JPH06152191A - Component mounting equipment - Google Patents

Abstract

PURPOSE:To surely select a system whose working time is short, by always comparing a step and repeat system with a pattern repeat system. CONSTITUTION:A, B, C and D are small board patterns which are arranged on a multiple pattern board. The same components are mounted on the same positions of the small board patterns A-D. In a step and repeat system, components are mounted on the position 1 in each of the small board patterns, in the order of A, B, C and D. Next, returning A, a component is mounted on the position 2. After the mounting on the position 2 is ended as far as the pattern D, the mounting work is returned to A, and the component mounting on the position 3 is started. In a pattern repeat system, all mounting steps are executed in the pattern A, and components are mounted on all mounting positions 1, 2, 3. After that, the working is started in the pattern B, and the work is progressed in order of the patterns C and D. The mounting times of both systems are obtained by simulation, and the system whose mounting time is shorter is automatically selected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board used for electronic equipment, which is of a type that is divided into a plurality of small boards after mounting the parts, that is, a device for mounting the parts on a multi-sided board.

[0002]

2. Description of the Related Art It is now widely practiced to make a plurality of small board patterns on one board, mount the components, and then divide the board to obtain a plurality of small boards. Examples appearing in the literature include Japanese Patent Laid-Open Nos. 64-47100 and 1-103.
709, JP-A-1-105600, and JP-A 1-212498.

[0003]

There are two methods for assembling the mounting sequence when mounting the components on the multi-chamber substrate. One is a method in which a specific mounting step is applied to all the small board patterns, and after the step is completed, the next mounting step is performed, which is called a step and repeat system. The second is a method of performing all the mounting steps for one small board pattern and moving to the next small board pattern after the completion of all the mounting steps, which is called a pattern repeat method. Both methods have advantages and disadvantages. For example, if the lineup of mounted parts includes parts that require the board to move at a low speed after mounting (low-speed parts), the pattern repeat method allows low speed parts to be added to the first small board pattern. After mounting the board, the XY table on which the board is mounted must be operated at a much lower speed, and the board may be moved at a high speed when processing the remaining small board patterns (high-speed parts). Even if there are more and more steps to put on, you can't take advantage of it. On the other hand, in the case of the step-and-repeat method, high-speed components can be mounted first, and then low-speed components can be collectively mounted, so there is no such loss. On the other hand, if the pattern of the small board is large,
The step-and-repeat method is a loss because it takes time to move from the pattern to the pattern. There was no standard to easily decide which was better, and process managers had to make a tough choice each time they encountered a new substrate.

[0004]

SUMMARY OF THE INVENTION In the present invention, the mounting time when mounted by the step-and-repeat method and the mounting time when mounted by the pattern repeat method are obtained by simulation. Compared with, the method with the shorter time is automatically selected.

[0005]

Since the mounting times by both methods are obtained by simulation and compared, the method with the shorter time is surely selected.

[0006]

Embodiment An embodiment will be described with reference to the drawings. The component mounting apparatus 10 of FIG. 3 has the components laid out as shown in FIG. In FIG. 4, 12 is a suction device, 14 is a component supply device, 16 is a supply-side substrate transfer device, 18 is a storage-side substrate transfer device, and 20 is a substrate positioning device. The substrate positioning device 20 is mainly composed of an XY table, and is connected to the substrate (multi-chamber substrate) from the supply-side substrate transfer device 16.
22 is received, and the component mounting locations of the substrate 22 are sequentially positioned at the work points. After mounting all the required components, the board positioning device 20 delivers the board 22 to the storage-side board transfer device 18.

The component supply device 14 is formed by arranging a plurality of component supply units 26 on a movable support base 24 which moves linearly. Tape, magazines, bulk hoppers, etc. are currently widely used as a component supply system, but any of them may be used. The suction device 12 is provided with a plurality of mounting heads on the peripheral edge of the rotary index table, but since this configuration is well known, detailed description thereof will be omitted.

FIG. 5 shows a control system of the component mounting apparatus 10. Reference numeral 30 is a control unit including an arithmetic processing unit 32 and a memory 34. The control unit 30 includes a suction device 12, a component supply device 14, a supply-side substrate transfer device 16, a storage-side substrate transfer device 18, a substrate positioning device 20, a component position regulating device 36, a data input unit 38, and a key. A board 40 is connected via an input / output interface 42.

The pattern of component mounting by the step-and-repeat method will be described with reference to FIG. In the figure, A, B, C, and D are small board patterns arranged in a "T" shape on the multi-chambered board. Small board pattern A,
B, C, and D have the same standard, and the same type of component is mounted at the same position. Reference numerals 1, 2, and 3 indicate component mounting positions. In the first mounting step, components are mounted in position A in each small board pattern in the order of A, B, C, and D. The second mounting step returns to A again to start the part to position 2. After completing the parts mounting to position 2 up to pattern D,
Moving to the third mounting step, the process returns to A and the component mounting at position 3 is started.

Next, the pattern of component mounting by the pattern repeat system will be described with reference to FIG. First, the small board pattern
In step A, all mounting steps are performed, and mounting position 1,
All parts are attached to a few. After that, small board pattern
The work is started for B, and then the small board pattern C and the small board pattern D are sequentially processed.

When the work specifications (small board pattern size and layout, component type and mounting position, etc.) are input from the data input unit 38, the component mounting apparatus 10 steps through the work. The control unit 30 determines the mounting time when the and repeat method is used and when the pattern repeat method is used.
Simulate and calculate each time.
Compare the results and choose the method that takes less time.
The flow of work is as shown in FIG.

[0012]

According to the present invention, the step-and-repeat
A comparison between the print method and the pattern repeat method is always performed, and the method that requires less work time is surely selected.

[Brief description of drawings]

FIG. 1 is a top view of a multi-panel board showing a component mounting procedure by a step-and-repeat method.

FIG. 2 is a top view of a multi-sided printed circuit board showing a component mounting procedure by a pattern repeat system.

FIG. 3 is a perspective view of a component mounting device.

FIG. 4 is a diagram showing a layout of components of the component mounting apparatus.

FIG. 5 is a block diagram showing a control system of the component mounting apparatus.

FIG. 6 is a flowchart for determining a mounting method.

[Explanation of symbols]

 22 Multi-Chamfering Board A Small Board Pattern B Small Board Pattern C Small Board Pattern D Small Board Pattern

Claims (1)

[Claims] 1. When a component is mounted on a multi-sided board that is divided into a plurality of small boards after component mounting, a specific mounting step is applied to all small board patterns, and after that step is completed. Move to the next mounting step, the mounting time when mounting by the step-and-repeat method and all the mounting steps for one small board pattern, and after the completion of all the mounting steps, the next small board pattern Move to the pattern
The component mounting apparatus is characterized in that the mounting time when mounted by the repeat method is obtained by simulation, and the two methods are compared and the method with the shorter time is automatically selected.