JPH0610160A - Single wafer etching system - Google Patents

Abstract

(57) [Summary] [Object] To provide a single-wafer etching apparatus capable of uniformly stopping the progress of etching and sufficiently washing with water. [Constitution] Immersion tank 11 where pure water overflows in the washing room 6
Was provided at the upper hand side position of the pure water spray discharge nozzle 7 so that the progress of etching could be stopped uniformly and sufficient washing with water could be performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a single-wafer etching apparatus used for manufacturing semiconductor elements.

[0002]

2. Description of the Related Art Recent wet etching apparatuses are Naraoka and Nihei; "Photo etching and fine processing", Sogo Denshi Publishing, P. 117-119, P.I. As described in Nos. 131 to 135, the spray method is predominant.

An example of the above-described conventional etching apparatus will be described below with reference to the drawings. FIG. 2 is a block diagram of a conventional single-wafer-type spray-type etching apparatus. In FIG. 2, 1 is a substrate, and 2 is a conveying roller that is continuously provided to horizontally convey the substrate 1 in the direction of arrow A. Reference numeral 3 denotes an etching chamber in which an etching liquid is supplied from the nozzle 4 to the surface of the substrate 1 for etching, 5 denotes a member for draining the etching liquid adhering to the substrate 1, 6 denotes a nozzle 7 for stopping the progress of the etching process. It is a water washing room where both the front and back surfaces of the substrate 1 are washed with pure water discharged from the water. Reference numeral 8 is a draining member for the pure water ching liquid adhering to the substrate 1. Reference numeral 9 is a pump for supplying the etching liquid accumulated in the lower portion of the etching chamber 3 to the nozzle 4, and 10 is a pump for supplying pure water accumulated in the lower portion of the water washing chamber 6 to the nozzle 7.

In the above structure, the substrate 1 is supplied to the carrying roller 2 by a loader (not shown) and sequentially supplied to the etching chamber 3. Inside the etching chamber 3, a plurality of nozzles 4 for ejecting the etching liquid in a spray form are provided, and the substrate 1 is subjected to etching treatment for a predetermined time.

After the etching process, the substrate 1 is drained of the etching liquid by the draining member 5, and then transported by the transport roller 2 to the washing chamber 6 in sequence. A plurality of nozzles 7 for spraying pure water in the form of a spray are provided above and below in the washing chamber 6, and the front and back of the substrate 1 are washed with water for a predetermined time.

[0006]

However, with the above-mentioned structure, it is difficult to discharge pure water over the substrate 1 in a uniform area and at a flow rate in the washing chamber 6 in which the progress of the etching process is stopped. There is a problem in that the etching solution cannot be uniformly and sufficiently washed with water, and the progress of etching becomes uneven in the substrate 1.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a single-wafer etching apparatus capable of uniformly stopping the progress of etching and sufficiently washing with water.

[0008]

In order to solve this problem, the single-wafer etching apparatus of the present invention is provided with an immersion tank in the washing chamber in which pure water overflows, provided at the upper side position of the pure water spray discharge nozzle. Is.

[0009]

With the above-described structure, the substrate after the etching process is treated in the dipping tank in which pure water overflows, and then rinsed with the pure water spray discharge nozzle to stop the progress of the etching process uniformly and sufficiently. Can be washed with water.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. 1 showing the configuration of a single wafer etching apparatus. In the drawings, the same reference numerals as those in the conventional example indicate the same members, and detailed description thereof will be omitted.

In FIG. 1, reference numeral 11 denotes an immersion tank provided at a position on the upper side of a portion for discharging pure water by the nozzle 7 in the water washing chamber 6, and is provided so that the pure water overflows at the height of the conveying roller 2. ing. Reference numeral 12 denotes a partition plate that partitions the space inside the water washing chamber 6 in which the immersion tank 11 is provided and the space for the pure water discharge portion of the nozzle 7 by the bottom portion of the water washing chamber 6. Reference numeral 13 denotes a pump for supplying the pure water accumulated in the lower portion of the water washing chamber 6 to the immersion tank 11.

The operation of the single-wafer etching apparatus constructed as above will be described below. The substrate 1 is supplied to the transport roller 2 by a loader (not shown) and then sequentially supplied to the etching chamber 3.

In the etching chamber 3, a plurality of nozzles 4 for discharging the etching liquid in a spray form are provided, and the substrate 1
Is etched for a predetermined time. After the etching process, the substrate 1 is drained of the etching liquid by the liquid draining member 5, and then transported by the transport roller 2 to the washing chamber 6 in sequence.

In the washing chamber 6, the substrate 1 passes through a dipping tank 11 in which pure water overflows, and subsequently, pure water is sprayed from a plurality of nozzles 7 provided on the upper and lower sides, and the front and back surfaces are washed with water for a predetermined time. It is processed.

As described above, according to the present embodiment, the immersion tank 11 in which pure water overflows is provided in front of the nozzle 7 for spraying pure water, so that the progress of etching can be stopped evenly and sufficiently. Can be washed with water.

In this embodiment, a plurality of nozzles 4 for spraying the etching solution into the etching chamber 3 are used.
However, the etching chamber 3 may be provided with a dipping tank in which the etching solution overflows like the dipping tank 11 of the water washing chamber 6.

[0017]

As described above, according to the present invention, by providing a dipping tank in which the pure water overflows in the washing chamber, the progress of etching can be uniformly stopped and sufficient washing can be carried out. The above effect is great.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a single-wafer etching apparatus according to an embodiment of the present invention.

FIG. 2 is a configuration diagram of a single-wafer-spray-type etching apparatus in a conventional example.

[Explanation of symbols]

 1 Substrate 2 Conveyor Roller 3 Etching Chamber 4 Nozzle 5 Draining Member 6 Rinsing Chamber 7 Nozzle 8 Draining Member 11 Immersion Tank

Claims (1)

[Claims] 1. A single-wafer etching apparatus, characterized in that an immersion tank in which pure water overflows in a water washing chamber is provided at a position on the upper side of a pure water spray discharge nozzle.