JPH059388B2 - - Google Patents
Info
- Publication number
- JPH059388B2 JPH059388B2 JP59227439A JP22743984A JPH059388B2 JP H059388 B2 JPH059388 B2 JP H059388B2 JP 59227439 A JP59227439 A JP 59227439A JP 22743984 A JP22743984 A JP 22743984A JP H059388 B2 JPH059388 B2 JP H059388B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier film
- ceramic
- ceramic powder
- parts
- sintered body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 claims description 31
- 239000000203 mixture Substances 0.000 claims description 23
- 239000000843 powder Substances 0.000 claims description 15
- 229920000178 Acrylic resin Polymers 0.000 claims description 10
- 239000004925 Acrylic resin Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 6
- 230000001590 oxidative effect Effects 0.000 claims description 6
- 239000012298 atmosphere Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000178 monomer Substances 0.000 description 9
- 238000005245 sintering Methods 0.000 description 9
- 238000004080 punching Methods 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- -1 alkyl methacrylates Chemical class 0.000 description 4
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 3
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 3
- 125000005250 alkyl acrylate group Chemical group 0.000 description 3
- 238000007606 doctor blade method Methods 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- VDYWHVQKENANGY-UHFFFAOYSA-N 1,3-Butyleneglycol dimethacrylate Chemical compound CC(=C)C(=O)OC(C)CCOC(=O)C(C)=C VDYWHVQKENANGY-UHFFFAOYSA-N 0.000 description 2
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JJBFVQSGPLGDNX-UHFFFAOYSA-N 2-(2-methylprop-2-enoyloxy)propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)COC(=O)C(C)=C JJBFVQSGPLGDNX-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 150000008360 acrylonitriles Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
Description
【発明の詳細な説明】
〔産業の利用分野〕
本発明の表面外観及び打抜き加工性に優れたセ
ラミツクス焼結体の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a ceramic sintered body having excellent surface appearance and punching workability.
セラミツクス焼結体の製造方法の１つとしてキ
ヤリヤフイルム上にセラミツクス粉体を積層する
ドクターブレード法が挙げられるが、該方法を用
いることにより数十μ程度の薄板成形が可能であ
りIC基板等に有用である。
One of the methods for producing ceramic sintered bodies is the doctor blade method, in which ceramic powder is laminated on a carrier film. By using this method, it is possible to form a thin plate of several tens of microns, and it is suitable for IC substrates, etc. It is useful for
しかしながら、上記方法においてはセラミツク
スを焼結する場合、キヤリヤフイルムといつしよ
に焼結すると、キヤリヤフイルムの燃焼カスがセ
ラミツクス焼結体表面に残るため従来は焼結時に
はキヤリヤフイルムを除去する工程を必要とし、
さらにはキヤリヤフイルム上に積層したセラミツ
クス積層物の打抜き性をよくするために通常予備
焼成を必要としその為耐熱性の高いフイルムを使
用しなければならず、コスト的に高いものとなつ
た。 However, in the above method, when sintering ceramics together with a carrier film, combustion residue of the carrier film remains on the surface of the ceramic sintered body, so conventionally the carrier film was removed during sintering. It requires a process to
Furthermore, in order to improve the punchability of the ceramic laminate laminated on the carrier film, preliminary firing is usually required, which necessitates the use of a film with high heat resistance, resulting in high costs.
本発明の目的とするところは、キヤリヤフイル
ム上のセラミツクス粉体混合物をキヤリヤフイル
ムを剥離することなく焼結させかつ表面外観の優
れたセラミツクス焼結体を得ることにある。
An object of the present invention is to sinter a ceramic powder mixture on a carrier film without peeling off the carrier film and to obtain a ceramic sintered body with an excellent surface appearance.
本発明は、セラミツクス粉体材料と結合剤を含
むセラミツクス粉体混合物を非酸化性雰囲気中で
完全分解し得るアクリル系樹脂組成物からなるキ
ヤリヤフイルム上に積層し、しかる後に焼結する
ことを特徴とするセラミツクス焼結体の製造方法
にある。
The present invention involves laminating a ceramic powder mixture containing a ceramic powder material and a binder on a carrier film made of an acrylic resin composition that can be completely decomposed in a non-oxidizing atmosphere, and then sintering it. The present invention is characterized by a method for producing a ceramic sintered body.
アクリル系樹脂組成物は成膜性、柔軟性及び非
酸化性雰囲気中で完全分解し得るものであれば特
に制限されるものではないが、アクリル系樹脂組
成物を構成する単量体成分としてはエチルメタク
リレート、プロピルメタクリレート、ブチルメタ
クリレート等のアルキルメタクリレートと、メチ
ルアクリレート、エチルアクリレート、プロピル
アクリレート、ブチルアクリレート等のアルキル
アクリレートを主成分とする単量体混合物が好ま
しい。 The acrylic resin composition is not particularly limited as long as it has film-forming properties, flexibility, and can be completely decomposed in a non-oxidizing atmosphere, but the monomer components constituting the acrylic resin composition are A monomer mixture whose main components are alkyl methacrylates such as ethyl methacrylate, propyl methacrylate, and butyl methacrylate, and alkyl acrylates such as methyl acrylate, ethyl acrylate, propyl acrylate, and butyl acrylate is preferred.
又、この単量体混合物にはアルキル（メタ）ア
クリレートと共重合可能な二重結合を有する単量
体、グラフト交叉剤、多官能単量体をアクリル系
樹脂組成物中に30重量％以下の範囲で添加してお
くことも可能である。 In addition, this monomer mixture contains a monomer having a double bond copolymerizable with alkyl (meth)acrylate, a grafting cross-agent, and a polyfunctional monomer in an amount of 30% by weight or less in the acrylic resin composition. It is also possible to add within a certain range.
共重合可能な二重結合を有する単量体の具体例
としてはアクリル酸、メタクリル酸及びこれらの
誘導体、スチレン等の芳香族ビニル化合物やアク
リロニトリル等のシアン化ビニル化合物等が挙げ
られる。 Specific examples of monomers having copolymerizable double bonds include acrylic acid, methacrylic acid and derivatives thereof, aromatic vinyl compounds such as styrene, and vinyl cyanide compounds such as acrylonitrile.
グラフト交叉剤としてはα、β不飽和モノカル
ボン酸又はジカルボン酸のアリル、メタアリル、
クロチルエステルおよびトリアリルイソシアヌレ
ート、トリアリルシアヌレート等が挙げられる。 As the graft cross-agent, allyl, meta-allyl, α, β unsaturated monocarboxylic acid or dicarboxylic acid,
Examples include crotyl ester, triallyl isocyanurate, triallyl cyanurate, and the like.
多官能性単量体としてはエチレングリコールジ
メタクリレート、１，３−ブチレングリコールジ
メタクリレート、１，４−ブチレングリコールジ
メタクリレート、プロピレングリコールジメタク
リレート等が挙げられる。 Examples of the polyfunctional monomer include ethylene glycol dimethacrylate, 1,3-butylene glycol dimethacrylate, 1,4-butylene glycol dimethacrylate, and propylene glycol dimethacrylate.
本発明においては特に好ましいアクリル系樹脂
組成物の構成単量体としてはアルキルメタクリレ
ート40重量部〜80重量部、アルキルアクリレート
20重量部〜60重量部でかつアルキルメタクリレー
トとアルキルアクリレートの合計が70重量部以上
となるような単量体混合物である。 In the present invention, particularly preferred constituent monomers of the acrylic resin composition include 40 parts by weight to 80 parts by weight of alkyl methacrylate, alkyl acrylate
The monomer mixture contains 20 parts by weight to 60 parts by weight, and the total amount of alkyl methacrylate and alkyl acrylate is 70 parts by weight or more.
又、キヤリヤフイルムの厚みは用途に応じて任
意のものが使用可能であるが、通常30〜200μ程
度のものが使われる。 Further, the thickness of the carrier film can be of any value depending on the purpose, but a thickness of about 30 to 200 μm is usually used.
本発明に用いられるセラミツクス粉末材料は特
に制限されるものではなく、酸化アルミニウム、
酸化ケイ素等の通常のものが用いられる。 The ceramic powder material used in the present invention is not particularly limited, and includes aluminum oxide,
Common materials such as silicon oxide are used.
本発明においては結合剤は特に制限されるもの
ではなく通常使用されているものを用いることが
できるが、メタクリル系の結合剤が好ましい。 In the present invention, the binder is not particularly limited and commonly used binders can be used, but methacrylic binders are preferred.
セラミツクス粉体材料と結合剤の混合物である
セラミツクス粉体混合物には必要に応じて可塑剤
等を添加することもできる。 A plasticizer or the like may be added to the ceramic powder mixture, which is a mixture of a ceramic powder material and a binder, if necessary.
又、セラミツクス粉体混合物には通常溶剤が添
加されるが、本発明においても通常の溶剤を必要
に応じて適量添加して用いることができる。 Further, although a solvent is usually added to the ceramic powder mixture, an appropriate amount of a normal solvent can be added as needed in the present invention.
本発明の特徴とするところはキヤリヤフイルム
上にセラミツクス粉体混合物を積層したまま焼結
することにあるが、焼結雰囲気は酸化性、非酸化
性いずれでもよい。又、焼結回数も特に制限され
るものではなく、予備焼結した後に再度焼結して
もよい。又、焼結温度についても特に制限される
ものではなく、任意のセラミツクスの焼結条件を
適用できる。 The feature of the present invention is that the ceramic powder mixture is sintered while being laminated on the carrier film, but the sintering atmosphere may be either oxidizing or non-oxidizing. Further, the number of times of sintering is not particularly limited, and sintering may be performed again after preliminary sintering. Further, the sintering temperature is not particularly limited, and any ceramic sintering conditions can be applied.
上記したように本発明はキヤリヤフイルムとし
て非酸化性雰囲気中で完全分解し得るアクリル系
樹脂組成物を使用していることから、キヤリヤフ
イルムを剥離せずに自由にセラミツクスを加工す
ることが可能である。 As mentioned above, since the present invention uses an acrylic resin composition that can be completely decomposed in a non-oxidizing atmosphere as a carrier film, it is possible to freely process ceramics without peeling off the carrier film. It is possible.
本発明の他の特徴としてはキヤリヤフイルムと
してアクリル系樹脂組成物を用いると驚くべきこ
とに打抜き加工性に優れたセラミツクスシートが
得られることである。 Another feature of the present invention is that when an acrylic resin composition is used as a carrier film, a ceramic sheet with surprisingly excellent punching processability can be obtained.
以下本発明を実施例により説明する。尚、実施
例において部は重量部を示す。 The present invention will be explained below with reference to Examples. In the examples, parts indicate parts by weight.
実施例 １
平均粒度0.5μの酸化アルミニウム粉末、ポリブ
チルメタクリレート及びメチルエチルケトンを均
一に混合し、セラミツクス粉体混合物を得た。Example 1 Aluminum oxide powder having an average particle size of 0.5μ, polybutyl methacrylate and methyl ethyl ketone were uniformly mixed to obtain a ceramic powder mixture.
このセラミツクス粉体混合物をドクターブレー
ド法により、メチルメタクリレート60部、ブチル
アクリレート38部、エチレングリコールジメタク
リレート２部を共重合して得られたアクリル系樹
脂組成物よりなる厚み50μのフイルム上に塗布
し、しかる後にメチルエチルケトンを蒸発させ
た。 This ceramic powder mixture was applied by a doctor blade method onto a 50μ thick film made of an acrylic resin composition obtained by copolymerizing 60 parts of methyl methacrylate, 38 parts of butyl acrylate, and 2 parts of ethylene glycol dimethacrylate. , then the methyl ethyl ketone was evaporated.
得られた積層物の打抜き加工性について打抜き
後の切り口面を肉眼評価したところ、切り口面の
くずれもなく打抜き加工性は良好であつた。 The punching workability of the obtained laminate was visually evaluated on the cut surface after punching, and the punching workability was good with no deformation of the cut surface.
次に上記積層物を窒素雰囲気下で700℃、３時
間の焼結を実施した。得られたセラミツクスの焼
結体はキヤリヤフイルムの燃焼カスも全く認めら
れず表面外観の優れたものであつた。 Next, the above laminate was sintered at 700° C. for 3 hours in a nitrogen atmosphere. The obtained ceramic sintered body had an excellent surface appearance with no visible burnt residue of the carrier film.
実施例 ２
キヤリヤフイルムとしてブチルメタクリレート
45部、エチルアクリレート53部、１，３−ブチレ
ンジメタクリレート２部を共重合して得られたア
クリル系樹脂組成物よりなる厚み100μのフイル
ムを用い、実施例１と同様のセラミツクス粉体混
合物をドクターブレード法によりキヤリヤフイル
ム上に積層させた。Example 2 Butyl methacrylate as carrier film
A ceramic powder mixture similar to that in Example 1 was prepared using a 100μ thick film made of an acrylic resin composition obtained by copolymerizing 45 parts of ethyl acrylate, 53 parts of ethyl acrylate, and 2 parts of 1,3-butylene dimethacrylate. It was laminated onto a carrier film by the doctor blade method.
次に上記積層物を窒素雰囲気下で250℃、１時
間の仮焼成をした。得られた仮焼成物の打抜き加
工性を実施例１と同様に評価したところ、抜抜き
加工性は良好であつた。さらに窒素雰囲気下で
600℃、３時間の本焼成を実施した。 Next, the above laminate was pre-fired at 250° C. for 1 hour in a nitrogen atmosphere. The punching workability of the obtained pre-fired product was evaluated in the same manner as in Example 1, and the punching workability was found to be good. Furthermore, under a nitrogen atmosphere
Main firing was performed at 600°C for 3 hours.
得られたセラミツクス焼結体はキヤリヤフイル
ムの燃焼カスも全く認められず表面外観の優れた
ものであつた。 The obtained ceramic sintered body had an excellent surface appearance with no visible burnt residue of the carrier film.
比較例 １
キヤリヤフイルムとして厚み50μのポリエチレ
ンテレフタレートフイルム（ダイヤホイル社製Ｔ
−500）を用いる他は実施例１と同様にしてセラ
ミツクス焼結体を得た。Comparative Example 1 A polyethylene terephthalate film with a thickness of 50 μm (T manufactured by Diafoil Co., Ltd.) was used as a carrier film.
A ceramic sintered body was obtained in the same manner as in Example 1, except that a ceramic material (-500) was used.
得られたセラミツクス焼結体の表面にはキヤリ
ヤフイルムの燃焼カスが残つており、実用に耐え
られるものではなかつた。 Burnt residue of the carrier film remained on the surface of the obtained ceramic sintered body, and it was not suitable for practical use.
以上詳述したように、本発明のセラミツクス焼
結体の製造方法により表面外観及び打抜き加工性
に優れたセラミツクス焼結体を得ることができ
る。
As described in detail above, by the method for manufacturing a ceramic sintered body of the present invention, a ceramic sintered body having excellent surface appearance and punching workability can be obtained.
Claims (1)
ツクス粉体混合物を非酸化性雰囲気中で完全分解
し得るアクリル系樹脂組成物からなるキヤリヤフ
イルム上に積層し、しかる後に焼結することを特
徴とするセラミツクス焼結体の製造方法。1. A ceramic powder mixture containing a ceramic powder material and a binder is laminated on a carrier film made of an acrylic resin composition that can be completely decomposed in a non-oxidizing atmosphere, and then sintered. A method for manufacturing a ceramic sintered body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59227439A JPS61106462A (en) | 1984-10-29 | 1984-10-29 | Method for manufacturing ceramic sintered bodies |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59227439A JPS61106462A (en) | 1984-10-29 | 1984-10-29 | Method for manufacturing ceramic sintered bodies |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61106462A JPS61106462A (en) | 1986-05-24 |
| JPH059388B2 true JPH059388B2 (en) | 1993-02-04 |
Family
ID=16860876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59227439A Granted JPS61106462A (en) | 1984-10-29 | 1984-10-29 | Method for manufacturing ceramic sintered bodies |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61106462A (en) |
-
1984
- 1984-10-29 JP JP59227439A patent/JPS61106462A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61106462A (en) | 1986-05-24 |
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