JPH0597529A - Device for printing baking of electronic component - Google Patents
Device for printing baking of electronic componentInfo
- Publication number
- JPH0597529A JPH0597529A JP3263721A JP26372191A JPH0597529A JP H0597529 A JPH0597529 A JP H0597529A JP 3263721 A JP3263721 A JP 3263721A JP 26372191 A JP26372191 A JP 26372191A JP H0597529 A JPH0597529 A JP H0597529A
- Authority
- JP
- Japan
- Prior art keywords
- printing
- jig
- electronic parts
- firing
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007639 printing Methods 0.000 title claims abstract description 30
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 claims abstract description 13
- 239000000919 ceramic Substances 0.000 claims description 20
- 238000010304 firing Methods 0.000 claims description 20
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000001179 sorption measurement Methods 0.000 abstract description 6
- 229910001635 magnesium fluoride Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 5
- 239000004020 conductor Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Ceramic Products (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は電子部品用印刷焼成治
具に関するもので、特に、スクリーン印刷を行い、印刷
後に、８５０℃前後の温度で焼成する電子部品用印刷焼
成治具に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printing and firing jig for electronic parts, and more particularly to a printing and firing jig for electronic parts which is screen-printed and fired at a temperature of around 850 ° C. after printing. ..
【０００２】[0002]
【従来の技術】近年、セラミック焼結体上に導電体ペー
ストを印刷して、この導電体ペーストが印刷されたセラ
ミック焼結体を焼成して得られる小型電子部品が多数見
受けられる。2. Description of the Related Art In recent years, many small electronic components have been found which are obtained by printing a conductor paste on a ceramic sintered body and firing the ceramic sintered body on which the conductor paste is printed.
【０００３】この様な電子部品は、通常、セラミック焼
結体上に、Ａg−Ｐd等の導電体ペーストをスクリーン印
刷し、印刷後に、８５０℃前後の温度で焼成される。Such an electronic component is usually formed by screen-printing a conductive paste such as Ag-Pd on a ceramic sintered body and firing it at a temperature of about 850 ° C. after printing.
【０００４】その際、印刷時においては、セラミック焼
結体は固定用治具に納められて、ペーストを印刷される
が、この固定用治具が、通常、金属製であり、焼成時に
そのまゝ使用すると、治具がそったり、ゆがんだりし
て、治具の繰り返し使用ができなかったり、また、大気
中で焼成する場合は、酸化による治具の劣化の問題もあ
る。そのために、焼成時には、セラミック焼結体を治具
より取り出して、焼成しなければならない。この手間
は、電子部品が小型で、多数個の場合、相当なものとな
り、工程上の大きな問題点となっている。At this time, at the time of printing, the ceramic sintered body is placed in a fixing jig and the paste is printed, and this fixing jig is usually made of metal, and the paste is printed as it is.ゝ When used, the jig is warped or warped so that the jig cannot be used repeatedly, and when firing in the air, there is a problem of deterioration of the jig due to oxidation. Therefore, at the time of firing, the ceramic sintered body must be taken out of the jig and fired. This trouble is considerable when the number of electronic parts is small and many, and it is a serious problem in the process.
【０００５】この問題点を解決するためには、印刷時の
固定用治具を、８５０℃の焼成に耐え得るものにし、印
刷を施したセラミック焼結体が治具に納められたまゝ焼
成できるように、固定治具を耐熱性のあるセラミックス
製、或はカーボン製にしなければならない。ところが、
カーボン製にした場合、大気中では、使用できないとい
う問題点やカーボンの耐摩耗性が低いために、使用中に
電子部品を固定するガイド孔の精度が劣化したり、摩耗
したカーボン粉が電子部品の汚染したりする問題点があ
る。また、セラミックス製の場合も、一体物のセラミッ
クスから加工により、治具を作製することは、セラミッ
クスの特性上、非常な困難が伴い、また、加工可能とし
ても、非常に、高価なものとなってしまう。In order to solve this problem, the fixing jig at the time of printing should be able to withstand 850 ° C. firing, and the printed ceramic sintered body can be fired until it is stored in the jig. As described above, the fixing jig must be made of heat-resistant ceramics or carbon. However,
When it is made of carbon, the problem that it cannot be used in the atmosphere and the wear resistance of carbon is low, so the accuracy of the guide holes that fix electronic parts during use deteriorates, and worn carbon powder causes electronic parts to wear. There is a problem of pollution. Further, even in the case of ceramics, it is extremely difficult to fabricate a jig by processing it from an integral ceramics due to the characteristics of ceramics, and even if it is possible to process it, it is very expensive. Will end up.
【０００６】[0006]
【発明が解決しようとする課題】上述した様に、金属製
の治具を用いた場合に、工程に大きな支障を生じる。こ
の様な支障を避けるためには、治具を８５０℃に耐え得
るセラミックス製、或はカーボン製にする必要がある
が、カーボン製の場合には、大気中で使用できないとい
う問題点や、耐摩耗性が低いという問題点等がある。ま
た、一体物のセラミックスからの加工は非常に困難であ
る。As described above, when a jig made of metal is used, a great trouble occurs in the process. In order to avoid such obstacles, the jig needs to be made of ceramics or carbon which can withstand 850 ° C. However, in the case of carbon, the problem that it cannot be used in the atmosphere and There are problems such as low wear resistance. In addition, it is very difficult to process the monolithic ceramics.
【０００７】従って、この発明の目的は、この様な従来
における課題を解決するようにした電子部品用印刷焼成
治具を提供することにある。Therefore, an object of the present invention is to provide a printing and firing jig for electronic parts, which solves the problems in the prior art.
【０００８】[0008]
【問題点を解決するための手段】上述の目的を達成する
ために、この発明に依れば、電子部品用印刷治具は、印
刷時の吸引吸着用の小孔を有した板と、電子部品を固定
するガイド孔を有した板とが接合一体化されていること
を特徴としている。In order to achieve the above-mentioned object, according to the present invention, a printing jig for electronic parts includes a plate having a small hole for sucking and sucking at the time of printing, and an electronic part. It is characterized in that a plate having a guide hole for fixing a component is joined and integrated.
【０００９】この発明に依ると、電子部品用印刷治具の
２つの板の材質としては、アルミナセラミックスが望ま
しく、これ等の板の接合一体化には、ＳiＯ2−ＭgＦ2系
の接着剤を用いることが好適である。According to the present invention, alumina ceramics is desirable as a material of the two plates of the printing jig for electronic parts, and a SiO 2 -MgF 2 -based adhesive is used for joining and integrating these plates. It is preferable to use.
【００１０】こゝで、これ等の板の吸引吸着用の小孔
と、電子部品を固定するガイド孔との穿孔は、機械的加
工、レーザー加工、超音波加工等の通常のセラミックス
加工法によって行われる。このために、加工性、更に
は、耐熱性、材料のコスト等を考え合わせると、両板の
材質としては、アルミナセラミックスが望ましい。Here, the small holes for suction and adsorption of these plates and the guide holes for fixing the electronic parts are formed by ordinary ceramics processing methods such as mechanical processing, laser processing and ultrasonic processing. Done. Therefore, considering workability, heat resistance, material cost, etc., alumina ceramics is desirable as the material for both plates.
【００１１】また、この発明による電子部品用印刷焼成
治具は、８５０℃前後の温度で使用されるために、この
様な温度に耐え得る接着剤によって接合されなければな
らない。そのためには、無機系の接着剤を用いなければ
ならないが、通常の無機系接着剤では、接合強度が十分
ではなく、特に、繰り返しの使用を行うと、接合部が剥
がれたりする問題点がある。更に、この発明に依るＳi
Ｏ2−ＭgＦ2系の接着剤は、耐熱性に優れ、接合強度も
通常の無機系接着剤に比較して、十分に大きいので、８
５０℃における使用、更には、繰り返しの使用も可能で
ある。Further, since the printing and firing jig for electronic parts according to the present invention is used at a temperature of around 850 ° C., it must be joined by an adhesive capable of withstanding such a temperature. For that purpose, it is necessary to use an inorganic adhesive, but with a normal inorganic adhesive, the bonding strength is not sufficient, and in particular, there is a problem that the bonding part peels off after repeated use. .. Further, according to the present invention, Si
Since the O 2 -MgF 2 -based adhesive has excellent heat resistance and the bonding strength is sufficiently larger than that of a normal inorganic-based adhesive,
It can be used at 50 ° C., and can be used repeatedly.
【００１２】また、この発明による電子部品用印刷焼成
治具の作製方法は、凡そ以下の通りである。すなわち、
所望のアルミナセラミックの板に、印刷焼成する電子部
品の形状に適合する吸引吸着用の小孔を、また、別の所
望のアルミナセラミックの板に、電子部品を固定するガ
イド孔とを夫々機械的加工、レーザー加工、超音波加工
等通常のセラミックス加工法により所望の数だけ設け
る。The method of manufacturing the printing and firing jig for electronic parts according to the present invention is as follows. That is,
Mechanically, a desired alumina ceramic plate is provided with small holes for suction and adsorption that conform to the shape of the electronic component to be printed and fired, and another desired alumina ceramic plate is provided with a guide hole for fixing the electronic component. The desired number is provided by a normal ceramics processing method such as processing, laser processing or ultrasonic processing.
【００１３】次に、ＳiＯ2−ＭgＦ2系の接着剤を穿孔し
ていない部分、例えば板の周辺の部分の複数箇所、例え
ば４箇所に介在させ、アルミナセラミックの両板を重ね
合わせて、熱処理することによりアルミナセラミックの
両板をしっかりと接合一体化する。この際の、熱処理の
温度パターンは、以下の通りである。Next, a SiO 2 -MgF 2 -based adhesive is interposed at a plurality of locations, for example, four locations around the unperforated portion, for example, the peripheral portion of the plate, and both alumina ceramic plates are superposed and heat treated. By doing so, both plates of alumina ceramic are firmly joined and integrated. The temperature pattern of the heat treatment at this time is as follows.
【００１４】 室温〜１０００℃ ２０℃／分 １０００℃保持 ３０分間 １０００〜１４５０℃ ３０℃／分 １４５０℃保持 １０分間 １４５０〜１０００℃ ３０℃／分 １０００〜室温 ２０℃／分Room temperature to 1000 ° C. 20 ° C./min 1000 ° C. hold 30 minutes 1000 to 1450 ° C. 30 ° C./min 1450 ° C. hold 10 minutes 1450 to 1000 ° C. 30 ° C./min 1000 to room temperature 20 ° C./min
【００１５】この様にして得られた電子部品用印刷焼成
治具を用いれば、印刷工程および焼成工程を一貫して行
うことが可能となり、小型電子部品を多数個処理する場
合に、省力化に大いに役立つ。By using the printing and firing jig for electronic parts thus obtained, it is possible to consistently perform the printing process and the firing process, and save labor when processing a large number of small electronic parts. Greatly useful.
【００１６】[0016]
【実施例】図１に示される様に、８４×８０×０.６ｍ
ｍのアルミナセラミックの板Ａの中央部分に、２ｍｍφ
の印刷時の吸引吸着用の円形の小孔１を１２ｍｍ間隔
で、５×５の計２５個、レーザー加工により設けた。こ
の小孔１は円形だけでなく、長方形でも四角形でも多角
形でも良く、１個宛だけでなく２個宛づゝの組でも良い
ことは勿論である。EXAMPLE As shown in FIG. 1, 84 × 80 × 0.6 m
2mmφ in the central part of plate A of alumina ceramic of m
The circular small holes 1 for suction / adsorption at the time of printing were provided at a 12 mm interval by a laser process, 25 × 5 × 5 in total. The small holes 1 may be not only circular, but also rectangular, quadrangular, or polygonal, and needless to say, may be a set of not only one but two.
【００１７】また、８４×８０×０.６ｍｍのアルミナ
セラミックの別の板Ｂの中央部分には、８×８ｍｍのガ
イド孔２を５×５の計２５個、アルミナセラミックの板
Ａ，Ｂを重ね合わせた時に、板Ａの吸引吸着用の小孔１
が板Ｂのガイド孔２の中央に位置するように、同じく、
レーザー加工により設けた。Further, in the central portion of another plate B of 84 × 80 × 0.6 mm alumina ceramic, a total of 25 5 × 5 guide holes 2 of 8 × 8 mm and plates A and B of alumina ceramic are provided. Small holes 1 for suction and adsorption of plate A when they are stacked
So that it is located in the center of the guide hole 2 of the plate B,
It was provided by laser processing.
【００１８】次に、アルミナセラミックの板Ａの周辺の
部分の複数箇所、例えば４箇所に、６×６０ｍｍのＳi
Ｏ2５０％−ＭgＦ2５０％のシート状の接着剤を載せ、
この接着剤の上に、アルミナセラミックの板Ｂを重ね合
わせ、以下の温度パターンで、熱処理を行い、接合一体
化した。Next, 6 × 60 mm Si is provided at a plurality of places, for example, four places, around the periphery of the alumina ceramic plate A.
Place the O 2 50% -MgF 2 50% of the sheet-like adhesive,
An alumina ceramic plate B was superposed on this adhesive and heat-treated in the following temperature pattern to join and integrate them.
【００１９】 室温〜１０００℃ ２０℃／分 １０００℃保持 ３０分間 １０００〜１４５０℃ ３０℃／分 １４５０℃保持 １０分間 １４５０〜１０００℃ ３０℃／分 １０００〜室温 ２０℃／分Room temperature to 1000 ° C. 20 ° C./min 1000 ° C. hold 30 minutes 1000 to 1450 ° C. 30 ° C./min 1450 ° C. hold 10 minutes 1450 to 1000 ° C. 30 ° C./min 1000 to room temperature 20 ° C./min
【００２０】この様にして得られた電子部品用印刷焼成
治具を用いて、或る電子部品のスクリーン印刷、並びに
８５０℃の焼成を繰り返した結果、現在までのところ、
２０サイクル使用したが、まったく支障はない。As a result of repeating screen printing of a certain electronic component and firing at 850 ° C. using the printing and firing jig for electronic components thus obtained, up to now,
It was used for 20 cycles, but there was no problem.
【００２１】また、別の実験で、ＳiＯ2５０％−ＭgＦ2
５０％の接着剤を用いて、アルミナセラミックスの板を
接合し、８５０℃における曲げ強度を測定したところ、
１５ｋｇ／ｍｍ2であった。In another experiment, SiO 2 50% -MgF 2
Alumina-ceramic plates were joined using 50% adhesive and the bending strength at 850 ° C. was measured.
It was 15 kg / mm 2 .
【００２２】[0022]
【発明の効果】上述した様に、この発明による電子部品
用印刷焼成治具により、印刷工程および焼成工程を一貫
して行うことが可能となり、小型電子部品を多数個処理
する場合の省力化に大いに役立つ等の効果が得られる。As described above, the printing and firing jig for electronic parts according to the present invention makes it possible to consistently perform the printing process and the firing process, and save labor in processing a large number of small electronic parts. The effect that it is very useful can be obtained.
【図１】この発明を説明するための模式図で、吸引吸着
用の小孔の設けられたアルミナセラミックスの板の平面
図である。FIG. 1 is a schematic view for explaining the present invention and is a plan view of a plate of alumina ceramics provided with small holes for suction and adsorption.
【図２】この発明を説明するための模式図で、電子部品
固定用のガイド孔の設けられたアルミナセラミックスの
板の平面図である。FIG. 2 is a schematic diagram for explaining the present invention, and is a plan view of an alumina ceramic plate provided with guide holes for fixing electronic components.
【図３】この発明を説明するための模式図で、図１と図
２のアルミナセラミックスの板を接合一体化して示す斜
視図である。FIG. 3 is a schematic view for explaining the present invention, and is a perspective view showing the alumina ceramic plates of FIGS. 1 and 2 joined and integrated.
１ 印刷時の吸引吸着用の小孔 ２ 電子部品を固定するガイド孔 ３ 接着剤 Ａ アルミナセラミックスの板 Ｂ アルミナセラミックスの別の板 1 Small holes for suction and suction during printing 2 Guide holes for fixing electronic parts 3 Adhesive A Alumina ceramics plate B Alumina ceramics other plate
───────────────────────────────────────────────────── フロントページの続き (72)発明者 三浦 啓一 東京都江東区豊洲１−１−７ 小野田セメ ント株式会社セラミツクス研究所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Keiichi Miura 1-1-7 Toyosu, Koto-ku, Tokyo Onoda Cement Ceramics Research Center Co., Ltd.
Claims (3)
時の吸引吸着用の小孔を有した板(Ａ)と電子部品を固定
するガイド孔を有した板(Ｂ)が接合一体化されているこ
とを特徴とする電子部品用印刷焼成治具。1. In a printing and firing jig for electronic parts, a plate (A) having a small hole for suction and suction at the time of printing and a plate (B) having a guide hole for fixing an electronic part are integrally joined. A printing and firing jig for electronic parts, which is characterized in that
スであることを特徴とする請求項１記載の電子部品用印
刷焼成治具。2. The printing and firing jig for electronic parts according to claim 1, wherein the material of the plates (A, B) is alumina ceramics.
によって接合一体化されていることを特徴とする請求項
１または２いずれか記載の電子部品用印刷焼成治具。3. The printing and firing jig for electronic parts according to claim 1 or 2, wherein the plates (A, B) are joined and integrated by a SiO 2 —MgF 2 -based adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3263721A JPH0597529A (en) | 1991-10-11 | 1991-10-11 | Device for printing baking of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3263721A JPH0597529A (en) | 1991-10-11 | 1991-10-11 | Device for printing baking of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0597529A true JPH0597529A (en) | 1993-04-20 |
Family
ID=17393390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3263721A Pending JPH0597529A (en) | 1991-10-11 | 1991-10-11 | Device for printing baking of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0597529A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006310763A (en) * | 2005-03-28 | 2006-11-09 | Tdk Corp | Tool for chip electronic component |
| JP2008091658A (en) * | 2006-10-03 | 2008-04-17 | Shin Etsu Polymer Co Ltd | Member lineup implement for small component, member lineup device for small component, method of arranging member for small component, and electrode forming method |
-
1991
- 1991-10-11 JP JP3263721A patent/JPH0597529A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006310763A (en) * | 2005-03-28 | 2006-11-09 | Tdk Corp | Tool for chip electronic component |
| JP2008091658A (en) * | 2006-10-03 | 2008-04-17 | Shin Etsu Polymer Co Ltd | Member lineup implement for small component, member lineup device for small component, method of arranging member for small component, and electrode forming method |
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