JPH06112181A - Substrate cleaning apparatus - Google Patents

Abstract

PURPOSE:To avoid excessive overlapped configuration of a chemical solution supply part to reduce an installation space of an entire apparatus so as to distribute same kinds of respective chemical solution to a plurality of substrate cleaning reservoirs for proper supply. CONSTITUTION:A chemical supply tube 7 on a dispense side of a pressure feeding pump 15 is split, and the split downstream sides of the chemical solution supply tube 7 are respectively connected to a plurality of substrate cleaning reservoirs 1 via chemical solution inlet valves 8, while a pressure detector 26 is provided on the dispense side of the pressure feeding pump 15 and on an upstream of a branch 18 of the chemical solution supply tube 7. A control means 12 which received a signal from the pressure detector 26 is used to incrementally/decrementally control the number of rotations of the pressure feeding pump 15 so that the chemical solution can be pressure-fed to the plurality of substrate cleaning reservoirs 1 at a predetermined set pressure. Thus excessive overlapped configuration of a chemical solution supply part can be avoided while an equal quantity of chemical solution can be supplied to each of the substrate cleaning reservoirs 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an immersion type substrate cleaning apparatus used for cleaning the surface of a thin substrate to be processed (hereinafter simply referred to as a substrate) such as a semiconductor substrate or a glass substrate for liquid crystal. Is.

[0002]

2. Description of the Related Art As an immersion type substrate cleaning apparatus of this type,
Conventionally, for example, the one disclosed in Japanese Examined Patent Publication No. 2-13459 is known. In the related art, as shown in FIG. 6, the cleaning liquid 102 can be replaced by a substrate cleaning tank 101 for each of a plurality of kinds of cleaning treatments, and a plurality of kinds of surface cleaning can be performed on a substrate W that is still sealed in the cleaning tank 101. This is done sequentially.

That is, the pure water supply pipe 103 connected to the substrate substrate processing tank 101, and a plurality of chemical liquid storage containers 106 _A to 10 _A
6 _D and each chemical storage container 106 _A - 106 each chemical liquid supply pipe 107 which communicates with the purified water and liquid feed line 103 to _{D A} to 107 _D
And each of the chemical liquid introducing valves 108 _{A to} 108 _D ,
Each of the chemical liquid introduction valves 108 _{A to} 108 _D is selectively opened / closed to introduce a predetermined chemical liquid Q _{A to} Q _D into the pure water supply pipe 103,
The pure water supply pipe 103 is configured to mix a chemical liquid and pure water to prepare a predetermined processing liquid 102.

In the above chemical liquid storage containers 106 _{A to} 106 _D ,
For example, high-temperature sulfuric acid is stored in the chemical liquid storage container 106 _A , etching agent such as hydrogen fluoride is stored in 106 _B, and ultrapure water is stored in 106 _C. The substrate processing bath 101 is configured as a closed type processing bath in which the processing liquid 102 can be replaced for each of these plural types of surface treatments. Reference numeral 111 is a drain for drainage.

[0005]

In the above prior art, since a plurality of types of cleaning treatment can be carried out by the single substrate treatment tank 101, the installation space of the entire apparatus can be reduced, but a plurality of cleaning treatments can be performed. The amount of cleaning treatment (capacity) is inferior to that having a cleaning treatment tank. On the other hand, if a plurality of substrate cleaning apparatuses of this type (so-called substrate cleaning units) are simply installed together, the chemical liquid storage containers 106A to 106A are provided.
A plurality of sets of D are required, and accordingly, the chemical liquid supply units are redundantly arranged, so that the installation space cannot be reduced as a whole. The present invention has been made in view of such circumstances, avoiding the redundant overlapping arrangement of the chemical liquid supply unit to reduce the installation space of the entire apparatus, and each chemical liquid of the same type in a plurality of substrate cleaning tanks. The technical issue is to distribute and supply appropriately.

[0006]

The present invention is configured as follows to solve the above problems. That is, according to the present invention, a plurality of substrate cleaning tanks for cleaning the surface of a substrate by collectively immersing a plurality of substrates in a cleaning liquid, and a cleaning liquid supply unit for supplying a plurality of kinds of cleaning liquids from the bottom of each substrate cleaning tank are provided. A substrate cleaning apparatus comprising: a cleaning liquid discharge unit configured to discharge a cleaning liquid overflowing from each substrate cleaning tank, wherein the cleaning liquid supply unit includes a pure water supply pipe connected to a lower portion of each substrate cleaning tank; Each of the pure water supply pipes is provided with a plurality of chemical liquid introduction valves that communicate with each other via the introduction valve connection pipes, and each chemical liquid introduction valve includes a plurality of chemical liquid storage containers that are respectively coupled through chemical liquid pressure feeding means,
The chemical liquid introducing valve is configured to selectively open and close to introduce a predetermined chemical liquid into the pure water supply pipe, and the chemical liquid pressure feeding means is
A pump for pumping the chemical solution is provided in the chemical solution supply pipe derived from each chemical solution storage container, the chemical solution supply pipe on the discharge side of the pressure pump is branched, and the downstream side of the branched chemical solution supply pipe is respectively connected to the plurality of chemical solution introduction valves via the chemical solution introduction valve. It is connected to the substrate cleaning tank, and a pressure detector is provided on the discharge side of the pressure pump on the upstream side of the branch of the chemical solution supply pipe, and the rotation speed of the pressure pump is increased or decreased based on the detection signal from this pressure detector. The substrate cleaning apparatus is characterized in that a chemical liquid pressure control means for controlling is provided and the chemical liquid is pressure-fed to each of the plurality of substrate cleaning tanks at a predetermined set pressure.

[0007]

[Operation] Since the chemical liquid supply pipe on the discharge side of one pressure pump is branched and each branched chemical liquid supply pipe is connected to multiple substrate cleaning tanks via chemical liquid introduction valves, each chemical liquid storage container and pressure pump It suffices to provide one for each chemical, and it is not necessary to provide for each of a plurality of substrate cleaning tanks. At this time, the rotation speed of the pressure feed pump is controlled to be increased or decreased by the control means, so that the chemicals in the chemicals supply pipes of the plurality of types are pressure-fed at a predetermined set pressure. When distributed and supplied, the supply amount of the chemical liquid sent from the chemical liquid supply pipe to the chemical liquid introduction valve is guaranteed to be a predetermined amount. That is, even if a part of the plurality of substrate cleaning tanks is stopped and the supply of the corresponding chemical liquid is stopped, the pumping force of the other chemical liquid supply pipes of the same type is adjusted to a predetermined pressure. It does not affect the mixing ratio of pure water and pure water.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. 1 is a schematic system diagram of a cleaning processing unit of the immersion type substrate cleaning apparatus, FIG. 2 is a schematic rear view of a partial cutout around the introduction valve connecting pipe, and FIG. 3 is a vertical cross-sectional view of the chemical solution introduction valve of FIG. 4 is a schematic perspective view of the substrate cleaning apparatus, and FIG. 5 is a schematic vertical sectional view of the cleaning apparatus. The present substrate cleaning apparatus 50 is provided with a plurality of substrate cleaning tanks 1 by eliminating the redundant overlapping arrangement of the chemical liquid supply units, and performs a plurality of types of surface treatments in each of the substrate cleaning tanks 1 ... It is a compact one.

That is, as shown in FIG. 4 and FIG. 5, the substrate cleaning apparatus 50 has a loading / unloading section 5 for the substrate accommodating cassette C.
1 and the substrate W from the cassette C or the cassette C
A substrate transfer section 60 for loading the substrate W therein, a cassette transfer robot 55 for transferring the cassette C between the carry-in / out section 51 of the cassette C and the substrate transfer section 60, and a plurality of substrates collectively. Immersion type substrate cleaning processing unit 65 for cleaning by cleaning, liquid draining substrate drying unit 70 for substrate W, and substrate transfer unit 60 for cassette C
The substrate transfer robot 75 is configured to collectively hold a plurality of substrates W taken out from the substrate W and transfer them to the cleaning processing unit 65 and the substrate drying unit 70.

As shown in FIG. 4, the cassette transfer robot 55 is configured to be movable up and down and rotatable, and movable in the direction of arrow A. The cassette C transferred into the carry-in / carry-out section 51 is transferred to the substrate transfer section. It is configured to be transferred onto the table 61 of 60 and to transfer the cassette C containing the cleaned substrate from the table 61 to the loading / unloading section 51.
As shown in FIGS. 4 and 5, the substrate transfer robot 75 is provided so as to be movable in the direction of the arrow B, and holds the plurality of substrates W received from the lifter of the substrate transfer unit 60 between the substrate transfer robots 75. It is held by the arm 76, and the moving unit 7
7 is configured to be sequentially conveyed into the cleaning processing unit 65 and the substrate drying unit 70.

The immersion type cleaning processing unit 65 is, as shown in FIGS. 4 and 5, an overflow type cleaning processing unit 65.
a and an acid cleaning processing section 65b for performing acid cleaning without overflow, which are two separate system processing sections. The substrate cleaning tank 1 of each of the cleaning processing units 65a and 65b is provided with a substrate holder 66 that can be moved up and down, and a plurality of substrates W received from the substrate transfer robot 75 are held by the substrate holder 66 to clean the cleaning tank 1. Configured to be immersed therein.

The overflow type cleaning processing section 65a.
As shown in FIG. 1 (A), two substrate cleaning tanks 1a, 1a for collectively cleaning the surface of the substrate W by immersing a plurality of substrates W in a cleaning liquid, and lower portions of the respective substrate cleaning tanks 1a. A cleaning liquid supply unit 4 for supplying a plurality of types of cleaning liquids, and each substrate cleaning tank 1
and a cleaning liquid discharge section 40 for discharging the cleaning liquid overflowing from a. As shown in FIG. 1A, this overflow type substrate cleaning tank 1a is made of quartz glass and is formed into a substantially V shape in a side view and a substantially rectangular shape in a plan view, and a pure water supply pipe 3 is connected to the lower portion thereof. The substrate W is configured as an overflow tank in which a uniform upward flow of the cleaning liquid is formed to surface-treat the substrate W and the cleaning liquid can be quickly replaced for each of a plurality of types of cleaning processes.

The substrate cleaning tank 1a is not limited to quartz glass. For example, when hydrofluoric acid or the like that corrodes quartz glass is used as the cleaning liquid, it is made of a resin such as tetrafluoroethylene resin that has corrosion resistance. It may be formed of a material. In addition, the substrate processing bath 1a includes a cleaning liquid discharge unit 40.
An overflow liquid recovery unit 41 constituting the above is additionally provided, and the overflowed cleaning liquid is configured to flow down to the drain drain 43 through the drain pipe 42.

As shown in FIG. 1 (B), the acid cleaning processing unit 65b has one acid cleaning tank 1b for collectively cleaning a plurality of substrates W with acid, and an acid cleaning solution from the bottom of the acid cleaning tank 1b. An acid cleaning liquid supply unit 4b for supplying and an acid cleaning liquid recovery unit 40b for recovering the acid cleaning liquid from the acid cleaning tank 1b are provided. However, the substrate cleaning tank 1a of the overflow type processing unit 65a
Is not limited to the combination of two cleaning tanks, and may be a combination of three or more cleaning tanks in series. The acid cleaning tank 1b of the acid cleaning processing unit 65b is not limited to a single tank and may be a plurality of tanks.

The substrate drying unit 70 is rotated by a centrifugal force about the center of the main plane of the substrate as a rotation center, as disclosed in, for example, Japanese Patent Laid-Open No. 1-255227 proposed by the present applicant. It is composed of a drying treatment tank for cutting and drying. Instead of the centrifugal type substrate drying unit 70, a solvent may be used to accelerate the drying, or a depressurization method may be used to accelerate the drying.

The layout of the substrate cleaning apparatus 50 is shown in FIG.
As shown in FIG. 5, the loading / unloading section 51 of the cassette C, the substrate transfer section 60, the substrate drying section 70, and the cleaning processing section from the front facing the clean room work area 30 to the rear facing the maintenance work area 31. 65 are arranged in order. Also,
The cleaning liquid supply / discharge piping chamber 20 is arranged below the three substrate cleaning tanks 1 of the cleaning processing unit 65, and the cleaning chemical liquid storage container 6 is arranged below the supply / discharging piping chamber 20 in three stages. The substrate transfer section 60, the substrate drying section 70, and the cleaning processing section 6
5, a moving part 77 of the substrate transfer robot 75 is formed in the front-rear direction on the right side of the substrate transfer robot 75, and in the space on the left side thereof, the substrate transfer part 6 is moved.
A space behind 0 is formed as a maintenance space 90. A plurality of pipes, valves, etc. are laid on the floor of the maintenance space 90.

That is, in the present embodiment, the substrate cleaning tank 1 of the cleaning processing unit 65, the supply / discharge pipe chamber 20, and the cleaning chemical liquid storage container 6 in the substrate cleaning apparatus 50 are stacked in three layers. By laying out (that is, laid out in the vertical direction), the maintenance space 90 is secured in the area facing the left side of these three-stage stacking portions. In other words, various work blocks such as the cleaning processing unit 65 and the substrate transfer unit 60 are arranged in an L shape in a plan view, and the surplus space in the substrate cleaning apparatus 50 serves as a maintenance space 90.

Therefore, in this embodiment, the cleaning processing unit 6 is mainly used.
By stacking 5 vertically, the entire apparatus can be compacted and the space of the entire clean room can be efficiently saved, as compared with the prior art that adopts the same cleaning liquid replacement method as in the present embodiment. This means that as the number of substrate cleaning devices 50 installed increases, the effective use efficiency of the space in the clean room improves.

Further, the substrate cleaning tank 1 of the cleaning processing section 65.
Regarding the layout of the substrate drying unit 70, as shown in FIGS. 4 and 5, one acid cleaning tank 1b and two acid cleaning tanks 1b are provided from the back side facing the maintenance work area 31 to the front side facing the clean room work area 30. The two overflow type substrate cleaning tanks 1a and 1a and the drying processing unit 70 are arranged in this order, and the drying processing unit 70 faces the substrate transfer unit 60. Usually, since the temperature-raised acid is used for the acid cleaning treatment, acid vapor or mist is likely to be generated. However, in the present embodiment, the acid cleaning tank 1b is arranged farthest from the clean room work area 30. Therefore, it is possible to prevent adverse effects on the clean room work area 30 and ensure work safety.

Further, since the substrate drying section 70 is located between the cleaning processing section 65 and the substrate transfer section 60, the cleaned substrate W is dried as quickly as possible, returned to the cassette C, and carried in and out. It can be efficiently carried out from 51. On the other hand, the substrate drying process is not strongly restricted by the time for returning to the cassette C, and the substrate transfer unit 60 is not operated after the completion of the drying process.
Since a waiting time can be taken during the returning to the substrate, the substrate drying section 70 provided adjacent to the substrate transfer section 60 can also serve as a buffer in the working process.

On the other hand, with respect to the cleaning treatment except the acid cleaning,
Since a relatively long time is required for the processing, the two overflow type substrate cleaning tanks 1a and 1a are shared to perform a plurality of types of cleaning processing. It does not slow down. Moreover, since the acid cleaning process is shared by one acid cleaning tank 1b, the cleaning process efficiency and space saving are further improved in addition to the common substrate drying unit 70.

On the other hand, the overflow type cleaning processing section 65a
In the above, since the cleaning liquid is configured to overflow from the upper portion of the substrate cleaning tank 1a, the cleaning liquid can be replaced for each of a plurality of types of cleaning processes without discharging all the cleaning liquid in the substrate cleaning tank 1a. Substrate W until processing is completed
Does not touch the air. Therefore, there is no risk that an oxide film will be formed on the substrate surface or that impurities in the air will adhere. Further, the substrate W can be loaded and unloaded without discharging all the cleaning liquid 2 in the substrate cleaning tank 1.

The overflow type cleaning processing section 65a.
As shown in FIG. 1 (A), the cleaning liquid supply unit 4 of FIG. 1 is provided with pure water supply pipes 3 connected to the lower portions of the respective substrate cleaning tanks 1a and introduction valve connection pipes 16 to the pure water supply pipes 4, respectively. A plurality of chemical liquid introduction valves 8 connected to each other and a plurality of chemical liquid storage containers 6 connected to the respective chemical liquid introduction valves 8 via the chemical liquid pressure feeding means 25,
It is configured to selectively open and close each chemical liquid introduction valve 8 to introduce a predetermined chemical liquid into the pure water supply pipe 3.

The pure water supply pipe 3 is provided with a supply / discharge liquid switching valve 13, a static mixer 14, an introduction valve connecting pipe 16, an open / close valve 27, etc., which are sequentially installed upstream from the substrate processing tank 1a. And is configured as a main passage of pure water for supplying the pure water D _W that has been heated to room temperature or a predetermined temperature.
The pure water D _W is more preferably deoxidized in order to prevent surface oxidation of the substrate. The supply / discharge liquid switching valve 13 always supplies the pure water D _W or the processing liquid to the substrate processing tank 1a, and if necessary, the processing liquid in the substrate processing tank 1a to the drain drain 43 via the drain pipe 42. It is configured to discharge.

As shown in FIG. 2, the static mixer 14 has a perforated torsion plate 1 in a mixer conduit 14a.
4b is fixed and the pure water D _W and the chemical liquids Q _{A to} Q _E are uniformly mixed. Other mixers may be used instead of this static mixer, and if the pipe line is sufficiently long, such mixer can be omitted. The introduction valve connection pipe 16 connects the plurality of chemical liquid introduction valves 8 _A to 8 _E of the treatment liquid supply unit 4, and the details will be described later.

As shown in FIG. 1 (C), the chemical liquid introducing valves 8 _A to 8 _E are fixed to an introducing valve connecting pipe 16 disposed upstream of the static mixer 14, and the introducing valve connecting pipe 16 is provided.
And is connected to the pure water supply pipe 3 through. This chemical liquid introduction valve 8 was proposed by the applicant in Japanese Patent Application No. 3-93634, and as shown in FIG.
A valve body 80 which is partitioned and formed, a valve body 84 which is inserted into a chemical liquid introducing chamber 81 through a valve shaft 83 and is openably and closably provided by an opening and closing drive means (not shown), and a pipe wall 16a of the valve connecting pipe 16. And a pure water passage 3a connected to the substrate processing bath 1 and a valve seat 84b formed on the substrate seat 84b for receiving the valve body 84.
Of the valve connecting pipe 16 connected to the valve body 80, and the chemical liquid Q is introduced into the pure water passage 3a in the valve connecting pipe 16 through the chemical liquid introducing chamber 81. Is composed of.

A chemical liquid introduction chamber 81 and a valve drive chamber 82 are defined in the valve body 80. The chemical liquid introduction chamber 81 and the valve drive chamber 82 extend through the valve shaft 83 and the chemical liquid inlet of the chemical liquid introduction chamber 81. The chemical solution supply pipe 7 _A is connected to 81 a, and the chemical solution introduction chamber 81
Inside, the valve element 84 is fixed to the tip of the valve shaft 83. In the valve drive chamber 82, an air piston 85 is fixed to a valve shaft 83, and a compression spring 86 closes the air piston 85 on the valve closing side (that is,
In this embodiment, the air piston 85 is urged to the lower side in FIG. 3 and the air piston 85 is opened by the compressed air A to pump the chemical solution Q _A into the pure water supply pipe line 3a by a predetermined amount. To be done. Reference numeral 82a in FIG. 3 is an inlet / outlet port for the compressed air A, 82b is a spring side communication port for letting air in the valve drive chamber 82 escape according to the operation of the air piston 85, and 87 is a bellows tube for sealing a chemical liquid. .

On the other hand, as shown in FIG. 3, the introduction valve connecting pipe 16 is formed with a chemical solution outlet 81b of the chemical solution introducing chamber 81 and a valve seat 84b on the pipe wall 16a thereof, so that the valve body 84 is seated in the valve seat 8a.
4b, the tip convex portion 84a of the valve element 84 extends into the chemical solution outlet 81b, and the space between the valve seat 84b and the pure water passage 3a is filled with the tip convex portion 84a, so that when the valve is closed, It is configured to eliminate the dead water area.
By the way, in the above-mentioned conventional introduction valve (see FIG. 7), the valve seat 1
Since the distance from 84b to the pure water passage 103 in the valve connecting pipe 116 is long, the chemical liquid passage 107A becomes a dead water region when the valve is closed, and there is a problem that the chemical liquid is stopped after the chemical liquid is supplied. The chemical liquid introducing valve 8 can smoothly solve such a problem.

That is, in this embodiment, the chemical liquid outlet 81b of the chemical liquid introducing chamber 81 and the valve seat 84b are formed on the pipe wall 16a of the introducing valve connecting pipe 16, and the valve seat 84a is the pure water in the valve connecting pipe 16. Since it is disposed close to the passage 3a (or may be exposed to the pure water passage), when the pure water is continuously supplied after the chemical solution is supplied, the problem of deterioration of the pure water purity is eliminated, and the surface treatment of the substrate is eliminated. Quality is improved. Further, since the liquid out of the chemical solution Q _A is improved, as described later, together with the control of the pumping pressure of the drug solution by the pressure pump, chemical Q _A to the feed amount of the pure water D _W
It is possible to accurately control the supply amount of the compound and to prepare a predetermined chemical solution concentration. Moreover, pure water does not stay and bacteria are not generated. However, chemical induction valve 8 _A to 8 _E is not limited to operating with compressed air, it may be used as appropriate solenoid valve or the like.

Each chemical liquid pressure feeding means 25 in the cleaning liquid supply unit 4 of the overflow type cleaning processing unit 65a is shown in FIG.
(A), the pumping pump 15 of the chemical one provided, is branched chemical supply pipe 7 _A discharge side of the feed pump 15 to one type of chemical storage container 6 chemical liquid supply pipe 7 was derived from _{A A} , branched respective chemical liquid supply pipe 7 _a · 7 the plurality of substrate cleaning tank 1a · 1 downstream portion through the respective said chemical introducing valve 8 _a of _a
The pressure detector 26 (specifically, a pressure gauge) is provided on the discharge side of the pressure feed pump 15 and upstream of the branch portion 18 of the chemical liquid supply pipe 7 _A. A chemical liquid pressure feed control means 12 for controlling the rotation speed of the pressure feed pump 15 based on a detection signal is provided, and the pressure detector 26 detects excess or deficiency with respect to a predetermined set pressure, and the control means 1
By driving and controlling the drive source 19 of the pressure-feeding pump 15 via 2, the chemical solution is pressure-fed to each of the plurality of substrate cleaning tanks 1a at a predetermined set pressure.

That is, the control means 12, which receives the pressure detected by the pressure detector 26, controls the rotation speed of the pressure feed pump 15 to increase or decrease in accordance with the preset transfer pressure. This allows
Whether the chemical solution is supplied to both of the overflow type two substrate cleaning tanks 1a and 1a or the chemical solution is supplied to only one of them, a single pressure pump 15
Thus, it is possible to always supply a predetermined set amount of the chemical liquid. In the embodiment shown in FIG. 1 (A), the chemical liquid introducing valve 8
Chemical pumping means 2 according to one type of chemical solution Q _A introduced from _A
5 has been described, other types of chemical Q _B, Q _C,
The chemical liquid pressure-feeding means relating to Q _D and Q _E are similarly configured. Accordingly, it is sufficient to arrange one set of a plurality of types of chemical liquid storage containers for the plurality of substrate cleaning tanks 1a and 1a, and there is no need to arrange them in duplicate.

[0032]

EFFECTS OF THE INVENTION (1) Since the chemical solution supply pipe on the discharge side of one pressure pump is branched and each branched chemical solution supply pipe is connected to a plurality of substrate cleaning tanks 1 via a chemical solution introduction valve, substrate cleaning Only by increasing the number of tanks, it is possible to avoid the redundant arrangement of the chemical liquid supply parts such as the chemical liquid storage container and the pressure feed pump, and to reduce the installation space of the entire apparatus. (2) Further, the rotation speed of the pressure feed pump is controlled to be increased / decreased by the control means so that each chemical liquid in the plural types of chemical liquid supply pipes is pressure-fed at a predetermined set pressure. When distributed and supplied to the tank, the supply amount of the chemical liquid sent from the chemical liquid supply pipe to the chemical liquid introduction valve is guaranteed to be a predetermined amount. As a result, even if a part of the plurality of substrate cleaning tanks is deactivated and the supply of the chemical liquid corresponding thereto is stopped, the pumping force of the other chemical liquid supply pipes of the same type is adjusted to a predetermined pressure. Therefore, the chemical liquid can be accurately prepared without affecting the mixing ratio of the chemical liquid and pure water.

[Brief description of drawings]

FIG. 1 is a schematic system diagram of a cleaning processing unit of an immersion type substrate cleaning apparatus.

FIG. 2 is a partially cutaway schematic rear view around the introduction valve connecting pipe.

FIG. 3 is a vertical sectional view taken along the line I-I of the chemical liquid introducing valve in FIG.

FIG. 4 is a schematic perspective view of the substrate cleaning apparatus.

FIG. 5 is a schematic vertical sectional view of the cleaning apparatus.

FIG. 6 is a view equivalent to FIG. 1 showing a conventional technique.

FIG. 7 is a view corresponding to FIG. 3 showing the conventional technique.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate processing tank, 2 ... Cleaning liquid, 3 ... Pure water supply pipe, 4 ... Cleaning liquid supply part, 6 ... Chemical liquid storage container, 7 ... Chemical liquid supply pipe, 8 ... Chemical liquid introduction valve, 12 ... Chemical liquid pressure feed control means, 1
5 ... pressure pump, 16 ... introduction valve connecting pipe,
17 ... Discharge side of the pressure pump 15, 18 ... Chemical liquid supply pipe 7
Branching portion, 25 ... Chemical liquid pressure feeding means, 26 ... Pressure detector, 40 ... Cleaning liquid discharging portion, _DW ... Pure water,
Q _A ~Q _E ... a chemical solution, W ... substrate,
C ... cassette.

Claims (1)

[Claims] 1. A plurality of substrate cleaning baths for cleaning the surface of a substrate by collectively immersing a plurality of substrates in a cleaning liquid, and a cleaning liquid supply unit for supplying a plurality of types of cleaning liquid from the bottom of each substrate cleaning bath. A substrate cleaning apparatus comprising: a cleaning liquid discharge unit configured to discharge a cleaning liquid overflowing from each substrate cleaning tank, wherein the cleaning liquid supply unit includes a pure water supply pipe connected to a lower portion of each substrate cleaning tank, Each of the chemical liquid introduction valves is connected to a pure water supply pipe via an introduction valve connecting pipe, and each of the chemical liquid introduction valves is connected to each chemical liquid introduction valve via a chemical liquid pressure feeding means. It is configured to selectively open / close control and introduce a predetermined chemical liquid into the pure water supply pipe, and the chemical liquid pressure feeding means is provided with a chemical liquid pressure pump for the chemical liquid supply pipe led out from each chemical liquid storage container. Branch the chemical supply pipe on the discharge side of The downstream side of the chemical liquid supply pipe is connected to the plurality of substrate cleaning tanks via the chemical liquid introduction valve, respectively, and a pressure detector is provided on the discharge side of the pressure pump at the upstream side of the branch portion of the chemical liquid supply pipe, A chemical liquid pressure feed control means for increasing / decreasing the rotation speed of the pressure feed pump based on a detection signal from the pressure detector is provided, and the chemical liquid is pressure fed to each of the plurality of substrate cleaning tanks at a predetermined set pressure. Substrate cleaning equipment.