JPH0592655A - Marking method - Google Patents

Abstract

(57) [Summary] [Purpose] To provide clear, highly durable and reliable marks. [Structure] A marking portion 2 heated to a temperature at which a thermoplastic resin is in a plastic state or higher is moved toward an electronic component by a cylinder 6, and a marking 3 attached to a tip of the marking portion 2 is attached to the envelope 1.
Press on the surface to be marked. When the marking 3 is pressed, the surface portion of the envelope 1 is heated to be partially plasticized and deformed. After a predetermined time has passed,
The urging force by the air cylinder 6 is released, and the marking portion 2 is separated from the envelope 1 by the elastic force of the spring 8. The marking surface of the envelope 1 is hardened when the marking 3 is separated, and a mark 9 is formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for marking various articles, such as electronic devices such as semiconductor devices, which are packaged with a thermoplastic resin.

[0002]

2. Description of the Related Art The following is a main method for providing a mark on a conventional envelope made of a thermoplastic resin.

(1) Method of Using Transfer-Type Thermosetting Ink Thermosetting ink is used as the ink. The ink is spread to a certain thickness, a rubber marking for printing is pressed against the ink, and then the marking is pressed against the envelope to transfer the ink. Finally, the ink is cured in a high temperature atmosphere to stabilize the mark display quality.

(2) Method of using transfer type UV curable ink UV curable ink is used as the ink. The ink is spread to a certain thickness, a rubber marking for printing is pressed against the ink, and then the marking is pressed against the envelope to transfer the ink. Finally, the ink adhered portion is irradiated with ultraviolet rays and cured to stabilize the mark display quality.

(3) Method of using laser A laser is applied to the envelope of a thermoplastic resin to make marking.

(4) Method by molding die The mark display content is engraved on the molding die in advance, and the mark is formed at the time of molding the envelope.

[0007]

These conventional methods still have the following problems in practical use.

(1) Method Using Transfer-Type Thermosetting Ink It takes time to cure the ink after marking, and it is difficult to construct an automated line in which a plurality of steps are connected. Further, the mark display quality is not stable, and the mark appearance inspection is required.

(2) Method of using transfer type UV curable ink Compared with the method of (1) above, it is easier to apply to an automated line, but maintenance of equipment is difficult. And
Since the mark display quality is not stable, 100% visual inspection is required.

(3) Method using a laser Although it is easy to introduce it into an automated line, the equipment cost required for it becomes high. And, mark merchandise is slightly inferior.

(4) Method using molding die Since the mark is drawn by engraving on the envelope molding die, the mark display is simple, but the display content is limited. For example, when the display content needs to be changed monthly such as the manufacturing lot number, it may not be possible depending on the mold structure.

The present invention solves the problems in the conventional methods, and provides a method capable of imparting a clear mark with high durability and high reliability, and which can be carried out with a small equipment cost. Is what you are trying to do.

[0013]

The marking method of the present invention is a method for forming a mark by pressing a marking made by heating an envelope made of a thermoplastic resin at a temperature higher than a temperature at which it becomes a plastic state.

[0014]

[Function] When the marking is heated to an appropriate temperature and pressed against the envelope, the heat of the marking or the resin composition of the composition is deformed into a plastic state at the portion where the marking is pressed, forming a clear mark. ..

[0015]

The marking method of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing an example of an apparatus for carrying out this method, and FIG. 2 is a perspective view of the main part thereof.

In FIG. 1, reference numeral 1 denotes a thermoplastic resin envelope which covers electronic components. Reference numeral 2 is a marking portion, and as shown in FIG. 2, a replaceable marking 3 is attached to the tip thereof. The figure shows an example of an engraving for giving the mark "16". A heating device 4 heats the marking portion 2 and the marking 3 connected thereto by a built-in heater. Reference numeral 5 denotes a control device, which has the functions of setting and holding the marking 3 by the heating device 4 at a predetermined temperature and controlling the marking operation. Reference numeral 6 denotes an air cylinder, which moves the support substrate 7 integrated with the control device 4 against the elastic force of the spring 8 toward the envelope 1 of the electronic component transferred to the engraving position to form an envelope. The marking 3 is brought into contact with the surface of the container 1 to be marked for a predetermined time to give the mark 9.

In the apparatus having the above-mentioned structure, the controller 5 heats the marking part 2 so that the marking 3 is heated and held by the heating device 4 at a predetermined temperature, and the temperature is kept constant. To control. When the sensor detects that the electronic component to be stamped has been sent to the predetermined stamping position, the control device 5 operates the cylinder 6 to move the support substrate 7 toward the electronic component, and the tip of the stamping portion 2 is moved. The marking 3 attached to the above is pressed against the surface of the envelope 1 to be marked. When the marking 3 is pressed, the surface portion of the envelope 1 is heated to be partially plasticized and deformed. According to the experiment, the marking temperature at this time is 200 to 30.
Good marks were formed in the range of 0 ° C. After a lapse of a predetermined time, the control device 4 releases the bias by the air cylinder 6. The marking portion 2 and the control device 4 are
The elastic force of the spring 8 pulls it away from the envelope 1. Envelope 1
The marking surface is hardened when the marking 3 is separated, and a concave portion having a depth of about 0.1 to 0.3 mm is formed along the shape carved on the surface, and the mark 9 is provided. The electronic component that has been stamped is sent to the next process, and the next electronic component arrives at a predetermined position. Then, by repeating the above operation, the electronic parts that are sequentially sent are marked.

If the temperature of the marking 3 set by the control device 4 is too high, the thermoplastic resin forming the envelope 1 is excessively melted and the marking becomes unclear. Not only that, but the material of the envelope 1 itself is damaged. If the set temperature of the marking 3 is too low, the mark 9 cannot be formed. Therefore, depending on the material of the thermoplastic resin forming the envelope 1, the temperature of the marking 3 is set above the temperature at which it becomes a plastic state. Of course, the upper limit of the marking temperature is set to a temperature at which the thermoplastic resin is not damaged. The conditions of the temperature of the stamp 3 and the pressure contact time thereof may be determined experimentally. For example, with modified polyphenylene oxide (PPO), which is often used as the envelope of an optical semiconductor device, the best mark quality can be obtained when the marking temperature is 250 ° C. and the marking pressure welding time is about 0.3 seconds. did it.

Further, by exchanging the stamp 3, it is possible to easily change the display of the product name, the lot number, the manufacturing date and the like.

The mark 9 formed in this manner is different from the mark made of paint or the like in that the surface of the resin is at least partially plasticized or partially melted, so that the mark 9 is easily formed. Cannot be erased,
It is durable, reliable and vivid.

Further, as compared with the conventional mark applying method using ink, the ink material is not required, so that the material cost can be reduced, and the ink drying step is not necessary. Can be automated at high speed.

Further, the content of the mark 9 is attached as a replaceable marking 3 to a heating device 4 and heated in advance, and this is applied to a thermoplastic resin envelope 1 such as an electronic part conveyed on an automation line. By pressing for an appropriate time,
A mark having stable quality and high durability can be formed.

[0023]

According to the method of the present invention, an envelope such as an electronic component is made of a thermoplastic resin, and the engraved mark heated to a proper temperature higher than the plastic temperature is pressed against the envelope to make it durable. It is possible to easily and easily provide clear and highly reliable marks. Furthermore, because it can be implemented with a small equipment cost,
It can be easily installed in an automated line.

[Brief description of drawings]

FIG. 1 is a block diagram showing an example of an apparatus for carrying out a marking method of the present invention.

FIG. 2 is a perspective view of a main part of the apparatus shown in FIG.

[Explanation of symbols]

 1 Enclosure of electronic parts 2 Engraved part 3 Engraved 4 Heating device 5 Control device 6 Air cylinder 8 Spring 9 Mark

Claims (1)

[Claims] 1. A marking method, wherein an engraved mark which is heated to a temperature at which the thermoplastic resin is in a plastic state or more is pressed against an envelope made of a thermoplastic resin to apply the mark.