JPH0590429A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH0590429A JPH0590429A JP3248714A JP24871491A JPH0590429A JP H0590429 A JPH0590429 A JP H0590429A JP 3248714 A JP3248714 A JP 3248714A JP 24871491 A JP24871491 A JP 24871491A JP H0590429 A JPH0590429 A JP H0590429A
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- resin
- cap
- semiconductor device
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0172—Seals
- B81C2203/019—Seals characterised by the material or arrangement of seals between parts
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】
【目的】 セラミックのキャップ及び基板より成るパッ
ケージにて、キャップの接着構造を改善する。
【構成】 キャップの封止に樹脂を用いる場合、セラミ
ックケース１１とセラミックキャップ１２の封着面を傾
斜形状とし、これにより封着樹脂１３の流れの均一化、
樹脂内の気泡逸脱をはかることができる。
(57) [Summary] [Objective] To improve the bonding structure of a cap in a package consisting of a ceramic cap and a substrate. When a resin is used for sealing the cap, the sealing surfaces of the ceramic case 11 and the ceramic cap 12 have an inclined shape, which makes the flow of the sealing resin 13 uniform.
Bubble escape in the resin can be measured.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体装置に関し、特
に、キャップの封止時に樹脂を用いる半導体装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a semiconductor device which uses a resin when sealing a cap.
【０００２】[0002]
【従来の技術】従来の半導体装置では、図３に示される
如く、筒状壁を持つセラミックスケース３１と平面セラ
ミックスキャップ３２により素子封止を行う場合、また
は図４に示される如く、平面セラミックスケース４１と
筒状壁をもつセラミックスキャップ４２により素子封止
を行う場合等が知られている。2. Description of the Related Art In a conventional semiconductor device, as shown in FIG. 3, elements are sealed by a ceramic case 31 having a cylindrical wall and a flat ceramic cap 32, or as shown in FIG. It is known that the element is sealed with 41 and a ceramics cap 42 having a cylindrical wall.
【０００３】上記いずれの場合等でも封着面はケース及
びキャップ共に平面形状であり、互いの封着は樹脂によ
り行われる。In any of the above cases, the sealing surface of both the case and the cap is flat, and the mutual sealing is performed by resin.
【０００４】樹脂の接着方法については、特開昭６３−
１９０３４５号公報に開示されているように、接着前処
理として、低圧処理と高圧処理を交互に行うことにより
接着樹脂の気泡発生や厚みばらつきの防止を行う方法が
提案されている。A method for adhering resin is disclosed in JP-A-63-
As disclosed in Japanese Patent No. 190345, as a pre-bonding treatment, a method has been proposed in which low-pressure treatment and high-pressure treatment are alternately performed to prevent generation of air bubbles and variation in thickness of the adhesive resin.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、従来の
封止技術では、接着面が互いに平面なるが故に、樹脂内
の気泡の逃げ道がなく封止前に低圧脱気等を行っても封
止後に接着面に気泡が残る課題があった。However, in the conventional sealing technique, since the bonding surfaces are mutually flat, there is no escape route for air bubbles in the resin, and even if low-pressure degassing is performed before sealing, after sealing. There was a problem that air bubbles remained on the adhesive surface.
【０００６】本発明は従来の上記実情に鑑みてなされた
ものであり、従って本発明の目的は、従来の技術に内在
する上記課題を解決することを可能とした新規な半導体
装置を提供することにある。The present invention has been made in view of the above conventional circumstances, and therefore, an object of the present invention is to provide a novel semiconductor device capable of solving the above problems inherent in the conventional art. It is in.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明に係る半導体装置は、ケースまたは基板及び
キャップの封止・封着面に適当な傾斜角・形状を備えて
構成される。In order to achieve the above object, a semiconductor device according to the present invention is configured such that the sealing / sealing surfaces of a case or a substrate and a cap are provided with appropriate inclination angles and shapes. .
【０００８】[0008]
【実施例】次に本発明をその好ましい各実施例について
図面を参照しながら具体的に説明する。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will now be specifically described with reference to the drawings for each of its preferred embodiments.
【０００９】図１は本発明による第１の実施例を示す断
面図である。FIG. 1 is a sectional view showing a first embodiment according to the present invention.
【００１０】図１を参照するに、参照番号１１はセラミ
ックケース、１２はセラミックキャップ、１３は封着樹
脂、１４は半導体素子、１５はボンディングワイヤをそ
れぞれ示している。Referring to FIG. 1, reference numeral 11 is a ceramic case, 12 is a ceramic cap, 13 is a sealing resin, 14 is a semiconductor element, and 15 is a bonding wire.
【００１１】本第１の実施例では、セラミックキャップ
１２の接着面が凸状の三角形となっており、セラミック
ケース１１側の接着面が凹状の三角形となっている。こ
こで必要なことは凸面が凹面より鋭角を有することであ
り、これにより接着面内での樹脂が接着時に一定方向へ
流れ、これに伴い樹脂の不均一性、気泡不良が解消され
る。In the first embodiment, the bonding surface of the ceramic cap 12 is a convex triangle, and the bonding surface on the ceramic case 11 side is a concave triangle. What is required here is that the convex surface has a sharper angle than the concave surface, so that the resin in the bonding surface flows in a certain direction at the time of bonding, and accordingly nonuniformity of the resin and bubble defects are eliminated.
【００１２】図２は本発明による第２の実施例を示す断
面図である。FIG. 2 is a sectional view showing a second embodiment according to the present invention.
【００１３】図中参照番号は図１と同じ要素には同一の
番号を付している。本第２の実施例では接着面形状を曲
面状としており、こうすることにより樹脂へのダメージ
を低減すると共に、さらにこの場合には、接着樹脂１３
をキャップ２２側に塗布する為にキャップ側を凹面とす
ることにより樹脂の塗布均一性が向上する効果がある。
本実施例でも、凸面を凹面の曲率よりも小さくすること
により樹脂を外側へ意図的に流れる様にすることは前記
第１の実施例と同様である。In the figure, the same reference numerals are given to the same elements as those in FIG. In the second embodiment, the shape of the adhesive surface is a curved surface, which reduces damage to the resin, and in this case, the adhesive resin 13
In order to apply the resin to the cap 22 side, by making the cap side concave, there is an effect that the resin application uniformity is improved.
Also in this embodiment, the resin is intentionally allowed to flow outward by making the convex surface smaller than the curvature of the concave surface, as in the first embodiment.
【００１４】[0014]
【発明の効果】以上説明したように、本発明によれば、
ケースもしくは基板及びキャップの封止・封着面に適当
な傾斜角・形状を持つことにより、特に粘度が高い樹脂
を接着剤として用いた場合に、接着面内での樹脂が一定
方向へ流れ、これにより樹脂の不均一性、気泡不良を解
消することができる。As described above, according to the present invention,
By having an appropriate inclination angle and shape on the sealing / sealing surface of the case or the substrate and the cap, the resin in the bonding surface flows in a certain direction when a resin having a particularly high viscosity is used as an adhesive. As a result, non-uniformity of the resin and bubble defects can be eliminated.
【図１】本発明による第１の実施例を示す断面図であ
る。FIG. 1 is a sectional view showing a first embodiment according to the present invention.
【図２】本発明による第２の実施例を示す断面図であ
る。FIG. 2 is a sectional view showing a second embodiment according to the present invention.
【図３】従来技術の第１の例を示す断面図である。FIG. 3 is a sectional view showing a first example of the prior art.
【図４】従来技術の第２の例を示す断面図である。FIG. 4 is a sectional view showing a second example of the prior art.
１１、２１、３１、４１…セラミックケース １２、２２、３２…セラミックキャップ １３…封着樹脂 １４…半導体素子 １５…ボンディングワイヤ 11, 21, 31, 41 ... Ceramic case 12, 22, 32 ... Ceramic cap 13 ... Sealing resin 14 ... Semiconductor element 15 ... Bonding wire
Claims (3)
脂を用いる半導体装置において、ケースもしくは基板及
びキャップの封止・封着面に所定の傾斜形状を持つこと
を特徴とする半導体装置。1. A semiconductor device, in particular, a semiconductor device using a resin for sealing a cap, wherein a sealing or sealing surface of a case or a substrate and a cap has a predetermined inclined shape.
凸状の三角形状としたことを更に特徴とする請求項１に
記載の半導体装置。2. The inclined shape of the sealing / sealing surface is concave.
The semiconductor device according to claim 1, further comprising a convex triangular shape.
凸状の曲面状としたことを更に特徴とする請求項１に記
載の半導体装置。3. The inclined shape of the sealing / sealing surface is concave.
The semiconductor device according to claim 1, further comprising a convex curved surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3248714A JPH0590429A (en) | 1991-09-27 | 1991-09-27 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3248714A JPH0590429A (en) | 1991-09-27 | 1991-09-27 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0590429A true JPH0590429A (en) | 1993-04-09 |
Family
ID=17182252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3248714A Pending JPH0590429A (en) | 1991-09-27 | 1991-09-27 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0590429A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0798764A3 (en) * | 1996-03-28 | 2002-06-12 | NEC Compound Semiconductor Devices, Ltd. | Hollow package manufacturing method and apparatus |
| JP2005505141A (en) * | 2001-09-28 | 2005-02-17 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Sealing member for OLED device |
| WO2016143845A1 (en) * | 2015-03-11 | 2016-09-15 | 田中貴金属工業株式会社 | Sealing cap for electronic component |
| WO2020149188A1 (en) * | 2019-01-17 | 2020-07-23 | 三菱電機株式会社 | Semiconductor device and method for manufacturing semiconductor device |
| US20220236512A1 (en) * | 2019-08-08 | 2022-07-28 | Mitsubishi Electric Corporation | Optical sensor module |
-
1991
- 1991-09-27 JP JP3248714A patent/JPH0590429A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0798764A3 (en) * | 1996-03-28 | 2002-06-12 | NEC Compound Semiconductor Devices, Ltd. | Hollow package manufacturing method and apparatus |
| JP2005505141A (en) * | 2001-09-28 | 2005-02-17 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Sealing member for OLED device |
| WO2016143845A1 (en) * | 2015-03-11 | 2016-09-15 | 田中貴金属工業株式会社 | Sealing cap for electronic component |
| JP2016171143A (en) * | 2015-03-11 | 2016-09-23 | 田中貴金属工業株式会社 | Electronic component encapsulation cap |
| KR20170106467A (en) * | 2015-03-11 | 2017-09-20 | 다나카 기킨조쿠 고교 가부시키가이샤 | Cap for sealing electronic parts |
| CN107408536A (en) * | 2015-03-11 | 2017-11-28 | 田中贵金属工业株式会社 | Electronic component sealing cap |
| US10103077B2 (en) | 2015-03-11 | 2018-10-16 | Tanaka Kikinzoku Kogyo K.K. | Sealing cap for electronic component |
| WO2020149188A1 (en) * | 2019-01-17 | 2020-07-23 | 三菱電機株式会社 | Semiconductor device and method for manufacturing semiconductor device |
| JPWO2020149188A1 (en) * | 2019-01-17 | 2021-09-30 | 三菱電機株式会社 | Semiconductor devices and manufacturing methods for semiconductor devices |
| US20220236512A1 (en) * | 2019-08-08 | 2022-07-28 | Mitsubishi Electric Corporation | Optical sensor module |
| US12541075B2 (en) * | 2019-08-08 | 2026-02-03 | Mitsubishi Electric Corporation | Optical sensor module |
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