JPH0590781U - Reed relay mounting structure - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a reed relay mounting structure capable of increasing mounting density. [Structure] Two sub-print boards 7A and 7B are arranged with their plate surfaces facing each other in parallel, and the signal lines 2A and 2B of the reed switch 2 are supported by being spanned within this facing interval. A conductive pipe 8 made of a non-magnetic material is arranged on the outer periphery of the reed switch, and the signal line of the reed switch 2 is formed into a coaxial structure line by this conductive pipe, impedance matching is performed, and an exciting coil is provided on the outer periphery of the conductive pipe. Wrap and form a reed relay. A connection portion 9 is provided on one side of the sub-printed board, and a reed relay is connected to another printed board 4 via this connection portion 9.

Description

[Detailed description of the device]

[0001]

[Industrial application]

 The present invention relates to a reed relay mounting structure that can be used in a device that handles high-speed signals, such as an IC tester.

[0002]

[Prior Art]

 FIG. 5 shows the structure of a conventional reed relay. In the conventional reed relay, the reed switch 2 and the exciting coil 3 are enclosed inside the insulating case 1, and the terminals 2A and 2B of the reed switch 2 and the terminals 3A and 3B of the exciting coil 3 are derived from one surface of the insulating case 1. Then, the reed relay RL is configured.

FIG. 6 shows a mounting structure in which the reed relay RL having this structure is mounted on the printed board 4. When mounting a large number of reed relays RL, it is necessary to make a multilayer. Therefore, conventionally, a sub-board 5 is provided, a reed relay RL is mounted on the sub-board 5, and the sub-board 5 is connected to the printed board 4 by leads 6.

[0004]

[Problems to be solved by the device]

 The lead 6 for electrically connecting the sub-board 5 and the printed board 4 is arranged at a position projecting outside the connection position of the terminals 2A, 2B and 3A, 3B of the reed relay RL arranged on the lower side. There is a drawback that the mounting area becomes large because it has to be done. In this example, the two-layer structure is described, but the three- or four-layer structure has a drawback that the mounting area is further increased.

In the reed switch 2, the signal line is arranged in a single-core structure, and since the reed switch 2 does not have a coaxial structure, the reed switch 2 has a mismatch with the impedances of other signal lines and deteriorates the waveform of a high-speed signal. There is also a drawback that causes it. The purpose of this invention is to propose a reed relay mounting structure having a structure in which the mounting area can be reduced and the impedance of other lines can be matched in the reed switch portion even for high-speed signals. To do.

[0006]

[Means for Solving the Problems]

 In this invention, two sub-print boards are arranged with their board surfaces facing each other in parallel, and a reed switch is arranged between the sub-print boards. At the same time, a conductive pipe made of a non-magnetic material is arranged around the reed switch, and this conductive pipe acts as an outer conductor of the coaxial line.

An exciting coil is wound around the outer circumference of the conductive pipe, and both terminals of the exciting coil are connected to the exciting circuit conductive pattern provided on the sub-print plate. On each side of the sub-printed board, a connection part for connecting the signal wire of the reed switch, the conductive pipe, and the exciting coil to the other main printed board is provided. According to the configuration of the present invention, since the reed switch is distributed between the two sub-printed boards whose board surfaces are arranged in parallel, even if a plurality of reed switches are mounted, the space between the two printed boards is kept. There is no need to change it and a constant value may be used. As a result, even if the number of reed switches is increased, the area of the two sub-printed boards may be increased, and the occupied area on the printed board that receives the two printed boards does not increase significantly. Therefore, the packaging density can be improved.

[0008]

【Example】

 1 and 2 show an embodiment of the present invention. Portions corresponding to those in FIGS. 5 and 6 are designated by the same reference numerals. In this invention, two sub-printed boards 7A and 7B are arranged with their plate surfaces parallel to each other, and the reed switch 2 is supported between the two sub-printed boards 7A and 7B. The example shown in the figure shows a case where four reed switches 2 are supported. The signal lines 2A and 2B of each reed switch 2 are inserted into the terminal through holes provided on the two sub-printed boards 7A and 7B, and the signal lines 2A and 2B are soldered to the conductive layer provided around the terminal through holes. The reed switch 2 is electrically and mechanically connected to the two sub-printed boards 7A and 7B.

A conductive pipe 8 made of a non-magnetic material such as copper or aluminum is arranged on the outer circumference of each reed switch 2. The conductive pipe 8 is connected to the common potential point of the main printed board 4 through the sub-printed boards 7A and 7B and makes the signal lines 2A and 2B act as coaxial lines. The exciting coil 3 is wound around the conductive pipe 8. Both terminals of the exciting coil 3 are connected to the circuit patterns for the exciting circuit of the sub-printed boards 7A and 7B.

A connecting portion 9 is provided on one side of the sub-printed boards 7A and 7B. The connecting portion 9 can be composed of, for example, a plurality of terminals 9A protruding from one side of the sub-printed boards 7A and 7B. The terminal 9A that constitutes the connecting portion 9 is connected to the signal lines 2A and 2B of each reed switch 2, the conductive pipe 8 and the terminal of the exciting coil 3, and these are electrically connected to the main printed board 4 through the terminal portion 9. Connect to each other.

[0011]

[Effect of the device]

 As described above, according to this invention, the reed switch 2 is arranged between the two sub-printed boards 7A and 7B, so that the gap between the two sub-printed boards 7A and 7B is , A fixed value is acceptable regardless of the number of reed switches 2 mounted. Therefore, the occupied area on the main printed board 4 can be reduced, and the mounting density of the reed relays can be increased.

Further, in the present invention, a conductive pipe 8 is attached to the outer circumference of the reed switch 2 and a common potential is applied to the conductive pipe 8 so that the signal lines 2A and 2B of the reed switch 2 act as coaxial lines. With such a configuration, by appropriately selecting the diameter of the conductive pipe 8, it is possible to match the impedance of the other line, that is, the characteristic impedance of the signal line formed on the main printed board 4. Therefore, even if it is used as a switching device for switching a high speed signal, it can be transmitted without deteriorating the waveform, and can be used for an IC tester for testing a high speed response type IC, for example.

In the above description, four reed switches 2 are supported between the two sub-printed boards 7A and 7B, but the number of reed switches 2 may be four or more from one. You can choose the number. As shown in FIG. 3, the sub-printed boards 7A and 7B are made of a flexible board having flexibility, and are bent near one side of the flexible board, and a flat terminal 9B is adhered to the bent surface. A surface mounting structure in which the terminals 9B are directly soldered to and connected to the conductive pattern formed on the printed board 4 can be provided.

As another example, as shown in FIG. 4, the upper end side of the flexible board is bent, and the connector 10 is attached to this bent portion and the connector 10 and the cable 11 are connected to another circuit. You can also

[Brief description of drawings]

FIG. 1 is a front view for explaining an embodiment of the present invention.

FIG. 2 is a side view for explaining an embodiment of the present invention.

FIG. 3 is a perspective view for explaining a modified embodiment of the present invention.

FIG. 4 is a perspective view showing still another modified example of the present invention.

FIG. 5 is a side view for explaining the structure of a conventional reed relay.

FIG. 6 is a side view for explaining a conventional reed relay mounting structure.

[Explanation of symbols]

 2 Reed switch 3 Excitation coil 4 Printed board 7A, 7B Sub-printed board 8 Conductive pipe 9A, 9B Terminal 9 Connection part

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[Procedure amendment]

[Submission date] May 28, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Item name to be amended] Scope of utility model registration request

[Correction method] Change

[Correction content]

[Scope of utility model registration request]

Claims (1)

[Scope of utility model registration request] 1. A. Two sub-printed boards whose sides are arranged parallel to each other; B. The signal line was placed between the sub-printed boards, inserted into the terminal through-holes formed in the sub-printed board, and electrically and mechanically connected to and supported by the conductive layer formed on the periphery of the terminal through-holes. A reed switch; A conductive pipe covering the outer circumference of the reed switch and connected to a common potential point and made of a nonmagnetic material for coaxializing the signal line of the reed switch; An exciting coil wound around the outer circumference of the conductive pipe and having both terminals electrically connected to the sub-printed board; A connection portion which is provided on one side of the sub-printed board and has terminals connected to the signal line of the reed switch, the conductive pipe, and the exciting coil, and which is connected to another printed board through each of these terminals. Reed relay mounting structure composed by.