JPH0613257A - Chip type capacitor - Google Patents

Abstract

PURPOSE:To improve the mounting efficiency of an electronic component to be mounted on a printed board. CONSTITUTION:The chip type capacitor has a capacitor 1 having external electrodes, and a sheath 3 formed separately from the capacitor 1 to enclose the capacitor 1, and comprises at least two auxiliary terminals 4 provided separately from the external electrodes on an. outer surface of the sheath 3, and a filmlike electronic component formed between the terminals 4. Thus, a composite component of the capacitor 1 and the other electronic component can be easily formed, and the mounting efficiency of the printed-board can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite part of a chip type capacitor and a film-shaped electronic part, and more particularly to a chip type capacitor which can be surface-mounted on a printed circuit board.

[0002]

2. Description of the Related Art As the trend toward lighter, thinner, shorter, and smaller electric appliances has increased, the miniaturization of electronic components used in electric appliances has been further accelerated. The miniaturization of electronic components does not simply mean miniaturization of electronic components, but must be in a form compatible with surface mounting, that is, made into chips. At present, it can be said that this chip formation is realized in most electronic parts such as resistors, inductors, crystal oscillators, filters and transformers. Of course, the capacitor did not leak from this example.
A horizontal type chip-type capacitor capable of surface mounting has been devised, as disclosed in 9-9557.

[0003]

However, in the horizontal type chip type capacitor, although the height of the component can be reduced, the capacitor housed in the outer package is mounted on the printed circuit board by laying it sideways. It is unavoidable that the printed circuit board occupies a large area. The increase in the area occupied by each electronic component on the printed circuit board reduces the number of electronic components that can be mounted on the printed circuit board, which is one of the major causes of deterioration in mounting efficiency.

An object of the present invention is to improve the mounting efficiency of electronic components mounted on a printed circuit board.

[0005]

SUMMARY OF THE INVENTION The present invention comprises a capacitor having an external electrode and an exterior body which is formed separately from the capacitor and encloses the capacitor, and the external electrode is provided on the outer surface of the exterior body. Separately, at least two auxiliary terminals are provided, and a film-shaped electronic component is formed between the auxiliary terminals.

[0006]

When the chip-type capacitor of the present invention is mounted on the printed circuit board 7, since the film-shaped electronic component is formed on the outer surface of the outer package 3 between the auxiliary terminals 4, the chip-type capacitor is conventionally used as a chip-type capacitor. Can reduce the occupied space of the printed circuit board 7 by the amount of the film-shaped electronic component mounted on the printed circuit board 7 as an independent component.

In addition to the external electrodes such as the lead wires 2, at least two auxiliary terminals 4 provided on the outer package 3 are connected to the wiring pattern 8 of the printed circuit board 7 in this chip type capacitor, so that the chip type capacitor The capacitor can be firmly mounted on the printed board 7.

[0008]

Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a partially exploded perspective view of a chip type capacitor according to a first embodiment of the present invention. FIG. 2 is a partial sectional front view of a chip type capacitor according to a second embodiment of the present invention. FIG. 3 is a perspective view of the chip type capacitor according to the first embodiment of the present invention mounted on a printed circuit board.

The capacitor 1 shown in FIG. 1 has a bottomed cylindrical outer case in which an unillustrated capacitor element impregnated with an electrolytic solution is housed, and the open end of the outer case is made of synthetic rubber or the like (not shown). It is sealed with a sealing body. Further, the lead wire 2 connected to the capacitor element is drawn out from the sealing body.

The lead wire 2 drawn out from the sealing body is bent along the end surface and the bottom surface of the exterior body 3 and is housed in a groove provided on the bottom surface of the exterior body 3.

The exterior body 3 having a rectangular columnar appearance is made of an insulating material such as a ceramic material, and has a cylindrical storage space in the center thereof, and the capacitor 1 is stored in this storage space. In addition, on the bottom surface of the exterior body 3, the lead wire 2
Separately, two plate-shaped auxiliary terminals 4 made of a solderable metal are attached by an adhesive. The auxiliary terminal 4 is not limited to this, and in addition to a plate-shaped metal, a solderable metal wire is attached with an adhesive, or a synthetic resin mixed with a solderable metal powder or the like is used as a conductive material. There is no problem in applying a paste. Examples of the solderable metal include silver, tin, lead, zinc, nickel, iron, copper and alloys thereof.

The exterior body 3 between the two auxiliary terminals 4
A metal film resistor 5 is formed on the bottom surface of the metal film so as to bridge between the auxiliary terminals 4, and in order to protect the metal film resistor 5, its surface is made of a heat-resistant synthetic resin such as epoxy resin. Covered with resin 6. The synthetic resin 6 may be silicone resin. In addition, the metal film resistor 5 of this embodiment
Is made of a single transition metal such as nickel, chromium, or titanium, or an alloy thereof, and is deposited on the bottom surface of the outer package 3 by a vacuum deposition method. When the metal film resistor 5 is formed by the vacuum vapor deposition method, the exterior body 3 is exposed to high temperature. Therefore, after the metal film resistor 5 is vapor-deposited on the exterior body 3 in advance, the capacitor 1 is housed in the exterior body 3. Is preferred. Further, the exterior body 3 made of a ceramic material also serves as an insulating base for the metal film resistor 5.

The resistors are not limited to the metal film resistor 5,
A carbon film resistor, a metal nitride film resistor, a glaze resistor, etc. may be used, and a resistor suitable for a desired property can be appropriately selected.

When the chip type capacitor according to this embodiment is mounted on the printed circuit board 7, since the metal film resistor 5 is formed on the outer surface of the exterior body 3 between the two auxiliary terminals 4, the chip type capacitor has been conventionally used. The capacitor can reduce the space occupied by the resistor, which is mounted on the printed circuit board 7 as an independent component, on the printed circuit board 7.

Further, as shown in FIG. 3, in this chip type capacitor, two auxiliary terminals 4 (not shown) provided on the exterior body 3 in addition to the lead wires 2 are connected to the wiring pattern 8 of the printed circuit board 7 by the solder 9. Therefore, the chip type capacitor can be firmly mounted on the printed circuit board 7.

Further, in the present embodiment, the metal film resistor 5 is vapor-deposited so as to linearly bridge between the auxiliary terminals 4, but the present invention is not limited to this, and the metal film resistor 5 is formed on the bottom surface of the exterior body 3, for example. 5 is vapor-deposited in a U-shape to change the length of the metal film resistor to bridge between the auxiliary terminals, or the metal is spread over both side surfaces and the upper surface of the exterior body as in the second embodiment shown in FIG. The film resistor 5 may be vapor-deposited. Particularly in the case of the second embodiment, the metal film resistor 5 can be formed at a longer distance than that of the first embodiment, so that various characteristics of the resistor such as the resistance value can be arbitrarily set.

In this embodiment, the resistor is taken as an example of the film-shaped electronic component, but the invention is not limited to this, and a film inductor or the like may be used in addition to the resistor.

Further, the auxiliary terminal and the metal film resistor are not limited to those in which one film-shaped electronic component is formed between the two auxiliary terminals 4 as in the present embodiment, and the auxiliary terminal is provided on the bottom surface of the exterior body. Alternatively, four resistors may be provided to form a resistor and an inductor between the respective auxiliary terminals. In this case, composite parts of passive elements such as capacitors, resistors and inductors can be easily obtained.

[0019]

As described above, the present invention comprises a capacitor provided with an external electrode and an exterior body which is formed separately from the capacitor and encloses the capacitor. The exterior surface of the exterior body is provided with the external electrode. Separately, at least two auxiliary terminals are provided, and a film-shaped electronic component is formed between the auxiliary terminals. Therefore, since the film-shaped electronic component is connected between the auxiliary terminals on the outer surface of the outer package, a composite component of the capacitor and other electronic components can be easily configured, and the printed circuit board mounting The efficiency can be increased.

Further, when the chip type capacitor is mounted on the printed circuit board, the auxiliary terminals are connected to the wiring pattern of the printed circuit board in addition to the external electrodes of the capacitor, so that the connection strength between the chip type capacitor and the printed circuit board is increased. As a result, the reliability of the chip type capacitor can be improved.

Further, since the outer package is formed separately from the capacitor, if the film-shaped electronic component is formed on the outer package in advance and then the capacitor is included in the outer package, the film-shaped electronic component is formed on the outer package. Even if the outer casing is treated in an environment such as high temperature and high pressure during the process, there is no adverse effect on the electrical characteristics and external shape of the electrolytic capacitor, which is particularly resistant to extremely high temperatures.

Moreover, since the external electrode and the auxiliary terminal are separate, the capacitor and the film-shaped electronic component are electrically separated from each other. Therefore, if the wiring pattern is arbitrarily changed, a circuit such as a series or parallel circuit of the capacitor and the film-shaped electronic component can be easily assembled.

[Brief description of drawings]

FIG. 1 is a partially exploded perspective view of a chip type electrolytic capacitor according to a first embodiment of the present invention.

FIG. 2 is a partial sectional front view of a chip type electrolytic capacitor according to a second embodiment of the present invention.

FIG. 3 is a perspective view showing a state in which the chip type capacitor of the first embodiment of the present invention is mounted on a printed board.

[Explanation of symbols]

 1 Capacitor 2 Lead wire 3 Exterior body 4 Auxiliary terminal 5 Metal film resistor 6 Synthetic resin 7 Printed circuit board 8 Wiring pattern 9 Solder

Claims (1)

[Claims] 1. A capacitor having an external electrode, and an exterior body that is formed separately from the capacitor and encloses the capacitor. At least two auxiliary terminals are provided on the outer surface of the exterior body in addition to the external electrode. And a film-shaped electronic component formed between the auxiliary terminals.