JPH058961U - Surface mount LED - Google Patents

Abstract

(57) [Abstract] [Purpose] A surface mount type that can be manufactured easily and at low cost, is stably fixed to the surface of a printed circuit board to be surface mounted, and is easily fixed at a predetermined mounting angle. Providing LEDs. A reflection frame portion having an LED chip 11 and a reflecting surface 12a supporting the LED chip and reflecting a light emitted from the LED chip in a direction of a predetermined angle and having a reflection axis of the predetermined angle. 12 and printed circuit board 1
5, the base portion 13 to be attached to the surface, and the conductive portion 14 formed along the surfaces of the reflection frame portion and the base portion.
The surface mount type LED is constructed from the above, and the reflective frame portion, the base portion and the conductive portion are integrally formed by the three-dimensional circuit board.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an improvement of an LED that emits light at a predetermined angle when mounted on the surface of a printed circuit board or the like.

[0002]

[Prior Art]

 Conventionally, when an LED is mounted on the surface of a printed circuit board or the like and light emitted from the LED is emitted at a predetermined angle, for example, in a lateral direction or an obliquely upward direction, a so-called forming LED is used as shown in FIG. 5, for example. It is implemented using. That is, in FIG. 5, the LED 1 includes two lead frames 2 and 3 extending substantially in parallel in the vertical direction and an LED chip (not shown) attached to the upper end of one of the lead frames 2. ) And a lens 4 molded by a transparent resin mold so as to cover the LED chips and the upper end regions of the lead frames 2 and 3, and below the lead frames 2 and 3 of the LED 1 having such a configuration. The lead portions 2a and 3a are bent at a predetermined angle as shown in the figure to form a so-called forming LED. As shown in FIG. 6, the LED 1 thus configured has the lead portions 2a and 3a vertically inserted into the mounting holes (not shown) previously provided at predetermined positions of the printed circuit board 5. The printed circuit board 5 is mounted by being fixed by soldering or the like. As a result, when power is supplied to the LED chip in the LED 1 through the lead portions 2a and 3a below the two lead frames 2 and 3, the LED chip emits light, and the light emitted from the LED chip is emitted from the lens 4 As a result, the light is emitted to the outside along the set optical axis direction of the sideways direction or the oblique direction.

[0003]

[Problems to be solved by the device]

 However, for the LED 1 shown in FIG. 5, it is necessary to bend the lower lead portions 2a and 3a of the lead frames 2 and 3 to a predetermined angle, but it is difficult to bend them accurately when bending. The bending position may be displaced, the bending angle may be varied, or the lead portions 2a and 3a may be broken in some cases, and bending of the lead portions 2a and 3a may cause a defective product. When mounted on the surface of a printed circuit board or the like, the LED 1 is unstable because it is supported only by the lead frames 2 and 3 made of thin metal wires on the printed circuit board, and a slight external force is applied. There is a problem that the lead frames 2 and 3 are bent and the entire LED 1 is tilted, or the lead frames 2 and 3 are broken in some cases. Even if the lead frames 2 and 3 themselves are not broken, the solder adhesion area is small at the places where the lead frames 2 and 3 and the circuit pattern formed on the printed circuit board are soldered. It is easy to remove and is a cause of failure. Further, when soldering the LED1 inserted in the printed circuit board, after inserting the lead frames 2 and 3 of the LED1 into the component mounting holes of the printed circuit board, a dedicated jig for holding the LED1 at a predetermined height is provided. There was a problem that the soldering work was complicated and the mounting angle varied due to the soldering.

In view of the above points, the present invention can be manufactured easily and at low cost, is stably fixed to the surface of a printed circuit board to be surface-mounted, and is easily fixed at a predetermined mounting angle. It is an object of the present invention to provide a surface mount type LED which is made possible.

[0005]

[Means for Solving the Problems]

 According to the present invention, the above object is to provide an LED chip and a reflection having a reflection axis of the predetermined angle for supporting the LED chip and reflecting light emitted from the LED chip in a direction of the predetermined angle. The reflecting frame portion is provided with a surface, a base portion to be attached to the surface of a printed circuit board, etc., and the reflecting frame portion and a conductive portion formed along the surface of the base portion. This is achieved by a surface mount type LED characterized in that the portion, the base portion and the conductive portion are integrally formed by a three-dimensional circuit board.

[0006]

[Action]

 According to the above configuration, the conductive portion corresponding to the lead frame in the conventional surface mount LED is integrally formed with the base portion having the reflection frame portion by the three-dimensional circuit board, so that the complicated shape is obtained. No matter what angle the reflection axis is, it is easily and inexpensively molded by a simple process. Further, since the shape of the reflection frame can be made into a desired shape, it is possible to obtain an arbitrary alignment characteristic aimed at a desired angle without using a resin-molded lens. Also, since the conductive part itself is integrally provided on the surface of the base part, even if an external force is applied, the conductive part will not be bent or bent, thus eliminating the defect of the lead terminal. To be done. Further, since the base portion functions to support the LEDs on the printed circuit board for mounting, the mounted state is stably held on the printed circuit board.

[0007]

【Example】

 Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the drawings. 1 and 2 show an embodiment of a surface mount LED according to the present invention. In the figure, a surface-mounted LED 10 supports an LED chip 11 and the LED chip 11, and reflects light emitted from the LED chip 11 in a direction of a predetermined angle (in the case of the drawing, lateral direction). In order to make it possible, the reflection frame portion 12 having the reflection surface 12a having the reflection axis of the predetermined angle, the base portion 13 to be attached to the surface of the printed circuit board 15, and the reflection frame portion 12 and the base portion 13 are attached. And a conductive portion 14 formed along the surface.

The reflection frame portion 12, the base portion 13 and the conductive portion 14 are formed on a three-dimensional circuit board by a method as exemplified in JP-A-63-128181 and JP-A-63-50482. Are integrally formed by.

As shown in the drawing, the conductive portion 14 extends from substantially the center of the reflection surface 12 a of the reflection frame portion 12 to the left along the reflection surface 12 a and reflects from the outside of the reflection surface 12 a. Along the outer surface of the frame portion 12 and the outer surface of the base portion 13, the first electrode 14a extending to the lower surface on the left side of the base portion 13 and the center of the reflecting surface 12a of the reflecting frame portion 12 are slightly shifted to the right. The second electrode 14b also extends from the open position to the right and extends to the lower surface on the right side of the base portion 13 along the outside of the reflection frame portion 12 and the base portion 13. Therefore, when the LED 10 is mounted on the surface of the printed circuit board 15 or the like, the portions of the electrodes 14a and 14b extending to the lower surface of the base portion are brought into contact with the conductive patterns provided on the printed circuit board 15. Is becoming

Further, the LED chip 11 is fixed to the end portion of the first electrode 14a by conductive bonding or the like at substantially the center of the reflection surface 12a of the reflection frame portion 12, so that the first electrode 14a is fixed. And is electrically connected to the end of the second electrode 14b by wire bonding.

The surface mount LED 10 according to the present invention is configured as described above, and by mounting the surface mount type LED 10 at a predetermined position on the surface of the printed circuit board 15 to be surface mounted, the base portion 13 of the two electrodes 14a and 14b is mounted. The portion extending to the lower surface is brought into contact with the conductive pattern provided on the printed board 15, and soldered by, for example, cream solder 16 or the like. As a result, when power is supplied to the LED chip 11 from that portion via the electrodes 14a and 14b, the LED chip 11 emits light, and at this time, the light emitted from the LED chip 11 is incident on the reflecting surface 12a. Light is reflected and travels along the reflection axis of the reflection surface 12a.

In FIG. 3, the reflection frame portion 12 is formed so as to also serve as the base portion 13, and the reflection axis of the reflection surface 12 a of the reflection frame portion 12 is configured to extend obliquely upward. Further, except that the front area of the reflecting surface 12a is covered with a lens 17 formed by resin molding, and the positioning pin 13a is integrally formed on the bottom surface of the base portion 13, The configuration is similar to that of the surface mount LED 10 of No. 1.

In this case, when the surface mounting is performed on the printed circuit board 15, the positioning pins 13a are fitted into the positioning holes previously provided at the mounting positions of the printed circuit board or the like, so that the surface mounting is performed. The mold LED 10 can be easily and surely positioned at a predetermined position of the printed circuit board 15 or the like, and the optical axis of the light emitted from the LED chip 11 of the LED 10 does not deviate with respect to the printed circuit board 15 or the like. The optical axis can be aligned so as to extend obliquely upward at a predetermined angle. Therefore, the light emitted from the LED chip 11 is reflected by the reflecting surface 12a and then radiated to the outside through the lens 17 along the reflection axis thereof. Thus, the surface-mounted LED 10 can be accurately mounted on a predetermined position of the printed circuit board 15 or the like by a simple work, and the soldering work can be easily automated.

[0014]

[Effect of the device]

 As described above, according to the present invention, the conductive portion corresponding to the lead frame in the conventional surface mount LED is integrally molded with the base portion having the reflection frame portion by the three-dimensional circuit board. Even if the shape is complicated or the reflection axis is at any angle, it can be easily formed at low cost by a simple process. Further, since the shape of the reflection frame can be made into a desired shape, it is possible to obtain an arbitrary alignment characteristic aimed at a desired angle without using a lens made of resin mold. Further, since the conductive portion itself is integrally provided on the surface of the base portion, even if an external force is applied, the conductive portion will not be bent or bent, so that the defect of the lead terminal is eliminated. Also, since the base part functions to support the LEDs on the printed circuit board for mounting, the mounting state is stably held on the printed circuit board, the reliability of soldering is improved, and the reflection is reflected. The mounting angle of the shaft does not shift during mounting. Thus, according to the present invention, it is easily manufactured at low cost, is stably fixed to the surface of the printed circuit board to be mounted, and can be easily fixed at a predetermined mounting angle. A surface mount LED is provided.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of a surface mount LED according to the present invention.

FIG. 2 is a perspective view of the surface mount LED of FIG.

FIG. 3 is a schematic cross-sectional view showing another embodiment of the surface mount LED according to the present invention.

FIG. 4 is a perspective view of the surface-mounted LED of FIG.

FIG. 5 is a perspective view showing an example of a conventional LED.

6 is a cross-sectional view showing a mounted state of the LED of FIG.

[Explanation of symbols]

 10 Surface Mount LED 11 LED Chip 12 Reflective Frame Part 12a Reflective Surface 13 Base Part 13a Positioning Pin 14 Conductive Part 14a Electrode 14b Electrode 15 Printed Circuit Board 16 Cream Solder 17 Lens

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI technical display location F21V 19/00 P 2113-3K

Claims (1)

Claims for utility model registration: 1. An LED chip and a reflection axis of the predetermined angle for supporting the LED chip and reflecting light emitted from the LED chip in a direction of the predetermined angle. A reflection frame portion having a reflection surface having, a base portion to be attached to the surface of a printed circuit board, and a conductive portion formed along the surfaces of the reflection frame portion and the base portion, and the reflection portion. The frame portion, the base portion and the conductive portion are integrally formed by a three-dimensional circuit board,
Surface mount LED.