JPH059379A - Polyamide resin composition - Google Patents
Polyamide resin compositionInfo
- Publication number
- JPH059379A JPH059379A JP19077991A JP19077991A JPH059379A JP H059379 A JPH059379 A JP H059379A JP 19077991 A JP19077991 A JP 19077991A JP 19077991 A JP19077991 A JP 19077991A JP H059379 A JPH059379 A JP H059379A
- Authority
- JP
- Japan
- Prior art keywords
- polyamide resin
- pts
- polyolefin
- resin composition
- flame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 32
- 239000011342 resin composition Substances 0.000 title claims abstract description 22
- 239000003063 flame retardant Substances 0.000 claims abstract description 23
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 13
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 10
- 150000002367 halogens Chemical class 0.000 claims abstract description 10
- 239000012744 reinforcing agent Substances 0.000 abstract description 9
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000203 mixture Substances 0.000 abstract description 5
- 229920000098 polyolefin Polymers 0.000 abstract description 5
- 239000003365 glass fiber Substances 0.000 abstract description 4
- 239000004793 Polystyrene Substances 0.000 abstract description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 abstract description 3
- 229920002223 polystyrene Polymers 0.000 abstract description 3
- 239000000454 talc Substances 0.000 abstract description 3
- 229910052623 talc Inorganic materials 0.000 abstract description 3
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 239000012760 heat stabilizer Substances 0.000 abstract description 2
- 239000004611 light stabiliser Substances 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 2
- 229920006389 polyphenyl polymer Polymers 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 description 20
- -1 sebacic acid Chemical compound 0.000 description 17
- 239000004698 Polyethylene Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229920000573 polyethylene Polymers 0.000 description 7
- 239000004743 Polypropylene Substances 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- 238000005452 bending Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- PZWQOGNTADJZGH-SNAWJCMRSA-N (2e)-2-methylpenta-2,4-dienoic acid Chemical compound OC(=O)C(/C)=C/C=C PZWQOGNTADJZGH-SNAWJCMRSA-N 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 229920013716 polyethylene resin Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- GPQLSLKPHQEEOP-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-(2,3,4-tribromophenoxy)benzene Chemical compound BrC1=C(Br)C(Br)=CC=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br GPQLSLKPHQEEOP-UHFFFAOYSA-N 0.000 description 1
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- QLZJUIZVJLSNDD-UHFFFAOYSA-N 2-(2-methylidenebutanoyloxy)ethyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OCCOC(=O)C(=C)CC QLZJUIZVJLSNDD-UHFFFAOYSA-N 0.000 description 1
- AWQSAIIDOMEEOD-UHFFFAOYSA-N 5,5-Dimethyl-4-(3-oxobutyl)dihydro-2(3H)-furanone Chemical compound CC(=O)CCC1CC(=O)OC1(C)C AWQSAIIDOMEEOD-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- VWPQCOZMXULHDM-UHFFFAOYSA-N 9-aminononanoic acid Chemical compound NCCCCCCCCC(O)=O VWPQCOZMXULHDM-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- QHWKHLYUUZGSCW-UHFFFAOYSA-N Tetrabromophthalic anhydride Chemical compound BrC1=C(Br)C(Br)=C2C(=O)OC(=O)C2=C1Br QHWKHLYUUZGSCW-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229920003144 amino alkyl methacrylate copolymer Polymers 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 239000005043 ethylene-methyl acrylate Substances 0.000 description 1
- JPZROSNLRWHSQQ-UHFFFAOYSA-N furan-2,5-dione;prop-2-enoic acid Chemical compound OC(=O)C=C.O=C1OC(=O)C=C1 JPZROSNLRWHSQQ-UHFFFAOYSA-N 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- VUNCWTMEJYMOOR-UHFFFAOYSA-N hexachlorocyclopentadiene Chemical class ClC1=C(Cl)C(Cl)(Cl)C(Cl)=C1Cl VUNCWTMEJYMOOR-UHFFFAOYSA-N 0.000 description 1
- 229920002681 hypalon Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- XUWHAWMETYGRKB-UHFFFAOYSA-N piperidin-2-one Chemical compound O=C1CCCCN1 XUWHAWMETYGRKB-UHFFFAOYSA-N 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、ポリアミド樹脂組成
物、更に詳しくは耐トラッキング性に優れた難燃性ポリ
アミド樹脂組成物に関する。TECHNICAL FIELD The present invention relates to a polyamide resin composition, and more particularly to a flame-retardant polyamide resin composition having excellent tracking resistance.
【0002】[0002]
【従来技術】ポリアミド樹脂は、優れた物理的、化学的
性質を有するために従来より各種用途に広く用いられて
いるが、中でも耐トラッキング性に優れるため、電子部
品、自動車部品、電気照明器具用スイッチなどの成形材
料として有用である。2. Description of the Related Art Polyamide resins have been widely used in various applications since they have excellent physical and chemical properties. Among them, since they have excellent tracking resistance, they are used for electronic parts, automobile parts, and electric lighting equipment. It is useful as a molding material for switches.
【0003】このような用途目的でポリアミド樹脂を用
いる場合、その難燃化のために各種難燃剤を添加したと
ころ、特に、ハロゲン系難燃剤を使用したときに耐トラ
ッキング性が著しく損なわれることが判明した。When a polyamide resin is used for such purposes, various flame retardants are added to make it flame-retardant, and particularly when a halogen-based flame retardant is used, the tracking resistance may be significantly impaired. found.
【0004】[0004]
【発明が解決しようとする課題】本発明は、難燃ポリア
ミド樹脂における上記の欠点を解消し、優れた耐トラッ
キング性を有する難燃性ポリアミド樹脂組成物を提供す
ることを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned drawbacks of flame-retardant polyamide resin and to provide a flame-retardant polyamide resin composition having excellent tracking resistance.
【0005】[0005]
【課題を解決するための手段】本発明者らは、上記の目
的を達成するために種々研究の結果、ポリアミド樹脂お
よびハロゲン系難燃剤を含有する組成物に、更にポリオ
レフィン系樹脂を添加することにより、耐トラッキング
性および難燃性のいずれにも優れた樹脂組成物が得られ
ることを見出して本発明を完成した。As a result of various studies to achieve the above object, the present inventors have found that a polyolefin resin is added to a composition containing a polyamide resin and a halogen-based flame retardant. It was found that a resin composition excellent in both tracking resistance and flame retardancy can be obtained, and the present invention was completed.
【0006】即ち、本発明は、ポリアミド樹脂、ハロゲ
ン系難燃剤およびポリオレフィン系樹脂を含有すること
を特徴とするポリアミド樹脂組成物に係るものであり、
更に詳しくは、ポリアミド樹脂100重量部に対してハ
ロゲン系難燃剤を通常は10〜150重量部、好ましく
は15〜70重量部、ポリオレフィン系樹脂を通常は3
〜300重量部、好ましくは10〜100重量部含有し
てなるポリアミド樹脂組成物に係るものである。That is, the present invention relates to a polyamide resin composition containing a polyamide resin, a halogen flame retardant and a polyolefin resin,
More specifically, the halogen-based flame retardant is usually 10 to 150 parts by weight, preferably 15 to 70 parts by weight, and the polyolefin-based resin is usually 3 to 100 parts by weight of the polyamide resin.
To 300 parts by weight, preferably 10 to 100 parts by weight, relating to the polyamide resin composition.
【0007】本発明のポリアミド樹脂組成物は、優れた
耐トラッキング性および難燃性を有しているので、これ
らの性質が特に要求される用途分野において好ましく用
いられ、例えばコネクター、トリマーポテンショメータ
ー、コイルボビン、フライバックトランス等の電子部
品、ディストリビューターキャップ、イグニッションコ
イルボビン等の自動車部品、電気照明器具のスイッチ等
の成形材料として非常に有用である。Since the polyamide resin composition of the present invention has excellent tracking resistance and flame retardancy, it is preferably used in the fields of application where these properties are particularly required. For example, connectors, trimmer potentiometers, coil bobbins. , It is very useful as a molding material for electronic parts such as flyback transformers, distributor caps, automobile parts such as ignition coil bobbins, and switches for electric lighting equipment.
【0008】本発明におけるポリアミド樹脂とは、分子
中に酸アミド結合(−CONH−)を有するものであ
り、具体的には、ε−カプロラクタム、6−アミノカプ
ロン酸、ω−エナントラクタム、7−アミノヘプタン
酸、11−アミノウンデカン酸、9−アミノノナン酸、
α−ピロリドン、α−ピペリドンなどから得られる重合
体または共重合体:ヘキサメチレンジアミン、ノナメチ
レンジアミン、ウンデカメチレンジアミン、ドデカメチ
レンジアミン、メタキシリレンジアミンなどのジアミン
とテレフタル酸、イソフタル酸、アジピン酸、セバシン
酸などのジカルボン酸とを重縮合して得られる重合体ま
たは共重合体もしくはこれらのブレンド物等を例示する
ことができるが、これらに限定されるものではない。The polyamide resin in the present invention is one having an acid amide bond (-CONH-) in the molecule, specifically, ε-caprolactam, 6-aminocaproic acid, ω-enanthlactam, 7-amino. Heptanoic acid, 11-aminoundecanoic acid, 9-aminononanoic acid,
Polymers or copolymers obtained from α-pyrrolidone, α-piperidone, etc .: Hexamethylenediamine, nonamethylenediamine, undecamethylenediamine, dodecamethylenediamine, metaxylylenediamine and other diamines and terephthalic acid, isophthalic acid, adipine Examples thereof include polymers or copolymers obtained by polycondensing an acid or a dicarboxylic acid such as sebacic acid, or blends thereof, but are not limited thereto.
【0009】上記のポリアミド樹脂のうち、平均分子量
が9,000 〜30,000のものが好ましく用いられる。Of the above polyamide resins, those having an average molecular weight of 9,000 to 30,000 are preferably used.
【0010】本発明において使用するハロゲン系難燃剤
としては、臭素系および塩素系のいずれでもよく、臭素
系難燃剤の例としては、テトラブロムビスフェノール
A、デカブロモジフェニールエーテル、オクタブロムジ
フェニールエーテル、ヘキサブロモシクロドデカン、ビ
ストリブロモフェノキシエタン、ポリジブロムフェニレ
ンオキサイド、テトラブロモ無水フタール酸、TBA カー
ボネートオリゴマー、臭化ポリスチレン等が、また塩素
系難燃剤の例としては、塩素化ポリフェニル、パークロ
ルペンタシクロデカン、ヘキサクロルシクロペンタジエ
ン誘導体等が挙げられるが、本発明はこれらに限定され
るものではない。The halogen-based flame retardant used in the present invention may be either bromine-based or chlorine-based, and examples of the bromine-based flame retardant include tetrabromobisphenol A, decabromodiphenyl ether and octabrom diphenyl ether. , Hexabromocyclododecane, bistribromophenoxyethane, polydibromophenylene oxide, tetrabromophthalic anhydride, TBA carbonate oligomer, polystyrene bromide, etc. Examples include decane and hexachlorocyclopentadiene derivatives, but the present invention is not limited thereto.
【0011】これらの難燃剤は、ポリアミド樹脂100
重量部に対して通常は10〜150重量部、好ましくは
15〜70重量部添加すればよい。These flame retardants are polyamide resin 100
It may be added in an amount of usually 10 to 150 parts by weight, preferably 15 to 70 parts by weight, based on parts by weight.
【0012】本発明においては、上記のハロゲン系難燃
剤とともに、難燃助剤を使用することもでき、この難燃
助剤としては、三酸化アンチモン、五酸化アンチモン、
酸化ジルコニウム等が好ましい例として挙げられるが、
これらに限定されるものではない。In the present invention, it is also possible to use a flame retardant auxiliary together with the above halogen-based flame retardant, and as the flame retardant auxiliary, antimony trioxide, antimony pentoxide,
Preferred examples include zirconium oxide,
It is not limited to these.
【0013】上記の難燃助剤は、前記ハロゲン系難燃剤
10重量部に対して1〜5重量部の割合で使用される。The above flame retardant aid is used in an amount of 1 to 5 parts by weight with respect to 10 parts by weight of the halogen-based flame retardant.
【0014】本発明において使用されるポリオレフィン
系樹脂としては、ポリエチレン系樹脂、ポリプロピレン
系樹脂、変性ポリエチレン樹脂および変性ポリプロピレ
ン樹脂等が挙げられ、具体的には、エチレン−酢酸ビニ
ル(EVA)共重合体、エチレン−酢酸ビニル−不飽和
カルボン酸共重合体、エチレン−アクリル酸エチル(E
EA)共重合体、エチレン−アクリル酸メチル(EM
A)共重合体、エチレン−メタクリル酸メチル(EMM
A)共重合体、エチレン−アクリル酸(EAA)共重合
体、エチレン−メタクリル酸(EMAA)共重合体、エ
チレン−メタクリル酸グリシジル(EGMA)共重合
体、エチレン−メタクリル酸グリシジル−VA,EA共
重合体、エチレン−架橋サイト含有モノマー共重合体、
エチレン−架橋サイト含有モノマー−アクリル酸メチル
共重合体、エチレン−メタクリル酸アミノアルキル共重
合体、エチレン−メタクリル酸ヒドロキシアルキル共重
合体、エチレン−スチレン共重合体、エチレン−ビニル
シラン共重合体、エチレン−無水マレイン酸−アクリル
酸共重合体、エチレン−一酸化炭素−(VA)共重合
体、エチレン−開環重合性モノマー共重合体、エチレン
−マクロモノマー共重合体などのエチレン系共重合体、
不飽和カルボン酸グラフトポリエチレン、ビニルシラン
グラフトポリエチレン、ビニルモノマーグラフトポリエ
チレン、ビニルモノマーグラフトエチレン系共重合体な
どのグラフト共重合体、塩素化ポリエチレン、クロルス
ルホン化ポリエチレン、ケン化EVA、アイオノマー
(EMAAの金属イオン架橋体)、無水マレイン酸など
による酸変性ポリエチレン、酸変性ポリプロピレン、エ
チレンプロピレンラバー(EPR)、酸変性EPR等が
例示されるが、これらに限定されるものではない。Examples of the polyolefin resin used in the present invention include polyethylene resin, polypropylene resin, modified polyethylene resin and modified polypropylene resin, and specifically, ethylene-vinyl acetate (EVA) copolymer. , Ethylene-vinyl acetate-unsaturated carboxylic acid copolymer, ethylene-ethyl acrylate (E
EA) copolymer, ethylene-methyl acrylate (EM
A) Copolymer, ethylene-methyl methacrylate (EMM
A) copolymer, ethylene-acrylic acid (EAA) copolymer, ethylene-methacrylic acid (EMAA) copolymer, ethylene-glycidyl methacrylate (EGMA) copolymer, ethylene-glycidyl methacrylate-VA, EA copolymer Polymer, ethylene-crosslinking site-containing monomer copolymer,
Ethylene-crosslinking site-containing monomer-methyl acrylate copolymer, ethylene-aminoalkyl methacrylate copolymer, ethylene-hydroxyalkyl methacrylate copolymer, ethylene-styrene copolymer, ethylene-vinylsilane copolymer, ethylene- Ethylenic copolymers such as maleic anhydride-acrylic acid copolymers, ethylene-carbon monoxide- (VA) copolymers, ethylene-ring-opening polymerizable monomer copolymers, ethylene-macromonomer copolymers,
Graft copolymers such as unsaturated carboxylic acid graft polyethylene, vinylsilane graft polyethylene, vinyl monomer graft polyethylene, vinyl monomer graft ethylene-based copolymer, chlorinated polyethylene, chlorosulfonated polyethylene, saponified EVA, ionomer (metal ion of EMAA Examples thereof include cross-linked products), acid-modified polyethylene with maleic anhydride, acid-modified polypropylene, ethylene propylene rubber (EPR), acid-modified EPR, and the like, but are not limited thereto.
【0015】これらのポリオレフィン系樹脂の中でも、
無水マレイン酸酸変性ポリオレフィンおよびポリオレフ
ィンと無水マレイン酸酸変性ポリオレフィンとの組合せ
が、機械的特性を考慮した場合特に好適なものとして挙
げられる。Among these polyolefin resins,
The maleic anhydride-modified polyolefin and the combination of the polyolefin and the maleic anhydride-modified polyolefin are particularly preferable in view of mechanical properties.
【0016】上記のポリオレフィン系樹脂は、ポリアミ
ド樹脂100重量部に対して通常は3〜300重量部、
好ましくは10〜100の割合で添加される。ポリオレ
フィン系樹脂の添加量がこれより少なすぎると、耐トラ
ッキング性向上の効果が充分でなかったり或いはその効
果が安定的に得られないおそれがあり、逆にあまり多す
ぎる場合には難燃性が低下したり、機械的特性(曲げ強
度)および耐熱性(熱変形温度)も低下するなどのおそ
れが生じる。The above-mentioned polyolefin resin is usually 3 to 300 parts by weight with respect to 100 parts by weight of polyamide resin,
It is preferably added in a ratio of 10 to 100. If the amount of the polyolefin-based resin added is too small, the effect of improving the tracking resistance may not be sufficient or the effect may not be obtained stably. On the contrary, if the amount is too large, flame retardancy may result. There is a possibility that it may decrease, and that mechanical properties (bending strength) and heat resistance (heat deformation temperature) may also decrease.
【0017】本発明のポリアミド樹脂組成物には、前述
の各成分の他にも各種用途目的に応じて、例えば、強化
剤、離型剤、光または熱安定剤、着色剤等を添加するこ
とができる。In addition to the above-mentioned components, for example, a reinforcing agent, a release agent, a light or heat stabilizer, a colorant, etc. may be added to the polyamide resin composition of the present invention according to various purposes of use. You can
【0018】強化剤には、繊維状強化剤とフィラー状強
化剤とがあり、繊維状強化剤としては、ガラス繊維、炭
素繊維等が、フィラー状強化剤としては、タルク、マイ
カ、ワラストナイト、炭酸カルシウム、シリカ、カオリ
ン、モンモリナイト、クレー等が挙げられるが、本発明
は特にこれらに限定されるものではない。The reinforcing agents include fibrous reinforcing agents and filler-like reinforcing agents. The fibrous reinforcing agents include glass fiber and carbon fiber, and the filler-like reinforcing agents include talc, mica and wollastonite. , Calcium carbonate, silica, kaolin, montmorillonite, clay and the like, but the present invention is not particularly limited thereto.
【0019】強化剤の添加量は、ポリアミド樹脂組成物
に対して通常は5〜60重量%、好ましくは10〜35
重量%の割合にするとよい。この量が少なすぎると望ま
しい補強効果を得ることが難しく、また多すぎる場合に
は成形性および成形品外観が悪くなる。The amount of the reinforcing agent added is usually 5 to 60% by weight, preferably 10 to 35, relative to the polyamide resin composition.
It is good to make it a ratio of weight%. If this amount is too small, it is difficult to obtain the desired reinforcing effect, and if it is too large, the moldability and the appearance of the molded product deteriorate.
【0020】[0020]
【実施例】次に、実施例および比較例を示して本発明を
更に具体的に説明するが、本発明がこれら実施例に限定
されるものではないことは言うまでもない。EXAMPLES Next, the present invention will be described more specifically by showing Examples and Comparative Examples, but it goes without saying that the present invention is not limited to these Examples.
【0021】実施例1〜10 ポリエチレンおよびポリプロピレンのそれぞれ100重
量部に、無水マレイン酸 0.8重量部とパークミルD
(F)(過酸化物)0.2 重量部をそれぞれ加え、この二
種の混合物を35φ2軸押出機でそれぞれ押し出し、冷
却後にカッティングして変性ポリエチレンおよび変性ポ
リプロピレンのペレットをそれぞれ作製した。Examples 1 to 10 100 parts by weight of polyethylene and polypropylene, 0.8 parts by weight of maleic anhydride and Perkmill D
(F) (Peroxide) (0.2 parts by weight) was added, and the mixture of the two kinds was extruded by a 35φ twin-screw extruder, cooled and cut to prepare modified polyethylene and modified polypropylene pellets.
【0022】ポリアミド樹脂として、ナイロン−6(東
洋紡績株式会社製、商品名T−803,分子量12,000)
またはナイロン−66(東洋紡績株式会社製、商品名F
662,分子量17,000)を使用し、このポリアミド樹脂
100重量部に対し、ポリプロピレン、上記の如くして
得られた変性ポリエチレンおよび変性ポリプロピレンか
らなる一種以上のポリオレフィン系樹脂を表1にそれぞ
れ示した割合で加え、更に、難燃剤としてブロム化ポリ
スチレン(日産フェロー有機化学株式会社製、商品名パ
イロチェック68PB)またはデカブロモジフェニール
エーテル(三本産業株式会社製、商品名DE−83R)
を、難燃助剤として三酸化アンチモンを、強化剤として
ガラス繊維(GF)またはタルクを、それぞれ表1に示
した割合で添加して実施例1〜10のポリアミド樹脂組
成物を得た。As a polyamide resin, nylon-6 (manufactured by Toyobo Co., Ltd., trade name T-803, molecular weight 12,000)
Or nylon-66 (manufactured by Toyobo Co., Ltd., trade name F
662, molecular weight 17,000), and 100 parts by weight of this polyamide resin, polypropylene, one or more polyolefin-based resins composed of the modified polyethylene and modified polypropylene obtained as described above, in the proportions shown in Table 1, respectively. In addition, as a flame retardant, brominated polystyrene (manufactured by Nissan Fellow Organic Chemical Co., Ltd., trade name Pyrocheck 68PB) or decabromodiphenyl ether (manufactured by Sanbon Sangyo Co., Ltd., trade name DE-83R).
Was added with antimony trioxide as a flame retardant aid and glass fiber (GF) or talc as a reinforcing agent at the ratios shown in Table 1, to obtain polyamide resin compositions of Examples 1 to 10.
【0023】比較例1〜7 比較例として、ポリオレフィン系樹脂を含まない樹脂組
成物(比較例1〜5)とポリアミド樹脂を含まない樹脂
組成物(比較例6および7)を、表1に示される如き組
成割合で配合して得た。Comparative Examples 1 to 7 Table 1 shows a resin composition containing no polyolefin resin (Comparative Examples 1 to 5) and a resin composition containing no polyamide resin (Comparative Examples 6 and 7) as Comparative Examples. It was obtained by blending in the composition ratio as described above.
【0024】[0024]
【表1】 [Table 1]
【0025】実験例 実施例1〜10および比較例1〜7の樹脂組成物に、離
型剤としてステアリン酸Mg 0.2重量%添加し、35φ
2軸押出機でそれぞれ押し出し、冷却後にカッティング
して実施例1〜10および比較例1〜7の樹脂組成物の
ペレット(2.5φ×2.5 l)を得た。このペレットを 80
℃で16 時間真空乾燥後、射出成形により特性値評価の
ためのテストピースを作製した。Experimental Example To the resin compositions of Examples 1 to 10 and Comparative Examples 1 to 7, 0.2% by weight of Mg stearate was added as a mold release agent, and 35 φ
The resin composition was extruded with a twin-screw extruder, cut after cooling, and pellets (2.5φ × 2.5 l) of the resin compositions of Examples 1 to 10 and Comparative Examples 1 to 7 were obtained. 80 these pellets
After vacuum drying at 16 ° C for 16 hours, a test piece for characteristic value evaluation was prepared by injection molding.
【0026】このようにして作製したテストピースを用
い、耐トラッキング性、難燃性、曲げ強度、曲げ弾性
率、および熱変形温度についての評価をそれぞれ行なっ
た。The test pieces thus produced were evaluated for tracking resistance, flame retardancy, bending strength, bending elastic modulus, and heat deformation temperature.
【0027】評価試験は、耐トラッキング性については
IEC PuBl 112、難燃性についてはUL規格Subject 94、曲
げ強度についてはASTM D-790に準じて行なった。その結
果を表2に示した。The evaluation test shows that the tracking resistance is
IEC PuBl 112, flame retardancy was UL Standard Subject 94, and bending strength was ASTM D-790. The results are shown in Table 2.
【0028】[0028]
【表2】 [Table 2]
【0029】表2に示された結果から明らかなように、
本発明のポリアミド樹脂組成物は、耐トラッキング性お
よび難燃性のいずれにおいても優れていることが判る。As is clear from the results shown in Table 2,
It can be seen that the polyamide resin composition of the present invention is excellent in both tracking resistance and flame retardancy.
【0030】[0030]
【発明の効果】以上述べた通り、本発明は、難燃剤を含
有するポリアミド樹脂組成物にポリオレフィン系樹脂を
添加することによって耐トラッキング性を改善したもの
であり、本発明に従えば耐トラッキング性および難燃性
のいずれにおいても優れたポリアミド樹脂組成物が得ら
れる。As described above, the present invention improves tracking resistance by adding a polyolefin resin to a polyamide resin composition containing a flame retardant. According to the present invention, tracking resistance is improved. A polyamide resin composition having excellent flame retardancy and flame retardancy can be obtained.
Claims (1)
びポリオレフィン系樹脂を含有することを特徴とするポ
リアミド樹脂組成物。Claim: What is claimed is: 1. A polyamide resin composition comprising a polyamide resin, a halogen-based flame retardant, and a polyolefin-based resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19077991A JPH059379A (en) | 1991-07-03 | 1991-07-03 | Polyamide resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19077991A JPH059379A (en) | 1991-07-03 | 1991-07-03 | Polyamide resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH059379A true JPH059379A (en) | 1993-01-19 |
Family
ID=16263596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19077991A Pending JPH059379A (en) | 1991-07-03 | 1991-07-03 | Polyamide resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH059379A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002309083A (en) * | 2001-04-10 | 2002-10-23 | Kuraray Co Ltd | Polyamide composition |
| WO2007007663A1 (en) * | 2005-07-08 | 2007-01-18 | Polyplastics Co., Ltd. | Flame retardant resin composition |
| WO2018221378A1 (en) * | 2017-05-30 | 2018-12-06 | 宇部興産株式会社 | Polyamide resin composition and release film using same |
| JP2018203804A (en) * | 2017-05-30 | 2018-12-27 | 宇部興産株式会社 | Polyamide resin composition and release film using the same |
-
1991
- 1991-07-03 JP JP19077991A patent/JPH059379A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002309083A (en) * | 2001-04-10 | 2002-10-23 | Kuraray Co Ltd | Polyamide composition |
| WO2007007663A1 (en) * | 2005-07-08 | 2007-01-18 | Polyplastics Co., Ltd. | Flame retardant resin composition |
| JPWO2007007663A1 (en) * | 2005-07-08 | 2009-01-29 | ポリプラスチックス株式会社 | Flame retardant resin composition |
| WO2018221378A1 (en) * | 2017-05-30 | 2018-12-06 | 宇部興産株式会社 | Polyamide resin composition and release film using same |
| JP2018203804A (en) * | 2017-05-30 | 2018-12-27 | 宇部興産株式会社 | Polyamide resin composition and release film using the same |
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