JPH0592982U - IC socket - Google Patents

Abstract

(57) [Summary] [Object] To provide a socket for an IC package having a J-bend type lead, the socket having a contact pin which is in two-point contact with a vertical portion of the lead. [Constitution] In a contact pin having two contact pieces, a first contact piece is provided with a taper portion for being pushed and bent toward the outside of the socket body by engaging with a lead, and a second contact piece is provided with An engaging portion for pushing and bending itself outward by engaging with the first contact piece and a taper portion for further pushing and bending outward by engaging with the lead are provided.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an IC socket for mounting an IC package having a J-bend type lead and connecting the lead to an external circuit.

[0002]

[Prior Art]

 As an IC socket for an IC package having a conventional J-bend type lead, for example, as shown in FIG. 4, a first contact portion 1c provided on a first contact piece 1 of a bifurcated contact pin and a second contact portion By sandwiching the R-shaped portions 8a, 8b of the lead from the diagonally upper and diagonally lower portions by the second contact portion 2c provided on the piece 2, the IC package is fixed to the IC socket, and at the same time, the contact pin is not By making point contact, the lead 8 and the contact pin were surely electrically connected.

Further, in the IC socket shown in FIG. 5, one contact piece of a contact pin is provided with two contact portions 1c and 2c, and the lead 8 is laterally sandwiched between the two contact portions 1c and 2c. Thus, the IC package is fixed to the socket body 6 and, at the same time, the lead 8 and the contact pin are reliably electrically connected by making two-point contact with the lead 8.

[0004]

[Problems to be solved by the device]

 However, in the case of the IC socket shown in FIG. 4, since the first contact portion 1c of the contact pin is in contact with the R-shaped portion 8b of the lead obliquely from above, when the IC package is taken out from the socket body 6, the contact The R-shaped portion 8b of the lead is easily caught by the first contact portion 1c of the pin and is difficult to take out, and the lead 8 may be damaged.

Further, due to a dimensional error in manufacturing the IC package, the R-shaped portion 8a. The position of 8b varies, the contact position between the contact pin and the lead 8 changes, and the contact pressure between the contact pin and the lead 8 may change for each IC package. When the contact pressure between the contact pin and the lead changes, the electric resistance of the contact portion also changes. Therefore, in the case of the IC socket shown in FIG. 4, when an IC package mounting test or the like is performed, variations in electric resistance affect the test results, which may cause inconvenience.

In the case of the IC socket of FIG. 5, since the two contact portions, the first contact portion 1c and the second contact portion 2c, are brought into contact with the lead 8 only by one spring portion 9 of the contact pin, The contact pressure between the first contact portion 1c and the second contact portion 2c with respect to the lead 8 is different, or either one of the first contact portion 1c and the second contact portion 2c does not contact the lead 8. In such a case, when carrying out a mounting test of an IC package, contact resistance may vary and a connection failure may occur, resulting in inconvenience.

Further, the contact pin is bifurcated like the IC socket shown in FIG. 4 to provide two contact pieces 1 and 2, and contact portions 1c and 2c provided on the two contact pieces 1 and 2 respectively. Both sides of the contact pin make it possible to contact the vertical portion A of the lead 8 shown in FIG. 6 from the side surely, since the dimension of the vertical portion A of the lead 8 is short, the first contact portion 1c and the second contact portion of the contact pin are It is necessary to make 2c extremely close to each other, and when inserting the IC package into the socket body 6 from above, the lead 8 pushes the second contact piece 2 of the contact pin toward the outside of the socket body 6 and bends it. Since it becomes impossible to provide the tapered portion 2b as a surface and the state becomes substantially horizontal, there is a problem that the portion B of the lead 8 shown in FIG. 6 is placed on the second contact piece 2. ..

The base portion of the lead 8 close to the IC package body 7 may not be electrically contacted with burrs during molding of the IC package body 7, so that the portion B of the lead 8 may not be contacted. It is desirable to avoid connection with the contact pins of.

The present invention is an IC socket having a J-bend type lead in an IC socket having a contact pin in which a contact portion is provided on each of two bifurcated contact pieces to make a two-point contact. When the package is inserted into the socket body from above, it will not cause troubles such as the lead resting on the second contact part of the contact pin, and both contact parts are on the side of the IC package. It is an object of the present invention to provide an IC socket for an IC package having a J-bend type lead, which can make more reliable contact with the leads.

[0010]

[Means for Solving the Problems]

 According to the present invention, an elastic contact pin is bifurcated to provide two contact pieces, and the first contact piece is provided with a taper portion that inclines from the upper side to the inner side at the free end, and the first contact piece has a first lower portion. One contact portion is formed, and the second contact piece is provided with a taper portion inclining inward from above at a free end thereof, and an engagement portion for engaging the first contact piece is provided on an upper portion of the taper portion while a lower portion is provided. The above problem is solved by forming the second contact portion on the.

[0011]

[Action]

 When the IC package having the J-bend type lead having the above structure is inserted into the socket body from above, the lead first contacts the tapered portion provided on the first contact piece of the contact pin. When the IC package is moved further downward, the first contact piece bends toward the outside of the socket body and comes into contact with the engaging portion above the tapered portion provided on the second contact piece, and the second contact piece also contacts the socket. Bend to the outside of the body.

When the IC package is further moved downward, the lead comes into contact with the second contact portion below the taper portion of the second contact piece which is already bent outward of the socket body, and the second contact piece is further extended. Bending outward, the IC package body comes into contact with the mounting portion provided on the socket body and is mounted on the socket body. Then, the first contact portion of the first contact piece and the second contact portion of the second contact piece press the lead from the outside, so that the lead and the contact pin are electrically contacted with each other, and the IC package is placed in the socket body. Fixed to.

[0013]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side view of an elastic contact pin according to the present invention. In the figure, 1 is a first contact piece having a tapered portion 1a, a pressing portion 1b bent at the lower end thereof, and a first contact portion 1c having a convex shape, and 2 is a tapered portion 2a having a shorter dimension than the tapered portion 1a. And an engaging portion 2b extendingly formed on the upper portion of the tapered portion 2a, and a second contact portion 2c having a convex shape formed on the bent portion by bending the lower portion of the tapered portion 2a. The second contact piece 3 has a connecting portion 3 extending downward for connecting to an external circuit, and 4 a hole for inserting a hook-shaped jig when the contact pin is press-fitted into the socket body. Is a notch for engaging with the positioning portion of the socket body.

FIG. 2 is a sectional view showing a state where the contact pin shown in FIG. 1 is mounted on the socket body, and FIG. 3 is a partial enlarged view showing a process of mounting the IC package on the IC socket shown in FIG. .. In the figure, reference numeral 6 denotes a socket body, which is provided with a mounting portion 6a, an elongated hole 6b for press-fitting the contact pin shown in FIG. 1, and a convex portion 6c which engages with the notch portion 5 of the contact pin. There is. Reference numeral 7 is an IC package body, and 8 is a J-bend type lead.

Next, a process of mounting the IC package having the J-bend type lead on the socket body will be described with reference to FIG. First, when the IC package 7 is inserted into the socket body 6 from the upper side in the direction shown in FIG. 3A, the R-shaped portion 8a of the lead 8 and the taper portion 1a of the first contact piece come into contact with each other, As shown by the arrow in FIG. 3 (b), the tapered portion 1 a of the first contact piece 1 is pushed and bent outward of the socket body 6. Then, as shown in FIG. 3C, the pressing portion 1b of the first contact piece comes into contact with the engaging portion 2b of the second contact piece, and the second contact piece 2 is also bent outward of the socket body 6. ..

When the IC package is further moved downward, as shown in FIG. 3D, the R-shaped portion 8 a of the lead 8 is already in a state of being bent outward of the socket body 6. The second contact piece 2 is further bent slightly toward the outer side of the socket body 6 by coming into contact with the tapered portion 2a of the contact piece. Then, as shown in FIG. 3 (e), the IC package body 7 contacts the mounting portion 6a of the socket body, and the first contact portion 1c of the first contact piece 1 and the second contact portion 2 of the second contact piece 2 are contacted with each other. Both c are in contact with the vertical portion of the lead 8 and the portion A shown in FIG. 6 and pinch the lead 8 from both sides, so that the lead 8 and the contact pieces 1 and 2 of the contact pin are electrically contacted securely. At the same time, the IC package is fixed to the socket body 6.

To attach the contact pin shown in FIG. 1 to the socket body 6, first, the contact pin shown in FIG. 1 is inserted into the elongated hole 6 b provided in the socket body 6 from above with a weak force. A portion of the bottom of the socket body 6 adjacent to the elongated hole is slightly lightened in advance. Therefore, by inserting a hook-shaped jig into the hole 4 of the contact pin and pulling the hook-shaped jig downward with a strong force, the contact pin becomes longer than the slightly lightened portion. Simultaneously with being press-fitted into the hole 6b, the notch 5 of the contact pin and the convex portion 6c of the socket body are engaged with each other to fix the contact pin to the socket body 6.

[0018]

[Effect of the device]

 As described above, since the IC package socket having the J-bend type lead of the present invention can make two-point contact at the vertical portion of the lead, the conventional IC of the type that makes contact at the R-shaped portion of the lead. Compared to the socket, the contact position between the contact pin and the lead has less variation, so the contact pressure between the contact pin and the lead does not vary, and the electrical connection is reliable and stable.

Also, when molding the IC package body, there is a case where burrs are attached to the base portion of the lead near the IC package body. In the case of the IC socket of the present invention, the lead is used. Since there is no contact with the contact pin at the base portion close to the IC package body, there is no fear of contact failure due to the resin.

[Brief description of drawings]

FIG. 1 is a side view showing an example of a contact pin according to the present invention.

FIG. 2 is a cross-sectional view of essential parts showing a state where the contact pin shown in FIG. 1 is mounted on a socket body.

3 is a partial cross-sectional view showing a process of mounting an IC package having a J-bend type lead on the IC socket shown in FIG. 2, (a) before mounting, (b), (c), (d) (E) shows the state of being completely attached while being attached.

FIG. 4 is a sectional view showing an example of a conventional IC package socket having a J-bend type lead.

FIG. 5 is a cross-sectional view showing another example of a conventional IC package socket having a J-bend type lead.

FIG. 6 is a cross-sectional view of an IC package having a conventional J-bend type lead.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 1st contact piece 1a Tapered part 1c 1st contact part 2 2nd contact piece 2a Tapered part 2b Engagement part 2c 2nd contact part 3 Connection part 4 Hole 5 Notch part 6 Socket main body 7 IC package main body 8 J bend type Reed

Claims (1)

[Scope of utility model registration request] 1. An IC mounted with an elastic contact pin formed by bifurcating upward to form a first contact piece and a second contact piece for contacting a J-bend type lead of an IC package. In the socket, the first contact piece is provided with a taper portion that is inclined from the upper side to the inner side at a free end, and a convex first contact portion is formed at a lower portion of the first contact piece. The end portion is provided with a taper portion that is inclined from the upper side to the inner side, and the upper portion of the taper portion is provided with an engagement portion that engages with the first contact piece, while the lower portion is formed with a convex second contact portion. An IC package socket having a J-vent type lead.