JPH06152180A - Connection structure of electromgnetic wave shielding member - Google Patents

Connection structure of electromgnetic wave shielding member

Info

Publication number
JPH06152180A
JPH06152180A JP30246092A JP30246092A JPH06152180A JP H06152180 A JPH06152180 A JP H06152180A JP 30246092 A JP30246092 A JP 30246092A JP 30246092 A JP30246092 A JP 30246092A JP H06152180 A JPH06152180 A JP H06152180A
Authority
JP
Japan
Prior art keywords
electromagnetic wave
wave shield
shield member
conductive
electromagnetic waves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30246092A
Other languages
Japanese (ja)
Inventor
Koji Kitagawa
弘二 北川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitagawa Industries Co Ltd
Original Assignee
Kitagawa Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitagawa Industries Co Ltd filed Critical Kitagawa Industries Co Ltd
Priority to JP30246092A priority Critical patent/JPH06152180A/en
Publication of JPH06152180A publication Critical patent/JPH06152180A/en
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE:To easily connect a plurality of electromagnetic waves shielding members formed by building conducting layers in the insides of board materials, while electric continuity of the conducting layers is kept. CONSTITUTION:Figure 2 is a part-enlarged view showing the state that, as a first embodiment, a first electromagnetic waves shielding member 3 and a second electromagnetic waves shielding member 5 are connected via a connection part 7, in an electromagnetic waves shielding board material 1. Since, as shown in the figure, the thickness of a first upper board material 33 is slightly different from that of a first lower board material 35, and the thickness of a second upper board material 53 is slightly different from that of a second lower board material 55, a first exposed part 39 of a first conducting mesh 31 is not electrically connected with a second exposed part 59 of a second conducting mesh 51, only by arranging the first electromagnetic waves shielding member 3 and the second electromagnetic waves shielding member 5, and engaging an engaging protrusion with an engaging recess 37. But electric continuity between the first conducting mesh 31 and the second conducting mesh 51 is ensured, because the connection part 7 is connected by using conducting adhesive agent.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子部品等を電磁波か
ら遮蔽したり、室内から外部に電磁波が漏れることを防
止したりする電磁波シールド部材の接続構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic wave shield member connection structure for shielding electronic parts and the like from electromagnetic waves and for preventing electromagnetic waves from leaking from the room to the outside.

【0002】[0002]

【従来の技術】近年、内部に制御用マイコンを備えた各
種装置、例えばパーソナルコンピュータ、プリンタ等の
事務機器、洗濯機や掃除機等の家庭用電気機器が急速に
普及してきた。そして使用されるマイクロコンピュータ
の個数も増加し、それとともにクロック周波数の高速化
が進められている。ところがこの高周波数化のために、
電子部品等の発生する電磁波ノイズが、各電子部品を収
納する筐体の隙間或は電子部品を配置した室内から放射
されて周辺の信号線に影響を与えたり、または外部から
の電磁波や他の電子機器からの電磁波が電子部品に直接
作用して故障や誤動作等を起こしたりすることがある。
さらに電子部品のうちの磁気的記録素子は、小さな磁気
エネルギにて高密度に磁性化させたものであるため、電
磁石等による外部磁界によって記録情報の消失といった
悪影響を受けることもある。
2. Description of the Related Art In recent years, various devices having a control microcomputer therein, for example, office equipment such as personal computers and printers, and household electric appliances such as washing machines and vacuum cleaners have rapidly spread. The number of microcomputers used has also increased, and along with this, the clock frequency has been increased. However, due to this high frequency,
Electromagnetic noise generated by electronic parts, etc. is radiated from the gaps between the housings that house each electronic part or from the room where the electronic parts are placed, affecting the surrounding signal lines, or electromagnetic waves from the outside and other Electromagnetic waves from electronic devices may directly act on electronic components and cause malfunctions or malfunctions.
Further, since the magnetic recording element of the electronic parts is magnetized at a high density with a small magnetic energy, it may be adversely affected by the loss of recorded information due to an external magnetic field from an electromagnet or the like.

【0003】従来、このような静電気および磁気的な誘
導などの全体または一部を遮断する電磁波シールド部材
として、ガラス等の表面に導電層(例えばチタンを含有
する導電性物質)をスパッタリングにより化学蒸着させ
たものがある。しかし単に表面に導電層を蒸着しただけ
では、形成した導電層に空気や水が触れることで化学的
に変質(腐食)したり、または物理的な外力が加わるこ
とで摩耗したりしやすいという問題があった。そのため
例えば特公平2−60496号に示される電磁波シール
ド部材のように、板材の内部に導電層を組み込み、導電
層を外部から遮断する電磁波シールド部材が提案されて
いる。
Conventionally, as an electromagnetic wave shield member for blocking all or part of such static electricity and magnetic induction, a conductive layer (for example, a conductive substance containing titanium) is chemically vapor-deposited on the surface of glass or the like by sputtering. There is something that I made. However, simply depositing a conductive layer on the surface may cause chemical deterioration (corrosion) due to air or water contact with the formed conductive layer, or abrasion due to physical external force. was there. Therefore, for example, as in the electromagnetic wave shielding member disclosed in Japanese Patent Publication No. 2-60496, an electromagnetic wave shielding member that incorporates a conductive layer inside a plate material and shields the conductive layer from the outside has been proposed.

【0004】[0004]

【発明が解決しようとする課題】しかしこのような電磁
波シールド部材であると、目的に応じた大きさや形状を
有する電磁波シールド部材を形成するのが難しいという
問題がある。つまり電磁波シールド部材は、適用される
場所に応じてさまざまな大きさや形状に形成する必要が
あるが、コスト効率や作業の困難性を考慮すると予め一
定の大きさに形成した電磁波シールド部材を接続して形
成できることが望ましい。この場合、板材の内部に導電
層を組み込んで形成する電磁波シールド部材は、導電層
が電気的に接触している状態で接続されていなければ、
電磁波を遮断するという本来の機能を果たすことができ
ない。
However, such an electromagnetic wave shield member has a problem that it is difficult to form an electromagnetic wave shield member having a size and a shape according to the purpose. In other words, the electromagnetic wave shield member needs to be formed in various sizes and shapes depending on the place to which it is applied, but in consideration of cost efficiency and work difficulty, the electromagnetic wave shield member formed in advance to a certain size should be connected. It is desirable to be able to form it. In this case, the electromagnetic wave shield member formed by incorporating the conductive layer inside the plate member, if the conductive layer is not connected in the state of being in electrical contact,
It cannot fulfill its original function of blocking electromagnetic waves.

【0005】しかし例えば導電層として金属の細線から
なるメッシュを用いた場合、板材を成形した時のさまざ
まな要因により厚みが微妙に異なるため、単に複数の電
磁波シールド部材の断面を揃え合わせるだけでは導電層
としてのメッシュを電気的に接触させることは難しい。
従来はこれらの条件を満たした接続方法がなかったた
め、目的に応じた大きさや形状の電磁波シールド部材を
形成することが難しかった。
However, for example, when a mesh made of thin metal wires is used as the conductive layer, the thickness is slightly different due to various factors when the plate material is molded. It is difficult to electrically contact the mesh as a layer.
Conventionally, there has been no connection method that satisfies these conditions, so it has been difficult to form an electromagnetic wave shield member having a size and shape according to the purpose.

【0006】本発明は上述した課題を解決するものと
し、板材の内部に導電層を組み込むことで形成される複
数の電磁波シールド部材を、導電層の電気導通性を保っ
た状態で、容易に接続可能とすることを目的とする。
The present invention has been made to solve the above-mentioned problems, and a plurality of electromagnetic wave shield members formed by incorporating a conductive layer inside a plate material can be easily connected to each other while maintaining the electrical conductivity of the conductive layer. The purpose is to enable.

【0007】[0007]

【課題を解決するための手段】上記目的を達成するため
に本発明は次の構成を採用している。即ち、板材内部に
導電層が形成されてなる複数の電磁波シールド部材の接
続構造であって、該複数の電磁波シールド部材はそれぞ
れ端部に上記導電層の露出部を有し該露出部どうしが導
電性接着剤を用いて接続されてなることを特徴とする電
磁波シールド部材の接続構造を要旨としている。
In order to achieve the above object, the present invention adopts the following constitution. That is, it is a connection structure of a plurality of electromagnetic wave shield members in which a conductive layer is formed inside the plate material, each of the plurality of electromagnetic wave shield members has an exposed portion of the conductive layer at an end, and the exposed portions are electrically conductive. The gist is a connection structure of an electromagnetic wave shield member, which is characterized in that it is connected using a conductive adhesive.

【0008】[0008]

【作用】本発明の電磁波シールド部材の接続構造の場
合、板材内部に導電層が形成されてなる複数の電磁波シ
ールド部材は、端部に有する導電層の露出部が導電性接
着剤により接続されてなる。そのため単に電磁波シール
ド部材の断面を揃えただけでは導電層がずれてしまい、
電気的に接触されない場合であっても、導電性接着剤が
各導電層の電気導通性を確保することになる。このこと
で板材内部に導電層が形成されてなる複数の電磁波シー
ルド部材であっても、所望とする電磁波シールド機能を
果たしつつ容易に接続することが可能となる。
In the electromagnetic wave shield member connection structure of the present invention, the plurality of electromagnetic wave shield members each having the conductive layer formed inside the plate member are formed by connecting the exposed portions of the conductive layers at the ends with the conductive adhesive. Become. Therefore, the conductive layer will be displaced by simply aligning the cross sections of the electromagnetic wave shield member,
Even when not electrically contacted, the conductive adhesive ensures the electrical conductivity of each conductive layer. As a result, even a plurality of electromagnetic wave shield members each having a conductive layer formed inside the plate material can be easily connected while fulfilling a desired electromagnetic wave shield function.

【0009】[0009]

【実施例】以下本発明の実施例を図面に基づき詳細に説
明する。図1は、第1実施例として、電磁波シールド部
材1の接続構造を示している。図に示す通り電磁波シー
ルド板材1は、第1電磁波シールド部材3および第2電
磁波シールド部材5が接続部7により接続されることに
より構成される。
Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 shows a connection structure of an electromagnetic wave shield member 1 as a first embodiment. As shown in the figure, the electromagnetic wave shield plate material 1 is configured by connecting the first electromagnetic wave shield member 3 and the second electromagnetic wave shield member 5 by the connecting portion 7.

【0010】第1電磁波シールド部材3は、第1導電メ
ッシュ31、第1上板材33、第1下板材35等から構
成され、端部に嵌め込み凹部37が設けられている。ま
た第1電磁波シールド部材3の第1導電メッシュ31
は、嵌め込み凹部37に第1露出部39を有しており外
部に露出している。
The first electromagnetic wave shield member 3 is composed of a first conductive mesh 31, a first upper plate member 33, a first lower plate member 35, and the like, and a recess 37 is provided at an end thereof. In addition, the first conductive mesh 31 of the first electromagnetic wave shield member 3
Has a first exposed portion 39 in the fitting recess 37 and is exposed to the outside.

【0011】第1電磁波シールド部材3は、例えば約3
0cm平方の電磁波シールド材である。第1導電メッシ
ュ31は、周知の技術により編まれた導電性メッシュ
(例えば3mm平方、0.02mmの細線)である。こ
れはできる限り細かいメッシュで、細い導電線であるこ
とが望ましい。第1上板材33および第1下板材35は
透明なアクリル樹脂により2色成形法により形成されて
なる。この2色成形法は、まず第1上板材33または第
1下板材35の一方を成形し、第1導電メッシュ31を
配置し、この第1導電メッシュ31が配置された側に第
1上板材33または第1下板材35の他方を成形する。
The first electromagnetic wave shield member 3 is, for example, about 3
It is a 0 cm square electromagnetic wave shield material. The first conductive mesh 31 is a conductive mesh knitted by a known technique (for example, 3 mm square, 0.02 mm thin wire). This is a mesh that is as fine as possible, and it is desirable that it is a thin conductive wire. The first upper plate member 33 and the first lower plate member 35 are made of transparent acrylic resin by a two-color molding method. In this two-color molding method, one of the first upper plate member 33 and the first lower plate member 35 is first molded, the first conductive mesh 31 is arranged, and the first upper plate member is arranged on the side where the first conductive mesh 31 is arranged. 33 or the other of the first lower plate members 35 is molded.

【0012】第2電磁波シールド部材5の構成は、第1
電磁波シールド部材3と同様に、第2導電メッシュ5
1、第2上板材53、第2下板材55等から構成され、
端部に嵌め込み凸部57が設けられている。第2電磁波
シールド部材5の第2導電メッシュ51は、嵌め込み凸
部57に第2露出部59を有しており外部に露出してい
る。成形方法については第1電磁波シールド部材3の場
合と同様である。
The structure of the second electromagnetic wave shield member 5 is the first
As with the electromagnetic wave shield member 3, the second conductive mesh 5
1, a second upper plate member 53, a second lower plate member 55, etc.,
A fitting protrusion 57 is provided at the end. The second conductive mesh 51 of the second electromagnetic wave shield member 5 has the second exposed portion 59 on the fitting convex portion 57 and is exposed to the outside. The molding method is similar to that of the first electromagnetic wave shield member 3.

【0013】接続部7は、さねと溝により第1電磁波シ
ールド部材3の嵌め込み凹部37と第2電磁波シールド
部材5の嵌め込み凸部57とを導電性接着剤により結合
する接続部分である。導電性接着剤が第1導電メッシュ
31の第1露出部39と第2導電メッシュ51の第2露
出部59とを電気的に接触させているので、電磁波シー
ルド部材1の電磁波遮蔽機能が損なわれることがない。
The connecting portion 7 is a connecting portion for connecting the fitting concave portion 37 of the first electromagnetic wave shield member 3 and the fitting convex portion 57 of the second electromagnetic wave shield member 5 by a tongue and groove with a conductive adhesive. Since the conductive adhesive electrically contacts the first exposed portion 39 of the first conductive mesh 31 and the second exposed portion 59 of the second conductive mesh 51, the electromagnetic wave shielding function of the electromagnetic wave shielding member 1 is impaired. Never.

【0014】ここで用いられる導電性接着剤としては、
例えば銀粉などの金属粉を導電性フィラーとしたエポキ
シ樹脂をベースとし、溶剤でペースト化したものであ
り、電気抵抗率は10-2〜10-3Ω・m程度である。こ
の導電性接着剤は、硬化品が導電性を示し且つ被着物に
接着する性質を有するものであり、硬化方式は常温硬化
型、加熱硬化型などがある。また外観を考慮するとより
透明度が高いことが望ましい。板材33,35,53,
55に有色の合成樹脂等を用いた場合は、同じ色の導電
性接着剤を用いればよい。
As the conductive adhesive used here,
For example, it is based on an epoxy resin containing a metal powder such as silver powder as a conductive filler and is pasted with a solvent, and has an electric resistivity of about 10 -2 to 10 -3 Ω · m. The conductive adhesive has a property that a cured product exhibits conductivity and has a property of adhering to an adherend, and a curing method includes a room temperature curing type and a heat curing type. Further, it is desirable that the transparency is higher considering the appearance. Plate materials 33, 35, 53,
When a colored synthetic resin or the like is used for 55, a conductive adhesive of the same color may be used.

【0015】図2は、第1実施例の電磁波シールド部材
1の部分拡大図である。図に示す通り、第1上板材33
および第1下板材35と、第2上板材53および第2下
板材とのそれぞれの厚みが微妙に違うため、単に第1電
磁波シールド部材3および第2電磁波シールド部材5を
揃え、嵌め込み凹部37に嵌め込み凸部57を嵌め込ん
だだけでは、第1導電メッシュ31の第1露出部39と
第2導電メッシュ51の第2露出部59とを電気的に導
通状態とすることができない。しかし接続部7が導電性
接着剤で接続されているため第1導電メッシュ31と第
2導電メッシュ51との電気導通性は確保されている。
FIG. 2 is a partially enlarged view of the electromagnetic wave shield member 1 of the first embodiment. As shown in the figure, the first upper plate member 33
Since the thicknesses of the first lower plate member 35 and the second upper plate member 53 and the second lower plate member are subtly different, the first electromagnetic wave shield member 3 and the second electromagnetic wave shield member 5 are simply aligned and fitted into the fitting recess 37. The first exposed portion 39 of the first conductive mesh 31 and the second exposed portion 59 of the second conductive mesh 51 cannot be electrically connected to each other only by fitting the fitting convex portion 57. However, since the connecting portion 7 is connected by the conductive adhesive, the electrical conductivity between the first conductive mesh 31 and the second conductive mesh 51 is secured.

【0016】図3は、第2実施例の電磁波シールド部材
61を示している。電磁波シールド部材61は第1電磁
波シールド部材63および第2電磁波シールド部材65
の二枚の板材からなる。第1電磁波シールド部材63と
第2電磁波シールド部材65とは接続部67が導電性接
着材で接続されている。第1実施例と異なるのは、第1
電磁波シールド部材63が二枚の導電メッシュ63a,
63bを内部に備えた5層構造で成形されてなり、第2
電磁波シールド部材65が三枚の導電メッシュ65a〜
65cを内部に備えた7層構造で成形されてなる点であ
る。このように電磁波をシールドする機能を高めるため
にシールド部材63,65を多層構造とした場合であっ
ても、接続部67の導電性接着剤により各導電メッシュ
63a,63b,65a〜65cの電気導通性が確保さ
れている。ここでは5層構造の第1電磁波シールド部材
63と7層構造の第2電磁波シールド部材65とを接続
させる実施例を示したが、必要に応じて所望の厚さおよ
び多層構造を採用することができ、いずれの場合でも電
気導通性を確保できる。
FIG. 3 shows an electromagnetic wave shield member 61 of the second embodiment. The electromagnetic wave shield member 61 includes a first electromagnetic wave shield member 63 and a second electromagnetic wave shield member 65.
It consists of two plates. The first electromagnetic wave shield member 63 and the second electromagnetic wave shield member 65 are connected at a connecting portion 67 with a conductive adhesive material. The difference from the first embodiment is that the first
The electromagnetic wave shield member 63 has two conductive meshes 63a,
It is formed by a five-layer structure having 63b inside, and the second
The electromagnetic wave shield member 65 includes three conductive meshes 65a to
It is a point formed by a 7-layer structure having 65c inside. Even when the shield members 63 and 65 have a multi-layered structure in order to enhance the function of shielding electromagnetic waves, the conductive adhesives of the connecting portions 67 are used to electrically connect the conductive meshes 63a, 63b, 65a to 65c. Sex is secured. Although an example in which the first electromagnetic wave shield member 63 having a five-layer structure and the second electromagnetic wave shield member 65 having a seven-layer structure are connected to each other has been shown here, a desired thickness and a multilayer structure may be adopted as necessary. In any case, electrical conductivity can be secured.

【0017】また接続部の形態として第1,2実施例で
は汎用のさねと溝を用いたが、図4に示す通り、さまざ
まな接続形態を採用することができる。例えば、図4
(a)に示すランドをつけたスカーフ型のさねと溝、図
4(b)に示すスカーフ型のさねと溝、図4(c)に示
す接着接合用つき合わせ接合等を用いることができる。
Although the general tongue and groove are used as the form of the connecting portion in the first and second embodiments, various connecting forms can be adopted as shown in FIG. For example, in FIG.
A scarf-shaped tongue and groove with a land shown in (a), a scarf-shaped tongue and groove shown in FIG. 4 (b), and a butt joint for adhesive bonding shown in FIG. 4 (c) can be used. it can.

【0018】以上説明した通り、本実施例の電磁波シー
ルド部材1が採用している接続構造により導電層として
の導電メッシュ31,51の電気導通性を保った状態
で、容易に接続可能となった。そのため予め所定の大き
さに形成された電磁波シールド部材3,5等を接続させ
ることにより、目的に応じた大きさや形状に対する要求
に応え得る汎用性の高い電磁波シールド部材1を形成す
ることが可能となる。
As described above, the connection structure adopted by the electromagnetic wave shield member 1 of the present embodiment enables easy connection while maintaining the electrical conductivity of the conductive meshes 31 and 51 as the conductive layers. . Therefore, it is possible to form a highly versatile electromagnetic wave shield member 1 that can meet the requirements for the size and shape according to the purpose by connecting the electromagnetic wave shield members 3, 5 and the like that are formed in a predetermined size in advance. Become.

【0019】本実施例ではアクリル樹脂を好適な材料と
したが、これは必ずしもアクリル樹脂である必要はなく
周知の合成樹脂の多くのもので成形してもガラス等で成
形しても構わない。尚板材33,35,53,55を形
成する物質として、本実施例のようにアクリル樹脂を用
いると、ガラスを用いて導電性メッシュを組み込んだ場
合に比較して、導電性メッシュの気密性または水密性を
よりよく確保できる。ガラスを用いた場合、気密性また
は水密性を保つことが難しいため通常で3〜5年の使用
耐久性しか得られない。
In this embodiment, an acrylic resin is used as a suitable material, but it is not always required to be an acrylic resin, and it may be molded with many known synthetic resins or glass. When an acrylic resin is used as the material for forming the plate members 33, 35, 53, 55 as in the present embodiment, the airtightness of the conductive mesh is reduced as compared with the case where the conductive mesh is incorporated using glass. Better water tightness can be secured. When glass is used, it is difficult to maintain airtightness or watertightness, and thus, usually only 3 to 5 years of use durability can be obtained.

【0020】またアクリル樹脂を用いているため、遠赤
外線で加熱することでさまざまな曲面を形成することが
容易であり、目的に応じて所望の形状とすることが可能
である。さらにアクリル等の合成樹脂に導電メッシュを
組み込むことで、強度が高くなるという効果もある。ま
た第2実施例に示したように導電メッシュを複数設けた
多層構造とすることも可能であり、より優れた電磁波の
シールド機能を果たすことができる。
Further, since the acrylic resin is used, it is easy to form various curved surfaces by heating with far infrared rays, and a desired shape can be formed according to the purpose. Further, by incorporating a conductive mesh in a synthetic resin such as acrylic, there is also an effect that the strength is increased. Further, as shown in the second embodiment, it is possible to have a multi-layer structure in which a plurality of conductive meshes are provided, and a more excellent electromagnetic wave shielding function can be achieved.

【0021】[0021]

【発明の効果】以上詳述した通り、本発明の電磁波シー
ルド部材の接続構造により、板材の内部に導電層を組み
込むことで形成される複数の電磁波シールド部材を、導
電層の電気導通性を保った状態で、容易に接続可能とな
った。
As described in detail above, the electromagnetic wave shield member connection structure of the present invention allows a plurality of electromagnetic wave shield members formed by incorporating a conductive layer inside a plate member to maintain the electrical conductivity of the conductive layers. It became possible to connect easily in the state.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明第1実施例として電磁波シールド部
材の接続構造を示す説明図である。
FIG. 1 is an explanatory view showing a connection structure of an electromagnetic wave shield member as a first embodiment of the present invention.

【図2】 その電磁波シールド部材の接続構造の一部
拡大図である。
FIG. 2 is a partially enlarged view of the connection structure of the electromagnetic wave shield member.

【図3】 本発明第2実施例として電磁波シールド部
材の接続構造を示す説明図である。
FIG. 3 is an explanatory view showing a connection structure of an electromagnetic wave shield member as a second embodiment of the present invention.

【図4】 他の接続構造を例示する説明図である。FIG. 4 is an explanatory diagram illustrating another connection structure.

【符号の説明】[Explanation of symbols]

1,61・・・電磁波シールド部材、3,63・・・第
1電磁波シールド部材、5,65・・・第2電磁波シー
ルド部材、7,67・・・接続部、31・・・第1導電
メッシュ、33・・・第1上板材、35・・・第1下板
材、37・・・嵌め込み凹部、39・・・第1露出部、
51・・・第2導電メッシュ、53・・・第2上板材、
57・・・嵌め込み凸部、59・・・第2露出部
1, 61 ... Electromagnetic wave shield member, 3, 63 ... First electromagnetic wave shield member, 5, 65 ... Second electromagnetic wave shield member, 7, 67 ... Connection portion, 31 ... First conductivity Mesh, 33 ... First upper plate material, 35 ... First lower plate material, 37 ... Fitting concave portion, 39 ... First exposed portion,
51 ... Second conductive mesh, 53 ... Second upper plate material,
57 ... Fitting convex portion, 59 ... Second exposed portion

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 板材内部に導電層が形成されてなる複数
の電磁波シールド部材の接続構造であって、該複数の電
磁波シールド部材はそれぞれ端部に上記導電層の露出部
を有し該露出部どうしが導電性接着剤を用いて接続され
てなることを特徴とする電磁波シールド部材の接続構
造。
1. A connection structure of a plurality of electromagnetic wave shield members, wherein a conductive layer is formed inside a plate material, wherein each of the plurality of electromagnetic wave shield members has an exposed portion of the conductive layer at an end thereof. A connection structure of an electromagnetic wave shield member, characterized in that they are connected using a conductive adhesive.
【請求項2】 上記板材はアクリル合成樹脂によりな
り、上記導電層は導電性メッシュによりなることを特徴
とする請求項1記載の電磁波シールド部材の接続構造。
2. The electromagnetic wave shield member connection structure according to claim 1, wherein the plate member is made of an acrylic synthetic resin, and the conductive layer is made of a conductive mesh.
JP30246092A 1992-11-12 1992-11-12 Connection structure of electromgnetic wave shielding member Pending JPH06152180A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30246092A JPH06152180A (en) 1992-11-12 1992-11-12 Connection structure of electromgnetic wave shielding member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30246092A JPH06152180A (en) 1992-11-12 1992-11-12 Connection structure of electromgnetic wave shielding member

Publications (1)

Publication Number Publication Date
JPH06152180A true JPH06152180A (en) 1994-05-31

Family

ID=17909214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30246092A Pending JPH06152180A (en) 1992-11-12 1992-11-12 Connection structure of electromgnetic wave shielding member

Country Status (1)

Country Link
JP (1) JPH06152180A (en)

Similar Documents

Publication Publication Date Title
US5524908A (en) Multi-layer EMI/RFI gasket shield
US8502080B2 (en) Flexible printed circuit board with waterproof structure
JPH07302318A (en) Card type electronic device
JPH02103808A (en) Beltlike cable
CN114072867A (en) Display module and display device
CN211742083U (en) Intelligent blackboard adopting zero laminating technology
KR20190060627A (en) EMI Gasket
WO2025237057A1 (en) Display module and display device
JP2904952B2 (en) Connection structure of conductive members
TW201517703A (en) Side-rim waterproof structure of flexible printed circuit board
JPH09307263A (en) Electromagnetic wave shielding gasket
CN210579421U (en) Flexible circuit board
JP2009117470A (en) Soft electric conductor
JPH02244788A (en) Circuit substrate
CN102403057B (en) Flexible flat cable with waterproof structure
JPH09323372A (en) FRP structure and method of manufacturing the same
JP4767494B2 (en) Electromagnetic wave shielding method and electromagnetic wave shielding window, manufacturing apparatus equipped with electromagnetic wave shielding window, transport equipment equipped with electromagnetic wave shielding window, and building structure equipped with electromagnetic wave shielding window
JPH1041679A (en) Electromagnetic wave shielding material and enclosure for electronic component
JPS61127197A (en) Plastic housing having electromagnetic wave shielding property
JPH07111371A (en) Flexible printed circuit board
JP2590341Y2 (en) Electromagnetic wave shielding gasket
CN217444175U (en) Electronic device protective belt and interactive flat plate
JPH05304387A (en) Flexible shielding sheet
JPH0231795Y2 (en)
CN118678529B (en) Flexible printed circuit board with electromagnetic shielding and its manufacturing method