JPH0590882A - Surface acoustic wave device and its preparation - Google Patents
Surface acoustic wave device and its preparationInfo
- Publication number
- JPH0590882A JPH0590882A JP3277355A JP27735591A JPH0590882A JP H0590882 A JPH0590882 A JP H0590882A JP 3277355 A JP3277355 A JP 3277355A JP 27735591 A JP27735591 A JP 27735591A JP H0590882 A JPH0590882 A JP H0590882A
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- comb
- electrode
- teeth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
(57)【要約】
【目的】 弾性表面波素子の機能面上に所定の振動空間
を確保しつつ、弾性表面波素子の機能面を確実に気密封
止して、信頼性を向上させる。
【構成】 弾性表面波素子３を、そのくし歯状電極２が
形成された機能面３ａを外部取出電極８が配設された基
板５に対向させ、くし歯状電極２及び表面波伝搬路４を
囲む位置に配設された環状部材１０を介して基板５上に
載置し、接合部材６によりくし歯状電極２と外部取出電
極８とを電気的に接続するとともに、樹脂１１により弾
性表面波素子３の機能面３ａを外部から封止する。
(57) [Abstract] [Objective] The functional surface of the surface acoustic wave element is reliably hermetically sealed while ensuring a predetermined vibration space on the functional surface of the surface acoustic wave element, thereby improving reliability. The surface acoustic wave element 3 is arranged such that the functional surface 3a thereof on which the comb-teeth-shaped electrode 2 is formed faces the substrate 5 on which the external extraction electrode 8 is arranged, and the comb-teeth-shaped electrode 2 and the surface-wave propagation path 4 are formed. It is placed on the substrate 5 via an annular member 10 disposed at a position surrounding the electrode, the connecting member 6 electrically connects the comb-teeth electrode 2 and the external extraction electrode 8, and the resin 11 forms an elastic surface. The functional surface 3a of the wave element 3 is sealed from the outside.
Description
【０００１】[0001]
【産業上の利用分野】本願発明は、弾性表面波フィルタ
などに用いられる弾性表面波装置に関し、詳しくは、表
面実装型の弾性表面波装置及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface acoustic wave device used for a surface acoustic wave filter or the like, and more particularly to a surface mount type surface acoustic wave device and a method for manufacturing the same.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】例え
ば、図８に示すように、従来の弾性表面波装置において
用いられている弾性表面波素子２３は、弾性表面波基板
（圧電基板）２１の一方の主面の所定の位置にくし歯状
電極（ＩＤＴ）２２を配設することにより形成されてい
る。また、弾性表面波基板２１の両端側には、ＩＤＴ２
２と接続する入出力電極２２ａが配設されている。そし
て、この弾性表面波素子２３のＩＤＴ２２に電圧が印加
されると、圧電作用のため、弾性表面波基板２１の表面
付近に歪が生じ、この歪が表面波となってその表面を伝
搬する。2. Description of the Related Art For example, as shown in FIG. 8, a surface acoustic wave element 23 used in a conventional surface acoustic wave device includes a surface acoustic wave substrate (piezoelectric substrate) 21. It is formed by disposing the comb-teeth electrode (IDT) 22 at a predetermined position on one of the main surfaces. Further, the IDT 2 is provided on both end sides of the surface acoustic wave substrate 21.
An input / output electrode 22a for connecting to 2 is provided. When a voltage is applied to the IDT 22 of the surface acoustic wave element 23, a piezoelectric action causes a strain near the surface of the surface acoustic wave substrate 21, and this strain becomes a surface wave and propagates on the surface.
【０００３】上記のように、弾性表面波装置を構成する
弾性表面波素子２３の、ＩＤＴ２２が配設された機能面
（振動面）２３ａは、表面波を発生させる振動面である
とともに、ＩＤＴ２２により発生した表面波を伝搬させ
る表面波伝搬路２４としても機能する。したがって、こ
の弾性表面波素子２３を正常に機能させるためには、弾
性表面波素子２３のＩＤＴ２２が配設され、かつ、表面
波伝搬路２４が形成された方の主面（機能面）２３ａ
を、他の部材などに接触させないようにする必要があ
る。As described above, the functional surface (vibration surface) 23a of the surface acoustic wave element 23 constituting the surface acoustic wave device, on which the IDT 22 is disposed, is a vibration surface for generating surface waves and is It also functions as the surface wave propagation path 24 for propagating the generated surface wave. Therefore, in order for the surface acoustic wave element 23 to function normally, the principal surface (functional surface) 23a on which the IDT 22 of the surface acoustic wave element 23 is arranged and the surface wave propagation path 24 is formed.
Need not be in contact with other members.
【０００４】そのために、弾性表面波素子をハーメチッ
クケースに収納した弾性表面波装置があるが、表面実装
用の弾性表面波装置のケースとしては、気密性を確保す
るために、高価な積層セラミック製のケースが主に用い
られており、製造コストを押し上げる要因となってい
る。For this reason, there is a surface acoustic wave device in which a surface acoustic wave element is housed in a hermetic case. However, the surface mounting surface acoustic wave device case is made of an expensive monolithic ceramic in order to ensure airtightness. The case is mainly used, which is a factor of increasing the manufacturing cost.
【０００５】また、樹脂モールドして、リード部を外部
に露出させるようにしたものもあるが、モールド用の樹
脂とリード部との密着性が十分ではなく、リフロー及び
洗浄の工程に耐えるだけの気密性を確保することができ
ないという問題点がある。There is also a resin molded product in which the lead portion is exposed to the outside, but the adhesion between the molding resin and the lead portion is not sufficient, and it only withstands the steps of reflow and cleaning. There is a problem that airtightness cannot be secured.
【０００６】また、配線を印刷した基板に、弾性表面波
素子を載置し、ダイボンドしてキャップを施すことによ
り形成される弾性表面波装置においては、ワイヤボンデ
ィングのために基板の表面をメタライズするための条件
が厳しく、また、ワイヤボンディングも困難で、製造工
程が複雑になり、コストの上昇を招くという問題点があ
る。Further, in a surface acoustic wave device which is formed by placing a surface acoustic wave element on a substrate on which wiring is printed, die-bonding and capping, the surface of the substrate is metalized for wire bonding. However, there are problems that the conditions are severe, wire bonding is difficult, the manufacturing process is complicated, and the cost is increased.
【０００７】また、図９に示すように、弾性表面波素子
２３の機能面２３ａを基板２５に対向させて載置し、は
んだなどの接合部材２６を介して、基板２５に実装する
フェイスダウンボンディングタイプの弾性表面波装置に
おいても、これにキャップを施すタイプのものでは、キ
ャップの接着しろが大きく取れず、かつ、内部空間が大
きいため、十分な気密封止を行うことが困難であるとい
う問題点がある。Further, as shown in FIG. 9, a face-down bonding is carried out in which the functional surface 23a of the surface acoustic wave element 23 is placed so as to face the substrate 25 and is mounted on the substrate 25 via a joining member 26 such as solder. Also in the type of surface acoustic wave device, in the type in which the cap is attached to the surface acoustic wave device, it is difficult to perform a sufficient airtight seal because the cap has a large adhesion margin and the internal space is large. There is a point.
【０００８】本願発明は、上記の問題点を解決するもの
であり、複雑な製造工程によることなく、弾性表面波素
子の機能面を確実に気密封止することが可能な弾性表面
波装置及びその製造方法を提供することを目的とする。The present invention solves the above-mentioned problems, and a surface acoustic wave device capable of reliably hermetically sealing the functional surface of a surface acoustic wave element without a complicated manufacturing process. It is intended to provide a manufacturing method.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
に、本願発明の弾性表面波装置は、弾性表面波素子を、
そのくし歯状電極が形成された機能面を外部取出電極が
配設された基板に対向させ、前記くし歯状電極及び表面
波が伝搬する表面波伝搬路を囲む位置に配設された環状
部材を介して、前記基板上に載置し、接合部材により前
記くし歯状電極と前記外部取出電極とを接続するととも
に、封止用の樹脂により弾性表面波素子の機能面を外部
から封止したことを特徴としている。In order to achieve the above object, a surface acoustic wave device of the present invention comprises a surface acoustic wave element,
An annular member arranged so that the functional surface on which the comb-teeth-shaped electrode is formed faces the substrate on which the external extraction electrode is arranged and which surrounds the comb-teeth-shaped electrode and the surface wave propagation path through which the surface wave propagates. Via the above, and connecting the comb-teeth electrode and the external extraction electrode by a joining member, the functional surface of the surface acoustic wave element was externally sealed with a sealing resin. It is characterized by
【００１０】また、本願発明の弾性表面波装置の製造方
法は、弾性表面波素子を、そのくし歯状電極が形成され
た機能面を外部取出電極が配設された基板に対向させ、
前記くし歯状電極及び表面波が伝搬する表面波伝搬路を
囲む位置に配設された環状部材を介して前記基板上に載
置し、接合部材により前記くし歯状電極と前記外部取出
電極とを電気的に接続するとともに、樹脂ポッティング
することにより、前記弾性表面波素子の機能面を外部か
ら封止することを特徴としている。Further, in the method of manufacturing the surface acoustic wave device of the present invention, the surface acoustic wave element is arranged such that the functional surface having the comb-teeth-shaped electrode is opposed to the substrate having the external extraction electrode.
It is placed on the substrate through an annular member arranged at a position surrounding the surface wave propagation path where the comb-teeth electrode and the surface wave propagate, and the comb-teeth electrode and the external extraction electrode by a joining member. Is electrically connected and resin potting is performed to seal the functional surface of the surface acoustic wave element from the outside.
【００１１】また、本願発明の他の弾性表面波装置の製
造方法は、複数の弾性表面波素子を、そのくし歯状電極
が形成された機能面を外部取出電極が配設されたユニッ
ト基板に対向させ、前記くし歯状電極及び表面波が伝搬
する表面波伝搬路を囲む位置に配設された環状部材を介
して前記ユニット基板上の所定の位置に載置し、接合部
材により前記くし歯状電極と前記外部取出電極とを電気
的に接続するとともに、各弾性表面波素子を一体的にま
たは個々に樹脂ポッティングして、前記各弾性表面波素
子の機能面を外部から封止した後、ダイシングすること
により個々の弾性表面波装置を切り出すことを特徴とし
ている。In another method of manufacturing a surface acoustic wave device according to the present invention, a plurality of surface acoustic wave elements are mounted on a unit substrate having a functional surface on which a comb-shaped electrode is formed on an external extraction electrode. The comb teeth are placed at a predetermined position on the unit substrate via an annular member arranged so as to face each other and surround the surface-wave propagation path through which the surface-wave propagates and the comb-teeth are joined by a joining member. While electrically connecting the electrode and the external extraction electrode, each surface acoustic wave element is integrally or individually resin potted, after sealing the functional surface of each surface acoustic wave element from the outside, It is characterized in that individual surface acoustic wave devices are cut out by dicing.
【００１２】[0012]
【作用】弾性表面波素子を、その機能面を基板に対向さ
せ、くし歯状電極及び表面波が伝搬する表面波伝搬路を
囲む位置に配設された環状部材を介して基板上の所定の
位置に載置することにより、弾性表面波素子の機能面が
外部から仕切られ、接合部材によりくし歯状電極と外部
取出電極とを接続することにより、所定の電気的接続が
行われ、樹脂ポッティングすることにより、弾性表面波
素子の機能面が外部から封止される。したがって、特に
複雑な工程を必要とすることなく、弾性表面波素子の機
能面上に、環状部材の厚みに対応した所定の厚みを有す
る振動空間を確保しつつ、弾性表面波素子の機能面を確
実に封止することが可能になる。The surface acoustic wave element has a functional surface opposed to the substrate, and is provided with a predetermined shape on the substrate through the comb-shaped electrode and an annular member arranged at a position surrounding the surface wave propagation path through which the surface wave propagates. By placing the surface acoustic wave element at a position, the functional surface of the surface acoustic wave element is partitioned from the outside, and a predetermined electrical connection is made by connecting the comb-teeth electrode and the external extraction electrode by a joining member, and resin potting is performed. By doing so, the functional surface of the surface acoustic wave element is sealed from the outside. Therefore, the functional surface of the surface acoustic wave element can be provided while ensuring a vibrating space having a predetermined thickness corresponding to the thickness of the annular member on the functional surface of the surface acoustic wave element without requiring a particularly complicated process. It is possible to reliably seal.
【００１３】また、複数個の弾性表面波素子を、環状部
材を介してユニット基板上の所定の位置に載置し、くし
歯状電極と外部取出電極とを電気的に接続し、各弾性表
面波素子を一体的にまたは個々に樹脂ポッティングし
て、弾性表面波素子の機能面を外部から封止した後、ダ
イシングすることにより、信頼性の高い弾性表面波装置
を複数個まとめて製造することが可能になり、製造効率
を向上させて、コストを低減することが可能になる。Further, a plurality of surface acoustic wave elements are placed at predetermined positions on the unit substrate via an annular member to electrically connect the comb-teeth-shaped electrode and the external extraction electrode to each elastic surface. Manufacturing a plurality of highly reliable surface acoustic wave devices by dicing after sealing the functional surface of the surface acoustic wave element from the outside by resin potting the wave elements integrally or individually. It is possible to improve the manufacturing efficiency and reduce the cost.
【００１４】[0014]
【実施例】以下、本願発明の実施例を図に基づいて説明
する。図１は、本願発明の一実施例にかかる弾性表面波
装置を示す断面図であり、図２は、この実施例の弾性表
面波装置を構成する弾性表面波素子を示す平面図であ
る。図２に示すように、弾性表面波素子３は、弾性表面
波基板（圧電基板）１の一方の主面の所定の位置にくし
歯状電極（ＩＤＴ）２を配設することにより形成されて
いる。また、弾性表面波基板１の両端側には、ＩＤＴ２
と接続する入出力電極２ａが配設されている。そして、
この弾性表面波素子３のＩＤＴ２が配設された機能面３
ａの一部は、発生した表面波が伝搬する表面波伝搬路４
となり、ＩＤＴ２，２間で所定の表面波の授受が行われ
る。また、弾性表面波素子３と対向して配置される基板
（例えば、ガラス−エポキシ基板）５には、図３に示す
ように、角部に外部取出電極８が形成されている。な
お、この外部取出電極８は、基板（ユニット基板）の所
定の位置（各角部になる位置）にスルーホールメタライ
ズを施した後これをカットすることにより形成したもの
であるが、その形成方法についてはこれに限られるもの
ではない。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing a surface acoustic wave device according to an embodiment of the present invention, and FIG. 2 is a plan view showing a surface acoustic wave element that constitutes the surface acoustic wave device of this embodiment. As shown in FIG. 2, the surface acoustic wave element 3 is formed by disposing a comb-shaped electrode (IDT) 2 at a predetermined position on one main surface of a surface acoustic wave substrate (piezoelectric substrate) 1. There is. Further, the IDT 2 is provided on both ends of the surface acoustic wave substrate 1.
An input / output electrode 2a connected to is provided. And
The functional surface 3 on which the IDT 2 of the surface acoustic wave element 3 is arranged
Part of a is a surface wave propagation path 4 through which the generated surface wave propagates.
Then, a predetermined surface wave is exchanged between the IDTs 2 and 2. Further, as shown in FIG. 3, an external extraction electrode 8 is formed on a corner of a substrate (for example, a glass-epoxy substrate) 5 arranged to face the surface acoustic wave element 3. The external extraction electrode 8 is formed by subjecting a substrate (unit substrate) to through-hole metallization at predetermined positions (positions at each corner) and then cutting the metal. Is not limited to this.
【００１５】そして、弾性表面波素子３は、その機能面
３ａのＩＤＴ２及び表面波伝搬路４を囲む、シリコーン
ゴムからなる環状部材１０を介して基板５上に載置さ
れ、ＩＤＴ２と導通する入出力電極２ａ（図１）が、接
合部材（導電性ペースト）６により、基板５の外部取出
電極８に接続されている。そして、弾性表面波素子３と
基板５との間に形成された隙間（振動空間）７は、弾性
表面波素子３を覆うよう盛り付けられた封止用の樹脂１
１により気密封止されている。The surface acoustic wave element 3 is placed on the substrate 5 via an annular member 10 made of silicone rubber, which surrounds the IDT 2 of the functional surface 3a and the surface wave propagation path 4, and is electrically connected to the IDT 2. The output electrode 2a (FIG. 1) is connected to the external extraction electrode 8 of the substrate 5 by a joining member (conductive paste) 6. The gap (vibration space) 7 formed between the surface acoustic wave element 3 and the substrate 5 is covered with the sealing resin 1 that covers the surface acoustic wave element 3.
It is hermetically sealed by 1.
【００１６】次に、上記弾性表面波装置の製造工程の一
例について、図１〜図６を参照しつつ説明する。図４
は、上記弾性表面波素子３を複数個（この実施例では３
個）載置することができるユニット基板５ａ上に弾性表
面波素子３を載置した状態を示している。ユニット基板
５ａには、各弾性表面波素子３の入出力電極２ａを介し
てＩＤＴ２と導通する外部取出電極８が形成されてい
る。そして、このユニット基板５ａ上に、環状部材１０
を介して弾性表面波素子３を載置し、接合部材６によ
り、入出力電極２ａを外部取出電極８に接続する。それ
から、離型性に優れた、例えば、フッ素樹脂（テフロ
ン）などからなる枠９をユニット基板５ａ上に載置して
各弾性表面波素子３を囲み、封止用の樹脂１１を流し込
むことにより樹脂ポッティングを行い、加熱して樹脂１
１を硬化させる。そして、枠９を外した後、ダイシング
することにより、個々の弾性表面波装置を切り出す。Next, an example of a manufacturing process of the surface acoustic wave device will be described with reference to FIGS. Figure 4
Is a plurality of the surface acoustic wave elements 3 (in this embodiment, 3
The surface acoustic wave device 3 is mounted on the unit substrate 5a which can be mounted. The unit substrate 5a is provided with an external extraction electrode 8 which is electrically connected to the IDT 2 via the input / output electrode 2a of each surface acoustic wave element 3. Then, the annular member 10 is provided on the unit substrate 5a.
The surface acoustic wave element 3 is mounted via the, and the joint member 6 connects the input / output electrode 2 a to the external extraction electrode 8. Then, a frame 9 made of, for example, a fluororesin (Teflon) or the like, which is excellent in releasability, is placed on the unit substrate 5a to surround each surface acoustic wave element 3, and a sealing resin 11 is poured. Resin potting and heating to resin 1
1 is cured. Then, after removing the frame 9, the individual surface acoustic wave devices are cut out by dicing.
【００１７】なお、図７に示すように、弾性表面波素子
３を囲む枠（図示せず）を個々の弾性表面波素子３に施
し、各枠に封止用の樹脂１１を流し込むことにより、ユ
ニット基板５ａ上の各弾性表面波素子３を個々に樹脂ポ
ッティングし、その後、各弾性表面波装置を切り出すよ
うに構成することも可能である。As shown in FIG. 7, a frame (not shown) surrounding the surface acoustic wave element 3 is applied to each surface acoustic wave element 3, and the resin 11 for sealing is poured into each frame. It is also possible that each surface acoustic wave element 3 on the unit substrate 5a is individually resin-potted, and then each surface acoustic wave device is cut out.
【００１８】上記実施例では、ユニット基板５ａを用い
て複数の弾性表面波装置を一度に製造する場合について
説明したが、個々の弾性表面波素子３を、個々にカット
した基板５上に載置し、封止用の樹脂１１をその上から
流し込み、これを硬化させることにより個々の弾性表面
波装置を製造するようにしてもよい。In the above embodiment, the case where a plurality of surface acoustic wave devices are manufactured at a time by using the unit substrate 5a has been described, but each surface acoustic wave element 3 is placed on the substrate 5 which is cut individually. However, the surface acoustic wave device may be manufactured by pouring the sealing resin 11 from above and curing it.
【００１９】なお、ポッティングした樹脂１１上に下面
が平面状の蓋を落とし蓋のように施すことにより、弾性
表面波装置の上面を平坦にして、実装時の真空吸着性を
向上させることができる。It should be noted that the potted resin 11 is provided with a lid having a flat lower surface like a lid so that the surface of the surface acoustic wave device is flattened and the vacuum suction property at the time of mounting can be improved. ..
【００２０】なお、上記実施例の弾性表面波装置におい
ては、環状部材１０として、シリコーンゴムを用いた場
合について説明したが、弾性材料からなる環状部材を用
いることは、シール効果を向上させて封止用の樹脂が振
動空間７に侵入することをより確実に防止するととも
に、環状部材１０を吸音材としても機能させ、反射波の
影響をを抑制して特性を向上させることができて好まし
い。また、別途、吸音材を配設する工程を必要としない
ため、製造工程を簡略化する見地からも望ましい。但
し、環状部材１０を構成する材料としては、特に弾性材
料に限られるものではなく、エポキシ樹脂その他種々の
材料を用いて形成することが可能である。In the surface acoustic wave device of the above embodiment, the case where silicone rubber is used as the annular member 10 has been described. However, using an annular member made of an elastic material improves the sealing effect and seals. It is preferable that the resin for stopping can be more surely prevented from entering the vibration space 7, and the annular member 10 can also function as a sound absorbing material to suppress the influence of reflected waves and improve the characteristics. Further, it is desirable from the viewpoint of simplifying the manufacturing process, since a separate process of disposing the sound absorbing material is not required. However, the material forming the annular member 10 is not particularly limited to the elastic material, and various materials such as epoxy resin can be used.
【００２１】また、上記実施例では、接合部材６として
導電性ペーストを用いた場合について説明したが、その
他にもはんだや導電性接着剤などを接合部材として用い
ることができる。Further, in the above embodiment, the case where the conductive paste is used as the joining member 6 has been described, but in addition thereto, solder, a conductive adhesive or the like can be used as the joining member.
【００２２】さらに、基板５としては、ガラス−エポキ
シ基板など、加工が容易で、封止用の樹脂との接着性の
良好な基板を用いることが好ましい。Further, as the substrate 5, it is preferable to use a substrate such as a glass-epoxy substrate that is easy to process and has good adhesiveness to the sealing resin.
【００２３】また、上記実施例の弾性表面波装置におい
て、外部取出電極にリード部を接続すれば、リード部品
を得ることも可能である。Further, in the surface acoustic wave device of the above-mentioned embodiment, a lead component can be obtained by connecting the lead portion to the external extraction electrode.
【００２４】[0024]
【発明の効果】上述のように、本願発明によれば、弾性
表面波素子を環状部材を介して基板上に載置し、樹脂ポ
ッティングすることにより弾性表面波素子の機能面を気
密封止するようにしているので、特に複雑な工程を必要
とすることなく、弾性表面波素子の機能面上に、所定の
厚みを有する振動空間を確保しつつ、弾性表面波素子の
機能面を確実に封止して、信頼性の高い弾性表面波装置
を得ることができる。As described above, according to the present invention, the surface acoustic wave element is mounted on the substrate via the annular member and resin potting is performed to hermetically seal the functional surface of the surface acoustic wave element. Therefore, the functional surface of the surface acoustic wave element can be securely sealed while ensuring a vibrating space having a predetermined thickness on the functional surface of the surface acoustic wave element without requiring a complicated process. Then, a highly reliable surface acoustic wave device can be obtained.
【００２５】また、本願発明の他の弾性表面波装置の製
造方法は、複数の弾性表面波素子の機能面をユニット基
板に対向させ、各弾性表面波素子を環状部材を介してユ
ニット基板上の所定の位置に載置し、各弾性表面波素子
を一体的にまたは個々に樹脂ポッティングして封止した
後、ダイシングすることにより個々の弾性表面波装置を
切り出すようにしているので、信頼性の高い複数個の弾
性表面波装置をまとめて製造することが可能になり、作
業効率を向上させて、製造コストを低減することができ
る。According to another method of manufacturing a surface acoustic wave device of the present invention, the functional surfaces of a plurality of surface acoustic wave elements are opposed to the unit substrate, and each surface acoustic wave element is mounted on the unit substrate via an annular member. The surface acoustic wave device is placed at a predetermined position, and each surface acoustic wave element is integrally or individually sealed by resin potting and sealed, and the individual surface acoustic wave devices are cut out by dicing, so that reliability of the device is improved. It becomes possible to collectively manufacture a plurality of high surface acoustic wave devices, improve work efficiency, and reduce manufacturing costs.
【図１】本願発明の一実施例にかかる弾性表面波装置を
示す断面図である。FIG. 1 is a sectional view showing a surface acoustic wave device according to an embodiment of the present invention.
【図２】本願発明の一実施例にかかる弾性表面波装置を
構成する弾性表面波素子を示す平面図である。FIG. 2 is a plan view showing a surface acoustic wave element that constitutes a surface acoustic wave device according to an embodiment of the present invention.
【図３】本願発明の一実施例にかかる弾性表面波装置を
構成する基板を示す平面図である。FIG. 3 is a plan view showing a substrate that constitutes a surface acoustic wave device according to an embodiment of the present invention.
【図４】本願発明の一実施例にかかる弾性表面波装置の
製造方法の一工程を示す平面図である。FIG. 4 is a plan view showing a step of the method of manufacturing the surface acoustic wave device according to the embodiment of the present invention.
【図５】本願発明の一実施例にかかる弾性表面波装置の
製造方法の他の工程を示す平面図である。FIG. 5 is a plan view showing another step of the method of manufacturing the surface acoustic wave device according to the embodiment of the present invention.
【図６】本願発明の一実施例にかかる弾性表面波装置の
製造方法の他の工程を示す平面図である。FIG. 6 is a plan view showing another step of the method of manufacturing the surface acoustic wave device according to the embodiment of the present invention.
【図７】本願発明の他の実施例にかかる弾性表面波装置
の製造方法の一工程を示す平面図である。FIG. 7 is a plan view showing a step of a method of manufacturing the surface acoustic wave device according to another embodiment of the present invention.
【図８】従来の弾性表面波装置を構成する弾性表面波素
子を示す平面図である。FIG. 8 is a plan view showing a surface acoustic wave element forming a conventional surface acoustic wave device.
【図９】従来の弾性表面波装置を示す断面図である。FIG. 9 is a cross-sectional view showing a conventional surface acoustic wave device.
１ 弾性表面波基板 ２ くし歯状電極（ＩＤＴ） ２ａ 入出力電極 ３ 弾性表面波素子 ３ａ 機能面（振動面） ５ 基板 ５ａ ユニット基板 ６ 接合部材 ７ 振動空間 ８ 外部取出電極 １０ 環状部材 １１ 樹脂 1 Surface Acoustic Wave Substrate 2 Comb Toothed Electrode (IDT) 2a Input / Output Electrode 3 Surface Acoustic Wave Element 3a Functional Surface (Vibration Surface) 5 Substrate 5a Unit Substrate 6 Joining Member 7 Vibration Space 8 External Extraction Electrode 10 Annular Member 11 Resin
Claims (4)
形成された機能面を外部取出電極が配設された基板に対
向させ、前記くし歯状電極及び表面波が伝搬する表面波
伝搬路を囲む位置に配設された環状部材を介して、前記
基板上に載置し、接合部材により前記くし歯状電極と前
記外部取出電極とを接続するとともに、封止用の樹脂に
より弾性表面波素子の機能面を外部から封止したことを
特徴とする弾性表面波装置。1. A surface acoustic wave element in which a surface of a surface acoustic wave element having a comb-teeth electrode formed thereon is opposed to a substrate having an external extraction electrode, and the comb-teeth electrode and the surface wave propagate. It is placed on the substrate via an annular member arranged at a position surrounding the path, and the comb-teeth electrode and the external extraction electrode are connected by a joining member, and an elastic surface is formed by a sealing resin. A surface acoustic wave device having a functional surface of a wave element sealed from the outside.
環状部材を用いたことを特徴とする請求項１記載の弾性
表面波装置。2. The surface acoustic wave device according to claim 1, wherein an annular member made of an elastic material is used as the annular member.
形成された機能面を外部取出電極が配設された基板に対
向させ、前記くし歯状電極及び表面波が伝搬する表面波
伝搬路を囲む位置に配設された環状部材を介して前記基
板上に載置し、接合部材により前記くし歯状電極と前記
外部取出電極とを電気的に接続するとともに、樹脂ポッ
ティングすることにより、前記弾性表面波素子の機能面
を外部から封止することを特徴とする弾性表面波装置の
製造方法。3. A surface acoustic wave element in which a surface of a surface acoustic wave element having a comb-teeth-shaped electrode formed thereon faces a substrate having an external extraction electrode, and the comb-teeth-shaped electrode and the surface wave propagate. Placed on the substrate via an annular member arranged at a position surrounding the path, electrically connecting the comb-teeth-shaped electrode and the external extraction electrode by a joining member, and by resin potting, A method of manufacturing a surface acoustic wave device, characterized in that a functional surface of the surface acoustic wave element is sealed from the outside.
電極が形成された機能面を外部取出電極が配設されたユ
ニット基板に対向させ、前記くし歯状電極及び表面波が
伝搬する表面波伝搬路を囲む位置に配設された環状部材
を介して前記ユニット基板上の所定の位置に載置し、接
合部材により前記くし歯状電極と前記外部取出電極とを
電気的に接続するとともに、各弾性表面波素子を一体的
にまたは個々に樹脂ポッティングして、前記各弾性表面
波素子の機能面を外部から封止した後、ダイシングする
ことにより個々の弾性表面波装置を切り出すことを特徴
とする弾性表面波装置の製造方法。4. A plurality of surface acoustic wave elements are arranged such that their functional surfaces, on which the comb-teeth-shaped electrodes are formed, face the unit substrate on which the external extraction electrodes are arranged, and the comb-teeth-shaped electrodes and the surface waves propagate. It is placed at a predetermined position on the unit substrate via an annular member arranged at a position surrounding the surface wave propagation path, and the comb-teeth electrode and the external extraction electrode are electrically connected by a joining member. At the same time, each surface acoustic wave element is integrally or individually resin potted, and after sealing the functional surface of each surface acoustic wave element from the outside, individual surface acoustic wave devices can be cut out by dicing. A method of manufacturing a characteristic surface acoustic wave device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3277355A JPH0590882A (en) | 1991-09-28 | 1991-09-28 | Surface acoustic wave device and its preparation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3277355A JPH0590882A (en) | 1991-09-28 | 1991-09-28 | Surface acoustic wave device and its preparation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0590882A true JPH0590882A (en) | 1993-04-09 |
Family
ID=17582373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3277355A Withdrawn JPH0590882A (en) | 1991-09-28 | 1991-09-28 | Surface acoustic wave device and its preparation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0590882A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5729185A (en) * | 1996-04-29 | 1998-03-17 | Motorola Inc. | Acoustic wave filter package lid attachment apparatus and method utilizing a novolac epoxy based seal |
| WO1998029942A1 (en) * | 1996-12-27 | 1998-07-09 | Motorola Inc. | Saw device package and method |
| WO1999052209A1 (en) * | 1998-04-08 | 1999-10-14 | Cts Corporation | Surface acoustic wave device package and method |
| US6078229A (en) * | 1997-08-05 | 2000-06-20 | Nec Corporation | Surface acoustic wave device mounted with a resin film and method of making same |
| US6900709B2 (en) | 2001-06-25 | 2005-05-31 | Murata Manufacturing Co., Ltd. | Surface acoustic wave device |
| WO2007058280A1 (en) * | 2005-11-16 | 2007-05-24 | Kyocera Corporation | Electronic part sealing board, electronic part sealing board in multiple part form, electronic device using electronic part sealing board, and electronic device fabricating method |
| JP2007149879A (en) * | 2005-11-25 | 2007-06-14 | Kyocera Corp | Electronic component sealing substrate, electronic device using the same, and method of manufacturing electronic device |
| JP2007160499A (en) * | 2005-11-16 | 2007-06-28 | Kyocera Corp | Electronic component sealing substrate, plural-shaped electronic component sealing substrate, electronic device using electronic component sealing substrate, and method of manufacturing electronic device |
| WO2010005061A1 (en) * | 2008-07-09 | 2010-01-14 | 国立大学法人東北大学 | Functional device and manufacturing method therefor |
-
1991
- 1991-09-28 JP JP3277355A patent/JPH0590882A/en not_active Withdrawn
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5729185A (en) * | 1996-04-29 | 1998-03-17 | Motorola Inc. | Acoustic wave filter package lid attachment apparatus and method utilizing a novolac epoxy based seal |
| WO1998029942A1 (en) * | 1996-12-27 | 1998-07-09 | Motorola Inc. | Saw device package and method |
| US5892417A (en) * | 1996-12-27 | 1999-04-06 | Motorola Inc. | Saw device package and method |
| US6078229A (en) * | 1997-08-05 | 2000-06-20 | Nec Corporation | Surface acoustic wave device mounted with a resin film and method of making same |
| EP0896427A3 (en) * | 1997-08-05 | 2001-01-10 | Nec Corporation | Surface acoustic wave device |
| WO1999052209A1 (en) * | 1998-04-08 | 1999-10-14 | Cts Corporation | Surface acoustic wave device package and method |
| US5969461A (en) * | 1998-04-08 | 1999-10-19 | Cts Corporation | Surface acoustic wave device package and method |
| US6900709B2 (en) | 2001-06-25 | 2005-05-31 | Murata Manufacturing Co., Ltd. | Surface acoustic wave device |
| WO2007058280A1 (en) * | 2005-11-16 | 2007-05-24 | Kyocera Corporation | Electronic part sealing board, electronic part sealing board in multiple part form, electronic device using electronic part sealing board, and electronic device fabricating method |
| JP2007160499A (en) * | 2005-11-16 | 2007-06-28 | Kyocera Corp | Electronic component sealing substrate, plural-shaped electronic component sealing substrate, electronic device using electronic component sealing substrate, and method of manufacturing electronic device |
| US7932594B2 (en) | 2005-11-16 | 2011-04-26 | Kyocera Corporation | Electronic component sealing substrate for hermetically sealing a micro electronic mechanical system of an electronic component |
| JP2007149879A (en) * | 2005-11-25 | 2007-06-14 | Kyocera Corp | Electronic component sealing substrate, electronic device using the same, and method of manufacturing electronic device |
| WO2010005061A1 (en) * | 2008-07-09 | 2010-01-14 | 国立大学法人東北大学 | Functional device and manufacturing method therefor |
| JP2010017805A (en) * | 2008-07-09 | 2010-01-28 | Tohoku Univ | Functional device and manufacturing method therefor |
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