JPH0597080U - IC socket - Google Patents

Abstract

(57) [Summary] [Purpose] To accurately position an LCC type IC package regardless of variations in external dimensions. [Structure] Floating plate 1 of IC socket 10
Guides 16 each having a tapered portion 16a for roughly positioning the IC package 1 are provided at the four corners. To each frame of the floating plate 14, a suitable number of positioning pins 17 positioned with a minute clearance in the recess 7 of the terminal 8 of the IC package 1 are attached. The spacing between the positioning pins 17 provided in one frame is substantially equal to the spacing between the appropriate terminals 8 on the corresponding surface of the IC package 1, and the IC package is positioned by the recess 7 and the positioning pins 17.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an IC socket for mounting an IC package and performing an electrical characteristic test.

[0002]

[Prior Art]

When mounting various IC packages such as LCC type in the IC socket for testing, make sure that each terminal of the IC package is securely held in contact with the contact pins arranged in the IC socket. , It is necessary to perform accurate positioning. By the way, generally, the external dimensions of the IC package 1 are defined by the Japan Electronic Machinery Manufacturers Association (EIAJ). Among them, the external dimensions of the quad flat leadless package body of the LCC type IC package are standard. Is as shown in Table 1 below. Table 1 (Units other than nominal dimensions: mm) Here, min and max in the table represent the minimum and maximum allowable outer dimensions, and max-min represents the difference between them, that is, the range of allowable variations. is there. As can be seen from the standard dimensions described above, the variation in external dimensions is approximately 0.4 mm to 0. There are 6 mm. Therefore, if an attempt is made to position the IC package according to the external dimensions of the IC package, the positions of the terminals and the contact pins may be displaced when the IC package is mounted, and there is a risk of contact failure.

Therefore, conventionally, the IC package body 1 was first prototyped by the same machine as that used for mass production, and the tapered portion 2a was formed on the inner side as shown in FIG. 7 in accordance with the outer dimensions of the prototype. An IC socket having a substantially L-shaped planar positioning guide 2 was designed. That is, the IC socket was designed and manufactured for each mass-production machine of the IC package body 1. Then, the mass-produced IC package 1 is placed on the package mounting portion of the IC socket manufactured for each mass-production machine, and the IC package 1 is guided by the taper-shaped portion 2a of each guide 2 to a predetermined position. Will be held in the position.

Further, as an IC socket having another positioning means, for example, there is one described in Japanese Patent Application Laid-Open No. 2-167485. This will be described with reference to FIG. 8. An insertion opening 5 for mounting the IC package 1 is formed in the outer frame 4 of the IC socket 3, and the hollow portion in the outer frame 4 is curved in a substantially U shape. The contact pins 6 are arranged facing each other. A leg 6a projects downward from the lower part of the contact pin 6 through the outer frame 4, and the upper end is bifurcated to form a side contact part 6b and a bottom contact part 6c. Then, when the IC package 1 is inserted into the insertion opening 5 of the IC socket 3 and placed, the IC package 1 is fixed by extending from the side surface to the bottom surface in each arc-shaped concave surface 7 lined up on the side surface. The V-shaped terminal 8 contacts the bottom contact portion 6c of the contact pin 6 and presses it. Then, the contact pin 6 bends inward due to the elasticity of the curved portion of the contact pin 6, and the side contact portion 6b is pressed against the side surface of the terminal 8 to make contact at two points. In this IC socket 3 as well, the alignment at the time of inserting the IC package 1 into the IC socket body is performed according to the outer dimensions of the IC package body 1. That is, the IC socket 3 having a different size of the insertion port 5 is required for each machine that mass-produces the IC package body 1.

[0005]

[Problems to be solved by the device]

 However, in such a conventional IC socket, the outer dimensions of the IC package produced differ depending on the machine that mass-produces the IC package. Therefore, an IC socket suitable for each IC package mass-production machine must be manufactured. However, there is a problem that it is complicated and causes an increase in cost.

In view of the above problems, the present invention makes it possible to perform various characteristic tests by accurately positioning the IC package using the same IC socket even if there are variations in external dimensions. Intended to provide a socket.

[0007]

[Means for Solving the Problems]

 The IC socket according to the present invention is an IC socket for mounting an LCC type IC package in which terminals are arranged in rows in the respective recesses. When the IC package is mounted, the positioning pins whose tips are located in the recesses are arranged in the space between the terminals. Correspondingly, a plurality of IC packages are arranged in the IC package mounting portion, and the positioning of the IC package to the IC socket is performed by the positioning pins.

[0008]

[Action]

 Since the positioning pins are arranged so as to correspond to the intervals between the recesses of the IC package, if the IC package is mounted on the mounting portion of the IC socket, the recesses or terminals will be positioned at the positions corresponding to the positioning pins. The position is accurately adjusted by adjusting the position.

[0009]

【Example】

 Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 is a plan view of the IC package, FIG. 2 is a plan view of an essential part of the IC socket with the IC package mounted, FIG. 3 is a longitudinal sectional view of an essential part of the IC socket with the cover open, and FIG. FIG. 5 is a partially enlarged view of FIG. 5, and is a partial vertical cross-sectional view of the IC socket with the cover closed. In FIG. 1, the LCC type IC package 1 has a large variation in the outer dimension A as described in Table 1 in the manufacturing process. However, since the arcuate concave portions 7 extending from the four side surfaces to the bottom surface are precisely formed in a process different from the manufacturing of the outer shape, the concave portions 7 and the terminals 8 attached thereto have a variation in the size of the interval. It is small and is not affected by variations in trapezoidal dimensions. Therefore, the dimensional accuracy of the interval B between the terminals 8 excluding both ends of one side is relatively good. The terminal 8 is formed in an arc shape in cross section, and even when it is attached to the concave portion 7, this portion forms a concave portion. Therefore, in the present embodiment, the IC package 1 is positioned with respect to the IC socket by the recess 7 in which the terminal 8 of the IC package 1 is attached.

In FIG. 2 and FIG. 3, the IC socket 10 is provided with a hollow body 11 having a rectangular floating plate 14 and a spring 15 interposed between the floating body 14 and the body 11 so as to move upward. It is installed in the installed state. The IC package mounting portion 12 is formed at the center of the floating plate 14. Further, around the lower side of the floating plate 14, contact pins 13 curved in a substantially U shape are planted and arranged in a row, and the contact pins 13 penetrate the main body 11 and project downward. A leg portion 13a is formed, and a tip contact portion 13b directed upward through the curved portion is formed. At the upper four corners of the floating plate 14, substantially L-shaped guides 16 are installed respectively when viewed from the plane, and the inside (opening 12 side) portion of the guide 16 is formed as a tapered portion 16a. The package 1 is roughly positioned when it is placed.

Further, between the adjacent guides 16 of the floating plate 14, an appropriate number of positioning pins 17 are attached at positions corresponding to the positions of the recesses 7 of the IC package 1 in the positioning state. As shown in FIG. 4, the positioning pin 17 has an inner tip portion 17a formed in a tapered shape, for example, and is positioned in the recess 7 when the IC package 1 is positioned. Between 0.1 mm and 0. There is a clearance of about 2 mm. Further, it is not necessary to arrange the positioning pins 17 in correspondence with the same number as the total number of terminals 7, and at least four positioning pins of the floating plate 14 can accurately position the IC package 1 with respect to the IC socket 10. It should be provided on the frame. In this embodiment, as shown in FIG. 2, one positioning pin 17 is attached to each side of each guide 16, and four pairs (eight) of the positioning pins 17 are provided facing each other with four frames of the floating plate 14. .. Therefore, the distance between the two positioning pins 17, 17 of each frame corresponds to the distance B between the IC packages 1 shown in FIG. The positioning pin 17 is made of, for example, stainless steel, but may be formed integrally with the floating plate 14 depending on the type of material forming the floating plate 14. The floating plate 14 and the guide 16 are integrally formed. A cover 18 is attached to the upper portion of the IC socket body 11 to open and close the floating plate 14 and the IC package 1.

Since the present embodiment is configured as described above, when the IC package 1 is mounted on the IC socket 10, the IC package 1 is handled from above with the cover 18 of the IC socket 10 open. Is inserted into the opening 12. Then, the IC package 1 is guided by the tapered portions 16a of the guides 16 provided at the four corners of the floating plate 14 for rough positioning. Then, in the IC package 1, at the position where the concave portion 7 corresponds to the inner tip portion 17a of the positioning pin 17, the inner tip portion 17a is fitted into the concave portion 7 with some clearance, and is completely inserted into the opening 12. Positioned. In this state, each terminal 8 is held at a position facing the positioning pin 17, so that the IC package 1 is accurately positioned. Further, when the IC package 1 is guided by the guide 16 and the non-recessed side surface between the two adjacent recesses 7 is in a position facing the positioning pin 17, that surface is the inner tip of the positioning pin 17. It cannot come into the opening 12 by coming into contact with the portion 17a. In that case, if the IC package 1 is moved slightly laterally, the recess 7 is brought to a position facing the positioning pin 17, and the IC package 1 can be inserted into the opening 12 at this position. ..

In this way, the IC package 1 can be accurately positioned in the IC socket 10 regardless of variations in its external dimensions. Then, when the cover 18 is closed, each terminal 7 of the IC package 1 can be brought into pressure contact with the tip end portion 13b of the contact pin 13 at its bottom surface (see FIG. 5).

As described above, the present embodiment has a relatively simple structure and can easily and accurately position the IC package 1 in the IC socket 10 regardless of variations in the outer dimensions thereof.

Next, a second embodiment of the present invention will be described with reference to FIG. In this embodiment, the positioning pin 20 is located above the floating plate 14, and is connected to the floating plate 14 by a spring member 21 made of, for example, metal and connected to the lower surface of the positioning pin 20. Further, the positioning pin 20 has an inner tip portion 20a formed in a tapered shape similarly to that of the first embodiment, and is positioned in the concave portion 7 when the IC package 1 is placed, and is positioned between the terminal 8 and the minute pin 20a. It is held by a spring member 21 so that a clearance is formed. Moreover, an inclined surface 20b is formed downward at the outer end of the positioning pin 20 so as to face the upward inclined surface 11a formed on the main body 11 of the IC socket 10 at a position slightly apart.

Since this embodiment is configured as described above, the same operation as that of the first embodiment is performed until the IC package 1 is inserted into the IC socket 10 and placed, and the IC package 1 Is positioned such that the terminal 8 has a positioning pin 20 located in the recess 7 and a clearance of about 0.1 to 0.2 mm 2. When the cover 18 is closed after mounting the IC package 1, the floating plate 14 and the IC package 1 are pushed down by the cover 18, but at this time, the positioning pin 20 also moves downward together, so that the outer end portion of the positioning pin 20 moves downward. The inclined surface 20b contacts the upwardly inclined surface 11a of the main body 11. Then, the positioning pin 20 is guided by the upward inclined surface 11a against the elasticity of the spring member 21 and is slightly moved inward, so that the clearance is closed and abuts on the terminal 8. As a result, the IC package 1 is firmly fixed and held by the IC socket 10, and the IC package 1 is positioned more accurately.

[0017]

[Effect of the device]

 As described above, in the IC socket according to the present invention, the IC package is positioned by the recess of the IC package and the positioning pin provided at the position corresponding to the recess. Even if there are variations in external dimensions, the IC package can be positioned easily and reliably.

[Brief description of drawings]

FIG. 1 is a plan view of an IC package.

FIG. 2 shows an IC in an IC socket according to the first embodiment of the present invention.
It is a principal part top view which shows the state with which the package was mounted.

FIG. 3 is a partial vertical sectional view of an IC socket.

FIG. 4 is a partially enlarged view of FIG. 2 showing a state where the IC package is positioned by a positioning pin.

FIG. 5 is a partial vertical cross-sectional view of the IC socket with the cover closed.

FIG. 6 is a vertical cross-sectional view of a main part showing a second embodiment of the present invention.

FIG. 7 is a plan view of an essential part showing a conventional positioning means of an IC package.

FIG. 8 is a schematic vertical sectional view showing another conventional example of the IC socket.

[Explanation of symbols]

1 ... IC package, 8 ... terminal, 10 ... IC socket, 16 ... guide, 17,20 ... positioning pin.

Claims (1)

[Scope of utility model registration request] 1. An IC socket for mounting an IC package in which terminals are arranged in rows in respective recesses, wherein the IC
A plurality of positioning pins whose tips can be located in the recesses when the package is mounted are arranged in the IC package mounting portion in correspondence with the distance between the terminals, and the positioning pins position the IC package in the IC socket. An IC socket characterized by being performed.