JPH0590458A - Heat-absorption/heat build-up module - Google Patents

Abstract

(57) [Abstract] [Structure] Alloy tip of n-type and p-type via electrodes 2a and 2b
Both ends of 6, 7 are alternately and continuously joined, the substrate 1 is provided on one electrode 2a side, and the heat exchanger main body 1b having the heat exchange section 3 is provided on the other electrode 2b side. [Effect] The movement of heat absorption or heat generation becomes extremely smooth, and the original performance of the module can be brought out.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an endothermic heat generating module in which the main body of the module also serves as a direct heat exchange portion.

[0002]

2. Description of the Related Art In recent years, an endothermic heat generating module (commonly referred to as a Peltier module) has been widely used in various fields such as local cooling of circuits and dehumidification, keeping constant temperature, and other industrial and private demands. The basic configuration of the conventional module used for these is described below.

FIG. 3 is a sectional view showing the structure of a conventional endothermic heat generating module. In FIG. 3, 31 is an insulating substrate to which an electrode 32 is attached, 33 is an n-type chip, 34 is a p-type chip, and the electrode 32 and each of the chips 33 and 34 are joined by soldering.
np ... are repeated and sandwiched between the insulating substrates 31. Lead wires 35a and 35b are joined to both ends of the electrode 32.

The operation of the heat-absorption and heat-generating module configured as described above will be described below. When a direct current is applied between the lead wires 35a and 35b, heat is generated on one surface 31a where the joints of the n-type chip 33 and the p-type chip 34 are lined up, and the other side where the joints of p and n are lined up. Heat is dissipated at 31b. If the direction of the current is reversed, the heat absorption and heat generation parts are reversed. Therefore, a continuous heat absorbing surface can be obtained by determining the current direction.

[0005]

In the above-mentioned conventional configuration, the module is brought into contact with the wall surface of the device which is going to absorb or heat. When trying to absorb heat from a device, a heat radiation fin is attached to the other surface 31b and a fan promotes heat radiation from the fin to perform a heat absorbing operation. The heat is transferred from the object to be absorbed or heated to the wall surface of the device, and further transferred to the module. This heat transfer uses a method of bringing the surface of the substrate 31 of the module into contact with the wall surface of the device, so that the heat conduction is poor and the inherent performance of the module cannot be fully exerted, and there has been a strong demand for this improvement. Further, since the module is attached to the wall surface of the device by tightening the whole module with screws, the module is often damaged.

The present invention solves the above-mentioned problems of the prior art. By providing a heat exchanger body on one side of the module so that heat can be directly exchanged, it is possible to eliminate the difficulty of heat transfer due to mere contact of the substrate. The first purpose is to do. A second object is to make it possible to easily attach the module to a target device that absorbs heat or heat without damage.

[0007]

SUMMARY OF THE INVENTION In order to achieve the first object, the present invention is one in which both ends of an n-type and a p-type alloy tip are alternately and continuously joined via an electrode and one electrode side is connected. Is provided with a substrate, and a heat exchanger body having a heat exchange section is provided on the other electrode side. In order to achieve the second object, a mounting flange is provided on the other electrode side of the heat exchanger body.

[0008]

According to the present invention, when the module is used, the heat exchanging portion of the heat exchanger main body is brought into direct contact with the target substance instead of being attached to the wall surface of the equipment as in the case of using the conventional endothermic heat generating module. By making it possible to reduce the number of contact points due to mounting, heat transfer of heat absorption is extremely smooth, and the original performance of the module can be brought out.

Further, since the module can be securely and easily attached to the equipment by the attachment flange provided on the heat exchanger body, it is possible to prevent the damage at the time of attachment which has been conventionally caused.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing the structure of the present invention. In this figure, 1 is a substrate on which an electrode 2a is attached. Reference numeral 1b denotes a heat exchange section body to which the electrode 2b is attached, which includes a heat exchange section 3 having fins and a flange 5 provided with an attachment screw hole 4. The n-type chip 6 and the p-type chip 7 are arranged and joined to the electrodes 2a and 2b in the order of npnp. Lead wires 8a, 8b for energization are attached to the electrodes 2b at both ends.

The operation will be described below. In FIG. 1, the lower part is the heat absorption side and the upper part is the heat generation side. When a direct current is passed in the direction from the lead wires 8a to 8b, the current flows through the electrode 2b, the chip 6, the electrode 2a,
The chip 7 and the electrode 2b flow in this order to generate a heat absorbing portion and a heat generating portion. The operational performance of this module was tested under the conditions shown in FIG. In FIG. 2, the heat exchange part 3 is immersed in a stainless steel container 31 containing water 30 as a target substance, and the flange 5 is fastened with a screw 33 and a nut 34 via a packing 32. A radiation fin 29 is attached to the substrate 1 of the module. This action is intended to cool the water 30. When a direct current is applied to the lead wires 8a and 8b, the heat absorption and heat generation module operates as described above, and the heat absorbed by the heat exchange section 3 from the water 30 continues to be dissipated from the heat radiation fins 29.

The following results are obtained by comparing the conventional heat absorption and heat generation module shown in FIG. 3 with the temperature drop of the water 30 due to the heat absorption, which is attached to the outer wall of the container similar to the above embodiment. The endothermic heat generating module used in this test is the maximum current 6.3 A, the maximum voltage 8.2 for both the product of the present invention and the conventional product.
V, 71 pairs of chips were used. (Module of the present invention) 1 liter of water used ... Time required from 30 ° C to 10 ° C: 90
Min (conventional module) Water consumption 1 liter… Time required from 30 ℃ to 10 ℃ ： 15
0 min The material of the equipment used here is an alumina substrate, but it goes without saying that any other electrically insulating substrate can be used.

[0013]

According to the present invention, when the module is used, since the part to be joined to the wall surface of the equipment is eliminated, the contact heat transfer resistance due to the mounting is eliminated, and the heat absorption or the heat transfer is extremely smooth. It is possible to pull out. Furthermore, since the mounting flange provided on the heat exchange section main body can surely and easily mount the module to the device, damage to the module due to the mounting is eliminated and the effect is great.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of an endothermic heat generating module according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a usage state of an endothermic heat generating module.

FIG. 3 is a sectional view of a conventional endothermic heat generating module.

[Explanation of symbols]

 1 substrate 1b heat exchanger body 2a, 2b electrode 3 heat exchange part 4 screw hole 5 mounting flange 6 n-type chip 7 p-type chip

Claims (2)

[Claims] 1. A heat exchanger main body having n-type and p-type alloy chips joined alternately and continuously through electrodes, a substrate provided on one electrode side, and a heat exchange section provided on the other electrode side. Endothermic heat generating module. 2. The endothermic heat generating module according to claim 1, wherein a mounting flange is provided on the other electrode side of the heat exchanger body.