JPH0593046U - Chip module with resistor array - Google Patents

Abstract

(57) [Abstract] [Purpose] In a chip module including a resistance element such as a pull-up resistor connected to an input terminal or the like, the board occupying area is reduced and the mounting process is simplified. [Structure] In a chip module with a resistor array that has a resistor element that can be selectively connected to an external connection terminal,
Bare chip IC element (5) mounted on insulating substrate (1), and bare chip IC provided on said insulating substrate
External connection terminals (7a, 7c, 7e, 7g, 9b, 9d, of the first group) electrically connected to the connection terminals of the element.
9f), a parallel connection circuit of a resistor (17) and a severable conductor pattern (19) formed on the insulating substrate and having one end connected to any of the external connection terminals of the first group, A second group of external connection terminals (7b, 7d, 7f, 9a, 9c, 9e, 9g) provided on the insulating substrate and connected to the other end of the parallel connection circuit is provided.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a chip module with a resistance array, and more particularly to a chip module having a resistance element that can be connected to an external connection terminal such as an input terminal of an IC element for pull-up or pull-down.

[0002]

[Prior Art]

 For example, when a digital IC is used, a resistor is connected to the input section or the output section of the digital IC element for pull-up or pull-down, and the element is connected to a power source such as +5 bolts. Keeping the input high or low is done. In order to form such a circuit, conventionally, an IC element and a resistance element are separately mounted on a printed board, and the resistance element is connected to an input section or an output section of the IC element by soldering and a wiring pattern. Was.

[0003]

[Problems to be solved by the device]

 However, in such a conventional circuit configuration method, since the IC element and the resistance element are separately mounted on the printed board, the board occupying area becomes large and it is impossible to mount the circuit at a high density. Further, since the terminals of the IC element and the resistance element are connected by a wiring pattern and soldering, the number of parts to be mounted is increased and the mounting man-hour is increased.

In view of the above-mentioned problems in the circuit structure of the conventional example, an object of the present invention is to be able to mount an electronic circuit including a pull-up resistor and the like at a high density by a simple mounting process, and to mount parts and the number of parts. It is to provide a chip module that can reduce the power consumption.

[0005]

[Means for Solving the Problems]

 To achieve the above object, according to the present invention, there is provided a chip module with a resistor array having a resistor element that can be selectively connected to an external connection terminal, the chip module being a bare chip mounted on an insulating substrate. An IC element, a first group of external connection terminals provided on the insulating substrate and electrically connected to connection terminals of the bare chip IC element, and a resistor and a conductor pattern formed on the insulating substrate in parallel connection. A circuit in which one end of the parallel connection circuit is connected to one of the external connection terminals of the first group, and a circuit connected to the other end of the parallel connection circuit provided on the insulating substrate. It is characterized by comprising two groups of external connection terminals.

It is convenient to provide the parallel connection circuit of the resistor and the conductor pattern on the surface of the insulating substrate opposite to the surface on which the bare IC element is mounted.

[0007]

[Action]

 In the chip module with a resistance array having the above configuration, the resistance element can be connected to the external connection terminal by cutting the conductor pattern of the parallel connection circuit by, for example, laser trimming. This resistance element can be used as, for example, a pull-up resistor, a pull-down resistor, an input resistor or the like. Also, when it is not necessary to connect a resistance element to the external connection terminal, by disconnecting the conductor pattern, the external connection terminal of the first group can be connected to the outside without connecting the resistor. In this case, both the external connection terminals of the first group and the external connection terminals of the second group connected by the conductor pattern can be used together for connection with an external circuit.

In addition, the parallel connection circuit of the resistor and the conductor pattern is provided on the surface of the insulating substrate opposite to the surface on which the bare IC element is mounted, so that the area on the insulating substrate is effectively utilized. Therefore, the integration degree of the chip module itself can be improved.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an appearance of a chip module with a resistor array according to one embodiment of the present invention. The chip module shown in the figure has, for example, a conductive die bond pad 3 formed on an insulating substrate 1 made of alumina or the like, and a bare chip IC element 5 is mounted on the die bond pad 3. ing.

Further, conductive peripheral connecting terminals 7a, 7b, 7c, ..., 7g and 9a, 9b, 9c ,. These external connection terminals 7a, 7b, 7c, ..., 7g and 9a, 9b, 9c ..., 9g are provided on the sides of the insulating substrate 1 which face each other.

Among these external connection terminals, for example, the external connection terminals 7a, 7c, 7e, 7g and 9b, 9d, 9f are respectively bonded to the bonding pad 13 via the wiring pattern 11 formed on the insulating substrate 1. Is electrically connected to. Then, the respective bonding pads 13 are connected to each other by the bonding pads on the bare chip IC element 5 and the bonding wires 15.

In the chip module of FIG. 1, the external connection terminals 7a, 7c, 7e, 7g and 9b, 9d, 9f are used as the external connection terminals of the first group, respectively, and the wiring pattern 11 and the bonding pad 13 are used, respectively. Also, it is connected to the external connection terminal of the bare chip IC element 5 via the bonding wire 15 and the like. Moreover, the other external connection terminals 7b, 7d, 7f and 9a, 9c, 9e, 9g provided on the insulating substrate 1 are used as the external connection terminals of the second group, and are directly connected to the bare chip IC element 5 Is not connected to.

FIG. 2 shows a circuit pattern provided on the surface of the insulating substrate 1 in the chip module of FIG. 1 on which the bare chip IC element 5 is mounted, that is, the surface A and the surface B opposite to the surface A. Note that, in FIG. 2, for ease of understanding, a state in which the circuit pattern on the B surface is seen through from the A surface is illustratively shown. Therefore, the electrodes 7g, 7f, ... And 9g, 9f, ... At both ends in the circuit pattern of FIG. 2 are connected to the internal connection terminals indicated by the same reference symbols in FIG. Each circuit pattern is composed of a parallel connection circuit of the printed resistor 17 and the conductive pattern 19, and both ends of such a parallel connection circuit are placed between the external connection terminals 7g and 9g, 7f and 9f, respectively. It is connected.

FIG. 3 shows details of the parallel connection circuit pattern of FIG. The parallel connection circuit includes, for example, a conductive pattern 19 provided between the external connection terminals 9g and 7g and a printed resistor 17 connected in parallel to the conductive pattern 19. The conductive pattern 19 and the printed resistor 17 can be cut by laser trimming or the like as shown by dotted lines D and C, respectively.

In such a configuration, for example, when the external connection terminal 7g is an input terminal of the bare chip IC element 5 and a pull-up resistor is connected to the input terminal 7g for use, the conductive pattern is used. The D part of 19 is cut by a laser beam or the like. As a result, as shown in FIG. 4A, the resistor 17 is connected between the input terminal 7g and the external connection terminal 9g, and the terminal 9g is connected to a predetermined power source. The input terminal 7g can be pulled up.

When it is not necessary to connect the pull-up resistor, the printed resistor 17 in FIG. 3 is cut at the portion indicated by the dotted line C, or it is used as it is without being cut, so that the external connection terminal Both 7g and 9g can be used as input terminals to the IC element 5. That is, it is possible to use the terminals 7g and 9g at two places as external connection terminals to an electrode of the IC element 5, and the degree of freedom of wiring is improved.

[0017]

[Effect of the device]

 As described above, according to the present invention, the IC element and the resistor are formed on the substrate of the chip module, and the two are connected to each other. Therefore, only the chip module needs to be mounted on the main printed circuit board and the resistor is separately provided. Eliminates the need to implement. For this reason, the area occupied by the substrate is significantly reduced, and high-density mounting of electronic circuits becomes possible. Also, because the selective connection between the resistor element and the IC element is performed by laser trimming, etc., the connection process is simplified compared to the conventional solder connection of the IC element and the resistor element on the printed circuit board. And reliability is improved. Also, it is not necessary to separately mount the resistance element, and the only parts to be mounted are the chip modules, which reduces the mounting man-hours. Further, when the resistance element is not used, the external connection terminals can be used at two places, so that the degree of freedom of wiring is improved and the design of the circuit pattern of the printed circuit board is facilitated.

[Brief description of drawings]

FIG. 1 is an explanatory perspective view showing the external appearance of a chip module with a resistor array according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a circuit pattern on the back surface of the chip module of FIG. 1 as seen through from the front surface of the chip module.

FIG. 3 is one of parallel connection circuits in the circuit pattern of FIG.
It is an enlarged explanatory view showing one in detail.

FIG. 4 is an explanatory block circuit diagram showing an equivalent circuit in the chip module of FIG. 1 when a pull-up resistance element is used (a) and when it is not used (b).

[Explanation of symbols]

1 Insulating Substrate 3 Die Bond Pad 5 Bare Chip IC Elements 7a, 7b, 7c, ..., 7g, 9a, 9b, 9c ,.
9g External connection terminal 11 Wiring pattern 13 Bonding pad 15 Bonding wire 17 Printing resistor 19 Conductive pattern

Claims (2)

[Scope of utility model registration request] 1. A chip module with a resistance array having a built-in resistance element that can be selectively connected to an external connection terminal, the bare chip IC element being mounted on an insulating substrate, and the bare chip IC provided on the insulating substrate. A first group of external connection terminals electrically connected to the connection terminals of the element;
A parallel connection circuit of a resistor and a conductor pattern formed on the insulating substrate, wherein one end of the parallel connection circuit is connected to one of the external connection terminals of the first group; A second group of external connection terminals that are connected to the other end of the parallel connection circuit and are connected to the other end of the parallel connection circuit by cutting the conductor pattern of the parallel connection circuit. A chip module with a resistor array, in which elements can be connected. 2. A chip module with a resistor array, wherein the parallel connection circuit of the resistor and the conductor pattern is provided on the surface of the insulating substrate opposite to the surface on which the bare chip IC element is mounted.