JPH0592764U - IC connector - Google Patents

Abstract

(57) [Summary] [Object] To provide an IC package connector for inspecting the quality and performance of an IC package having a J-bend type lead. [Structure] The IC package main body 1 is provided inside the opposing side walls 4 forming an IC package accommodating portion 5 of the connector main body.
A plurality of contacts 9 are arranged in parallel so as to face the side surfaces of the first contact 9 and extend parallel to the front and rear of the contacts 9 and extend upward.
An elastic contact piece 9a and a second elastic contact piece 9b are provided, and the J-bend type lead 2 is captured between the both bent portions where the first elastic contact piece 9a and the second elastic contact piece 9b are in pressure contact. , The IC package body 1 is floated from the bottom surface of the IC housing portion 5 and held.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an IC package connector for inspecting the quality and performance of an IC package having a J-bend type lead.

[0002]

[Prior Art]

 The J-bend type leads are arranged side by side on the side surface of the IC package body, and extend in the vertical direction, and the tips are bent inward in a substantially U shape.

[0003]

[Problems to be solved by the device]

 However, in this case, since the tip is bent, it is not possible to adopt a contact structure in which it is plugged into the connector and sandwiched between the contact pieces of the contact. A mechanism is used to make electrical contact with the IC package and hold the IC package by the frictional contact. However, since it depends on the friction on the side surface of the lead, the IC may not be pushed in sufficiently due to vibration or shock, The package may float or come off from the connector, and thus there is a problem of impairing the reliability of electrical contact.

The present invention solves the above-mentioned problem in a connector for an IC package having the J-bend type lead, and by devising the external contact form of the contact adapted to the lead form, And a contact make a highly reliable electrical contact and maintain the contact state, and provide a connector in which the IC package is properly floated and held between the rows of contacts.

[0005]

[Means for Solving the Problems]

 The present invention relates to a connector 3 for an IC package, which has J-bend type leads 2 extending in an upward and downward direction, which are arranged in parallel along opposite side surfaces of an IC package body 1, and which is an IC package accommodating portion of the connector body. A plurality of contacts 9 are arranged in parallel inside the opposing side walls 4 that form 5 so as to face the side surface of the IC package body 1, and the first elastic contact piece extends in parallel to the contact 9 and extends upward. 9a and the second elastic contact 9b.

[0006]

[Action]

 The second elastic contact piece 9b is pressed to the outer surface of one of the bent portions of the J-bend type lead 2 to give a pressing force, and the first elastic contact piece 9a is placed to the lower side to provide the J elastic wire. The first elastic contact piece 9a applies a pushing-up force to the J bend type lead 2 at the bent portion so that the outer surface of the other bent portion of the bend type lead 2 is brought into pressure contact with the first elastic contact piece 9a. The J-bend type lead 2 is captured between the two bent portions where the second elastic contact piece 9b and the second elastic contact piece 9b come into pressure contact with each other, and the IC package body 1 is floated from the bottom surface of the IC housing portion 5 and held.

[0007]

【Example】

 As shown in the first figure, the IC package body 1 has a substantially flat rectangular parallelepiped shape, and has lead wires curved in a loop shape, that is, J-bend leads 2, 2, ... In FIG. 1 (C), the IC package body 1 is shown in the opposite direction to the normal use direction, so that the lower corner is upward. Hereinafter, the upper and lower sides will be described with reference to FIG. As shown in FIGS. 1 (a) and 2, the connector 3 for IC test has a substantially rectangular parallelepiped shape, and has side walls 4 and 4 protruding upward on both sides of its upper surface, and between the side walls 4 and 4. Has an IC package accommodating portion 5 having a shape in which the IC package body 1 is tightly fitted, and a flat second concave portion for tool insertion opened at both ends in the center of the bottom surface A of the IC package accommodating portion 5. There is a place 6, and at the center of the bottom surface B of the second recess 6, there is a through hole 7 having the same width as the recess 6 and a rectangular planar shape.

Corresponding to the J-bend type leads 2, 2, ... Of the IC package body 1, thin contact accommodating grooves 8, 8, ... These contact accommodating grooves 8, 8 ... Are opened on the lower surface of the connector 3. Thin contacts 9, 9 are inserted into the contact receiving grooves 8, 8 ... This contact 9 is made by punching out a thin gold-plated beryllium copper elastic plate having a thickness of 0.2 to 0.3 mm. The contact 9 is on the side of the J-bend type lead 2 of the IC package body 1 above. It has a first elastic contact piece 9a having a smooth convex surface which is in contact with the slanting lower part of the bulging portion and a second elastic contact piece 9b which is in contact with the slanting upper part thereof, and the upper slant surface 9c of the second elastic contacting piece 9b is connected. It is opened outward at an inclination angle of about 10 ° with respect to the center line 3a of the container 3. The contact 9 has an engagement protrusion 9d for preventing it from coming off, and its lower end 9e projects downward from the lower end of the contact receiving groove.

Next, the operation of this device will be described. When the IC package body 1 is fitted to the connector 3, the IC package body 1 is turned upside down as shown in FIG. 1C, and the side walls 4 and 4 are inserted from above as shown in FIG. To insert. As a result, the lower sides of the J-bend type lead 2 of the IC package body 1 are first engaged with the upper slopes 9c, 9c of the second elastic contact pieces 9b, 9b, and are pushed outward to descend, As shown in FIG. 1 (a), it fits into the IC package housing 5. As a result, as shown in FIG. 1 (b), the second elastic contact pieces 9b, 9b come into contact with the oblique upper portion of the J-bend type lead 2 of the IC package body 1 and prevent the IC package body 1 from coming out upward. The first elastic contact piece 9 a contacts the oblique lower portion of the J bend type lead 2.

When the IC package body 1 is detached from the connector 3, a wedge-shaped tool is inserted below the IC package body 1 from the open end of the recess 6. As a result, the IC package body 1 is pushed upward, and the second elastic contact pieces 9b, 9b are pushed outward and expanded upward.

[0011]

[Effect of the device]

 As described above, according to the present invention, in the connector for the IC package having the J-bend type lead, the contact pressure of the second elastic contact piece of the contact, which is in pressure contact with one bent portion of the lead, is provided. And the contact pressure of the first elastic contact piece of the contact, which makes pressure contact with the other bent portion of the lead in the lower part, can achieve highly reliable electrical contact, and at the same time, the contact of the second elastic contact piece can be achieved. The lead pressing force due to the pressure and the lead pressing force of the first elastic contact piece exert a concentrated contact pressure on the upper and lower bent portions while maintaining the balance in a floating and supported state, so that the IC package is moved upward. Floating can be satisfactorily suppressed, and it can be securely held in the housing, effectively preventing play and separation of the IC package due to vibration, shock, etc., and contact by the first and second elastic contact pieces. Maintain the condition properly It can be.

As described above, the present invention applies the pushing force of the second elastic contact piece to one bending portion of the J-bend type lead and the pushing force of the first elastic contact piece to the other bending portion of the same. The IC package body is floated and supported at a position where the push-up force and the push-down force by both contact pieces are balanced. Therefore, the IC package body is not restricted to the bottom surface of the IC housing part (due to the difference in relative position between the contact height and the height of the bottom surface) and is not biased upward or downward, and the J-bend type lead is provided. Pressing force of the second and first elastic contact pieces applied to the upper and lower bent parts of the J-bend type lead without causing variations in the contact position and contact pressure of the first and second elastic contact parts to the upper and lower bent parts of the A sound pressure contact can be achieved at the balance point between the push-up force and the push-up force, and the upper and lower bent portions of the lead function as a concentrated contact point, so that highly reliable contact can be expected.

Further, it is possible to solve the problem that the pushing depth is limited by the bottom surface of the IC housing and the first elastic contact piece is opened more than necessary to accumulate fatigue. The first and second elastic contact pieces balance each other's load so that they are mutually absorbed and the load is not biased to one side. According to the present invention, the first and second elastic contact pieces can make use of the shape of the J-bend piece lead to achieve a good contact shape and hold the IC package, and the contact can eliminate the conventional drawbacks of the external lead-type connector. It can be effectively resolved.

[Brief description of drawings]

FIG. 1A is a vertical sectional view of an embodiment of the present invention, and FIG.
Is an enlarged view of the main part, and (c) is an end view showing only the IC in the reverse direction.

FIG. 2 is a plan view thereof.

FIG. 3 is a side view thereof.

FIG. 4 is an end view thereof.

[Explanation of symbols]

 1 IC Package Main Body 2 J Bend Type Lead 3 Connector 4 Side Wall 5 IC Package Housing 8 Contact Housing Groove 9 Contact 9a First Elastic Contact Piece 9b Second Elastic Contact Piece

Claims (1)

[Scope of utility model registration request] 1. A connector (3) for an IC package having vertically extending J-bend type leads (2) arranged in parallel along opposite side surfaces of an IC package body (1). Inside the opposing side walls (4) forming the IC package accommodating portion (5) of the main body, a number of contacts (9) are provided facing the side surface of the IC package main body (1).
Are arranged in parallel, and the contact (9) is provided with a first elastic contact piece (9a) and a second elastic contact piece (9b) which are parallel to the front-rear direction and extend upward, and the second elastic contact piece (9b). ) Is pressure-contacted to the outer surface of the one bent portion of the J-bend type lead (2) at a higher level to give a pressing force, and
The elastic contact piece (9a) is brought into pressure contact with the outer surface of the other bent portion of the J-bend type lead (2) at a lower position, and the first elastic contact piece (9a) has the J-bend shape at the bent portion. A push-up force is applied to the lead (2) so that the first elastic contact piece (9a) and the second elastic contact piece (9b) come into contact with each other under pressure by J
An IC connector that captures the bend type lead (2) and floats and holds the IC package body (1) from the bottom surface of the IC housing portion (5).