JPH0590738A - Manufacture of injection molding circuit parts - Google Patents

Abstract

(57) [Abstract] [Purpose] In manufacturing molded circuit parts, it is possible to simplify and unify the catalyst applying step for imparting conductivity only to the desired circuit forming portion on the surface of the molded product. To do. [Structure] After forming a molded article 1 by injection molding of a resin-molded substrate, wrapping a region other than the circuit-forming portion with a film 2 and then performing pretreatment for circuit formation, the entire surface is left uncoated. An electroplating catalyst is applied, and then the wrapping film 2 on the surface is peeled off to form a conductive portion 4 by electroless plating.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing molded circuit parts by injection molding.

[0002]

2. Description of the Related Art Generally, as a method of manufacturing a molded circuit portion, a two-color molding method in which a resin containing a plating catalyst for applying a plating catalyst only to a circuit forming portion and a resin without a catalyst are combined, or a catalyst is applied to the surface After that, a method of masking a portion other than the circuit and irradiating with ultraviolet rays to fix the catalyst on the circuit molded portion and then removing the catalyst other than the circuit formed portion is used.

[0003]

However, in the two-color molding method, the amount of the catalyst in the resin containing the plating catalyst, which is the circuit forming portion, has to be small because of the limitation of the insulation resistance characteristics of the resin. The deposition property for forming a circuit in electroless plating for imparting properties was very slow. Further, since it is a two-step molding, it is necessary to put the primary molded product into the mold for the secondary molding again, and at this time, it takes time and labor to deburr the primary molded product in advance. Also, because it is a two-color molding, the combination of molding materials is
The selection range was very small due to the restriction of the resin characteristics.

On the other hand, in the case of the ultraviolet irradiation method, it is necessary to wash away or chemically remove the plating catalyst other than the circuit forming portion after fixing the circuit portion, and therefore the manufacturing process is complicated.

Therefore, an object of the present invention is to simplify and unify the step of applying a plating catalyst for imparting conductivity to the surface of a molded product in the production of the above-mentioned molded circuit component.

[0006]

In order to achieve the above object, a method of manufacturing an injection molded circuit component according to the present invention comprises forming a molded product by injection molding a resin molding base material, and then forming an area other than the circuit forming portion. After wrapping with a film and then performing pretreatment for circuit formation, apply electroless plating catalyst to the part that should be the conductive part of the surface, and then peel off the wrapping film on the surface and electroless plating To form a conductive portion.

[0007]

In the manufacturing of the molded circuit component, the process of applying the plating catalyst only to the circuit forming portion can be simplified, and the manufacturing process can be shortened. At the same time, the surface roughening by the pre-plating treatment covers the parts other than the circuit formation of the molded part with the film in advance, so the surface is roughened only on the circuit formation part, and the film is peeled off after the catalyst application. The plating catalyst remains only on the circuit formation portion, and the surface of the portion other than the circuit formation is not damaged in appearance.

The lapping film used in the method of producing the molded circuit component is acid resistant so that it can sufficiently withstand the pretreatment of plating. In addition, even if the surface of the component cannot be completely removed after peeling, it has the property that it can be sufficiently removed from the surface in the plating solution or any alkaline solution, but peeling occurs in the alkaline step during pretreatment. It is a film that has alkali resistance to the extent that it does not.

The simplest method for wrapping the film on the surface of the molded product is to return the molded product to the mold of the molding machine once and wrap it in the mold.

As a molding material for this molded circuit component, a resin called engineering plastic is used in consideration of composition, dimensional stability, electrical characteristics and thermal characteristics.

As a method of forming a circuit on the surface after molding,
The molding method may be a combination of different molding materials or a single molding material. All are made of plating grade material.

[0012]

An embodiment of the present invention will be described with reference to the accompanying drawings.

As a concrete manufacturing method, as shown in FIG. 1 (a), first, an engineering plastic is used to make a resin molded product 1 for a formed circuit component by injection molding. Next, this is put into a film lapping die, and as shown in FIG. 1B, the surface region of the circuit component other than the circuit forming component is covered with the lapping film 2. Next, this molded product is subjected to a pre-plating treatment for forming a plated film, and then a catalyst is applied to the entire molded part. After that, the film 2 is peeled off from this surface, and the plating catalyst is left only on the circuit forming portion as shown as the catalyst coating portion 3 in FIG. 1 (c). In this way, after the catalyst is applied only to the desired circuit forming portion, the circuit portion 4 is formed on the surface of the molded body by electroless plating.

[0014]

As described above, according to the present invention, in the step of imparting conductivity in the production of molded circuit parts, after the portion other than the circuit formation is wrapped with a film, a plating catalyst is applied to the surface and the film is peeled off. Since the plating catalyst is left only on the circuit forming portion, the application of the plating catalyst only on the circuit forming portion of the molded circuit component is extremely simplified, and the manufacturing process can be shortened. .

In addition, regarding the surface roughening by the pretreatment of plating, the surface of the molded part other than the circuit formation is covered with the film in advance, so that the surface is roughened only in the circuit formation part and the film is peeled off after the catalyst application. Therefore, the effect that the plating catalyst remains only in the circuit formation portion and the surface of the portion other than the circuit formation is not damaged in appearance is obtained.

[Brief description of drawings]

FIG. 1 is a diagram showing a method of manufacturing a molded circuit component according to an embodiment of the present invention.

[Explanation of symbols]

 1 Resin molded product 2 Lapping film 3 Catalyst coated part 4 Circuit part

Claims (1)

[Claims] 1. After forming a molded article by injection molding of a resin molded substrate, the area other than the circuit forming portion is wrapped with a film, and then subjected to pretreatment for circuit formation, and then the surface has conductivity. A method for producing an injection molded circuit component, which comprises applying an electroless plating catalyst to a portion to be a portion, and then peeling off the wrapping film on the surface to form a conductive portion by electroless plating.