JPH0592463A - Interfacial device for mold-monitoring device - Google Patents

Abstract

PURPOSE:To enable the simulation of an injection molding machine to be operated without using a mold-monitoring device and to enable its electric connection to be simply comfirmed by providing a pseudoloading signal-generating circuit in the mold-monitoring interfacial device. CONSTITUTION:An interfacial device 23 has the control signal-converting circuit for equally levelling the control signals of an injection molding machine 11 and a mold-monitoring device 12, and the pseudosignal-generating circuit 19 generating the pseudosignal of the mold-monitoring device for confirming the electric connection of the mold-monitoring device to the injection molding machine. Said pseudosignal-generating circuit 19 switches over the switching circuit 25 of a data-selector 24 by a signal-switching means 21. When the switch is changed over to the side of the pseudosignal-generating circuit 19, the simulated operation of the injection molding machine 11 is carried out by generating the same pseudosignal as that of the mold-monitoring device 12, thereby checking the error of the connection of electric wiring.

Description

Detailed Description of the Invention

[001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pseudo signal generating circuit for electrically connecting and confirming the connection state with a mold monitoring device for monitoring a mold of an injection molding machine having a movable mold and a fixed mold. The present invention relates to a mold monitoring device interface device.

[002]

2. Description of the Related Art Conventionally, for example, Japanese Patent Laid-Open No. 63-265850.
In the mold monitoring device known in (1), the injection molding machine and the control signal line for transmitting and receiving timing signals of the mold monitoring device were directly connected. As described above, conventionally, a mold monitoring device suitable for an injection molding machine that monitors a mold has been manufactured, and the injection molding machine and the mold monitoring device have been electrically connected.

[003]

In the conventional example as described above, it is preferable to manufacture the mold monitoring device in conformity with the injection molding machine, but if only the mold monitoring device is mass-produced, the injection molding is performed. Since the specifications on the machine side are not known, there is a problem in that several types of mold monitoring devices must be manufactured or the mold monitoring device must be modified when the specifications are determined. Further, in the conventional example, the injection molding machine and the mold monitoring device do not have a function of checking a wrong connection after electrically connecting, and there is a problem such as an expensive mold damage due to the wrong connection. ..

The present invention has been made to solve these problems, and to confirm the electrical connection and the control signal conversion circuit for making the control signal levels of the injection molding machine and the mold monitoring device the same. By electrically connecting the injection molding machine and the mold monitoring device through the interface device equipped with the pseudo signal generation circuit of, one type of mold monitoring device can support all injection molding machines and An interface device for a mold monitoring device capable of checking a connection is provided.

[0095]

The interface device described above incorporates a control signal from the injection molding machine into the mold monitoring device, and also receives a command signal from the mold monitoring device to the injection molding machine to convert the signal level. It is equipped with a circuit and an output buffer circuit, so that the control signal sent from the injection molding machine to the mold monitoring device and the command signal sent from the mold monitoring device to the injection molding machine are automatically adjusted to the signal level of the other side. be able to.

Further, the interface device has a pseudo signal generating circuit equivalent to the command signal of the mold monitoring device. This pseudo signal generating circuit switches the switch circuit of the data selector by the signal switcher to make the pseudo load generating circuit side. When the switch is turned on, a pseudo signal similar to that of the mold monitoring device is generated to perform the simulation operation of the injection molding machine, so that the erroneous connection of the electric wiring can be checked.

[0097]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows the structure of the injection molding machine main body. The resin is injected from the nozzle 4 with the fixed mold 1 and the movable mold 2 engaged, and after the resin is solidified, the movable mold 2 is moved to the position shown in the figure. After moving, the movable mold 2 turns on the mold opening completion detecting limit switch 7 and outputs a signal that the mold opening is completed. With this signal, the mold monitoring video camera 8 images the state of the product molding section 9 of the movable mold 2.

Next, the protrusion 3 moves in the direction of the movable die 2 and pushes the protrusion pin 5 to drop a molded product (not shown) from the product molding unit 9. After this, the protruding portion 3 moves to the original position and the limit switch 6 for detecting the protruding and retracted position 6
Is turned on, and the mold monitoring video camera 8 captures an image of the state of the product forming unit 9 after the ejection is completed by this signal, and monitors whether the product remains in the product forming unit 9.

FIG. 2 is a system diagram of signals of the conventional injection molding machine 11 and the mold monitoring device 12, and shows the injection molding machine 11
The signal output from the control unit 1 via the input signal conversion circuit 14
Sent to 3. Further, the signal from the mold monitoring video camera 8 is also sent to the control unit 13. The control unit 13 determines the state of this result, the output signal conversion circuit 15 converts the result into a signal that can be taken in by the injection molding machine 11, and sends the signal to the injection molding machine 11.

FIG. 3 shows an embodiment according to the present invention. A mold monitoring interface device 16 is provided between the injection molding machine 11 and the mold monitoring device 12, and the mold monitoring interface device 16 is injection molded. Signal OP from machine 11
An input buffer circuit 17 for taking in M, EJLM, RSM, an output buffer circuit 18 for converting a signal from the input buffer circuit 17 into a signal level of the mold monitoring device 12, and a signal ESW from the mold monitoring device 12. , CS
Input buffer circuit 22 for converting W and ALW into signal levels of the injection molding machine 11, the input buffer circuit 22
Signal from the injection molding machine 11 to ESM, CSM, A
An output buffer circuit 20 for sending out as LM, a pseudo signal generating circuit 19 for generating a signal similar to the signal output from the mold monitoring device 12, a signal output from the pseudo signal generating circuit 19 and an input buffer circuit 22. It comprises a signal switcher 21 for switching the output signal, and the signal switcher 21 is an ESS, CSS, ALS.
It comprises a data selector 24 for switching signals and ESW, CSW, SLW signals, and a switch unit 25 for instructing switching of the data selector 24.

Next, the case where the injection molding machine 11 is operated by the pseudo signal generating circuit 19 will be described with reference to FIG. When the injection molding machine 11 performs the mold opening operation and the mold opening is completed, the contact OPS is closed and the OPM signal becomes LOW. When the OPM signal passes through the input buffer circuit M17, it becomes a HI signal OP. The OP signal is supplied to the reset terminals R of the latch circuits RA1, RA2, RA3 that hold the primary monitoring result and the secondary monitoring result, respectively, and first resets the latch circuit. Further, this signal is supplied to the clock terminal CK of the latch circuit through the delay circuit T1. SW1 is connected to the D terminal of the latch circuit RA1, and the switch SW1 is turned on.
When it is N, the D terminal is LOW, and when the switch SW1 is OFF, the D terminal is HI. The switch SW1 represents the state of the result in the primary monitoring.
When it is N, the primary monitoring result is in an abnormal state, and when it is OFF, it is in a normal state. Therefore, the switch SW1 is O
In the abnormal state of N, the ESS signal of the output Q is set to LOW, and in the normal state of the switch SW1 being OFF, the output Q is set to HI. The ESS signal is H
When I, it is a signal requesting a protrusion operation.

The ESS signal is sent to the signal switching machine 21 and sent to the injection molding machine 11 through the output buffer circuit 20 as the ejection operation start signal ESM. When the injection molding machine 11 receives the ESS signal, the injection molding machine 11 starts the ejecting operation and drops the product in the movable mold 2. At the end of the ejecting operation, the EJS contact notifying the completion of the ejecting operation is closed and the EJLM signal becomes LOW. When the EJLM signal passes through the input buffer circuit M17, the EJLM signal becomes HI and is supplied to the clock terminal CK of the latch circuit RA2 which holds the signal as the EJL signal.

When the EJLM signal arrives, the latch circuit RA2 is latched, the output terminal Q becomes HI, and the EE signal is transmitted. A switch SW2 is connected to the D terminal of the latch circuit RA3 indicating the secondary monitoring state of the EE signal, and the D terminal is set to HI when the SW2 is in the ON state. The switch SW2 is ON, the secondary monitoring result is abnormal, and the switch SW2 is OFF.
In the state, the secondary monitoring result shows that the output signal CSS of the latch circuit is set to LOW and the switch SW2 is OFF when the switch SW2 is ON when the EE signal arrives. The output signal CS
S becomes HI.

Since the CSS signal requests the injection molding machine 11 to start the next cycle, the switch SW
Since 2 is set to OFF, the injection molding machine 11 is requested to start the next cycle under normal conditions. The CSS signal passes through the signal switcher 21 and is output to the output buffer circuit 20.
And is sent to the injection molding machine 11 as a CSM signal. When the injection molding machine 11 receives this CSM signal,
Start the next cycle and start mold clamping. Switch SW
When a pseudo abnormality is generated in the primary monitoring and the secondary monitoring by the operations 1 and 2, the latch circuits RA1, 2,
3 is turned off, and the next signal is not generated.

Therefore, in order to cancel this state, the contact RSS operated by opening and closing the safety door (not shown) of the injection molding machine 11 is closed and the RSM signal is generated. The RSM signal passes through the input buffer circuit 17, becomes an RS signal, and is supplied to the S terminals of the latch circuits RA1 and RA3.
Therefore, in order to cancel the abnormal state in the primary monitoring and the secondary monitoring, the safety door is opened / closed to the injection molding machine 11 to send the RS signal, and the latch circuits RA1 and RA3 are set by the RS signal to continue. The next ESS and CSS signals are sent to continue the operation. When an abnormal state is set in the latch circuits RA1 and RA3 in the primary confirmation and the secondary confirmation, the output ESS and CSS signals of the respective output terminals Q become HI and an abnormal state signal is generated.

These signals become ALS1 and ALS2 signals and are combined by the OR circuit and sent to the signal switching machine 21 as an ALS signal, and the injection molding machine 11 is informed of an abnormal state as an ALM signal through the output buffer circuit 20.

Next, the operation of the mold monitoring device 12 will be described. When the signal switching machine 21 is switched and the signal connection to the injection molding machine 11 is set on the mold monitoring device 12 side, the connection between the injection molding machine 11 and the mold monitoring device 12 is the signal OPM from the injection molding machine 11. , EJLM, RSM are sent as OPW, EJLW, RSW signals to the mold monitor 12 through the input buffer circuit 17 and the output buffer circuit 18.

The mold monitoring device 12 performs the primary monitoring operation by the OPW signal and the secondary monitoring operation by the EJLW signal. When resetting the abnormal state, RSW
Do by signal. If the results of these confirmation operations are normal, the signal ESW requesting the ejector operation and the signal CSW requesting the cycle start are sent to the interface device. The interface device receives these signals by the input buffer circuit 22 and sends them to the signal switcher 21. Since the signal switching machine 21 has already been switched to the mold monitoring device side, these signals pass through the output buffer circuit 20 and are sent to the injection molding machine 11 by ESM, CS.
The M and ALM signals are sent and the injection molding machine 11 performs the following operations.

[0119]

The mold monitoring interface device 1 is also provided.
If the power source 26 of the injection molding machine 11 is taken in the unit 6 and the constant voltage power source 23 used as the power source of the mold monitoring interface device 16 is provided, the wiring of the power source can be simplified. In order to simplify the handling of the mold monitoring interface device 16, for example, when the mold monitoring device 12 is powered on, the signal switching device SCH causes the mold monitoring device 12 to operate.
You may make it switch to the side automatically.

As described above, according to the present invention, the injection molding machine 11
A mold interface device 16 provided between the mold monitoring device 12 and the mold monitoring device 12 controls the injection molding machine 11 and the mold monitoring device 12.
And a pseudo load signal generating circuit 19 provided in the mold monitoring interface device 16 at the same time facilitates the simulation of the injection molding machine without using the mold monitoring device 12. Operation is possible,
The electrical connection can be easily confirmed.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of an injection molding machine.

FIG. 2 is a diagram showing a signal system diagram of a conventional injection molding machine and a mold monitoring device.

FIG. 3 is an overall configuration diagram showing an interface of a mold monitoring apparatus according to an embodiment.

FIG. 4 is a detailed explanatory diagram of a mold monitoring interface device according to an embodiment.

[Explanation of symbols]

1 Fixed type 2 Movable type 3 Projection part 4
Nozzle 5 Protruding pin 6 Limit switch for detecting backward position 7 Limit switch for detecting mold opening completion 8 Mold monitoring video camera 9 Product molding section 11 Injection molding machine 12 Mold monitoring device 13 Control section 14 Input signal conversion circuit 15 Output signal conversion Circuit 16 Mold monitoring interface device 17 Input buffer circuit 18 Output buffer circuit 19 Pseudo signal generating circuit 20 Output buffer circuit 21 Signal switching machine 22 Input buffer circuit 23 Interface device internal power supply 24 Data selector 25 Switch part

Claims (1)

[Claims] 1. A mold for an injection molding machine, which is made up of a fixed mold and a movable mold, is imaged by a video camera to compare the image output of the video camera with a reference value. In the mold monitoring device that monitors the presence of molded products,
An interface device for electrically connecting the injection molding machine and the mold monitoring device is provided between the injection molding machine and the mold monitoring device, and the interface device controls the injection molding machine and the mold monitoring device. A control signal conversion circuit for making signals the same level and a pseudo signal generation circuit for generating a pseudo signal of the mold monitoring device for confirming electrical connection between the injection molding machine and the mold monitoring device are provided. Interface device for mold monitoring equipment.