JPH06112488A - Method of manufacturing insulating film and thin film transistor device using the same - Google Patents
Method of manufacturing insulating film and thin film transistor device using the sameInfo
- Publication number
- JPH06112488A JPH06112488A JP25955192A JP25955192A JPH06112488A JP H06112488 A JPH06112488 A JP H06112488A JP 25955192 A JP25955192 A JP 25955192A JP 25955192 A JP25955192 A JP 25955192A JP H06112488 A JPH06112488 A JP H06112488A
- Authority
- JP
- Japan
- Prior art keywords
- film
- insulating film
- electrode
- sinx
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Liquid Crystal (AREA)
- Formation Of Insulating Films (AREA)
- Thin Film Transistor (AREA)
Abstract
(57)【要約】
【目的】 大面積の基板を陽極酸化する場合に膜欠陥の
ない緻密な陽極酸化膜を得ることを目的とする。
【構成】 ガラス基板１の上に、Ａｌ：Ｓｉ膜を堆積
し、フォトリソグラフィとエッチングによりゲート電極
２を３０００Å形成する（図２ａ）。電極表面を酸素雰
囲気中で４００℃、５分間プラズマ処理することによ
り、電極表面を改質する（図２ｂ）。陽極酸化法により
Ａｌ2Ｏ3膜４を２０００Å形成する（図２ｃ）。P-CVD
法で第２のＳｉＮｘゲート絶縁膜５とａ−Ｓｉ半導体層
６とその上に設けられたチャンネルストッパ層ＳｉＮｘ
膜７を各々２０００Å，５００Å，１０００Åの厚さに
連続製膜する（図２ｄ）。ＳｉＮｘ膜７を選択的にエッ
チングし、チャンネルストッパ層とする（図２ｅ）。Ａ
ｌをスパッタリング法で形成した後、フォトリソグラフ
ィとエッチングにより、ソース電極８を形成する（図２
ｆ）。
(57) [Summary] [Objective] The purpose is to obtain a dense anodic oxide film without film defects when anodizing a large-area substrate. [Structure] An Al: Si film is deposited on a glass substrate 1, and a gate electrode 2 of 3000 Å is formed by photolithography and etching (FIG. 2a). The electrode surface is modified by plasma treatment at 400 ° C. for 5 minutes in an oxygen atmosphere (FIG. 2b). An Al 2 O 3 film 4 of 2000 Å is formed by anodization (FIG. 2c). P-CVD
Second SiNx gate insulating film 5, a-Si semiconductor layer 6 and channel stopper layer SiNx provided thereon
The film 7 is continuously formed to a thickness of 2000Å, 500Å and 1000Å respectively (Fig. 2d). The SiNx film 7 is selectively etched to form a channel stopper layer (FIG. 2e). A
After forming 1 by a sputtering method, the source electrode 8 is formed by photolithography and etching (FIG. 2).
f).
Description
【０００１】[0001]
【産業上の利用分野】本発明は液晶表示装置等に利用で
きる絶縁膜の製造方法及びこれを用いた薄膜トランジス
ター素子関し、特に、ゲート電極−ソース電極間の短絡
防止に好適なスイッチング素子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an insulating film that can be used in a liquid crystal display device and a thin film transistor element using the same, and more particularly to a switching element suitable for preventing a short circuit between a gate electrode and a source electrode.
【０００２】[0002]
【従来の技術】非晶質シリコン薄膜トランジスタ（以下
ａ−ＳｉＴＦＴと略する）は、ガラスや石英などの絶縁
性基板上にＡｌからなるゲート電極と、この上にＡｌを
陽極酸化することによって形成されたゲート絶縁膜とP-
CVDで形成したＳｉＮｘゲート絶縁膜とａ−Ｓｉ半導体
層と半導体層上に設けられたＳｉＮｘ層とＡｌからなる
ソース電極により構成されていた。2. Description of the Related Art An amorphous silicon thin film transistor (hereinafter abbreviated as a-Si TFT) is formed by forming a gate electrode made of Al on an insulating substrate such as glass or quartz, and anodizing Al on the gate electrode. Gate insulation film and P-
It is composed of a SiNx gate insulating film formed by CVD, an a-Si semiconductor layer, a SiNx layer provided on the semiconductor layer, and a source electrode made of Al.
【０００３】[0003]
【発明が解決しようとする課題】上記従来技術では、10
インチ以上の大面積基板に陽極酸化によってゲート絶縁膜
を形成する場合、以下のような問題点があった。即ち大
面積の場合には陽極酸化電流が非常に大きくなるため
に、陽極酸化する電極表面の不均質な部分には電界集中
が起こることである。その結果、陽極酸化膜に欠陥が発
生しそれがゲート絶縁膜欠陥となり、最終的にゲート電
極−ソース電極間の短絡となっていた。[Problems to be Solved by the Invention]
When a gate insulating film is formed on a large-area substrate of inches or more by anodic oxidation, there are the following problems. That is, in the case of a large area, the anodizing current becomes very large, so that electric field concentration occurs in the non-uniform portion of the anodized electrode surface. As a result, a defect was generated in the anodic oxide film, which became a defect in the gate insulating film, and finally resulted in a short circuit between the gate electrode and the source electrode.
【０００４】本発明は、大面積基板における陽極酸化膜
の欠陥をなくすることにより、ゲート電極−ソース電極
間の短絡の生じないａ−ＳｉＴＦＴ素子を提供すること
を目的とする。It is an object of the present invention to provide an a-Si TFT element in which a short circuit between a gate electrode and a source electrode does not occur by eliminating defects in an anodized film on a large area substrate.
【０００５】[0005]
【課題を解決するための手段】この目的を達成するため
に、本発明の薄膜トランジスター素子は、ゲート絶縁膜
の陽極酸化前にゲート電極表面に酸素プラズマ処理を行
なうことが特徴である。その方法は陽極酸化前の電極表
面を１５０℃以上の高温酸素プラズマ処理により、電極
表面の均質化を行った後で陽極酸化によってゲート絶縁
膜を形成するものである。To achieve this object, the thin film transistor element of the present invention is characterized in that the surface of the gate electrode is subjected to oxygen plasma treatment before the anodization of the gate insulating film. The method is to form a gate insulating film by anodic oxidation after the electrode surface before anodization is subjected to high temperature oxygen plasma treatment at 150 ° C. or higher to homogenize the electrode surface.
【０００６】[0006]
【作用】本発明は大面積のガラス基板上に電極を形成
し、続いて絶縁膜を陽極酸化する際に、予め電極表面を
プラズマ処理によって表面改質し、その後で陽極酸化す
る。電極表面が均質化され、陽極酸化膜となる絶縁膜の
欠陥もなくすることができる。その結果、本発明の方法
を用いて作製した薄膜トランジスター素子におけるゲー
ト電極−ソース電極間の短絡現象を防止することができ
るものである。According to the present invention, when an electrode is formed on a large-area glass substrate and then the insulating film is subsequently anodized, the surface of the electrode is surface-modified by plasma treatment and then anodized. The surface of the electrode is homogenized, and defects in the insulating film serving as the anodic oxide film can be eliminated. As a result, it is possible to prevent the short circuit phenomenon between the gate electrode and the source electrode in the thin film transistor element manufactured by the method of the present invention.
【０００７】[0007]
【実施例】以下本発明の実施例について、図面を用いて
説明する。Embodiments of the present invention will be described below with reference to the drawings.
【０００８】（実施例１）第１の実施例について（図
１）を用いて説明する。(Embodiment 1) A first embodiment will be described with reference to FIG.
【０００９】ガラス基板１上にＡｌ：Ｔａ膜２を堆積
し、フォトリソグラフィとエッチングにより電極を形成
する（図１ａ）。An Al: Ta film 2 is deposited on the glass substrate 1 and electrodes are formed by photolithography and etching (FIG. 1a).
【００１０】３００℃で１５分間の窒素雰囲気中プラズ
マ処理によって、表面改質を行なう（図１ｂ）。Surface modification is carried out by plasma treatment in a nitrogen atmosphere at 300 ° C. for 15 minutes (FIG. 1b).
【００１１】陽極酸化法により絶縁膜Ａｌ2Ｏ3膜４を２
０００Å形成する（図１ｃ）。また、プラズマ処理を行
なわなかった従来方法で作製したサンプルも同時に作製
した。両者の陽極酸化膜のピンホール数を比較した結
果、本発明の方法で作製したサンプルではピンホール数
は0.01個/cm2以下であったが、従来方法で作製したサン
プルのピンホール数は1個/cm2であった。The insulating film Al 2 O 3 film 4 is formed by anodizing.
Form 000Å (Fig. 1c). A sample prepared by a conventional method without plasma treatment was also prepared at the same time. As a result of comparing the number of pinholes of both anodic oxide films, the number of pinholes in the sample manufactured by the method of the present invention was 0.01 / cm 2 or less, but the number of pinholes in the sample manufactured by the conventional method was 1 The number was pieces / cm 2 .
【００１２】（実施例２）本発明の第２の実施例につい
て、（図２）を参照しながら説明する。(Embodiment 2) A second embodiment of the present invention will be described with reference to FIG.
【００１３】ガラス基板１の上にスパッタリング法によ
りＡｌ：Ｓｉ膜を堆積し、フォトリソグラフィとエッチ
ングによりゲート電極２を形成する（図２ａ）。An Al: Si film is deposited on the glass substrate 1 by a sputtering method, and a gate electrode 2 is formed by photolithography and etching (FIG. 2a).
【００１４】電極を酸素ガス中、電力５００Ｗ、４００
℃で５分間プラズマ処理を行ない、表面改質を行なう
（図２ｂ）。The electrode is placed in oxygen gas at an electric power of 500 W, 400
Plasma treatment is performed at 5 ° C. for 5 minutes to perform surface modification (FIG. 2b).
【００１５】クエン酸を用いて陽極酸化法によりゲート
絶縁膜Ａｌ2Ｏ3膜４を２０００Åの厚さに形成する（図
２ｃ）。A gate insulating film Al 2 O 3 film 4 is formed to a thickness of 2000 Å by using anodic oxidation method using citric acid (FIG. 2c).
【００１６】P-CVD法で第２のＳｉＮｘゲート絶縁膜５
を２０００Åとａ−Ｓｉ半導体層６を５００Åとその上
に設けられたチャンネルストッパ層ＳｉＮｘ膜７を１０
００Å連続製膜する（図２ｄ）。The second SiNx gate insulating film 5 is formed by the P-CVD method.
2000 Å, the a-Si semiconductor layer 6 is 500 Å, and the channel stopper layer SiNx film 7 provided thereon is 10
00Å Continuous film formation (Fig. 2d).
【００１７】ＳｉＮｘ膜７を選択的にエッチングし、チ
ャンネルストッパ層とする（図２ｅ）。Ａｌを３０００
Åスパッタリング法で形成した後、フォトリソグラフィ
とエッチングにより、ソース電極８を形成する（図２
ｆ）。The SiNx film 7 is selectively etched to form a channel stopper layer (FIG. 2e). 3000 for Al
Å After forming by the sputtering method, the source electrode 8 is formed by photolithography and etching (see FIG. 2).
f).
【００１８】また、同様の作製方法を用いてプラズマ処
理のみを行なわなかったサンプルも作製した。両プロセ
スの各々１０サンプルについてゲートとソース間の短絡
数を比較した結果、本発明のサンプルでは短絡数はなか
ったが、従来方法のサンプルでは１０サンプル中６個に
短絡が発生した。A sample which was not subjected to the plasma treatment alone was also manufactured by using the same manufacturing method. As a result of comparing the number of short-circuits between the gate and the source for each of 10 samples of both processes, there was no short-circuit in the sample of the present invention, but in the sample of the conventional method, 6 out of 10 short-circuits occurred.
【００１９】[0019]
【発明の効果】以上のように本発明は、大面積の基板を
陽極酸化する場合に膜欠陥のない緻密な陽極酸化膜を得
ることができるものである。その結果ゲート絶縁膜の欠
陥が原因でゲート電極とソース電極間の短絡を生じるこ
となく、スイッチング素子の歩留まりを向上することが
できる。As described above, according to the present invention, a dense anodic oxide film having no film defects can be obtained when anodizing a large-area substrate. As a result, the yield of the switching element can be improved without causing a short circuit between the gate electrode and the source electrode due to the defect in the gate insulating film.
【図１】本発明の第１の実施例における絶縁膜の製造方
法を示す工程図FIG. 1 is a process chart showing a method of manufacturing an insulating film according to a first embodiment of the present invention.
【図２】本発明の第２の実施例における薄膜トランジス
ター素子の作製方法を示す工程図FIG. 2 is a process chart showing a method of manufacturing a thin film transistor element according to a second embodiment of the present invention.
【符号の説明】 １ ガラス基板 ２ 電極 ３ 表面改質した膜 ４ 絶縁膜 ５ 第２のゲート絶縁膜 ６ 半導体層 ７ チャンネルストッパ層 ８ ソース電極[Explanation of symbols] 1 glass substrate 2 electrode 3 surface-modified film 4 insulating film 5 second gate insulating film 6 semiconductor layer 7 channel stopper layer 8 source electrode
Claims (3)
ラズマ処理によって改質した後に、陽極酸化法により絶
縁膜を形成することを特徴とする絶縁膜の製造方法。1. A method for producing an insulating film, which comprises modifying the surface of an electrode by plasma treatment in an oxygen or nitrogen atmosphere and then forming the insulating film by an anodic oxidation method.
する請求項１記載の絶縁膜の製造方法。2. The method for producing an insulating film according to claim 1, wherein the insulating film contains Al as a main component.
絶縁膜を形成したことを特徴とする薄膜トランジスター
素子。3. A thin film transistor element having a gate insulating film formed by using the anodic oxidation method according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25955192A JP2996025B2 (en) | 1992-09-29 | 1992-09-29 | Method of manufacturing insulating film and thin film transistor device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25955192A JP2996025B2 (en) | 1992-09-29 | 1992-09-29 | Method of manufacturing insulating film and thin film transistor device using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06112488A true JPH06112488A (en) | 1994-04-22 |
| JP2996025B2 JP2996025B2 (en) | 1999-12-27 |
Family
ID=17335688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25955192A Expired - Fee Related JP2996025B2 (en) | 1992-09-29 | 1992-09-29 | Method of manufacturing insulating film and thin film transistor device using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2996025B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08195635A (en) * | 1995-01-18 | 1996-07-30 | Nec Corp | Method for manufacturing surface acoustic wave device |
| US5915172A (en) * | 1996-12-26 | 1999-06-22 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing LCD and TFT |
| KR100502096B1 (en) * | 1998-03-20 | 2005-12-02 | 삼성전자주식회사 | Contact structure of aluminum film and itio film, thin film transistor substrate using same and method for manufacturing same |
| KR100701658B1 (en) * | 2001-06-14 | 2007-03-30 | 비오이 하이디스 테크놀로지 주식회사 | Manufacturing method of liquid crystal display device |
| CN118407103A (en) * | 2024-07-02 | 2024-07-30 | 山东建筑大学 | Preparation method of surface anodic oxide film of aluminum alloy for building |
-
1992
- 1992-09-29 JP JP25955192A patent/JP2996025B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08195635A (en) * | 1995-01-18 | 1996-07-30 | Nec Corp | Method for manufacturing surface acoustic wave device |
| US5915172A (en) * | 1996-12-26 | 1999-06-22 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing LCD and TFT |
| KR100502096B1 (en) * | 1998-03-20 | 2005-12-02 | 삼성전자주식회사 | Contact structure of aluminum film and itio film, thin film transistor substrate using same and method for manufacturing same |
| KR100701658B1 (en) * | 2001-06-14 | 2007-03-30 | 비오이 하이디스 테크놀로지 주식회사 | Manufacturing method of liquid crystal display device |
| CN118407103A (en) * | 2024-07-02 | 2024-07-30 | 山东建筑大学 | Preparation method of surface anodic oxide film of aluminum alloy for building |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2996025B2 (en) | 1999-12-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |