JPH0590123A - Aligner - Google Patents

Abstract

(57) [Summary] [Structure] This exposure apparatus is an exposure apparatus that performs sequential exposure, and in one driving motor 38, an upper friction wheel 36a and a lower friction wheel 36a having a diameter ratio equal to the exposure magnification. A step wheel 36 having 36b, and second and third friction wheels 33 rollingly contacting the upper friction wheel 36a and the lower friction wheel 36b, respectively.
36 through the wafer scanning stage 22 and
The mask scanning stage 23 and the mask scanning stage 23 are simultaneously fed and driven at a ratio equal to the exposure magnification. [Effect] The mask and the work can be positioned and fed at a high speed with no time delay, so that there is an effect that a better exposure can be performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus that sequentially exposes wafers.

[0002]

2. Description of the Related Art For example, a semiconductor exposure apparatus uses an ultrahigh pressure Hg.
A spectrum of a predetermined wavelength is extracted from the lamp, and this is exposed through a condenser lens (hereinafter referred to as "pattern").
Part of the mask on which the mask is formed).
Then, the exposure apparatus is a pattern that passes through the mask.
The image is reduced or enlarged by a reduction projection lens or a magnification projection lens and projected onto the wafer. As a result, a part of the pattern is exposed on the wafer.

Further, in order to expose the entire pattern on the wafer, the exposure apparatus drives the mask and the wafer relative to the irradiation light from the lamp in accordance with the reduction rate or the enlargement rate. .. As a result, the entire mask pattern is sequentially exposed on the wafer.

An example of such an exposure apparatus is generally shown in FIG. In this exposure apparatus 1, a pair of guide rails 3 are arranged on a base 2 in parallel with each other,
On the guide rails 3 and 3, the first and second sliders 4 and
5 are slidably provided.

A wafer holding table 7 for holding the wafer 6 or the substrate is attached to the upper surface of the first slider 4, and a mask holding table for holding a mask 8 is attached to the upper surface of the second slider 4. 10 is attached.

On the upper surface of the base 2 between the pair of guide rails 3 and 3, a projection lens 1 for reduction or enlargement is provided.
1 is provided. The projection lens 11 is held on the upper surface of a support member 13 fixed to the upper surface of the base 2 with the optical axis thereof being horizontal.

The first and second sliders 4 and 5 are respectively guided by the first and second ball screw mechanisms 14 and 15 provided on the pair of guide rails 3 and 3, respectively. -It is designed to be driven separately along the channels 3 and 3.

The first drive motor 14a of the first ball screw mechanism 14 and the second ball screw mechanism 1 are also provided.
The second drive motor 15a of No. 5 is connected via the control unit 16. The control device 16 causes the first ball screw mechanism 14 to follow the feed of the second ball screw mechanism 15 and operate by a feed amount of a ratio equal to the magnification of the projection lens 11. Controlled.

According to this exposure apparatus 1, first, a lamp (not shown) is turned on to expose the mask 8 with the exposure light.
Is irradiated to a part (indicated by A in the figure) of the. The pattern that has passed through the mask 8 enters the projection lens 11 and is enlarged or reduced to a predetermined magnification to form an image on the wafer 6 (shown by B in the figure). As a result, a part of the pattern of the mask 8 is exposed on the part B of the wafer 6.

Next, the exposure apparatus 1 operates the second drive motor 15a to drive the second slider 5 by a predetermined amount to drive the mask 8 at a position where the light for exposure is irradiated. Move sequentially. On the other hand, the first drive motor 14
a is the second drive motor 1 through the control device 16
5a, the first slider 4 is successively fed and driven by an amount corresponding to the magnification of the projection lens 11. The exposure apparatus 1 performs the above-described operation over the entire mask 8 and sequentially exposes the entire pattern of the mask 8 onto the wafer 6. Further, as another exposure apparatus, there is one shown by 1'in FIG. The same components as those of the exposure apparatus 1 shown in FIG.

The support member 13 is provided on the upper surface of the base 1 so as to be rotatable around a rotary shaft 13a. Then, as will be described later, a connecting rod 18 for connecting the first and second sliders 4 and 5 is slidably inserted into the support member 13 with the optical axis of the projection lens 11 aligned with the axis. ing.

Further, one end of the connecting rod 18 is rotatably attached to one side surface of the second slider 5, and the other end is attached so as to penetrate from one side surface of the first slider 4 to the other side surface. There is.

Therefore, by pressing the other end of the connecting rod 18 in the direction shown by the arrow (a) in the figure, the connecting rod 18 can be rotated around the rotation axis of the supporting member 13, and As a result, the first and second sliders 3 and 4 are separated from each other by the principle of "lever" in the directions from the mask 8 to the projection lens 11 and the wafer 6 to the projection lens 11 in opposite directions. Move an amount equal to the ratio.

According to this apparatus, the pattern of the mask 8 is
The mask is exposed to the wafer 6 after being enlarged or reduced at a magnification equal to the ratio of the distance from the mask 8 to the projection lens 11 and the distance from the wafer 6 to the projection lens 11.

[0015]

By the way, in the exposure apparatus 1 shown in FIG. 2, the first ball screw mechanism 14 is used.
The second ball screw mechanism 1 based on the feed rate of
The feed error is fed back to 5. Since such follow-up control is a delay system, it is difficult to control the positional deviation with an accuracy of μm or less, which may cause a problem in accuracy.

On the other hand, in the exposure apparatus 1'shown in FIG. 3, there is no time delay between the feeding of the first slider 4 and the feeding of the second slider 5, but this exposure apparatus 1 '
′ Has a stripped mechanism because it drives the first and second sliders 4 and 5 linearly using the principle of “lever”.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an exposure apparatus in which the positioning accuracy between the mask and the wafer is good and the control is easy.

[0018]

SUMMARY OF THE INVENTION The present invention is an exposure apparatus for exposing a pattern formed on a mask to a work through a projection optical system at a predetermined magnification and holding the mask in a linear direction. A movably provided scanning stage for the mask and a work which holds the work in a state of facing the mask and is provided so as to be movable in a direction parallel to the first stage. The scanning stage for masks and the first contact portion integrally provided with the scanning stage for masks are arranged in contact with each other and are driven to rotate, so that the scanning stage for masks is linearly moved. The mask-side friction wheel to be driven is arranged in contact with a second contact portion integrally provided with the work scanning stage to be rotationally driven so that the work scanning station can be rotated.
And a mask-side friction wheel for driving the mask-side friction wheel and the work-side friction wheel to rotate at a rotational speed ratio equal to the exposure magnification. A driving force transmitting means connected to the work side friction wheel and the driving force transmitting means are driven to move the mask scanning stage and the work scanning stage to the mask side friction wheel and the work side. And a drive motor that feeds a predetermined amount at a constant speed through the friction wheel.

[0019]

According to this structure, by operating the drive motor, the mask scanning stage and the work scanning stage are simultaneously synchronized at the same ratio as the exposure magnification. It can be driven.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. The same components as those of the conventional example are designated by the same reference numerals and the description thereof will be omitted.

Reference numeral 21 in the drawing is a base of the exposure apparatus 20. The upper surface of the base 21 is formed flat. Then, at the one longitudinal end of the base 21, the base 21
A wafer scanning stage 22 (work scanning stage) and a mask scanning stage 23, which are reciprocally movable in the longitudinal direction, are arranged opposite to each other.

The wafer scanning stage 22 is slidably held by a first guide rail 25 provided at one end of the base 21 in the width direction. The mask scanning stage 23 is slidably held by a second guide rail 26 provided in parallel with the first guide rail 25 at the other widthwise end of the base 21. There is.

On the surface of the wafer scanning stage 22 facing the mask scanning stage 23, the wafer 6 as a work is vertically arranged so as to face the mask scanning stage 23. A minute amount adjustment table 27 is provided for holding and driving the wafer 6 by a minute amount in the XYZ and θ directions.

Further, the scanning stage 2 for the mask described above.
A mask holding table 28 for holding the mask 8 vertically is provided on the surface of the wafer 3 opposite to the surface facing the wafer scanning stage 22.

Then, the scanning station for the mask described above.
A projection lens 11 as a projection optical system for equalizing or reducing or enlarging the pattern of the mask 8 is provided between the facing surfaces of the wafer 23 and the wafer scanning stage 22.

Further, the wafer scanning stage 22 and the mask scanning stage 23 serve as first and second contact portions which are horizontally projected from the other end of the base 21 in the longitudinal direction. Rod-shaped first and second drive arms 3
0 and 31 are provided.

The free end of the first drive arm 30 has a first friction wheel 32 provided at the other longitudinal end of the base 21 and a second friction wheel as a work side friction wheel. It is sandwiched between the car 33 and held in a frictional state. The first friction wheel 32 is driven by a biasing means (not shown) to drive the first drive gear.
The friction force of the second friction wheel 33 and the first drive arm 30 is increased by being urged toward the arm 30.

The free end of the second drive arm 31 is provided at the other end of the base 21 in the longitudinal direction. The third friction wheel 34 and the fourth friction wheel 35 function as mask side friction wheels. It is sandwiched between and and is held in a frictional state. The fourth friction wheel 35
Is a second drive arm 3 by an urging means (not shown).
It is urged toward No. 1 to increase the frictional force between the third friction wheel 34 and the second drive arm 31.

The second friction wheel 33 and the third friction wheel 34
Between them, an upper friction wheel 36a that contacts the second friction wheel 33 on the upper side and a lower friction wheel 36b that contacts the third friction wheel 34 on the lower side serve as driving force transmission means. The vehicle 30 (two-stage friction wheel) is the above-mentioned upper and lower friction wheels 3
6a and 36b are respectively the second and third friction wheels 33,
It is provided in a state of rolling contact with 34. This step car 36
The ratio of the diameter of the lower friction wheel 36b to the diameter of the upper friction wheel 36a is formed to be the same as the enlargement (reduction) magnification of the pattern.

Further, at the center of the other end of the base 21 in the longitudinal direction, a drive motor 38 whose axis is vertical is provided. A fifth friction wheel 39, which is in rolling contact with the upper friction wheel 36a of the step wheel 36, is provided at the upper end of the drive shaft of the drive motor 38.
Is fixed.

A sixth friction wheel 40, which urges the step wheel 36 toward the fifth friction wheel 39, is rotatably provided on the opposite side of the fifth wheel 39 from the step wheel 36. Has been.

That is, when the drive motor 38 rotates in the direction shown by the arrow in the figure, the step wheel 36 is driven,
As a result, the second and third friction wheels 33 and 34 are rotationally driven. As a result, the first and second drive arms 30 and 31 are driven in opposite directions. At this time, the first drive arm 30 is driven at the same speed as the peripheral speed of the upper friction wheel 36a of the step wheel 36, and the second drive arm 31 is driven by the lower friction wheel of the step wheel 36. It is driven at the same speed as the peripheral speed of the car 36b.

Therefore, the mask scanning stage 23 and the wafer scanning stage 22 are relatively driven in opposite directions at a speed corresponding to the magnification of the projection lens 11.

A lamp (not shown) for irradiating the mask 8 with exposure light is provided outside the mask scanning stage 23. Light from this lamp is applied to a part of the mask 8 as in the conventional example, and the pattern from the mask 8 passes through the projection lens 11 and is held on the wafer scanning stage 22. 6 is exposed. Next, the operation of the exposure apparatus 20 of the present invention will be described.

The exposure apparatus 20 first sets the pattern of the mask 8 held on the mask scanning stage 23 and the exposure position of the wafer 6 held on the wafer scanning stage 22. Align. For this purpose, the exposure apparatus 20 operates the minute amount adjustment table 27 of the wafer scanning stage 22 in the XYZ and θ directions.

Then, the exposure device 20 operates the lamp (not shown) to irradiate a part A of the mask 8 with exposure light. As a result, a part of the pattern of the mask 8 enters the projection lens 11, is enlarged (reduced) by the projection lens 11, and is irradiated to the corresponding portion B of the wafer 6. As a result, part B of the wafer 6 is exposed.

The exposure apparatus 20 is provided with the drive motor 38.
Is operated to simultaneously drive the mask scanning stage 23 and the wafer scanning stage 20, and the mask 8 and the wafer 6 are moved with respect to the exposure light to perform successive exposure.

That is, the upper friction wheel 36 of the step wheel 36.
Since the outer diameter of "a" and the outer diameter of the lower friction wheel 36b are formed to have the same ratio as the exposure magnification, the mask scanning stage 23 and the wafer scanning stage 22 are exposed to each other. Is driven in a relatively opposite direction at a constant speed by an amount corresponding to.

Further, the patterning of the mask 8 and the corresponding precise alignment of the exposed portion of the wafer 6 are performed by the minute amount adjusting stage 27 in real time. The misalignment between the scanning stage 23 and the wafer scanning stage 22 is corrected. As a result, the pattern of the mask 8 is
The wafers are sequentially exposed to predetermined portions of the wafer 6.

According to such a configuration, the exposure apparatus 2 described above
No. 0 is designed so that one driving motor 38 simultaneously drives the wafer side and the mask scanning stages 22 and 23, so that there is no time delay and the wafer 6 can be more accurately measured.
And the mask 8 can be positioned.

Further, according to the above-mentioned exposure apparatus 20, by using a plurality of friction wheels 33 to 36, 39 and 40 in the drive system, rattling of the drive system can be reduced and high speed can be achieved at a desired speed. The wafer-side and mask-side scanning stages 22 and 23 can be started, fed and stopped with high accuracy.

Further, the exposure apparatus 20 is positioned by frictional driving by the plurality of friction wheels 33 to 36, 39, 40, and positioning by the minute amount adjustment table 27 attached to the wafer scanning stage 22. When used together, a submicron order synchronization accuracy can be obtained. It should be noted that the present invention is not limited to the above-described embodiment, but can be variously modified without changing the gist of the invention.

For example, in the above-mentioned one embodiment, the step wheel 36 is used as the driving force transmitting means, but the second and third friction wheels 33 and 34 are driven at the rotation ratio corresponding to the magnification of the projection lens 11. As long as it is possible, a plurality of other friction wheels may be used, or belt drive or wire drive may be used. Further, although the projection lens 11 is used as the projection optical system in the above-mentioned one embodiment, it may be a projection optical system using a reflection mirror.

[0044]

As described above, the exposure apparatus of the present invention is an exposure apparatus that performs sequential exposure, and uses one drive motor,
The mask scanning stage and the work scanning stage are simultaneously fed and driven through a friction wheel at a ratio equal to the exposure magnification.

According to such a structure, the mask and the work can be fed and positioned with high accuracy and with no time delay, so that better exposure can be performed.

[Brief description of drawings]

FIG. 1 is an overall perspective view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing a conventional example.

FIG. 3 is a perspective view showing a conventional example.

[Explanation of symbols]

6 ... Wafer (work), 8 ... Mask, 11 ... Projection lens, 20 ... Exposure device, 22 ... Wafer scanning stage (work scanning stage), 23 ... Mask scanning stage , 27 ... Micro amount adjustment table,
30 ... 1st drive arm (1st contact part), 31 ... 2nd
Drive arm (second contact portion) 33, second friction wheel,
34 ... Third friction wheel, 36 ... Step wheel, 36a ... Upper friction wheel, 36b ... Lower friction wheel, 38 ... Driving motor.

Claims (1)

[Claims] 1. An exposure device for exposing a pattern formed on a mask to a work at a predetermined magnification through a projection optical system, the mask being held by the mask and movably provided in a linear direction. A scanning stage, a scanning stage for the work, which is held in a state of facing the mask to the mask and is movable in a direction parallel to the first stage; Scanning station for the above mask
A friction wheel on the mask side, which is arranged in contact with a first contact portion provided integrally with the gear to drive the mask scanning stage in a linear direction by being rotationally driven;
A work for driving the scanning stage for work in a linear direction by being placed in contact with a second contact portion integrally provided with the scanning stage for work and driven to rotate.
The friction wheel on the mask side, and the friction wheel on the mask side and the friction wheel on the work side are connected to the friction wheel on the mask side and the friction wheel on the work side so that they are driven to rotate at a rotational speed ratio equal to the magnification of the exposure. The driving force transmitting means and the driving force transmitting means are driven to determine the mask scanning stage and the work scanning stage through the mask side friction wheel and the work side friction wheel. An exposure apparatus having a drive motor for feeding a predetermined amount at high speed.