JPH059772U - Laser drilling machine - Google Patents

Abstract

(57) [Abstract] [Purpose] The present invention is a laser hole that is suitable for drilling a workpiece with a closed cross section that prevents chips from falling during drilling with a laser beam and that makes it particularly difficult to remove chips. Provide a light processing device. A wire feeding device (3) for feeding a wire (4) in front of the laser gun (2) to a robot arm (1) equipped with a laser gun (2) for oscillating a laser beam, and a wire fed by the wire feeding device (3). A wire cutting device 7 for cutting 4 is provided.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a laser drilling device for drilling a metal plate with a laser beam.

[0002]

[Prior Art]

 The panel used for the body of an automobile is perforated by pressing, etc. in the state of a single panel, but recently, due to technological advances, it is possible to perforate with a laser beam in the body state.

[0003]

[Problems to be solved by the device]

 As shown in FIG. 3, the laser beam drilling is equipped with a laser gun LG on the robot arm RA, and the robot arm RA is trained to rotate in a required shape and size such as a perfect circle or an ellipse. , The work W is cut by a laser beam to make a hole H, but when the work W has a closed cross section, the cut chips S 1 drop and remain in the closed cross section of the work W. Is not suitable for drilling holes in workpieces.

An object of the present invention is to solve the above-mentioned problems of the related art and to provide a laser drilling device applicable to a work having a closed cross section.

[0005]

[Means for Solving the Problems]

 The gist of the present invention for achieving the above object is to provide a robot arm with a laser gun that oscillates a laser beam, a wire feeding device that feeds a wire in front of the laser gun, and a wire feeding device. And a wire cutting device that cuts the wire fed by the feeding device.

[0006]

[Advantages] With the above configuration, prior to the drilling by the laser beam, the tip of the wire fed by the wire feeding device is welded to the work surface to be chips by the laser beam, and thereafter, Drilling is performed, and the cut chips are held by the wire and extracted, and the tip of the wire is cut by a wire cutting device above the chip collection box.

[0007]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, reference numeral 1 is a robot arm having a laser gun 2 at its tip. In the present invention, a wire feeding device 3 for feeding the wire 4 wound around a spool (not shown) to the robot arm 1 toward the tip of the robot arm 1 is installed.

Further, the wire guide 6 and the wire cutting device 7 are installed on the robot arm 1 near the laser gun 2 via the bracket 5.

The operation of the present invention will be described. First, as shown in FIG. 2 (A), before the drilling process, the tip of the wire 4 guided by the wire guide 6 by the wire feeding device 3 and fed forward from the wire cutting device 7 is attached to the workpiece. Weld with laser beam 8 and attach to the part that will become chips by drilling W.

After that, as shown in FIG. 2B, the robot arm 1 is pivoted to cut the work W by the laser beam so as to open a predetermined hole H.

Next, as shown in FIG. 2C, the robot arm 1 is moved backward so as to be separated from the work W. As a result, the chips S to which the wire 4 is welded 8 are pulled out from the work W, and a predetermined hole H is opened in the work W.

Then, as shown in FIG. 2D, the tip of the robot arm 1 is positioned above the chip collecting box 9 until the tip of the wire 4 holds the chip S, and the wire 4 is removed. The wire cutting device 7 cuts the chips S into the chip recovery box 9.

After the cutting of the wire 4, the wire feeding device 3 operates to feed the wire 4 of a required length in front of the wire guide 6 to prepare for the next drilling cycle.

[0014]

[Effect of the device]

 As described above, the present invention provides a robot arm with a laser gun that oscillates a laser beam, a wire feeder that feeds a wire in front of the laser gun, and a wire that is fed by the wire feeder. A wire cutting device for cutting is provided, and the tip of the wire fed by the wire feeding device is attached by welding with a laser beam to the part that will become chips by drilling the workpiece. By drilling with a laser beam in this state, chips do not fall off the work, and the inconvenience of chips falling and accumulating on the floor surface or the like at the working position is prevented.

Further, even if a hole in a work having a closed cross-section structure is difficult to take out, the chips do not fall into the closed cross-section. Is possible, and there is an advantage that the range of application of laser beam drilling equipment is expanded.

[Brief description of drawings]

FIG. 1 is a side view of the present invention.

FIG. 2 is an operation explanatory diagram of the present invention.

FIG. 3 is an explanatory diagram of a conventional defect

[Explanation of symbols]

 1 Robot arm 2 Laser gun 3 Wire feeding device 4 Wire 7 Wire cutting device

Claims (1)

[Claims for utility model registration] 1. A robot gun for oscillating a laser beam, a wire feeder for feeding a wire in front of the laser gun, and a wire feeder for feeding to the robot arm. A laser drilling device, comprising: a wire cutting device for cutting the supplied wire.