JPH06108285A - Jig for semiconductor wafer plating - Google Patents

Abstract

(57) [Abstract] [Purpose] In plating semiconductor wafers, prevent cathode contacts from being exposed to the plating solution. [Structure] In a plating jig for electroplating a semiconductor wafer 1 in a plating solution, the plating solution is prevented from flowing into members 3 and 4 for holding the semiconductor wafer in the plating solution except for the plating surface of the semiconductor wafer. A sealing member 5 for sealing the semiconductor wafer is provided, and a cathode contact 7 is provided on the surface of the sealed semiconductor wafer that does not come into contact with the plating solution.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to semiconductor wafer plating, and more particularly to a plating jig for plating a semiconductor wafer.

[0002]

2. Description of the Related Art Conventionally, bump plating of a semiconductor wafer is
Historically, first, as shown in FIG. 6, the wafer 2
Starting from an immersion method in which the back surface is coated with wax or resist and immersed in a plating solution, a cup method as shown in FIG. 7 has become mainstream recently. Whichever method is used, FIG.
As shown in, the electric cathode contact portion 3 breaks the resist 2,
The metal part 1 under the resist is pierced. Therefore, the contact part is also exposed to the plating solution,
Plating also deposits on the contact tip, and it was necessary to frequently polish the contact tip (remove deposits) and replace the contact in order to maintain contact performance.

[0003]

SUMMARY OF THE INVENTION It is an object of the present invention to solve the drawbacks of the prior art and to provide a semiconductor wafer plating jig in which plating is not deposited on the tip of the cathode contact.

[0004]

In order to achieve the above object, in the present invention, in a plating jig for electroplating a semiconductor wafer in a plating solution, a member for holding the semiconductor wafer in the plating solution is used. A semiconductor wafer, characterized in that a sealing member for sealing the semiconductor wafer is provided so that the plating solution does not flow into a portion other than the plating surface of the semiconductor wafer, and a cathode contact is provided on a surface of the sealed semiconductor wafer that does not come into contact with the plating solution. This is a jig for plating. As the sealing member for sealing the semiconductor wafer used in the present invention, any material can be used as long as the plating solution does not flow in other than the plated surface of the semiconductor wafer, but a soft rubber such as silicon or urethane developed by the present inventors is used. W- used
A lip seal or a C-type seal can be preferably used.

[0005]

According to the present invention, the surface of the semiconductor wafer other than the plating is sealed so that the plating solution does not flow in, and the cathode contact is provided on the surface that does not flow in. Therefore, the cathode contact itself should not come into contact with the plating solution. And the cathode contacts are not plated. Also, the part where the cathode contact on the wafer surface is provided is
Since the resist is peeled off, contact between the wafer surface and the cathode contact is easy, and more stable contact performance can be obtained.

[0006]

EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited thereto. Example 1 FIG. 1 shows a partially enlarged view of a plating jig of the present invention. In FIG. 1, a wafer 1 is sandwiched by plating jigs 3 and 4 which are members for holding the wafer, and a seal 5
(Here, a W lip seal is shown) to seal the back surface and the end surface of the wafer so that the plating solution does not flow in. Then, in the vicinity of the end face of the wafer surface which is sealed 5, the resist peeling portion 6 where the resist 2 is cut is formed.
Is provided and the metal is exposed. Cathode contact 7
Is connected to the resist stripping section 6 by a spring-shaped or cushion-shaped contact 7 mounted between the lips of the seal 5,
Is led to the outside through. Further, as shown in FIG. 2, the cathode wiring is connected by the jig 4, and the resist peeling portion 6 in the seal 5 and the contact pin 15 and the contact receiver 16 are connected.
It is also possible to make a cathode contact 7 which is connected through a foil, a conductive rubber or the like.

Embodiment 2 FIG. 3 shows a partially enlarged view of another embodiment of the plating jig of the present invention. In FIG. 3, the wafer 1 is sealed with a C-shaped seal at the end, and the sealed wafer is sandwiched by jigs 3 and 4 which are members for holding the wafer, and the pressing lever 8 is pushed. By pressing, the plating solution is sealed so that the back surface and the end surface of the wafer do not flow. A spring-shaped cathode contact 7 is provided on the resist peeling portion 6 on the end surface of the wafer 1 in the C-type seal 5, and is in contact with the wafer, and is guided to the outside through the jig 3.

Embodiment 3 FIG. 4 shows a perspective view of an assembly jig which is an example of a plating jig used in the present invention, and FIG. 5 shows a sectional view of a jig having a wafer as a set. As shown in FIGS. 4 and 5, the wafer 1 is set on the jig 4 with the surface to be plated facing up. A jig 3 having a hole only on the surface to be plated is prepared, and a seal packing (W lip seal or C-type seal described above) is provided along the end of the hole. The jig 3 and the jig 4 are put together and lightly sandwiched by the clamper 13 to obtain the state of FIG. The surface of the wafer is plated by immersing this in a plating solution. At this time, a cathode contact is provided in the seal packing as shown in Examples 1 and 2, and the plating solution does not come into contact with the cathode contact. Good results were obtained by performing plating using such a jig.

[0009]

EFFECTS OF THE INVENTION By using the plating jig of the present invention, the cathode contact does not come into contact with the plating solution, the cathode contact does not deteriorate, and stable plating can be performed for a long period of time.

[Brief description of drawings]

FIG. 1 is a partially enlarged view showing an example of a plating jig of the present invention.

FIG. 2 is a partially enlarged view showing another example of the plating jig of the present invention.

FIG. 3 is a partially enlarged view showing another example of the plating jig of the present invention.

FIG. 4 is a perspective view of an assembling jig using the plating jig of the present invention.

5 is a sectional view of a jig on which the wafer of FIG. 4 is set.

FIG. 6 is a cross-sectional view of an immersion plating apparatus.

FIG. 7 is a cross-sectional view of a cup type plating apparatus.

FIG. 8 is an explanatory view of a conventional external contact type cathode contact.

[Explanation of symbols]

1: wafer, 2: resist, 3, 4: jig, 5: seal, 6: resist peeling portion, 7: cathode contact, 8: pressing lever, 10: plating tank, 11: cathode wiring, 12: anode wiring, 13: clamper, 14: hinge, 15: contact pin, 16: contact receiver.

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[Procedure amendment]

[Submission date] September 25, 1992

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Correction target item name] All drawings

[Correction method] Change

[Correction content]

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[Figure 8]

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Manabu Tsujimura 11-11 Haneda Asahi-cho, Ota-ku, Tokyo Ebara Corporation (72) Inventor Takuya Kanayama 11-1 Haneda-asaka-cho, Ota-ku, Tokyo Inside the EBARA CORPORATION

Claims (1)

[Claims] 1. In a plating jig for electroplating a semiconductor wafer in a plating solution, a semiconductor is provided so that the plating solution does not flow into a member for holding the semiconductor wafer in the plating solution except for the plating surface of the semiconductor wafer. A jig for semiconductor wafer plating, characterized in that a sealing member for sealing the wafer is provided, and a cathode contact is provided on a surface of the sealed semiconductor wafer that does not come into contact with the plating solution.