JPH06112295A - Mounted board production system - Google Patents
Mounted board production systemInfo
- Publication number
- JPH06112295A JPH06112295A JP4260449A JP26044992A JPH06112295A JP H06112295 A JPH06112295 A JP H06112295A JP 4260449 A JP4260449 A JP 4260449A JP 26044992 A JP26044992 A JP 26044992A JP H06112295 A JPH06112295 A JP H06112295A
- Authority
- JP
- Japan
- Prior art keywords
- equipment
- mounting
- analysis
- monitoring item
- warning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Image Analysis (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】
【目的】不良発生原因を事前に解消して良品を無駄なく
生産するとともに製品品質の堅固な信頼性を得る。
【構成】各不良監視項目における不良判定基準には達し
ない警告基準との比較結果に基づいて各設備条件および
各設備を通過した基板の品質を各分析部22，24，26で各
工程の集計分析および時系列分析し、これら分析結果に
基づいてその検査工程の設備に動作制御指示を出力する
とともに、相関分析部27を介して半田印刷機４、装着機
７およびリフロー炉10のうち、監視項目の要因に関連す
る工程の設備に動作制御指示を出力して動作状態を動的
に変えるので、各監視項目の検査値が不良判定基準に達
するまでに各工程の異常が事前に発見されて、各工程に
対して事前に的確な対策指示が可能となり、これにより
不良発生が未然に食い止められる。
(57) [Summary] [Purpose] To eliminate the cause of defects in advance, to produce good products without waste, and to obtain solid reliability of product quality. [Structure] Based on the result of comparison with the warning criteria that does not reach the failure judgment criteria in each failure monitoring item, the condition of each equipment and the quality of the board that has passed through each equipment are tabulated by each analysis unit 22, 24, 26 for each process. Analysis and time-series analysis are performed, and based on these analysis results, an operation control instruction is output to the equipment in the inspection process, and the solder printer 4, the mounting machine 7, and the reflow furnace 10 are monitored via the correlation analysis unit 27. Since an operation control instruction is output to the equipment of the process related to the factor of the item and the operating state is dynamically changed, the abnormality of each process is detected in advance by the time the inspection value of each monitored item reaches the defect judgment standard. It is possible to give an appropriate countermeasure instruction to each process in advance, which prevents the occurrence of defects.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、回路基板に部品を実装
する実装基板生産システムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting board production system for mounting components on a circuit board.
【０００２】[0002]
【従来の技術】図15は従来の実装基板生産システムの構
成を示すブロック図である。図15において、回路基板の
移送ラインに沿ってその上手側から半田印刷部１、部品
装着部２さらに半田付部３が順次配設されている。半田
印刷部１において、クリーム半田印刷機４は回路基板な
どの被印刷物のランド上にクリーム半田を印刷する。ク
リーム半田印刷検査機５は、基板および印刷設備の状態
を検査するとともに、クリーム半田印刷機４で印刷した
クリーム半田の印刷状態を検査する。このクリーム半田
印刷検査機５に接続されるデータ処理装置６はクリーム
半田印刷機４に接続され、クリーム半田印刷検査機５か
らの出力データをデータ解析してクリーム半田印刷機４
に対してフィードバック制御する構成である。2. Description of the Related Art FIG. 15 is a block diagram showing the structure of a conventional mounting board production system. In FIG. 15, a solder printing unit 1, a component mounting unit 2, and a soldering unit 3 are sequentially arranged from the upper side along the transfer line of the circuit board. In the solder printing unit 1, the cream solder printing machine 4 prints the cream solder on the land of an object to be printed such as a circuit board. The cream solder printing inspection machine 5 inspects the state of the board and the printing equipment, and also inspects the printing state of the cream solder printed by the cream solder printing machine 4. The data processing device 6 connected to the cream solder printing inspecting machine 5 is connected to the cream solder printing inspecting device 4, and the output data from the cream solder printing inspecting device 5 is analyzed to perform the data processing.
The feedback control is performed with respect to.
【０００３】また、部品装着部２において、装着機７
は、Ｘ−Ｙ駆動装置により、電子部品などが供給される
部品供給部に吸着ノズルヘッドを移送し、吸着ノズルヘ
ッドで部品を吸着して回路基板の装着位置まで移送し
て、ランド上に印刷されたクリーム半田上にリードや電
極が位置するように部品を装着する。このとき、部品の
回路基板への装着は、部品認識カメラにより部品の吸着
状況を撮影して吸着ミスを管理しながら行う。部品装着
後検査機８は、装着機４により回路基板上の所定位置に
装着された部品や設備の状態を検査する。この部品装着
後検査機８に接続されるデータ処理装置９は装着機７に
接続され、部品装着後検査機８からの出力データをデー
タ解析して装着機４に対してフィードバック制御する構
成である。Further, in the component mounting unit 2, the mounting machine 7
Uses an XY driving device to transfer the suction nozzle head to a component supply unit to which electronic components and the like are supplied. The suction nozzle head sucks the component and transfers it to the mounting position of the circuit board for printing on the land. The parts are mounted so that the leads and electrodes are located on the solder paste. At this time, the component is mounted on the circuit board while the component recognition camera photographs the component suction state to manage the suction error. The after-component mounting inspection machine 8 inspects the state of components and equipment mounted by the mounting machine 4 at predetermined positions on the circuit board. The data processing device 9 connected to the post-component mounting inspection machine 8 is connected to the mounting machine 7 and is configured to analyze the output data from the post-component mounting inspection machine 8 and perform feedback control to the mounting machine 4. .
【０００４】さらに、半田付部３において、リフロー炉
10は、炉体内に被加熱物である回路基板を搬送するコン
ベアを配設し、このコンベアの上下位置にヒータをそれ
ぞれ配設し、さらにその上下位置にファンを配設してヒ
ータを通して加熱された熱風ガスを回路基板に吹き付け
る構成である。また、リフロー炉10の内部は、予熱室、
リフロー加熱室さらに徐冷室に区画され、各室にそれぞ
れ上記ヒータおよびファンが配設されており、リフロー
加熱室においては、回路基板を均一に加熱することによ
ってクリーム半田をリフローすることで部品を半田付け
する構成である。半田付検査機11は、回路基板上の部品
の半田付け状態および設備の状態を検査する。この半田
付検査機11に接続されるデータ処理装置12はリフロー炉
10に接続され、半田付検査機11からの出力データをデー
タ解析してリフロー炉10に対してフィードバック制御す
る構成である。Further, in the soldering section 3, a reflow furnace is used.
10, a conveyer for transferring a circuit board, which is an object to be heated, is arranged in the furnace body, heaters are arranged at the upper and lower positions of the conveyer, and fans are arranged at the upper and lower positions thereof to be heated through the heater. The hot air gas is blown onto the circuit board. Further, the inside of the reflow furnace 10 is a preheating chamber,
The reflow heating chamber is further divided into a slow cooling chamber, and the above-mentioned heater and fan are arranged in each chamber.In the reflow heating chamber, the circuit board is uniformly heated to reflow the cream solder, and thereby the parts are separated. It is a structure for soldering. The soldering inspection machine 11 inspects the soldering state of components on a circuit board and the state of equipment. The data processing device 12 connected to this soldering inspection machine 11 is a reflow furnace.
It is connected to 10 and is configured to perform data analysis of output data from the soldering inspection machine 11 and perform feedback control to the reflow furnace 10.
【０００５】以上の半田印刷部１、部品装着部２および
半田付部３により、実装基板生産システム13が構成され
ている。上記構成により、以下、その動作を説明する。
まず、回路基板のランド上にクリーム半田印刷機４でク
リーム半田を印刷する。そして、基板および設備の状態
や、ランド上に印刷したクリーム半田の印刷状態、たと
えば、印刷カスレ、印刷ずれおよび印刷の有無などをク
リーム半田印刷検査機５で検査する。このクリーム半田
印刷検査機５からの出力データをデータ処理装置６でデ
ータ解析してクリーム半田印刷機４に対して不良品の発
生を抑制するようにフィードバック制御する。The above-mentioned solder printing section 1, component mounting section 2 and soldering section 3 constitute a mounting board production system 13. With the above configuration, the operation will be described below.
First, cream solder is printed by the cream solder printer 4 on the land of the circuit board. Then, the state of the board and the equipment, the printing state of the cream solder printed on the land, for example, the print blur, the print misalignment and the presence or absence of the printing are inspected by the cream solder printing inspection machine 5. The data processing device 6 analyzes the output data from the cream solder printing inspection machine 5 and feedback-controls the cream solder printing machine 4 so as to suppress the generation of defective products.
【０００６】次に、装着機７は、電子部品などが供給さ
れる部品供給部に吸着ノズルヘッドをＸ−Ｙ駆動装置で
移送して部品を吸着し、これを回路基板の装着位置まで
移送して部品装着所定箇所に押し付けてランド上の印刷
クリーム半田の粘性で装着する。装着機７の設備状況
や、装着機７により装着された部品装着状況、たとえ
ば、部品欠品、部品立ち、部品装着位置ずれおよび部品
装着極性ミスなどを部品装着後検査機８で検査する。こ
の部品装着後検査機８からの出力データをデータ処理装
置９でデータ解析して装着機７に対して不良品の発生を
抑制するようにフィードバック制御する。Next, the mounting machine 7 transfers the suction nozzle head to the component supply section to which electronic components and the like are supplied by the XY driving device to suck the components, and transfers the components to the mounting position of the circuit board. Parts are mounted by pressing on a predetermined place and mounting with the viscosity of the printing cream solder on the land. The equipment condition of the mounting machine 7 and the mounting status of the components mounted by the mounting machine 7, for example, a component missing item, a component standing, a component mounting position shift, and a component mounting polarity error are inspected by the component mounting inspection machine 8. The data processing device 9 analyzes the output data from the post-component mounting inspection machine 8 and performs feedback control on the mounting machine 7 so as to suppress the generation of defective products.
【０００７】さらに、リフロー炉10内に回路基板をコン
ベアにて搬送し、ファンによりヒータを通して加熱され
た熱風ガスを回路基板に吹き付けることで、まず、予熱
室で回路基板を予熱し、次に、リフロー加熱室で印刷し
たランド上の印刷クリーム半田をリフローさせ、さら
に、リフローした印刷クリーム半田を徐冷室で除々に冷
やして部品のリードまたは電極と回路基板のランドを半
田接合する。そして、リフロー炉10の設備の状態や、回
路基板上の部品の半田付け状態、たとえば、部品欠品、
部品立ち、部品装着位置ずれおよび部品装着極性ミスな
どを半田付検査機11で検査する。この半田付検査機11か
らの出力データをデータ処理装置12でデータ解析してリ
フロー炉10に対して不良品の発生を抑制するようにフィ
ードバック制御する。Further, the circuit board is conveyed into the reflow furnace 10 by a conveyor, and hot air gas heated by a fan through a heater is blown to the circuit board to first preheat the circuit board in a preheating chamber, and then, The printed cream solder on the land printed in the reflow heating chamber is reflowed, and the reflowed printed cream solder is gradually cooled in the slow cooling chamber to solder the leads or electrodes of the component to the land of the circuit board. Then, the state of equipment of the reflow furnace 10 and the soldering state of the components on the circuit board, for example, the component is out of stock,
The soldering inspection machine 11 inspects the component standing, component mounting position deviation, component mounting polarity error, and the like. The data processing device 12 analyzes the data output from the soldering inspection machine 11 and feedback-controls the reflow furnace 10 so as to suppress the generation of defective products.
【０００８】ここで、半田印刷部１、部品装着部２およ
び半田付部３の各検査機による検査により、不良と判定
された場合にはその不良回路基板を廃却するか、または
修正していた。Here, when the solder printing section 1, the component mounting section 2 and the soldering section 3 are inspected by the respective inspection machines and are determined to be defective, the defective circuit board is discarded or corrected. It was
【０００９】[0009]
【発明が解決しようとする課題】しかし、上記従来の構
成では、不良発生時に各検査機５，８，11からの出力デ
ータをデータ処理装置６，９，12でそれぞれデータ解析
して各部内に対してフィードバック制御し不良品の発生
を抑制するように制御していたが、高密度実装において
不良発生要因は複雑で他の工程や複数の監視項目が関わ
っており各部内毎のフィードバック制御だけでは根本的
な不良発生原因の解消には至らず、また、従来は、生産
システムとしての総合的な見知から良品を無駄なく作る
という思想がなく、不良と判定されれば不良の回路基板
は廃却、または修正するので、大幅な製造時間や部品の
ロスを来すものであった。However, in the above-mentioned conventional configuration, when the defect occurs, the output data from each of the inspection machines 5, 8 and 11 are analyzed by the data processing devices 6, 9 and 12, respectively, and the data is stored in each section. In contrast, feedback control was performed to control the occurrence of defective products, but in high-density mounting, the cause of defectiveness is complicated and involves other processes and multiple monitoring items, so feedback control within each part alone is not enough. The cause of the fundamental failure has not been resolved, and conventionally there was no idea of making good products without waste from the overall knowledge of the production system. Since it is rejected or modified, it causes a great loss of manufacturing time and parts.
【００１０】本発明は上記従来の問題を解決するもの
で、根本的な不良発生原因を事前に解消して良品を無駄
なく生産するとともに製品品質の堅固な信頼性を得るこ
とができる実装基板生産システムを提供することを目的
とする。The present invention solves the above-mentioned problems of the prior art, and eliminates the fundamental cause of defects in advance to produce good products without waste, and at the same time, to manufacture a mounting substrate capable of obtaining reliable product quality. The purpose is to provide a system.
【００１１】[0011]
【課題を解決するための手段】上記課題を解決するため
に本発明の実装基板生産システムは、基板のランド上に
半田を印刷する印刷手段と、前記印刷された半田の所定
位置に部品を装着する部品装着手段と、前記部品が装着
された基板のランドと前記部品の端子を半田接合する半
田付手段とを有する実装基板生産システムであって、前
記印刷手段、部品装着手段および半田付手段のうち少な
くとも何れかに対する設備および基板の所定監視項目を
検出する監視項目検出手段と、前記監視項目検出手段の
検出結果により予め設定された前記監視項目に対する、
不良判定基準には達しない警告基準との比較結果に基づ
いて前記設備の条件および基板の品質を分析する制御手
段と、前記制御手段の分析結果をモニタ出力するモニタ
手段とを備えたものである。In order to solve the above-mentioned problems, a mounting board production system of the present invention comprises a printing means for printing solder on a land of a board and a component mounted at a predetermined position of the printed solder. A mounting board production system having a component mounting means for mounting, and a soldering means for solder-joining a land of the substrate on which the component is mounted and a terminal of the component, the printing means, the component mounting means, and the soldering means. Monitoring item detection means for detecting a predetermined monitoring item of equipment and a board for at least one of them, and for the monitoring item preset by the detection result of the monitoring item detection means,
It is provided with a control means for analyzing the condition of the equipment and the quality of the substrate based on a result of comparison with a warning standard which does not reach the defect determination standard, and a monitor means for outputting the analysis result of the control means on a monitor basis. .
【００１２】また、本発明の実装基板生産システムの制
御手段は、設備の条件および基板の品質を分析した分析
結果に基づいて印刷手段、部品装着手段および半田付手
段のうち少なくとも何れかに動作制御指示を出力して動
作状態を動的に変えて良品生産させるように制御する構
成としたものである。Further, the control means of the mounting board production system of the present invention controls the operation of at least one of the printing means, the component mounting means and the soldering means based on the analysis result of analyzing the condition of the equipment and the quality of the board. The configuration is such that an instruction is output to dynamically change the operating state and control is performed so that a non-defective product is produced.
【００１３】さらに、本発明の実装基板生産システムの
制御手段は、検出結果が警告領域にある場合に、監視項
目の検出工程よりも下流工程の設備に対して動作制御指
示を出力し基板が前記下流工程の設備に到達するまでに
前記下流工程の設備の動作状態を動的に変えて良品生産
させる制御、および、監視項目の検出工程を含む前記検
出工程よりも上流工程の設備に対して動作制御指示を出
力し前記上流工程の設備の動作状態を動的に変えて良品
生産させる制御のうち少なくとも何れかの制御が可能な
ものである。Further, when the detection result is in the warning area, the control means of the mounting board production system of the present invention outputs an operation control instruction to the equipment in the process downstream from the detection process of the monitoring item, and the board is said to Control to dynamically change the operating state of the equipment of the downstream process until it reaches the equipment of the downstream process, and operate for equipment of the upstream process from the detection process including the detection process of monitoring items It is possible to control at least one of the controls for outputting a control instruction and dynamically changing the operating state of the equipment in the upstream process to produce a non-defective product.
【００１４】さらに、本発明の実装基板生産システムの
制御手段は、監視項目の警告基準との比較結果に応じた
設備および基板の分析結果に基づいて前記監視項目の不
良要因に関連する各工程相互の相関を分析して印刷手
段、部品装着手段および半田付手段のうち少なくとも何
れかに動作制御指示を出力して動作状態を動的に変えて
良品生産させるように制御するものである。Further, the control means of the mounting board production system according to the present invention is based on the analysis result of the equipment and the board according to the result of comparison with the warning standard of the monitoring item, and the mutual process of each step related to the failure factor of the monitoring item. Is analyzed to output an operation control instruction to at least one of the printing unit, the component mounting unit, and the soldering unit to dynamically change the operation state and control to produce a good product.
【００１５】さらに、本発明の実装基板生産システムの
制御手段は、監視項目に対する警告基準との比較結果、
または複数監視項目の組み合わせに対する警告基準との
比較結果により警告を要する工程の設備に対してメンテ
ナンス指示を知らせるように制御するものである。Further, the control means of the mounting board production system of the present invention, the result of comparison with the warning standard for the monitoring item,
Alternatively, it is controlled so as to notify the maintenance instruction to the equipment of the process requiring a warning based on the result of comparison with the warning standard for the combination of a plurality of monitoring items.
【００１６】[0016]
【作用】上記構成により、不良監視項目における不良判
定基準には達しない警告基準との比較結果に基づいて設
備条件および基板の品質を分析し、この分析結果に基づ
いてモニタ出力するとともに、印刷手段、部品装着手段
および半田付手段のうち少なくとも何れかに動作制御指
示を出力して動作状態を動的に変えて良品生産させるよ
うに制御するので、各監視項目の検査値が不良判定基準
に達するまでに各工程の異常が事前に発見されて、各工
程に対して事前に対策指示が可能となり、これにより不
良発生が未然に食い止められ良品が無駄なく生産される
とともに製品品質の堅固な信頼性が実現する。With the above structure, the equipment condition and the quality of the board are analyzed based on the result of comparison with the warning standard that does not reach the failure determination standard in the failure monitoring item, and the monitor output based on the analysis result and the printing means. Since the operation control instruction is output to at least one of the component mounting means and the soldering means so as to dynamically change the operation state so as to produce a good product, the inspection value of each monitoring item reaches the defect judgment standard. By this time, abnormalities in each process can be detected in advance, and countermeasure instructions can be given in advance to each process, which prevents defects from occurring and produces good products without waste, and solid reliability of product quality. Will be realized.
【００１７】また、検出結果が警告領域にある場合に、
監視項目の検出工程よりも下流工程の設備に対して動作
制御指示を出力し基板が下流工程の設備に到達するまで
に下流工程の設備の動作状態を動的に変えて良品生産さ
せる制御、および、監視項目の検出工程を含む、検出工
程よりも上流工程の設備に対して動作制御指示を出力し
上流工程の設備の動作状態を動的に変えて良品生産させ
る制御のうち少なくとも何れかの制御をすることができ
るので、警告基準を越えてしまった監視項目に対しても
不良判定基準を越えないように下流工程に対して対策指
示が可能となり、また、監視項目の検出工程を含む、検
出工程よりも上流工程の設備に対して監視項目の警告領
域にならないように対策指示が可能となって、不良発生
が未然に食い止められ良品が無駄なく生産されるととも
に製品品質の堅固な信頼性が実現する。When the detection result is in the warning area,
Control to output an operation control instruction to the equipment in the downstream process rather than the detection process of the monitoring item and dynamically change the operation state of the equipment in the downstream process until the board reaches the equipment in the downstream process, and At least one of the controls that outputs an operation control instruction to the equipment in the upstream process including the detection process of the monitoring item and dynamically changes the operating state of the equipment in the upstream process to produce a good product. Therefore, it is possible to instruct countermeasures to downstream processes so as not to exceed the defect judgment standard even for the monitoring items that have exceeded the warning standard. It is possible to instruct countermeasures so that the equipment in the upstream process rather than the process does not fall into the warning area of the monitoring item, the occurrence of defects is stopped in advance, good products are produced without waste, and product quality is robust. Reliability can be realized.
【００１８】さらに、監視項目の警告基準との比較結果
に基づいて設備条件および基板の品質を分析するととも
に、この分析結果に基づいて監視項目の不良要因に関連
する各工程間の相関を分析して印刷手段、部品装着手段
および半田付手段のうち少なくとも何れかに動作制御指
示を出力して動作状態を動的に変えて良品生産させるよ
うに制御するので、高密度実装における不良要因は複雑
に関連しており、設備および基板の状態把握を、たとえ
ば検査結果の集計分析や時系列推移分析や品質分布分析
などの分析だけではなく、不良要因に関連する各工程相
互の相関分析など多様な角度からの分析で真の不良原因
の把握が即座に可能となり、監視項目の不良原因に応じ
た的確な対策指示が同時に可能となる。また、これらの
品質データをデータベース化すれば任意の期間指定して
品質動向の分析や品質履歴の管理なども容易に可能とな
る。Further, the equipment condition and the quality of the board are analyzed based on the result of comparison with the warning standard of the monitoring item, and the correlation between each process related to the failure factor of the monitoring item is analyzed based on the analysis result. The operation control instruction is output to at least one of the printing unit, the component mounting unit, and the soldering unit to dynamically change the operating state so as to produce a non-defective product. Related to grasping the status of equipment and boards, not only analysis such as total analysis of inspection results, time series analysis and quality distribution analysis, but also various angles such as correlation analysis between processes related to defect factors. The real cause of the defect can be immediately grasped by the analysis from, and the corrective countermeasure instruction according to the cause of the defect of the monitoring item can be simultaneously performed. Further, if these quality data are stored in a database, it is possible to easily analyze the quality trend and manage the quality history by designating an arbitrary period.
【００１９】さらに、監視項目に対する警告基準との比
較結果、または複数監視項目の組み合わせに対する警告
基準との比較結果により警告を要する工程の設備に対し
てメンテナンス指示を知らせるので、事前の確実な品質
管理が可能となる。Further, the maintenance instruction is notified to the equipment of the process requiring the warning by the result of comparison with the warning standard for the monitoring item or the result of comparison with the warning standard for the combination of a plurality of monitoring items, so that reliable quality control in advance can be performed. Is possible.
【００２０】[0020]
【実施例】以下、本発明の一実施例について図面を参照
しながら説明する。なお、従来例と同一の作用効果を奏
するものには同一の符号を付してその説明を省略する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. It should be noted that components having the same effects as those of the conventional example are designated by the same reference numerals and the description thereof will be omitted.
【００２１】図１は本発明の一実施例の実装基板生産シ
ステムの構成を示すブロック図である。図１において、
クリーム半田印刷検査機５が接続される印刷データ保持
部21は、ランド上に印刷したクリーム半田の印刷状態の
監視項目、たとえば、印刷カスレ、印刷ずれおよび印刷
半田の有無などのデータを収集して保持し、また、基板
および印刷設備に対する監視項目、たとえば、基板マー
クずれ量やスクリーンマークずれ量などのデータを収集
して保持する。この印刷データ保持部21が接続される印
刷データ分析部22は、印刷データ保持部21で収集された
各監視項目のデータを、監視項目別、回路番号別、設備
別などに集計分析および時系列分析などの分析をし、こ
の分析結果における、予め設定された監視項目に対す
る、不良判定基準には達しない警告基準との比較結果に
基づいて印刷設備としてのクリーム半田印刷機４の状
態、およびクリーム半田印刷機４を通過した回路基板の
品質状態を把握する。この印刷データ分析部22はクリー
ム半田印刷機４に接続され、クリーム半田印刷機４の状
態、およびクリーム半田印刷機４を通過した回路基板の
品質状態に応じて、クリーム半田印刷機４に対して動作
制御指示を出力して動作状態を動的に変えて良品生産さ
せるように制御する。FIG. 1 is a block diagram showing the configuration of a mounting board production system according to an embodiment of the present invention. In FIG.
The print data holding unit 21 to which the cream solder printing inspection machine 5 is connected collects monitoring items of the printing state of the cream solder printed on the land, for example, data such as print blur, print misalignment, and the presence or absence of print solder. It also holds and collects and holds monitoring items for the board and printing equipment, such as data such as board mark deviation and screen mark deviation. The print data analysis unit 22 to which the print data storage unit 21 is connected collects and analyzes the data of each monitoring item collected by the print data storage unit 21 by monitoring item, circuit number, equipment, etc. Analysis such as analysis is performed, and based on the result of comparison with a warning criterion that does not reach the defect criterion with respect to a preset monitoring item in the analysis result, the state of the cream solder printing machine 4 as the printing facility, and the cream. The quality state of the circuit board that has passed through the solder printer 4 is grasped. The print data analysis unit 22 is connected to the cream solder printing machine 4, and depending on the state of the cream solder printing machine 4 and the quality state of the circuit board that has passed through the cream solder printing machine 4, An operation control instruction is output to dynamically change the operation state so that a non-defective product is produced.
【００２２】また、部品装着後検査機８が接続される装
着データ保持部23は、装着機７により装着された部品装
着状況の監視項目、たとえば、部品欠品、部品立ち、部
品装着位置ずれおよび部品装着極性ミスなどのデータを
収集して保持し、また、装着設備に対する監視項目、た
とえば、吸着ノズルの吸着エラーおよび認識エラーなど
のデータを収集して保持する。この装着データ保持部23
が接続される装着データ分析部24は、装着データ保持部
23で収集された各監視項目のデータを、監視項目別、回
路番号別、設備別などに集計分析および時系列分析など
の分析をし、この分析結果における、予め設定された監
視項目に対する警告基準との比較結果に応じて装着機７
の状態、および装着機７を通過した回路基板の品質状態
を把握する。この装着データ分析部24は装着機７に接続
され、装着機７の状態、および装着機７を通過した回路
基板の品質状態に応じて、装着機７に対して動作制御指
示を出力して動作状態を動的に変えて良品生産させるよ
うに制御する。Further, the mounting data holding section 23 to which the post-component mounting inspection machine 8 is connected has a monitoring item of the mounting state of the components mounted by the mounting machine 7, for example, component missing, component standing, component mounting position deviation and Data such as component mounting polarity mistakes is collected and held, and monitoring items for the mounting equipment, for example, data such as suction error and recognition error of the suction nozzle are collected and held. This mounting data holding unit 23
The attachment data analysis unit 24 connected to
The data of each monitoring item collected in 23 is analyzed by monitoring item, circuit number, equipment, etc. such as aggregation analysis and time series analysis, and the warning criteria for the preset monitoring item in this analysis result. Depending on the result of comparison with
And the state of quality of the circuit board that has passed through the mounting machine 7. The mounting data analysis unit 24 is connected to the mounting machine 7 and outputs an operation control instruction to the mounting machine 7 in accordance with the state of the mounting machine 7 and the quality state of the circuit board that has passed through the mounting machine 7. Control to dynamically change the state to produce good products.
【００２３】さらに、半田付検査機11が接続される半田
付データ保持部25は、回路基板上の部品の半田付け状態
の監視項目、たとえば、部品欠品、部品立ち、部品装着
位置ずれおよび部品装着極性ミスなどのデータを収集し
て保持し、また、リフロー設備に対する監視項目、たと
えば、ヒータ温度、コンベア速度および酸素濃度などの
データを収集して保持する。この半田付データ保持部25
が接続される半田付データ分析部26は、半田付データ保
持部25で収集された各監視項目のデータを、監視項目
別、回路番号別、設備別などに集計分析および時系列分
析などの分析をし、この分析結果における、予め設定さ
れた監視項目に対する警告基準との比較結果に応じてリ
フロー炉10の状態、およびリフロー炉10を通過した回路
基板の品質状態を把握する。この半田付データ分析部26
はリフロー炉10に接続され、リフロー炉10の状態、およ
びリフロー炉10を通過した回路基板の品質状態に応じ
て、リフロー炉10に対して動作制御指示を出力して動作
状態を動的に変えて良品生産させるように制御する。Further, the soldering data holding unit 25 to which the soldering inspection machine 11 is connected monitors the soldering state of the components on the circuit board, such as component missing, component standing, component mounting position deviation and component. Data such as a mounting polarity error is collected and held, and monitoring items for the reflow equipment, for example, data such as heater temperature, conveyor speed and oxygen concentration are collected and held. This soldering data holding unit 25
The soldering data analysis unit 26 to which is connected analyzes the data of each monitoring item collected by the soldering data holding unit 25 by monitoring item, circuit number, equipment, etc. such as aggregate analysis and time series analysis. Then, the state of the reflow furnace 10 and the quality state of the circuit board that has passed through the reflow furnace 10 are grasped according to the result of comparison with the warning standard for the preset monitoring item in this analysis result. This soldering data analysis unit 26
Is connected to the reflow furnace 10, and outputs an operation control instruction to the reflow furnace 10 to dynamically change the operation state according to the state of the reflow furnace 10 and the quality state of the circuit board that has passed through the reflow furnace 10. Control to produce good products.
【００２４】さらに、これら印刷データ分析部22、装着
データ分析部24および半田付データ分析部26が接続され
る相関分析部27はクリーム半田印刷機４、装着機７およ
びリフロー炉の各設備機器に接続され、印刷データ分析
部22、装着データ分析部24および半田付データ分析部26
からの各種分析データおよび分析結果により、監視項目
の不良要因に関連する各工程相互の相関を分析して、ク
リーム半田印刷機４、装着機７およびリフロー炉10のう
ち少なくとも何れかに動作制御指示を出力して動作状態
を動的に変えて良品生産させるように制御する。Further, the correlation analysis unit 27 to which the print data analysis unit 22, the mounting data analysis unit 24, and the soldering data analysis unit 26 are connected is installed in each equipment of the cream solder printing machine 4, the mounting machine 7, and the reflow furnace. Connected, print data analysis unit 22, mounting data analysis unit 24 and soldering data analysis unit 26
Based on various analysis data and analysis results from the above, the mutual correlation of each process related to the failure factor of the monitoring item is analyzed, and the operation control instruction is given to at least one of the cream solder printing machine 4, the mounting machine 7 and the reflow furnace 10. Is output to dynamically change the operating state and control to produce a good product.
【００２５】以上の印刷データ分析部22、装着データ分
析部24および半田付データ分析部26と、相関分析部27と
により制御手段28をコンピュータ構成し、監視項目に対
する警告基準との比較結果、または複数監視項目の組み
合わせに対する警告基準との比較結果により警告を要す
る工程の設備に対してメンテナンスの必要性を警報ブザ
ーや表示モニタなどで知らせるようにも制御する。ま
た、制御手段において、監視項目別、回路番号別、設備
別などに集計分析および時系列分析などの各種分析デー
タおよび分析結果、各工程相互の相関分析データは順次
データベース化され、必要なときに必要なデータを検索
してモニタ表示やコピーなどで見ることができる。The print data analysis unit 22, the mounting data analysis unit 24, the soldering data analysis unit 26, and the correlation analysis unit 27 constitute a control means 28 as a computer, and a comparison result with a warning standard for a monitoring item, or Based on the result of comparison with the warning criteria for the combination of multiple monitoring items, the equipment in the process requiring a warning is also informed by a warning buzzer or display monitor. Also, in the control means, various analysis data and analysis results such as aggregate analysis and time series analysis for each monitoring item, circuit number, equipment, etc., and correlation analysis data for each process are sequentially made into a database, and when necessary. You can search for the necessary data and view it on the monitor display or copy.
【００２６】上記構成により、以下、その動作を説明す
る。まず、クリーム半田印刷機４で基板のランド上にク
リーム半田を印刷し、次に、クリーム半田が印刷された
ランド上に装着機７でリードや電極が位置するように部
品を装着し、最後に、リフロー炉10でクリーム半田をリ
フローしてリードや電極と基板のランドを半田接合す
る。このようにして部品実装された回路基板が完成され
るが、クリーム半田印刷検査機５は、ランド上に印刷し
たクリーム半田の印刷状態の監視項目、たとえば、印刷
カスレ、印刷ずれおよび印刷半田の有無などを検査し、
また、基板および印刷設備に対する監視項目、たとえ
ば、基板マークずれ量やスクリーンマークずれ量などを
検査する。また、部品装着後検査機８は、装着機７によ
り装着された部品装着状況の監視項目、たとえば、部品
欠品、部品立ち、部品装着位置ずれおよび部品装着極性
ミスなどを検査し、また、部品装着設備に対する監視項
目、たとえば、吸着ノズルの吸着エラーおよび認識エラ
ーなどを検査する。さらに、半田付検査機11は、回路基
板上の部品の半田付け状態の監視項目、たとえば、部品
欠品、部品立ち、部品装着位置ずれおよび部品装着極性
ミスなどを検査し、また、リフロー設備に対する監視項
目、たとえば、ヒータ温度、コンベア速度および酸素濃
度などを検査する。With the above configuration, the operation will be described below. First, the cream solder printing machine 4 prints the cream solder on the land of the substrate, and then the mounting machine 7 mounts the components so that the leads and electrodes are located on the land where the cream solder is printed. , The reflow furnace 10 is used to reflow the cream solder and solder the leads or electrodes to the land of the substrate. In this way, the circuit board on which the components are mounted is completed, but the cream solder printing inspector 5 uses the cream solder printing inspector 5 to monitor the printing state of the cream solder printed on the land, for example, the presence of print scrapes, print misregistration, and print solder. And inspect
Also, the monitoring items for the board and the printing equipment, for example, the board mark deviation amount and the screen mark deviation amount are inspected. In addition, the post-component mounting inspection machine 8 inspects monitoring items of the component mounting state mounted by the mounting machine 7, for example, component missing, component standing, component mounting position deviation, component mounting polarity error, and the like. Inspection items for the installation equipment, such as suction error and recognition error of the suction nozzle, are inspected. Further, the soldering inspector 11 inspects a soldering condition of a component on a circuit board, for example, a component missing item, a component standing, a component mounting position deviation, a component mounting polarity error, and the like, and also for reflow equipment. Inspect monitoring items such as heater temperature, conveyor speed and oxygen concentration.
【００２７】さらに、クリーム半田印刷検査機５からの
検査データを印刷データ保持部21で収集して保持し、ま
た、部品装着後検査機８からの検査データを装着データ
保持部23で収集して保持し、さらに、半田付検査機11か
らの検査データを半田付データ保持部25で収集して保持
する。そして、印刷データ保持部21で収集された各監視
項目のデータを印刷データ分析部22で、また、装着デー
タ保持部23で収集された各監視項目のデータを装着デー
タ分析部24で、さらに、半田付データ保持部25で収集さ
れた各監視項目のデータを半田付データ分析部26で、監
視項目別、回路別、設備別などに集計分析および時系列
分析などの分析をそれぞれすることにより、予め設定さ
れた監視項目に対する警告基準との比較結果に応じて各
設備の状態、および各設備を通過した回路基板の品質状
態を把握する。Further, the inspection data from the cream solder printing inspection machine 5 is collected and held by the print data holding section 21, and the inspection data from the after-component mounting inspection machine 8 is collected by the mounting data holding section 23. The soldering data holding unit 25 collects and holds the inspection data from the soldering inspection machine 11. Then, the data of each monitoring item collected by the print data holding unit 21 is the print data analyzing unit 22, and the data of each monitoring item collected by the mounting data holding unit 23 is the mounting data analyzing unit 24. The data of each monitoring item collected by the soldering data holding unit 25, the soldering data analysis unit 26, by monitoring item, circuit, by equipment, etc., by performing analysis such as aggregate analysis and time series analysis, respectively. The state of each piece of equipment and the quality state of the circuit board that has passed through each piece of equipment are grasped according to the result of comparison with a warning standard for a preset monitoring item.
【００２８】ここで、印刷データ分析部22、装着データ
分析部24および半田付データ分析部26でそれぞれ集計分
析および時系列分析されるデータにおいては、図２に示
すように、不良品として判定するライン基準としての判
定基準の他に判定基準には至っていないが注意を要する
警告を出すためのＣＩＭ基準としての警告基準を設け、
監視項目の検査結果が警告基準を越えて警告領域に入っ
たかどうかを検出して、その監視項目が不良判定基準を
越えず警告領域を脱して正常領域に収まるように動作状
態を動的に事前に変えて良品生産させる。Here, as shown in FIG. 2, the data analyzed by the print data analysis unit 22, the mounting data analysis unit 24, and the soldering data analysis unit 26 are analyzed as tabulated and time-series, respectively, and are determined to be defective products. In addition to the judgment criteria as the line criteria, the warning criteria as the CIM criteria for issuing a warning that has not reached the judgment criteria, but requires attention, is provided.
Detects whether the inspection result of the monitoring item exceeds the warning standard and enters the warning area, and the operating status is dynamically set in advance so that the monitoring item does not exceed the failure judgment standard and exits the warning area and falls within the normal area. To produce good products.
【００２９】印刷工程において、たとえば、図３に回路
番号別の複数監視項目の半田欠けおよび半田ニジミにお
ける印刷検査エラー集計分析を示しており、これら半田
欠けおよび半田ニジミがそれぞれ警告基準に至ったエラ
ー件数に応じて、印刷検査エラー集計分析における警告
基準および判断基準を設定している。図３の場合は、最
も多い回路番号Ｎ４１３についても警告基準のエラー件
数には至っておらず、警告基準を越えた段階で各設備や
基板に対するメンテナンス指示として、スキージ圧力や
傾きなどのスキージチェック、ランド位置精度や平面度
などの基板（ＰＣＢ）チェックおよび、位置精度や押し
込み量チェックなどのスクリーンチェックなどを知らせ
る。また、図４に印刷半田位置ずれ（Ｘ方向）の検査計
測値時系列分析を示しており、警告基準を±0.1 ｍｍ、
判断基準を±0.2 ｍｍとし、検査計測値は正常領域に収
まっているが、警告基準の±0.1 ｍｍを越えた段階で各
設備や基板に対するメンテナンス指示としてスキージチ
ェック、基板チェックおよび温度チェックなどを知らせ
るとともに、印刷オフセット変更、スキージ圧力などの
印圧調整、スクリーンの目詰まりなどに対するクリーニ
ング動作実行などの印刷条件の修正をクリーム半田印刷
機４に対して行い、検査計測値が正常領域に収まるよう
に動作状態を動的に事前に変えて良品生産させる。In the printing process, for example, FIG. 3 shows a print inspection error tabulation analysis of solder missing and solder blemishes of a plurality of monitoring items for each circuit number. Depending on the number of cases, warning criteria and judgment criteria are set in the print inspection error aggregation analysis. In the case of FIG. 3, the number of errors for the most frequent circuit number N413 has not reached the warning standard, and when the warning standard is exceeded, squeegee checks such as squeegee pressure and inclination are performed as a maintenance instruction for each equipment and board, and land. Notify the board (PCB) check such as position accuracy and flatness, and screen check such as position accuracy and push amount check. In addition, Fig. 4 shows the time series analysis of the inspection measurement values of the print solder misalignment (X direction). The warning standard is ± 0.1 mm,
The judgment standard is ± 0.2 mm, and the inspection measurement value is within the normal range, but when the warning standard exceeds ± 0.1 mm, squeegee check, board check, and temperature check are issued as maintenance instructions for each equipment and board. At the same time, the print soldering machine 4 is modified such that the printing offset is changed, the printing pressure is adjusted such as the squeegee pressure, and the cleaning operation is performed for the screen clogging so that the inspection measurement value falls within the normal range. Dynamically change the operating state in advance to produce a good product.
【００３０】また、装着工程において、たとえば、図５
にノズル別の複数監視項目の未吸着、立ち吸着、回転吸
着、認識エラーおよび認識異常のエラー集計分析を示し
ており、これら未吸着、立ち吸着、回転吸着、認識エラ
ーおよび認識異常がそれぞれ警告基準に至ったエラー件
数に応じて、エラー集計分析における警告基準および判
断基準を設定している。図５の場合、ノズルＮｏ．４，
５，８が警告基準のエラー件数を越えており、各設備に
対するメンテナンス指示としてノズル清浄チェックおよ
びカセットチェックなどを知らせるとともに、ノズルへ
の半田吸引などによるフィルタ目詰まりに対するフィル
タ交換、およびノズルクリーニングなどを装着機７に対
して行う。また、図６に部品装着位置ずれ（Ｘ方向）の
検査計測値時系列分析を示しており、警告基準を±0.2
ｍｍ、判断基準を±0.38ｍｍとし、検査計測値は正常領
域に収まっているが、警告基準の±0.2 ｍｍを越えた段
階で各設備に対するメンテナンス指示として、基板穴に
嵌合して位置決めする基準ピンのチェックおよびノズル
清浄チェックなどを知らせるとともに、装着位置ＮＣデ
ータにおけるデータオフセット修正などのずれ量の補正
を装着機７に対して行い、検査計測値が正常領域に収ま
るように動作状態を動的に事前に変えて良品生産させ
る。In the mounting process, for example, as shown in FIG.
Shows the non-adsorption, standing adsorption, rotary adsorption, recognition error and recognition error error analysis of multiple monitoring items for each nozzle. These non-adsorption, standing adsorption, rotation adsorption, recognition error and recognition error are warning criteria respectively. The warning criteria and judgment criteria in the error aggregation analysis are set according to the number of errors that reached. In the case of FIG. 4,
5 and 8 exceed the number of errors of the warning standard, and notify nozzle cleaning check and cassette check as maintenance instructions to each equipment, and also perform filter replacement for nozzle clogging due to suction of solder to the nozzle and nozzle cleaning. This is done for the mounting machine 7. In addition, Fig. 6 shows the time series analysis of the inspection measurement value of the component mounting position deviation (X direction).
mm, the judgment standard is ± 0.38 mm, and the inspection measurement value is within the normal range, but when it exceeds the warning standard ± 0.2 mm, it is a standard for fitting and positioning the board hole as a maintenance instruction for each facility. In addition to notifying the pin check and nozzle cleaning check, etc., correction of the deviation amount such as data offset correction in the mounting position NC data is performed on the mounting machine 7, and the operation state is dynamically changed so that the inspection measurement value falls within the normal range. Change in advance to produce good products.
【００３１】さらに、半田付工程であるリフロー工程に
おいて、たとえば、図７に回路番号別の複数監視項目に
おける部品高さ低、右回転ずれ、左回転ずれ、ブリッジ
不良およびエッジ検出不良の半田付検査エラー集計分析
を示しており、これら部品高さ低、右回転ずれ、左回転
ずれ、ブリッジ不良およびエッジ検出不良がそれぞれ警
告基準に至ったエラー件数に応じて、半田付検査エラー
集計分析における警告基準および判断基準を設定してい
る。図７の場合、最も多い回路番号Ｎ４１３は警告基準
のエラー件数を越えており、各設備に対するメンテナン
ス指示として半田チェック、基板チェックおよび、炉の
温度分布のプロファイルチェックなどを知らせるととも
に、ヒータ温度変更、コンベアスピードおよび、半田付
性に影響するＮ2 量（Ｏ2 濃度）増減などのリフロー条
件の修正をリフロー炉10に対して行う。また、図８に半
田付後検査の部品位置ずれ（Ｘ方向）の検査計測値時系
列分析を示しており、警告基準を±0.1 ｍｍ、判断基準
を±0.2 ｍｍとし、検査計測値は警告基準を＋0.1 ｍｍ
を越えており、メンテナンス指示としてプロファイルチ
ェック、基板チェックおよび半田チェックなどを知らせ
るとともに、ヒータ温度変更などのリフロー条件の修正
をリフロー炉10に対して行い、検査計測値が正常領域に
収まるように動作状態を動的に事前に変えて良品生産さ
せる。Further, in a reflow process which is a soldering process, for example, a soldering inspection for low component height, right rotation deviation, left rotation deviation, bridge failure and edge detection failure in a plurality of monitoring items for each circuit number in FIG. The error aggregation analysis is shown. The warning standard in the soldering inspection error aggregation analysis is shown according to the number of errors in which the height of these parts, the right rotation deviation, the left rotation deviation, the bridge failure, and the edge detection failure each reach the warning criteria. And the judgment standard is set. In the case of FIG. 7, the most frequent circuit number N413 exceeds the number of errors of the warning standard, and as a maintenance instruction for each equipment, a solder check, a board check, a furnace temperature distribution profile check, etc. are notified, and a heater temperature change, The reflow furnace 10 is corrected for the reflow conditions such as the increase and decrease of the N 2 amount (O 2 concentration) that affects the conveyor speed and the solderability. Fig. 8 shows the time series analysis of the inspection measurement value of the component position deviation (X direction) of the inspection after soldering. The warning standard is ± 0.1 mm, the judgment standard is ± 0.2 mm, and the inspection measurement value is the warning standard. To +0.1 mm
In addition to notifying the profile check, board check, solder check, etc. as a maintenance instruction, the reflow condition such as the heater temperature change is corrected to the reflow furnace 10 so that the inspection measurement value falls within the normal range. Dynamically change the state in advance to produce a good product.
【００３２】さらに、相関分析部27は、印刷データ分析
部22、装着データ分析部24および半田付データ分析部26
からの分析データに基づいて各監視項目の不良要因に関
連する各工程相互の相関を相関分析して、クリーム半田
印刷機４、装着機７およびリフロー炉10のうち少なくと
も何れかに動作制御指示を出力して動作状態を動的に変
えて良品生産させるように制御する。Further, the correlation analysis unit 27 includes a print data analysis unit 22, a mounting data analysis unit 24, and a soldering data analysis unit 26.
Correlation analysis is performed on each process related to the cause of failure of each monitoring item based on the analysis data from, and an operation control instruction is given to at least one of the cream solder printing machine 4, the mounting machine 7 and the reflow oven 10. The output is controlled and the operating state is dynamically changed to control to produce a good product.
【００３３】すなわち、監視項目として、たとえば、チ
ップ立ち不良について各工程間の相関を説明すると、リ
フロー工程において、加熱スピードを上げると急激に半
田温度が上昇する。このとき、半田印刷ずれや部品装着
ずれがあると、図９に示すようにチップ部品29の端子30
は半田31の印刷位置に対してずれた状態で置かれてお
り、急激な半田温度の変化で容積の小さい側が先に溶け
るので、端子30が表面張力で引っ張られてチップ立ちの
状態となる。このように、チップ立ち不良の要因は、図
10の不良要因図に概略示すように、半田印刷工程、部品
装着工程さらにリフロー工程の全てに要因がある。しか
し、チップ立ち不良が検査工程で検出されるのは、部品
が装着される必要があるためリフロー工程においてであ
る。したがって、監視項目としてのチップ立ち不良はリ
フロー工程の検査において行われ、チップ立ちに対する
印刷工程、装着工程さらにリフロー工程の各設備へのア
クションは、印刷工程では印刷ずれや印刷厚さなどの改
善、装着工程では装着ずれや押し込み量などの改善、さ
らにリフロー工程では加熱スピードや風速などを弱める
など、相関分析部27で不良要因に関連する各工程相互の
相関を分析して印刷工程、装着工程さらにリフロー工程
の各設備に対して動作制御指示を出力し動作状態を動的
に事前に変えて良品生産するように制御する。That is, as a monitoring item, for example, the correlation between the respective steps regarding chip failure will be described. In the reflow step, the solder temperature rises rapidly when the heating speed is increased. At this time, if there is a solder printing deviation or a component mounting deviation, as shown in FIG.
Is placed in a state of being displaced from the printing position of the solder 31, and the side having a small volume is melted first due to a rapid change in solder temperature, so that the terminal 30 is pulled by the surface tension to be in a chip standing state. In this way, the cause of chip failure is
As outlined in the figure 10 of defect factors, there are factors in all of the solder printing process, component mounting process, and reflow process. However, the chip standing failure is detected in the inspection process only in the reflow process because it is necessary to mount components. Therefore, the chipping failure as a monitoring item is performed in the inspection of the reflow process, and the action to each equipment of the printing process, the mounting process and the reflow process for the chip standing is to improve the print misalignment and the printing thickness in the printing process, In the mounting process, the misalignment and pushing amount are improved, and in the reflow process, the heating speed and the wind speed are weakened, etc. An operation control instruction is output to each facility in the reflow process to dynamically change the operating state in advance so that a non-defective product is produced.
【００３４】また逆に、印刷工程で検出結果が警告領域
にある場合、たとえば印刷ずれの警告基準を越えていれ
ば、この検出工程よりも下流工程の装着工程さらにリフ
ロー工程において基板が下流工程の設備に到達するまで
にチップ立ちの危険がないようにその印刷ずれの方向や
量に応じて、チップ立ちの要因分析図で示した要因とは
逆の改善処置を実行し、印刷工程で印刷ずれの警告基準
を越えた基板をチップ立ち不良から守り、かつ、印刷工
程においても次の基板のために印刷ずれの方向や量に応
じて改善処置を実行する。On the contrary, when the detection result in the printing process is in the warning region, for example, if the warning standard of the printing deviation is exceeded, the mounting process in the downstream process from the detection process and the substrate in the downstream process in the reflow process are performed. Depending on the direction and amount of print misalignment so that there is no danger of chipping before reaching the equipment, improvement measures opposite to those shown in the factor analysis chart of chip standing are executed, and print misalignment occurs in the printing process. The board exceeding the warning standard of No. 1 is protected from the chip standing defect, and the improvement process is executed for the next board in the printing process depending on the direction and amount of the print misalignment.
【００３５】さらに、印刷データ分析部22、装着データ
分析部24および半田付データ分析部26において、監視項
目別、回路別、設備別など各別に各監視項目のデータ集
計分析、時系列分析、さらに図11に示す検査計測値分布
分析（この場合部品装着位置ずれ分布）など分析した分
析結果と、この分析結果に基づいて、相関分析部27にお
いて、監視項目の不良要因に関連する各工程間の相関を
分析する相関分析結果とは、生産と同時にデータベース
化されて何時でもモニタ表示したり表示箇所をコピーし
たりすることができ、任意の期間指定して品質動向の分
析や品質履歴の分析、さらに品質の源流分析など多様な
角度からの各種分析で真の不良原因の把握が即座に可能
となる。Further, in the print data analysis unit 22, the mounting data analysis unit 24, and the soldering data analysis unit 26, the data tabulation analysis, time series analysis, Based on the analysis results such as the inspection measurement value distribution analysis (parts mounting position deviation distribution in this case) shown in FIG. 11, and the correlation analysis unit 27 based on the analysis results, between the processes related to the failure factor of the monitoring item. Correlation analysis results are stored in the database at the same time as production, and can be displayed on the monitor or copied at any time.Any time period can be specified, analysis of quality trends and analysis of quality history, Furthermore, it is possible to immediately understand the true cause of defects by various analyzes from various angles such as quality source analysis.
【００３６】図12および図13は図１の実装基板生産シス
テムの構成図である。図12および図13において、回路基
板の移送ラインに沿ってその上手側からクリーム半田印
刷機４、クリーム半田印刷検査機５、装着機７，７、部
品装着後検査機８、リフロー機10、半田検査機11が順次
配設されている。これら各設備と設備監視部41とがネッ
トワークされており、矢印41ａに示すように各検査結果
データや実装データなどが設備監視部41に入力され、ま
た、矢印41ｂに示すように実装データや補正データなど
が各設備に対して出力される。この設備監視部41では生
産計画41ｃ、生産実績41ｄおよび部品在庫管理41ｅなど
がモニタ表示されて必要ポイントなどが指示される。12 and 13 are block diagrams of the mounting board production system of FIG. 12 and 13, cream solder printing machine 4, cream solder printing inspection machine 5, mounting machines 7, 7, component after-inspection machine 8, reflow machine 10, solder along the transfer line of the circuit board The inspection machines 11 are sequentially arranged. These facilities and the facility monitoring unit 41 are networked, each inspection result data and mounting data are input to the facility monitoring unit 41 as shown by an arrow 41a, and the mounting data and correction data are corrected as shown by an arrow 41b. Data etc. are output to each equipment. In the equipment monitoring unit 41, the production plan 41c, the production record 41d, the parts inventory management 41e, etc. are displayed on the monitor, and necessary points are instructed.
【００３７】さらに、これら各設備および設備監視部41
とネットワークされるＣＩＭステーション42には、制御
手段28とプリント基板ＣＡＭシステム43が設けられ、装
着機重視でＮＣデータ（生産設計データ）通信され、24
時間ライン監視されて品質情報分析（自己診断およびモ
ニタリング）される。この制御手段28は、印刷データ28
ａ、認識データ28ｂ、速度設定データ28ｃおよび品質管
理データ28ｄなどにより不良判定基準には達しない警告
基準との比較結果に基づいて品質分析および統計評価
し、その品質分析および統計評価結果をモニタ出力する
とともに、各設備のうち少なくとも何れかに動作制御指
示を出力して動作状態を動的に変えて良品生産させるよ
うに制御する。また、この品質分析および統計評価結果
などはデータベース化される。また、プリント基板ＣＡ
Ｍシステム43では実装順序や半田付熱解析シュミレーシ
ョンなど生産設計がなされる。Furthermore, each of these facilities and facility monitoring unit 41
The control means 28 and the printed circuit board CAM system 43 are provided in the CIM station 42 that is networked with the network, and NC data (production design data) is communicated with emphasis on the mounting machine.
Time line monitoring and quality information analysis (self-diagnosis and monitoring). The control means 28 controls the print data 28.
a, recognition data 28b, speed setting data 28c, quality control data 28d, etc. are used to perform quality analysis and statistical evaluation based on the result of comparison with a warning standard that does not reach the defect determination standard, and the quality analysis and statistical evaluation results are output to a monitor. At the same time, an operation control instruction is output to at least one of the facilities to dynamically change the operation state so that a non-defective product is produced. The quality analysis and statistical evaluation results are stored in a database. In addition, the printed circuit board CA
In the M system 43, production design such as mounting order and thermal analysis of soldering is performed.
【００３８】さらに、これら各設備、設備監視部41およ
びＣＩＭステーション42と設計部門44および生産管理部
門45などがネットワークされ、必要なときに必要な場所
で品質分析および統計評価された情報が得られる。すな
わち、超合理化でＭＴＭ（マニュファクチュア、トータ
ル、マネージメント）リンクで実装工場（ミックス生
産）と、受発注、設計および生産管理部門などの事業部
との効率的な情報伝達によりトータル管理可能な良品生
産実装システムが得られる。Furthermore, each of these facilities, the facility monitoring unit 41, the CIM station 42, the design department 44, the production management department 45, etc. are networked, and information obtained by quality analysis and statistical evaluation can be obtained when and where necessary. . In other words, by super rationalization, the MTM (manufacture, total, management) link implements the factory (mixed production) and the production management that allows total management through efficient communication of information between business units such as ordering, design and production control departments. The system is obtained.
【００３９】したがって、経験的にこういうふうになっ
てくると、次には不良となるといったことを、警告基準
を設けて数値により明確にする品質の警告領域の管理に
より、各監視項目の検査値が不良判定基準に達するまで
に各工程に対する注意事項を工程のささいな変化も見逃
さず事前に発見することができるため、不良にならない
うちに各工程に対して事前に対策指示することができて
良品を無駄なく生産することができる。Therefore, the inspection value of each monitoring item is managed by managing the warning area of the quality, which makes it clear numerically by setting a warning standard that empirically such a situation will cause the next failure. Since it is possible to detect precautions for each process in advance before reaching the defect judgment standard without overlooking even minor changes in the process, it is possible to give advance instructions to each process before it becomes defective. Good products can be produced without waste.
【００４０】なお、本実施例の相関分析では、マンハッ
タンと言われるチップ立ち不良について説明したが、図
14に示すように半田ブリッジや部品位置ずれなど幾つも
の不良監視項目があり、要は不良要因分析で各工程にア
クション可能な不良監視項目であれば相関分析の対象と
なる。図14の（第１）は不良判定基準、（第２）は警告
基準による判定を示しており、（第２）に示す警告基準
による判定で改善指示を行っていれば、半田付検査にお
いて（第１）に示すブリッジ、ずれ、マンハッタンなど
の不良を食い止めることができる。また、本実施例で
は、半田印刷工程、部品装着工程さらにリフロー工程の
３工程それぞれに対する設備および基板の所定監視項目
を検出し、この検出結果により各設備の条件および基板
の品質を分析するとともに、この分析結果に基づいて印
刷手段、部品装着手段およびリフロー手段の３工程それ
ぞれに対して動作制御指示を出力するうようにしたが、
半田印刷工程、部品装着工程さらにリフロー工程の３工
程のうち任意の２工程に対して所定監視項目を検出して
もよく、また、３工程のうち任意の１工程に対して所定
監視項目を検出してもよく、また、不良要因分析上必要
な何れかの工程に対して動作制御指示を出力すればよ
い。In the correlation analysis of this embodiment, a chip standing defect called Manhattan has been described.
As shown in FIG. 14, there are a number of defect monitoring items such as solder bridges and component misalignment, and the point is that any defect monitoring item that can be acted on in each process in defect factor analysis will be subject to correlation analysis. In FIG. 14, (first) shows a defect judgment standard, (second) shows a warning standard, and if the improvement instruction is given by the warning standard judgment shown in (2), in the soldering inspection ( It is possible to prevent defects such as bridges, gaps, and Manhattan shown in 1). Further, in this embodiment, the predetermined monitoring items of the equipment and the board for each of the three steps of the solder printing step, the component mounting step, and the reflow step are detected, and the condition of each equipment and the quality of the board are analyzed based on the detection result. Based on the analysis result, the operation control instruction is output to each of the three processes of the printing unit, the component mounting unit, and the reflow unit.
The predetermined monitoring item may be detected for any two of the three steps of the solder printing step, the component mounting step, and the reflow step, and the predetermined monitoring item may be detected for any one of the three steps. Alternatively, the operation control instruction may be output to any of the steps necessary for the failure factor analysis.
【００４１】[0041]
【発明の効果】以上のように本発明によれば、品質の警
告領域の管理により、各監視項目の検査値が不良判定基
準に達するまでに各工程の異常を事前に発見することが
できるため、各工程に対して事前に対策指示することが
できて、不良発生を未然に食い止めて良品を無駄なく生
産するとともに製品品質の堅固な信頼性を得ることがで
きるものである。As described above, according to the present invention, by managing the quality warning area, it is possible to detect an abnormality in each process in advance before the inspection value of each monitoring item reaches the defect judgment standard. It is possible to instruct countermeasures in advance for each process, prevent defects from occurring, produce good products without waste, and obtain solid reliability of product quality.
【００４２】また、監視項目の警告基準との比較結果に
基づいて設備条件および基板の品質を分析し、この分析
結果に基づいて監視項目の不良要因に関連する各工程間
の相関を分析することにより、設備および基板の状態把
握を不良要因に関連する他の工程にまたがった対策指示
をすることができるため、不良要因に関連した複雑な不
良原因の源流把握をより正確に即座にすることができる
とともに、監視項目の不良原因に応じた的確な対策指示
を同時にすることできる。Further, the equipment condition and the quality of the board are analyzed based on the result of comparison with the warning standard of the monitoring item, and the correlation between each process related to the failure factor of the monitoring item is analyzed based on the analysis result. This makes it possible to identify the condition of the equipment and the board so that countermeasures can be given across other processes related to the failure factor, so that the source flow of the complicated failure cause related to the failure factor can be more accurately and immediately. At the same time, it is possible to give an appropriate countermeasure instruction at the same time according to the cause of the defect in the monitoring item.
【００４３】さらに、監視項目に対する警告基準との比
較結果、または複数監視項目の組み合わせに対する警告
基準との比較結果によるメンテナンス指示により、警告
を要する工程設備に対しても条件悪化の前に的確な改善
処置をすることができる。Further, by the maintenance instruction based on the comparison result with the warning standard for the monitoring item or the comparison result with the warning standard for the combination of a plurality of monitoring items, the process equipment requiring the warning can be properly improved before the condition is deteriorated. Can be treated.
【図１】本発明の一実施例の実装基板生産システムの構
成を示すブロック図FIG. 1 is a block diagram showing a configuration of a mounting board production system according to an embodiment of the present invention.
【図２】検査計測値のずれ量に対する警告領域を含む各
領域を示す分布図FIG. 2 is a distribution chart showing each area including a warning area for the deviation amount of the inspection measurement value.
【図３】図１の印刷データ分析部22における分析例の回
路番号別印刷エラー検査集計図とその分析例に対する動
作制御指示のメンテナンス指示内容を示す表示モニタ図FIG. 3 is a print error inspection tabulation diagram by circuit number of an analysis example in the print data analysis unit 22 of FIG. 1 and a display monitor diagram showing maintenance instruction contents of operation control instructions for the analysis example.
【図４】図１の印刷データ分析部22における分析例の半
田印刷位置ずれ時系列計測図とその分析例に対する動作
制御指示のメンテナンス指示内容およびフィードバック
指示内容を示す表示モニタ図FIG. 4 is a time-series measurement diagram of solder print position deviation of an analysis example in the print data analysis unit 22 of FIG. 1 and a display monitor diagram showing maintenance instruction content and feedback instruction content of operation control instructions for the analysis example.
【図５】図１の部品装着データ分析部24における分析例
のノズル番号別エラー集計図とその分析例に対する動作
制御指示のメンテナンス指示内容およびフィードバック
指示内容を示す表示モニタ図FIG. 5 is a view showing error summaries by nozzle number of an analysis example in the component mounting data analysis unit 24 of FIG. 1 and a display monitor diagram showing maintenance instruction contents and feedback instruction contents of operation control instructions for the analysis example.
【図６】図１の部品装着データ分析部24における分析例
の部品装着位置ずれ時系列計測図とその分析例に対する
動作制御指示のメンテナンス指示内容およびフィードバ
ック指示内容を示す表示モニタ図6 is a time-series measurement diagram of component mounting position deviation of an analysis example in the component mounting data analysis unit 24 of FIG. 1 and a display monitor diagram showing maintenance instruction content and feedback instruction content of operation control instructions for the analysis example.
【図７】図１の半田付データ分析部26における分析例の
回路番号別半田付エラー検査集計図とその分析例に対す
る動作制御指示のメンテナンス指示内容およびフィード
バック指示内容を示す表示モニタ図FIG. 7 is a diagram of a soldering error inspection tabulation by circuit number of an analysis example in the soldering data analysis unit 26 of FIG. 1, and a display monitor diagram showing maintenance instruction content and feedback instruction content of operation control instructions for the analysis example.
【図８】図１の半田付データ分析部26における分析例の
半田付後部品位置ずれ時系列計測図とその分析例に対す
る動作制御指示のメンテナンス指示内容およびフィード
バック指示内容を示す表示モニタ図8 is a time-series measurement diagram of component position deviation after soldering in an analysis example in the soldering data analysis unit 26 in FIG. 1, and a display monitor diagram showing maintenance instruction content and feedback instruction content of operation control instructions for the analysis example.
【図９】チップ立ち不良の状態図[Fig. 9] State diagram of chip standing defect
【図１０】チップ立ち不良の概略要因分析図FIG. 10 is a schematic factor analysis diagram of chip standing failure.
【図１１】警告領域およびＮＧ領域における部品装着位
置ずれの検査計測値分布分析図FIG. 11 is an inspection measurement value distribution analysis diagram of component mounting position deviations in the warning area and the NG area.
【図１２】図１の実装基板生産システムの構成図（その
１）FIG. 12 is a configuration diagram (part 1) of the mounting board production system of FIG.
【図１３】図１の実装基板生産システムの第２の構成図
（その２）13 is a second configuration diagram (part 2) of the mounting board production system of FIG.
【図１４】各工程間の相関分析図FIG. 14: Correlation analysis diagram between each process
【図１５】従来の実装基板生産システムの構成を示すブ
ロック図FIG. 15 is a block diagram showing a configuration of a conventional mounting board production system.
４ クリーム半田印刷機 ５ クリーム半田印刷検査機 ７ 装着機 ８ 部品装着後検査機 10 リフロー機 11 半田検査機 22 印刷データ分析部 24 装着データ分析部 26 半田付データ分析部 27 相関分析部 28 制御手段 29 チップ部品 30 端子 31 半田 42 ＣＩＭステーション 4 Cream solder printing machine 5 Cream solder printing inspection machine 7 Mounting machine 8 Parts mounting inspection machine 10 Reflow machine 11 Solder inspection machine 22 Print data analysis section 24 Mounting data analysis section 26 Soldering data analysis section 27 Correlation analysis section 28 Control means 29 Chip parts 30 Terminals 31 Solder 42 CIM station
───────────────────────────────────────────────────── フロントページの続き (72)発明者 益田 聖 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 兼松 宏一 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kiyoshi Masuda 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Koichi Kanematsu 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.
Claims (5)
と、前記印刷された半田の所定位置に部品を装着する部
品装着手段と、前記部品が装着された基板のランドと前
記部品の端子を半田接合する半田付手段とを有する実装
基板生産システムであって、前記印刷手段、部品装着手
段および半田付手段のうち少なくとも何れかに対する設
備および基板の所定監視項目を検出する監視項目検出手
段と、前記監視項目検出手段の検出結果により予め設定
された前記監視項目に対する、不良判定基準には達しな
い警告基準との比較結果に基づいて前記設備の条件およ
び基板の品質を分析する制御手段と、前記制御手段の分
析結果をモニタ出力するモニタ手段とを備えた実装基板
生産システム。1. A printing means for printing solder on a land of a substrate, a component mounting means for mounting a component at a predetermined position of the printed solder, a land of the substrate on which the component is mounted, and a terminal of the component. A mounting board production system having a soldering means for solder-joining, and a monitoring item detecting means for detecting a predetermined monitoring item of equipment and a board for at least one of the printing means, the component mounting means, and the soldering means. A control means for analyzing the condition of the equipment and the quality of the board based on a result of comparison with a warning criterion that does not reach a failure criterion, with respect to the monitoring item preset by the detection result of the monitoring item detecting means, A mounting board production system, comprising: a monitor that outputs the analysis result of the controller.
を分析した分析結果に基づいて印刷手段、部品装着手段
および半田付手段のうち少なくとも何れかに動作制御指
示を出力して動作状態を動的に変えて良品生産させるよ
うに制御する構成とした請求項１記載の実装基板生産シ
ステム。2. The control means outputs an operation control instruction to at least one of the printing means, the component mounting means, and the soldering means on the basis of the analysis result obtained by analyzing the condition of the equipment and the quality of the board, thereby determining the operation state. The mounting board production system according to claim 1, wherein the mounting board production system is configured so as to be dynamically changed to produce a non-defective product.
合に、監視項目の検出工程よりも下流工程の設備に対し
て動作制御指示を出力し基板が前記下流工程の設備に到
達するまでに前記下流工程の設備の動作状態を動的に変
えて良品生産させる制御、および、監視項目の検出工程
を含む前記検出工程よりも上流工程の設備に対して動作
制御指示を出力し前記上流工程の設備の動作状態を動的
に変えて良品生産させる制御のうち少なくとも何れかの
制御が可能な請求項１記載の実装基板生産システム。3. The control means, when the detection result is in the warning area, outputs an operation control instruction to equipment in a process downstream of the detection step of the monitoring item, until the substrate reaches the equipment in the downstream process. Control for dynamically changing the operating state of the equipment of the downstream process to produce a non-defective product, and outputting an operation control instruction to the equipment of the upstream process, including the detection process of the monitoring item, and outputting the upstream process. 2. The mounting board production system according to claim 1, wherein at least one of the controls for dynamically changing the operating state of the equipment to produce a non-defective product is possible.
結果に応じた設備および基板の分析結果に基づいて前記
監視項目の不良要因に関連する各工程相互の相関を分析
して印刷手段、部品装着手段および半田付手段のうち少
なくとも何れかに動作制御指示を出力して動作状態を動
的に変えて良品生産させるように制御する請求項１記載
の実装基板生産システム。4. The control means analyzes the mutual correlation between the processes related to the failure factor of the monitoring item based on the analysis result of the equipment and the board according to the result of comparison with the warning standard of the monitoring item, and the printing means. 2. The mounting board production system according to claim 1, wherein an operation control instruction is output to at least one of the component mounting means and the soldering means to control the operation state dynamically so as to produce a good product.
の比較結果、または複数監視項目の組み合わせに対する
警告基準との比較結果により警告を要する工程の設備に
対してメンテナンス指示を知らせるように制御する請求
項１記載の実装基板生産システム。5. The control means controls to notify a maintenance instruction to equipment of a process requiring a warning according to a comparison result with a warning standard for a monitoring item or a comparison result with a warning standard for a combination of a plurality of monitoring items. The mounting board production system according to claim 1.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26044992A JP3344739B2 (en) | 1992-09-30 | 1992-09-30 | Mounting board production system and mounting board production method |
| US08/129,604 US5564183A (en) | 1992-09-30 | 1993-09-30 | Producing system of printed circuit board and method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26044992A JP3344739B2 (en) | 1992-09-30 | 1992-09-30 | Mounting board production system and mounting board production method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06112295A true JPH06112295A (en) | 1994-04-22 |
| JP3344739B2 JP3344739B2 (en) | 2002-11-18 |
Family
ID=17348096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26044992A Expired - Lifetime JP3344739B2 (en) | 1992-09-30 | 1992-09-30 | Mounting board production system and mounting board production method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3344739B2 (en) |
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