JPH06104352A - Semiconductor device and its direction inspection device - Google Patents

Abstract

(57) [Abstract] [Purpose] Make the orientation of semiconductor devices easy and reliable.
Automates direction inspection by preventing exposure from plastic packages such as semiconductor substrates. [Structure] The surface roughness of a direction determination mark formed by making a gap in a part of a plastic package in which a semiconductor substrate or the like is embedded is made different from the surface roughness of the plastic package, and a surface roughness different from others. The direction identification mark with is provided on the surface substantially equal to the surface of the plastic package, and based on the binary image of the imaged semiconductor device,
The direction of the direction discrimination mark is inspected by the direction inspection means.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a direction discriminating mark and a direction inspection device for inspecting the direction of the semiconductor device using the direction discriminating mark.

[0002]

2. Description of the Related Art FIG. 11 is a perspective view showing a conventional semiconductor device, in which 1 is a semiconductor device, 2 is a plastic package of the semiconductor device 1, 3 is an upper surface of the semiconductor device 1, and 4 is a semiconductor device 1. In the formed direction determining mark, the plastic package 2 and the direction determining mark 4 are formed on the matte surface.

Further, 6 is an external electrode of the semiconductor device 1, and 7 is a mark printed on the upper surface 3. In the plastic package 2, as shown in FIG. 12, a semiconductor substrate 8 and the external electrode 6 are provided. A wire 9 that connects the two is embedded. Reference numeral 10 is a step forming the direction discrimination mark 4.

Next, the operation will be described. Semiconductor device 1
The plastic package 2 is provided with the upper surface 3 and a semicircular step 10 so that the direction determining mark 4 indicating the direction can be obtained.
Is marked. In this case, if there is the semiconductor substrate 8 or the wire 9 below the direction determining mark 4, the semiconductor substrate 8 or the wire 9 may be exposed on the plastic package 2, so that the step 10 is formed shallowly.

[0005]

Since the conventional semiconductor device is configured as described above, it becomes difficult to determine the direction as the step 10 becomes shallower, and the semiconductor device 1 is erroneously arranged in the incorrect direction. There were problems such as being stored.

Further, since the direction discrimination mark 4 has a step 10 even if it is shallow, there is a problem that a part of the plastic package 2 is exposed depending on variations in the package positions of the semiconductor substrate 8 and the wires 9. was there.

The invention of claim 1 has been made to solve the above-mentioned problems, and an object thereof is to obtain a semiconductor device capable of accurately and easily determining a direction.

An object of the present invention is to obtain a semiconductor device capable of preventing the internal semiconductor substrate and wires from being exposed from the plastic package.

According to the invention of claim 3, the direction of the semiconductor device is
An object of the present invention is to obtain a semiconductor device orientation inspection apparatus that can automatically inspect by optically detecting the orientation determination mark.

[0010]

According to another aspect of the present invention, there is provided a semiconductor device in which the surface roughness of a direction determining mark formed by forming a step on a part of a plastic package in which a semiconductor substrate or the like is embedded is determined by the plastic package. The surface roughness is different from that of.

According to a second aspect of the present invention, there is provided a semiconductor device in which a part of a plastic package having a semiconductor substrate embedded therein is provided.
The direction determining mark having a surface roughness different from that of the plastic package is arranged so as to be formed on a surface substantially equal to the plastic package.

According to a third aspect of the present invention, there is provided a direction inspecting device for a semiconductor device, wherein the direction inspecting means is provided with binarizing means for binarizing an original image of the semiconductor device picked up by the imaging means. Based on the direction discrimination mark binary image obtained by using the binary threshold value for the direction discrimination mark as a reference from the binary data obtained by the means, the direction of the direction discrimination mark is inspected, and the result is output. It was done.

[0013]

In the semiconductor device according to the invention of claim 1, the surface roughness of the direction discriminating mark is different from that of the other, so that the amount of reflected light is also different from that of the other, whereby the position of the direction discriminating mark is judged and the direction is judged. Make it easy and reliable.

In the semiconductor device according to the second aspect of the present invention, the direction discrimination mark having a surface roughness different from that of the other is provided on the surface of the plastic package which is substantially equal to the direction discrimination mark, so that the internal semiconductor substrate and the wires have the plastic package. It is prevented that the direction discrimination mark is exposed from the installation site.

According to the third aspect of the present invention, there is provided a semiconductor device direction inspecting apparatus which detects a difference from the other direction determining marks as, for example, a white or black optical image based on a difference in light reflectance due to a difference in surface roughness. Then, depending on whether the color in the inspection frame is white or black, it is inspected whether the direction discrimination mark is in the correct direction.

[0016]

【Example】

Example 1. An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 1 is a semiconductor device, 2 is a plastic package of the semiconductor device 1, 3 is an upper surface of the semiconductor device 1, 4A is a direction identification mark of the semiconductor device 1, and the upper surface of the mark 4A is a mirror surface, and the mark 4A is a mirror surface. The surface of the plastic package 2 except for is satin. Further, 6 is an external electrode of the semiconductor device 1, and 7 is a mark printed on the upper surface 3.

FIG. 2 is a block diagram showing a direction inspecting apparatus for the semiconductor device 1. In FIG. 2, 12 is an image pickup means for picking up the image of the semiconductor device 1, 13 is illumination, and 14 is an image pickup means 1.
2 is an original image output from 2, 2 is a binarizing means for binarizing the original image 14, 16 is a mark binarizing threshold output means, 1
Reference numeral 7 is a direction determination mark binary conversion threshold output means, 18 is a mark binary image, and 19 is a direction determination mark binary image.

Further, 20 is a mark inspecting means which receives the mark binary image 18, and 21 is a direction discrimination mark binary image 1
9 is an input direction inspection means, 22 is each inspection means 20,
21 is an inspection result, 23 is an inspection result output means for outputting the inspection result 22, 24 is a mark inspection unit, and 25 is a direction inspection unit.

Next, the operation will be described. In the present invention, since the surface of the direction determining mark 4A in the semiconductor device 1 is made to be a mirror surface different from the matte surface of the surface of the plastic package 2, the light is reflected differently to perform the direction determination.

That is, as shown in FIG. 2, first, since the direction discrimination inspection and the mark inspection are simultaneously performed, the illumination 13
Are arranged around the semiconductor device 1 so as to uniformly illuminate the upper surface 3 of the plastic package 2, and light is obliquely irradiated.

In the present invention, since the surface of the direction discriminating mark 4A is a mirror surface, as shown in FIG. 3, the incident light 24 from the illumination 13 is totally reflected at the same reflection angle 27 as the incident angle 26, and the image pickup means. Light does not enter 12. On the other hand, as shown in FIG. 4, substantially the entire surface of the plastic package 2 is satin-finished, the incident light 24 is scattered by the satin-finished, and a part of the reflected light 25 enters the imaging means 12.

As shown in FIG. 5, in the case of the mark 7, the reflected light 25 is scattered more than that in the satin finish 5, so that more reflected light 25 enters the image pickup means 12.

Further, FIG. 6 shows a brightness-frequency distribution characteristic in which the amount of light received per unit area is the brightness, the horizontal axis is the horizontal axis, and the vertical axis is the frequency. The peaks T7, T of this frequency distribution are shown.
2, T4 correspond to the mark 7, the plastic package 2, and the direction determination mark 4 from the brightest side. In addition, the brightness of the valleys of the peaks T7, T2, T4 is set to the binarization threshold value 16A for marks and the binarization threshold value 17A for direction determination marks from the brightest side.

FIG. 7 shows the original image 14 as the binarization threshold 1 for marks.
6A shows a mark binary image 18 binarized by the binarizing means 15 and FIG. 8 shows the direction discriminating mark binarized by binarizing the original image 14 on the basis of the binarization threshold 17A for the direction discriminating mark. The value image 19 is shown.

Next, the mark inspecting means 20 inspects the marks in the mark binary image 18, while the direction inspecting means 21.
Is provided with an inspection frame 28A and an inspection frame 29A in the direction discrimination mark binary image 19, and the inside of the inspection frame 28A is black and the inspection frame 29A is
If the inside is white, it is considered good, and otherwise it is considered bad. In this way, the inspection result 22 output from each inspection means 20 and 21.
Is output by the inspection result output means 23.

In the above embodiment, the direction discriminating mark 4A is used.
Is a mirror surface and the surface of the plastic package is satin.However, since it is only necessary to give a difference in the amount of reflected light, basically each surface roughness may be in a state where the amount of reflected light is different, and is not limited to the above. Not something.

Example 2. FIG. 9 shows another embodiment of the present invention. This is such that when the semiconductor substrate 8 and the wires 9 are below the direction determining mark 4, the step 10 is not provided on the respective upper faces of the direction determining mark 4 and the plastic package 2. Therefore, the mirror surface of the direction determining mark 4 is provided on a part of the upper surface of the plastic package 2 as shown in FIG. This can prevent a part of the semiconductor substrate 8 and the wires 9 from being exposed on the surface of the plastic package 2.

[0028]

As described above, according to the first aspect of the present invention, the surface roughness of the direction determining mark formed by forming a step in a part of the plastic package in which the semiconductor substrate or the like is embedded is determined by the surface roughness of the plastic package. Since the surface roughness is different from that of the surface roughness, there is an effect that the direction of the semiconductor device can be reliably and easily determined by the direction determination mark.

According to the second aspect of the present invention, a direction discriminating mark having a surface roughness different from that of the plastic package is formed on a part of the plastic package in which the semiconductor substrate or the like is embedded, on a surface substantially equal to the plastic package. Since the arrangement is such that the wires and the semiconductor substrate are prevented from being exposed from the plastic package, there is an effect that it can be obtained.

According to the third aspect of the invention, the binarizing means for binarizing the original image of the semiconductor device imaged by the imaging means is provided, and the direction inspecting means obtains the binarizing means. Since the direction of the direction discrimination mark is inspected based on the direction discrimination mark binary image obtained from the binary data using the binary threshold for the direction discrimination mark as a reference, the result is output. There is an effect that the direction can be automatically inspected by optically detecting the direction discrimination mark.

[Brief description of drawings]

FIG. 1 is a perspective view showing a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a configuration diagram showing a semiconductor device orientation inspection apparatus according to an embodiment of the invention of claim 3;

FIG. 3 is an explanatory diagram showing light reflection of a direction determination mark in FIG.

FIG. 4 is an explanatory diagram showing light reflection of the plastic package in FIG.

FIG. 5 is an explanatory diagram showing light reflection of a mark in FIG.

FIG. 6 is a brightness-frequency distribution characteristic diagram showing the amount of light incident on the imaging means in FIG.

FIG. 7 is a binary image diagram for mark inspection according to the present invention.

FIG. 8 is a binary image diagram for direction inspection according to the present invention.

FIG. 9 is a perspective view showing a semiconductor device according to an embodiment of the present invention.

10 is a sectional view showing the semiconductor device in FIG. 9 with a part thereof broken away.

FIG. 11 is a perspective view showing a conventional semiconductor device.

12 is a cross-sectional view showing the semiconductor device in FIG. 11 with a part thereof cut away.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 semiconductor device 2 plastic package 4A direction discrimination mark 8 semiconductor substrate 12 imaging means 15 binarization means 21 direction inspection means 23 inspection result output means

Claims (3)

[Claims] 1. A semiconductor device in which a surface roughness of a direction determining mark formed by forming a step on a part of a plastic package in which a semiconductor substrate or the like is embedded is different from the surface roughness of the plastic package. 2. A semiconductor device in which a direction discrimination mark having a surface roughness different from that of the plastic package is formed on a part of the plastic package in which a semiconductor substrate or the like is embedded so as to be formed on a surface substantially equal to the plastic package. . 3. An image pickup means for picking up an image of a semiconductor device having a direction discrimination mark having a surface roughness different from that of the other surface, and binarization for binarizing an original image of the semiconductor device picked up by the image pickup means. And a direction inspection for inspecting the direction of the direction discrimination mark based on the direction discrimination mark binary image obtained from the binary data obtained by the binarizing means with reference to the binary threshold for the direction discrimination mark. A direction inspecting apparatus for a semiconductor device, comprising: means and an inspection result output means for outputting an inspection result by the direction inspecting means.