JPH0613759B2 - Plating equipment and cleaning equipment - Google Patents

Description

FIELD OF THE INVENTION The present invention relates to strip plating and cleaning apparatus.

"Prior art" High current density plating with an insoluble anode is indispensable for increasing the production of plated steel sheets and improving productivity. To this end, it is necessary to solve the following problems in equipment technology.

(1) Shortening the distance between the strip and the anode (2) Agitating the plating solution between the strip and the anode (3) Supplying ions between the strip and the anode The conventional distance between the electrodes was 30-40 mm. However, if the gap is shortened as in (1) above, there is a danger of causing a serious accident called anode touch. Further, a device (a Japanese Patent Laid-Open No. 55-148798 and a Japanese Patent Laid-Open No. 62-212399) in which a baffle plate is provided on the inner surface of the anode for the agitation of (2) has been devised. The plated surface may be damaged. Further, the above-mentioned (3) ion supply device supplies the plating liquid in the strip running direction and the countercurrent direction (JP-A-40-56092, JP-A-62-212399).
However, this method requires a large amount of plating solution to be blown in, which requires a huge amount of equipment, and this method is effective at low speeds (50 m / min), but the speed is 100-500 m / min. It is clear that the faster the min, the less effective. In addition, a cleaning device for cleaning contaminants such as rolling oil on the surface of the strip that has undergone the rolling process by electrolysis in an alkaline solution also needs to solve the above conditions (1) (2) (3) similar to the above plating device. .

[Problems to be Solved by the Invention] The present invention is intended to solve the above problems (1), (2) and (3), and to obtain an apparatus for safely and quickly performing high current density plating or cleaning of strips. .

[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention is a strip treating apparatus in which an anode is arranged in a liquid tank so as to face each other, and a strip travels between the anodes. A plating apparatus comprising an insulator provided in a projecting manner, and a taper surface inclined from the anode side toward the strip side in the traveling direction of the strip is formed on the insulator, and the zigzag position is used instead of the facing position. The plating device according to the first or second aspect of the present invention, in which a through hole that communicates with the inner and outer surfaces of the anode of the insulator is provided to allow the processing liquid to flow in and out of the anode. The above-mentioned first and second in the vertical direction
Alternatively, the plating apparatus according to the third invention, the plating apparatus according to the fourth invention in which the insulator is provided at a facing position above the anode above the liquid surface of the liquid tank, and the running direction of the strip is horizontal. The plating apparatus according to the first, second or third invention, and the first, second, third, fourth, fifth or sixth invention in which a treatment liquid forced supply device is connected to a gap between insulators By the plating device described above, the cathode is arranged opposite to the anode, and the cleaning device described in each of the first, second, third, fourth, fifth, sixth or seventh invention is replaced by the plating device. To be achieved.

"Operation" Therefore, the plating solution 9 is drawn (conveyed) between the strip 3 between the anodes 2 and 2 and the tapered surface 5 of the insulator 4 as the strip 3 travels, whereby the strip 3 and the tapered surface 5 are carried. A liquid film is formed between the liquid film and the liquid. Since the lift force is generated on the liquid film by the action of the tapered surface 5, the strip 3 and the insulator 4 do not come into contact with each other. Therefore, the strip 3 and the anode 2 do not come into contact with each other, and even the strip 3 having a bad shape, that is, the strip 3 having a warp in a direction perpendicular to the traveling direction and a meandering fold of both ears receives the lift force. There is no contact with the insulator 4.

When the insulators 4 are projected at the staggered positions instead of the facing positions, the strips 3 meander by avoiding the insulators 4 by the above-mentioned lift force and do not come into contact with the insulators 4 as shown in FIG.

That is, by providing the insulator 4, even if the gap between the anode 2 and the strip 3 is reduced, the contact between the strip 3 and the anode 2 is prevented.

Further, since the insulator 4 projects to the inner surface of the anode 2, the plating liquid 9 carried along with the strip 3 hits the insulator 4 and flows backward as shown in FIGS. Immediately before being drawn into the space, it is rotated between the anode 2 and the strip 3 and shearing force is generated between the entrained flow c and the backflow b (Fig. 3).
And stirred.

The insulator 4 can be provided in a staggered position (FIG. 5) so as to further reduce the gap between the anodes 2 and 2.

The plating solution 9 flows from the through holes 6 and 6 to the inside and outside of the anode 2, and the plating solution 9 on the outside of the anode 2 can be taken in between the anode 2 and the strip 3, and the ions on the outside are stirred and supplied into the anode 2. be able to.

As shown in FIG. 6, the anodes 2, 2 above the liquid level 7
Strip 3 between the tapered surfaces 5, 5 of the opposing insulators 4, 4 of
The plating liquid 9 that is continuously lifted up by the counter insulators 4 and 4 is prevented from rising.

The plating liquid 9 is applied to the gap between the insulators 4 by the forced supply device 8.
Can be supplied from the outside to increase the ion concentration.

The above operation is the same in the cleaning device that electrolyzes the dirt on the strip surface with an alkali or acid solution. In this case, the electrodes are switched using the strip 3 on the anode side and the anode 2 on the cathode side.

[Example] Plate-shaped anodes 2, 2 are arranged in a liquid tank 1 of a plating liquid 9 so as to face each other in the vertical direction, the upper portions of the anodes 2, 2 are held above the liquid surface 7, and the facing plate The pair of anodes 2 and 2 are held in each liquid tank 1 for two sets (FIG. 6). The strip 3 is run downward between the facing plate-shaped anodes 2 and 2 on one side, and the guide roller 10 is bypassed to run upward between the anodes 2 and 2 on the other side. In this state, when an anode is connected to the anodes 2 and 2 and a current is passed toward the strip 3, the metal ions in the plating solution 9 are deposited on the strip 3 and the plating process can be performed. As shown in FIGS. 1, 2, and 4, a plurality of ceramic insulators 4 and 4 are provided so as to protrude from each other on the facing surfaces (inner surfaces) of the plate-like anodes 2 and 2, or As shown in FIG. By making the length of the insulator 4 in the traveling direction as short as possible as shown in FIG. 4, the electrode area of the anode 2 can be kept wide. A taper surface 5 is formed on a portion of the insulator 4 facing the strip 3 in this manner, and the taper surface 5 is inclined from the anode 2 side toward the strip 3 side in the traveling direction. This insulator 4,
The anode 2 at the interval in the traveling direction of 4 is provided with through holes 6 and 6 for communicating the inner surface (opposing surface) and the outer surface, and is carried along with the strip 3 as shown in FIG. The plating liquid 9 hits the insulator 4 and is discharged from the through hole 6 to the outer surface (arrow d), and flows from the other through hole 6 to the inner surface side. The plate-shaped anodes 2, 2 may be arranged not only in the vertical direction but also in the horizontal direction (horizontal direction). Further, as shown in FIG. 2, a pipe 11 is connected to the through hole 6 ', and a forced supply device 8 for forcibly supplying the plating solution 9 in the storage tank from the outside by a pump 12 is provided, whereby a new plating solution 9 is supplied. The ion concentration can be improved by supplying it between the electrodes. The present invention is more effective as the traveling speed of the strip 3 becomes higher (and 300 to 1000 m / min), but the distance between the anodes 2 and 2 is about 5 mm, and the traveling speed is 30 to 300 m / min. Can be designed up to low speed. When the speed of the strip 3 is low, another through hole penetrating the anode 2 and the insulator 4 is provided so as to have an appropriate arrangement, and the liquid 9 is forcibly blown out from this through hole. The lift force exerted on the strip 3 can be assisted by the dynamic pressure or static pressure at that time. Also, both edges of the strip may come into contact with the insulator at very low speeds due to reduced lift. However, it is not electrically short-circuited, and even if scratches occur on the edges of the strip, they will be cut off in a later process and will not affect the product.

Although the plating apparatus has been described above, it can be applied to a cleaning apparatus by electrolysis of the dirt attached to the surface of the strip 3 in an alkaline treatment liquid. 1 in the figure
2 shows the upper guide roller of the strip 3, and 13 in FIGS. 3 and 9 shows the velocity distribution curve.

[Advantages of the Invention] Since the present invention is configured as described above, not only can the distance between the anodes or cathodes 2 and 2 facing each other be remarkably shortened, but there is a risk of contact between the strip 3 and the anodes or cathodes 2 and 2. It is possible to safely carry out high current density plating or cleaning, and to significantly improve the running speed of the strip 3.

Further, it is possible to sufficiently stir the liquid in the gaps and supply the ions to the gaps, and it is possible to remarkably improve the efficiency of the plating or cleaning treatment.

Further, the opposing insulators 4 and 4 above the liquid surface 7 are strips 3
The level of the upper strip guide rollers 12 and 12 can be lowered toward the liquid surface 7 in order to prevent the processing liquid entrained in the equipment, which has the effect of downsizing the equipment.

[Brief description of drawings]

FIG. 1 is a perspective view showing a plating apparatus of the present invention, FIG. 2 is an enlarged vertical front view of an opposed anode, FIG. 3 is a flow velocity curve diagram of a plating solution, and FIG. 4 is a front view of another embodiment of the anode. , Fifth
FIG. 7 is a front view of the staggered arrangement of the anodes, FIG. 6 is a front view of the reciprocating strip, FIG. 7 is a perspective view of a conventional plating apparatus, and FIG. 8 is a front view of the anodes and strips shown in FIG. FIG. 9 is a velocity distribution curve of the treatment liquid between anodes in FIG. 1 ... Liquid tank, 2 ... Anode or cathode, 3 ... Strip, 4 ... Insulator, a ... Running direction, 5 ... Tapered surface, 6 ... Through hole, 7 ... Liquid surface, 8 ... ... Processing liquid forced supply device.

Claims (8)

[Claims] 1. A strip processing apparatus in which an anode is arranged to face each other in a liquid tank and a strip runs between the anodes, and an insulator is provided so as to project from the inner surface of the anode at a facing position, and the strip runs on the insulator. A plating apparatus in which a tapered surface is formed that is inclined in the direction from the anode side to the strip side. 2. The staggered position instead of the facing position.
(1) The plating device as described above. 3. The plating apparatus according to claim 1, wherein a through hole communicating with an inner surface and an outer surface of the anode is provided at a gap portion of the insulator, and the treatment liquid is allowed to flow in and out of the anode. 4. The plating apparatus according to claim 1, wherein the running direction of the strip is a vertical direction. 5. The plating apparatus according to claim 4, wherein the insulator is provided at a facing position above the anode above the liquid surface of the liquid tank. 6. The running direction of the strip is horizontal.
(1) The plating device described in (2) or (3), respectively. 7. The plating apparatus according to claim 1, wherein a processing liquid forced supply device is connected to the gap between the insulators. 8. A cathode is arranged opposite to the anode instead of the anode,
And claim (1) (2) (3) (4) (5) (6) or instead of the plating device
The cleaning device described in (7).