JPH0613209A - Electronic component exterior method - Google Patents

Abstract

PURPOSE:To obtain the outer packaging method of electronic part having excellent massproductivity while facilitating the regulation of resin size bonded onto outer lead terminals. CONSTITUTION:The outer packaging method of electrode part is composed of three steps enumerated as follows, i.e., a first step for sticking a resin layer bonding preventive heat resistant tape 7 to a lead terminals 3, a second step for setting a substrate 2 and the lead terminals 3 on the substrate 2 side by coating them with resin powder and a third step for releasing the heat resistant tape 7 from a lead frame 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for packaging electronic components, and more particularly to a method for packaging electronic components in which an outer periphery of an electronic component having external lead terminals is resin-molded.

[0002]

2. Description of the Related Art When a resin is molded on the outer periphery of an electronic component having external lead terminals, a method for controlling the size of the resin attached to the lead terminals is disclosed in, for example, Japanese Patent Publication No.
As shown in Japanese Patent No. 28043, a powdery thermosetting resin is attached to an electronic component, and the cured thermosetting resin is heated and melted, and then the softening temperature of the powdery thermosetting resin or less Cool to. Next, a thermosetting display ink is used to display on the surface of the resin, and the thermosetting resin adhering to the excess portion of the lead wire is removed and heated again to give a thermosetting resin and display. Allow the ink to completely cure. In the packaging method for electronic parts, a resin coating film having excellent moisture resistance and insulating properties can be obtained, and the resin dimension can be regulated with high dimensional accuracy.

[0003]

In the above-mentioned conventional electronic component packaging method, unnecessary resin attached to the resin adhesion prohibited portion after the normal resin molding is performed in order to regulate the resin size attached to the lead terminals. The steps of scraping off and reheating are added. Therefore, the process is complicated and the operation requires skill.

An object of the present invention is to provide a packaging method for electronic parts, in which the size of the resin attached to the external lead terminals can be easily regulated and the mass productivity is excellent.

[0005]

An electronic component packaging method according to the present invention is an electronic component packaging method in which a resin molding is performed on the outer periphery of an electronic component having an external lead terminal, and includes the following three steps.

Step of applying a tape member to prevent resin from adhering to the external lead terminal Step of applying resin to a part of the lead terminal extending from the electronic component and electronic component element and curing the tape member Peeling off the tape member from the external lead terminal Process

[0007]

In the electronic component packaging method according to the present invention, the tape member for preventing the resin from adhering is attached to the external lead terminal, so that the unnecessary resin adhering to the electronic component and the lead terminal close to the electronic component is removed from the tape member. Can be easily peeled by the step of peeling from the external lead terminal. For this reason, it is possible to provide an electronic component packaging method having excellent mass productivity.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The electronic part packaging method of the present invention will be described in detail below with reference to the drawings. As an electronic component, a resistance network in which a plurality of resistance elements are formed on an insulating substrate and a plurality of lead terminals extend from the insulating substrate will be described. For example, a plurality of lead terminals extend from a substrate of a hybrid integrated circuit component. It can be widely applied to electronic components.

FIG. 1 is an external view of a resistor network to which the packaging method of the present invention is applied. In the figure, 1 is a resistance network component, 2 is a substrate on which a resistance element covered with an exterior resin is formed, 3 is a lead terminal extended from one end of the substrate 2, and 5 is an exterior. It is a resin.
Although the plurality of lead terminals 3 are integrated by the lead frame 3a, in practice, the lead terminals 3 are cut and used at the one-dot chain line portion.

The substrate 2 has a substantially rectangular parallelepiped shape and is made of, for example, 96% alumina ceramic. On the main surface of the substrate 2, for example, a thick film resistance element and a wiring pattern which are not shown are formed, and the wiring pattern formed up to near the end of the substrate 2 and the lead terminals 3 are solder-joined. There is.

The lead terminals 3, ... Are formed so that the ends on the substrate 2 side sandwich the thickness of the substrate 2, and the other ends are integrated with the lead frame 3a.

The exterior resin 5 is formed by applying a powder or paste containing a thermosetting resin as a main component, to which a light-shielding agent or the like is added, and heating and curing. The exterior resin is coated on the entire periphery of the substrate 2 and the end portions of the lead terminals 3 ... On the substrate 2 side.
As a result, the resistance element and the wiring pattern on the substrate 2 are
Protected from external moisture and shock. When an IC chip or the like is mounted on the substrate 2, it is possible to block the light that causes the malfunction of the IC.

In the figure, an X region is an adhesion prohibition part to which the exterior resin is not adhered, and a Y region is an adhesion required part Y to which the exterior resin is to be adhered.

Next, as an example of the electronic component packaging method according to the present invention, the packaging method for the resistor network component 1 will be described.

In the packaging method, as shown in FIG. 2, first, the heat-resistant tape 7 is attached to the adhesion-prohibited portion X of the lead terminal 3.
Stick from both sides. As the heat-resistant tape 7, for example, Nomex paper manufactured by DuPont is used.

Next, the lead frame 3a is held and fixed by the clamper 4.

Next, as shown in FIG. 3, the substrate 2 and the lead terminals 3 ...
A part of it is heated by the heater 10. The heating temperature is set to around 150 ° C.

Next, as shown in FIG. 4, a part of the substrate 2 and the lead terminals 3 ... Is immersed in the mold layer 6 in which the resin powder 5a to be the exterior resin 5 is contained. When a predetermined amount of the resin powder 5a is attached to the substrate 2 and the lead terminals 3, ...

Next, as shown in FIG. 5, the substrate 2 and the lead terminals 3 on which the resin powder 5a is attached are heated and cured by the heater 11. This processing temperature is about 170
℃. As a result, the thermosetting resin adheres to the surfaces of the substrate 2, the lead terminals 3 ... At this time, the thermosetting resin also adheres to a part of the heat resistant tape 7.

Next, as shown in FIG. 6, the lead terminal 3
..Peel off the heat-resistant tape 7 attached to the adhesion-prohibiting portion X on the upper part. As a result, the exterior resin layer 5 made of the thermosetting resin is formed only on the surface and the outer peripheral portion of the substrate 2 and the lead terminals 3 ... As a result, the resistance net watt 10 having the resin layer which is excellent in moisture proofness and insulation and has a beautiful appearance is obtained.

As described above, the electronic component packaging method of the present invention is
By removing the heat-resistant tape 7, it becomes possible to easily remove the unnecessary resin attached to the lead frame, which improves the appearance yield and the reliability of the parts.

Further, since the unnecessary exterior resin layer 5 can be removed by removing the heat-resistant tape 7, it is possible to easily control the attachment positions of the lead terminals 3 ... A complicated manufacturing process of removing unnecessary resin after applying such a resin powder and performing primary curing becomes unnecessary.

Therefore, it is possible to provide a highly reliable electronic component having excellent moisture resistance and insulation properties.

[0024]

Since the electronic part packaging method according to the present invention includes the steps of attaching a heat-resistant tape member for preventing resin from adhering to the external lead terminals, and the step of peeling the tape member from the external lead terminals, The unnecessary resin attached to the external lead terminals can be easily peeled off. Therefore, the size of the resin attached to the external lead terminals can be easily regulated, and the electronic component packaging method is excellent in mass productivity.

[Brief description of drawings]

FIG. 1 is an external view of a resistor network to which an embodiment of the present invention is applied.

FIG. 2 is a schematic diagram for explaining a process of the present invention.

FIG. 3 is a schematic diagram for explaining a process of the present invention.

FIG. 4 is a schematic diagram for explaining a process of the present invention.

FIG. 5 is a schematic diagram for explaining a process of the present invention.

FIG. 6 is a schematic diagram for explaining a process of the present invention.

[Explanation of symbols]

 1 ... Resistor network 2 ... Insulating substrate 3 ... Lead terminal 5 ... Exterior resin layer 7 ... Heat-resistant tape

Claims (1)

[Claims] 1. A method of packaging an electronic component, wherein an outer periphery of an electronic component having an external lead terminal is resin-molded, a step of attaching a tape member for preventing resin from adhering to the external lead terminal, the electronic component and An electronic component packaging method comprising: a step of applying a resin to a portion of a lead terminal extending from an electronic component and curing the resin; and a step of peeling the tape member from the external lead terminal.