JPH06112635A - Wiring board - Google Patents
Wiring boardInfo
- Publication number
- JPH06112635A JPH06112635A JP26174392A JP26174392A JPH06112635A JP H06112635 A JPH06112635 A JP H06112635A JP 26174392 A JP26174392 A JP 26174392A JP 26174392 A JP26174392 A JP 26174392A JP H06112635 A JPH06112635 A JP H06112635A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- wiring pattern
- component connecting
- wiring
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】
【目的】 片側のみ配線パターンに接続されている部品
接続部の剥離を防止する。
【構成】 一方の端部にのみ配線パターン３が接続され
ている部品接続部４−１の他端にダミー配線パターン３
−１を設ける。
(57) [Summary] [Purpose] To prevent peeling of the component connection part that is connected to the wiring pattern on only one side. [Structure] The dummy wiring pattern 3 is provided at the other end of the component connecting portion 4-1 in which the wiring pattern 3 is connected only at one end.
-1 is set.
Description
【０００１】[0001]
【産業上の利用分野】本発明は部品接続部のパターンの
剥離を防止するようにした配線基板に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board which is designed to prevent peeling of a pattern of a component connecting portion.
【０００２】[0002]
【従来の技術】図２は、従来の配線基板の平面図であ
る。2. Description of the Related Art FIG. 2 is a plan view of a conventional wiring board.
【０００３】絶縁物よりなる基板１の表面には配線パタ
ーン３および部品接続部４，４−１を含むパターンが印
刷されており、大部分はソルダレジスト２で覆われてい
るが、部品接続部４，４−１の周辺は窓２−１をあけ、
部品接続部４，４−１は露出されている。部品接続部４
は両端が配線パターン３に接続され、部品接続部４−１
は一端のみが配線パターン３に接続されている。図中５
は表面から裏面に配線を通すスルーホールである。A pattern including the wiring pattern 3 and the component connecting portions 4 and 4-1 is printed on the surface of the substrate 1 made of an insulating material, and most of the pattern is covered with the solder resist 2. Open windows 2-1 around 4,4-1
The component connecting portions 4 and 4-1 are exposed. Parts connection part 4
Both ends are connected to the wiring pattern 3, and the component connecting portion 4-1
Has only one end connected to the wiring pattern 3. 5 in the figure
Is a through hole for passing wiring from the front surface to the back surface.
【０００４】[0004]
【発明が解決しようとする課題】従来の配線基板のパタ
ーンは、前述のように電子部品をハンダ付けする部品接
続部のパターンは、必要な配線だけに接続されるように
形成されている。このようなパターンの場合、修理や試
作のため搭載されている不適当な電子部品を取り替える
とき、図２の部品接続部４−１のように片側のみ配線さ
れているパターンは、両側に配線されている部品接続部
４に比較して、剥離する可能性が高い。そのためパター
ンが剥離したことにより基板が使用できなくなったり、
ジャンパを使用したりしなければならなくなる。特にパ
ターンの微細なものやピッチの小さいものは、パターン
と基板との接着力が弱くさらに剥がれやすくなる。In the conventional wiring board pattern, as described above, the pattern of the component connecting portion for soldering the electronic component is formed so as to be connected only to necessary wiring. In the case of such a pattern, when an improper electronic component mounted for repair or trial manufacture is replaced, a pattern in which only one side is wired like the component connection section 4-1 in FIG. 2 is wired on both sides. The possibility of peeling is higher than that of the component connecting portion 4 which is present. Therefore, the pattern cannot be used due to the peeling of the pattern,
You will have to use jumpers. In particular, in the case of a fine pattern or a pattern having a small pitch, the adhesive force between the pattern and the substrate is weak, and peeling is more likely to occur.
【０００５】本発明の目的は、片側配線されている部品
接続部の剥離を防止することにある。An object of the present invention is to prevent peeling of a component connecting portion which is wired on one side.
【０００６】[0006]
【課題を解決するための手段】本発明の配線基板におい
ては、一方の端部にのみ配線パターンが接続されている
部品接続部の他方の端部にダミー配線を設けるようにし
た。In the wiring board of the present invention, the dummy wiring is provided at the other end of the component connecting portion where the wiring pattern is connected to only one end.
【０００７】[0007]
【作用】部品接続部の一方に配線パターンを接続し他方
にダミー配線パターンを接続することにより、部品接続
部は両方で支持されるから、基板との接着力が強くなり
剥離しにくくなる。By connecting the wiring pattern to one of the component connecting portions and connecting the dummy wiring pattern to the other, the component connecting portions are supported by both of them, so that the adhesive force with the substrate becomes strong and peeling is difficult.
【０００８】[0008]
【実施例】図１は本発明の一実施例の平面図である。1 is a plan view of an embodiment of the present invention.
【０００９】絶縁物よりなる基板１の表面には配線パタ
ーン３およびダミー配線パターン３−１ならびに部品接
続部４，４−１を含むパターンが印刷されており、大部
分はソルダレジスト２で覆われているが、部品接続部
４，４−１の周辺は窓２−１をあけ、部品接続部４，４
−１は露出されている。部品接続部４は両端が配線パタ
ーン３に接続され、部品接続部４−１は一端が配線パタ
ーン３に接続され他端はダミー配線パターン３−１に接
続されている。図中５は表面から裏面に配線を通すスル
ーホールである。A pattern including a wiring pattern 3, a dummy wiring pattern 3-1, and component connecting portions 4, 4-1 is printed on the surface of a substrate 1 made of an insulating material, most of which is covered with a solder resist 2. However, a window 2-1 is opened around the component connecting portions 4 and 4-1, and the component connecting portions 4 and 4 are formed.
-1 is exposed. Both ends of the component connecting portion 4 are connected to the wiring pattern 3, one end of the component connecting portion 4-1 is connected to the wiring pattern 3, and the other end is connected to the dummy wiring pattern 3-1. Reference numeral 5 in the drawing denotes a through hole for passing wiring from the front surface to the back surface.
【００１０】図２の従来例と異なるところは、部品接続
部４−１の一端は配線パターン３に接続されており、他
端はダミー配線３−１に接続されていることである。こ
のダミー配線３−１を設けることにより片側のみ配線さ
れている部品接続部４−１の接着強度を強くすることが
できる。The difference from the conventional example of FIG. 2 is that one end of the component connecting portion 4-1 is connected to the wiring pattern 3 and the other end is connected to the dummy wiring 3-1. By providing this dummy wiring 3-1, it is possible to increase the adhesive strength of the component connecting portion 4-1 wired only on one side.
【００１１】このダミー配線３−１の先端を、たとえば
図のように丸くするとか、必要な範囲でダミー配線の幅
を広くする等、面積を広くすることによりさらに強度を
増加することができる。The strength can be further increased by widening the area such as by rounding the tip of the dummy wiring 3-1 as shown in the figure or by widening the width of the dummy wiring within a necessary range.
【００１２】[0012]
【発明の効果】電子機器等に使用されている配線基板の
修理および試作において、ＩＣ等の電子部品の付け替え
作業時にしばしば発生するパターンの剥離を防止するこ
とができる。したがって、基板が使用不可能になった
り、ジャンパを使用しなければならなくなることを防ぐ
ことができる。EFFECTS OF THE INVENTION It is possible to prevent the peeling of a pattern that often occurs during the work of replacing electronic components such as ICs in the repair and trial manufacture of wiring boards used in electronic equipment and the like. Therefore, it is possible to prevent the substrate from becoming unusable and having to use the jumper.
【図１】本発明の一実施例の平面図である。FIG. 1 is a plan view of an embodiment of the present invention.
【図２】従来の一例の平面図である。FIG. 2 is a plan view of a conventional example.
１ 基板 ２ ソルダレジスト ３ 配線パターン ３−１ ダミー配線パターン ４，４−１ 部品接続部 1 substrate 2 solder resist 3 wiring pattern 3-1 dummy wiring pattern 4,4-1 component connection part
Claims (2)
に、両端を接続された基板の表面に露出する部品接続部
と、 一方の端部をソルダレジストに覆われた配線パターン
に、他方の端部をソルダレジストに覆われたダミー配線
パターンに、それぞれ接続された基板の表面に露出する
部品接続部、 を有することを特徴とする配線基板。1. A wiring pattern covered with a solder resist, a component connecting portion exposed at the surface of a substrate having both ends connected, and one end of the wiring pattern covered with the solder resist and the other end thereof. A wiring board comprising: a dummy wiring pattern covered with a solder resist; and a component connecting portion exposed on the surface of the board connected to the dummy wiring pattern.
ターンの先端は面積を広くしたことを特徴とする請求項
１記載の配線基板。2. The wiring board according to claim 1, wherein the tip of the dummy wiring pattern covered with the solder resist has a wide area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26174392A JPH06112635A (en) | 1992-09-30 | 1992-09-30 | Wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26174392A JPH06112635A (en) | 1992-09-30 | 1992-09-30 | Wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06112635A true JPH06112635A (en) | 1994-04-22 |
Family
ID=17366095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26174392A Withdrawn JPH06112635A (en) | 1992-09-30 | 1992-09-30 | Wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06112635A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006324605A (en) * | 2005-05-20 | 2006-11-30 | Sony Corp | Flexible printed wiring board and method for manufacturing flexible printed wiring board |
| US9728516B2 (en) | 2015-05-29 | 2017-08-08 | Samsung Electronics Co., Ltd. | Electric apparatus including electric patterns for suppressing solder bridges |
-
1992
- 1992-09-30 JP JP26174392A patent/JPH06112635A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006324605A (en) * | 2005-05-20 | 2006-11-30 | Sony Corp | Flexible printed wiring board and method for manufacturing flexible printed wiring board |
| US9728516B2 (en) | 2015-05-29 | 2017-08-08 | Samsung Electronics Co., Ltd. | Electric apparatus including electric patterns for suppressing solder bridges |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19991130 |