JPH0743283U - Flexible board peeling prevention mechanism - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide solder peeling prevention for connection terminals of a flexible substrate with a simple configuration. [Structure] Reinforcing the soldering of the flexible board to the circuit board against stress such as pulling in all directions, especially vertical stress, by providing reinforcing solder attachment parts on the side surfaces other than the side surface with connection terminals However, it is possible to prevent the cause of contact failure such as peeling of solder and cracking of solder.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a peeling prevention mechanism suitable for a flexible substrate or the like.

[0002]

[Prior art]

 Flexible boards are used to connect boards to each other and to connect boards to external input terminals for the purpose of space saving.

FIG. 2 shows an example of such a conventional flexible substrate. In the figure, reference numeral 6 is a flexible substrate containing a flexible wire 7, and a plurality of connection terminals 8 are provided at the tip thereof.

The connection terminal 8 is soldered to, for example, a circuit board 9 of an electronic device or the like, and a headphone jack or the like (not shown) is connected to the other end. The circuit board 9 is electrically connected to a headphone jack (not shown) via the flexible board 6.

[0005]

[Problems that the device is trying to solve]

 The above-mentioned flexible substrate is often used for a movable part or a vibrating part of an electronic device or the like, so that the soldering part of the connection terminal at the tip is always stressed.

Due to this stress, the solder is peeled off or the solder is cracked, resulting in contact failure and the like, which has been a cause of equipment failure.

Further, in many cases, the flexible substrate is used for connecting substrates, components, etc. which are not on the same surface, for example, the rear surface or the components arranged in a horizontal plane.

Therefore, it is necessary to bend the flexible substrate during the work such as assembling into the cabinet, and stress is applied to the soldering portion during this bending as well, so that it must be handled with caution.

In order to solve this problem, for example, as disclosed in JP-A-55-41555, outside the two connecting terminals 8a located outside each connecting terminal, the same shape as the connecting terminal 8 is formed. There is an invalid dummy terminal 10 (see FIG. 3).

However, the provision of such a dummy terminal 10 is effective as a reinforcement against the stress in the front and rear on the same surface, but it is not so effective against the stress in the vertical, horizontal, and diagonal directions.

Therefore, the present invention solves the above-mentioned problems, and provides a peeling-preventing mechanism for a flexible substrate, which is effective for preventing solder peeling against stress in multiple directions.

[0012]

[Means for Solving the Problems]

 In order to solve the above-mentioned problems, in the present invention, in a flexible board having a plurality of parallel connection terminals on one side surface, a reinforcing solder mounting portion is provided on a side surface other than the side surface having each connection terminal. It is the one.

[0013]

[Action]

 Reinforcing solder mounting parts are provided on the side surfaces other than the side surface that has the connection terminals. It is possible to prevent the cause of poor contact such as peeling and cracking of solder.

[0014]

Embodiment An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a top view showing an embodiment of the present invention.

In the figure, reference numeral 1 denotes a flexible substrate containing a flexible wire 2, a connection terminal 3 is provided at its tip, and a headphone jack or the like (not shown) is connected to the other end. These are electrically connected.

Reference numeral 4 denotes a reinforcing solder attachment portion, which is provided on each side surface of the flexible substrate 1 at a substantially symmetrical position.

Reference numeral 5 denotes a circuit board, on which a connecting portion of the connecting terminal 3 is provided. The circuit board 5 is provided with a terminal mounting portion 3a at a position corresponding to the connection terminal 3 and a soldering portion 4a at a position corresponding to the reinforcing solder mounting portion 4 with a width substantially the same as that of the flexible substrate 1. Each is provided.

Then, the connection terminal 3 and the terminal mounting portion 3a, and the reinforcing solder mounting portion 4 and the soldering portion 4a are soldered to each other, and the flexible board 1 is mounted on the circuit board.

In this embodiment, the reinforcing solder mounting portion 4 is provided at a substantially symmetrical position, but the reinforcing solder mounting portion 4 does not have to be at a symmetrical position. The setting position is not limited to this embodiment.

In this embodiment, a pair of reinforcing solder mounting portions 4 is provided, but the number of reinforcing solder mounting portions and the number of soldering portions may be two or more. You don't have to. .

Further, in the present embodiment, the reinforcing solder mounting portion 4 and the soldering portion 4a are shown to have a quadrangular shape, but these may be of any shape as long as they can be used for reinforcement. It is not limited to the embodiment.

Further, in the present embodiment, the circuit board 5 and the headphone jack are connected via the flexible board, but it is necessary to electrically connect the boards to each other or the board and the jack. However, the present invention is not limited to this embodiment.

In the present embodiment, the case where the reinforcing solder mounting portion 4 is composed of the dummy terminals that do not electrically connect the circuits to each other is shown, but the flexible wire that electrically connects the circuits to each other is shown. It may be configured with two patterns.

[0025]

[Effect of device]

 As described above, according to the present invention, since the reinforcing battery mounting portion is provided on the side surface other than the side surface having the connection terminal, it is flexible against stress such as pulling in all directions, especially in the vertical direction. It is possible to reinforce the soldering of the board and prevent the cause of contact failure such as solder peeling and cracking of the solder.

Further, according to the present invention, since the soldering is performed on the three side surfaces, the position of the flexible base plate is securely fixed, and the flexible base plate is prevented from being twisted during handling or warped due to long-term use. You can also

[Brief description of drawings]

FIG. 1 is a top view showing an embodiment of a solder peeling prevention mechanism for a flexible substrate according to the present invention.

FIG. 2 is a top view showing an example of a conventional solder peeling prevention mechanism for a flexible substrate.

FIG. 3 is a top view showing another example of a conventional solder peeling prevention mechanism for a flexible substrate.

[Explanation of symbols]

 1 flexible board 2 flexible wire 3 connection terminal 4 reinforcing solder attachment part 4a soldering part 5 circuit board

Claims (1)

[Scope of utility model registration request] 1. A peeling prevention mechanism for a flexible board, comprising: a flexible board having a plurality of parallel connection terminals on one side surface; and a reinforcing solder mounting portion provided on a side surface other than the side surface having the connection terminals. .