. A third electrode corresponding to the same lead electrode of another electronic component on the same substrate while being electrically connected to each other at a position and arranged so as to be aligned with the second electrode terminal on a position substantially on the same straight line. The printed circuit board for evaluation test of an electronic component according to claim 1, wherein the electrode terminals are electrically connected to each other. 9. A plurality of the second electrode terminals and the third electrode terminals are arranged at predetermined intervals for one lead electrode, and the same electrode terminals are electrically connected to each other. In addition, the second and third electrode terminals are arranged so as to be aligned on substantially the same straight line.
A printed circuit board for evaluation test of any one of the electronic components. 10. The plurality of second electrode terminals and the plurality of third electrode terminals are arranged on the same straight line with each other, and each of them has the same interval as any one of the opposite electrode terminals. The printed circuit board for evaluation test of an electronic component according to claim 9, wherein the printed circuit board is arranged as follows. 11. A lead electrode of an electronic component under test is connected to and mounted on a first electrode terminal on a printed circuit board according to claim 1, and a measuring circuit configuration is provided on a second and a third electrode terminal. Printed circuit board for evaluation test that is connected and mounted with lead electrodes of parts. 12. A step of mounting an electronic component under test and a circuit component for measurement on a predetermined electrode terminal position of the printed circuit board according to claim 1, and soldering each component to the electrode terminal. A method of mounting a printed circuit board for evaluation test, which comprises a step of connecting. 13. An electronic component evaluation test method for connecting an input / output terminal of a printed circuit board according to claim 11 to an evaluation test control system and performing an electronic component evaluation test according to predetermined test items.