JPH06155293A - Grinding working method for workpiece and device therefor - Google Patents

Grinding working method for workpiece and device therefor

Info

Publication number
JPH06155293A
JPH06155293A JP34162192A JP34162192A JPH06155293A JP H06155293 A JPH06155293 A JP H06155293A JP 34162192 A JP34162192 A JP 34162192A JP 34162192 A JP34162192 A JP 34162192A JP H06155293 A JPH06155293 A JP H06155293A
Authority
JP
Japan
Prior art keywords
grinding
abrasive grains
liquid passage
grindstone
cooling medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP34162192A
Other languages
Japanese (ja)
Inventor
Yasushi Onishi
康司 大西
Kazuya Taji
和也 田路
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Sumitomo Special Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Special Metals Co Ltd filed Critical Sumitomo Special Metals Co Ltd
Priority to JP34162192A priority Critical patent/JPH06155293A/en
Publication of JPH06155293A publication Critical patent/JPH06155293A/en
Pending legal-status Critical Current

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  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

PURPOSE:To provide the cutting and grinding work for ceramics, metal, plastics or the composite body of these materials, with high quality and high efficiency, in the cutting and grinding work by using a rotary grinding wheel which is formed trough metal-bonding the diamond abrasive grains thereon. CONSTITUTION:A flange part 2 and a cylinder part 3 having a small diameter are coaxially arranged on one edge side, and a ring shaped working rotary grinding wheel 10 is insertion-fitted into the cylinder part 3 of a fixing flange member 1 which is fixed on a rotary shaft 5 by a bolt, and fixed by a tightening metal fitting 7 screwed with the outer peripheral surface of the cylinder part through a tightening flange 6, and liquid flow grooves 11 are arranged at a place or plural places ranging from the center side to the circumference edge surface on both the surfaces of the grinding wheel 10. The liquid flow grooves are connected to a cooling medium feeding source through a liquid flow hole 4 formed on the cylinder part 3, and the cooling medium mixed with the fine isolated abrasive grains having an average particle diameter of 0.005-50mum is jetted to the contact part of a workpiece 20 by the centrifugal force in revolution.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、セラミックス、金属
及び合金あるいはプラスチック及びこれらの複合体を、
砥粒を塗布固着した加工用回転砥石を有する研削加工装
置で研削加工する方法の改良に係り、回転砥石の砥粒を
塗布固着した円周端面に通液溝を設けて特定の微細遊離
砥粒を混入した冷却媒体を接触加工作業点に供給可能と
なし、高品質かつ高能率の研削加工を実現した被加工材
の研削加工法とその装置に関する。
This invention relates to ceramics, metals and alloys or plastics and composites thereof,
According to the improvement of the method of grinding with a grinding machine that has a rotating grindstone for coating with adhered abrasive grains, a specific fine free abrasive grain is provided by providing a liquid passage groove on the circumferential end surface where the abrasive grains of the rotary grindstone are coated and adhered. TECHNICAL FIELD The present invention relates to a grinding method of a work material and a device therefor capable of supplying a cooling medium mixed with iron to a working point of contact processing and realizing high-quality and high-efficiency grinding.

【0002】[0002]

【従来の技術】従来、Al23系あるいはZrO2系等
の磁気ヘッド用基板、あるいはディスプレイや光シャッ
ターに用いられるPLZTのような光学セラミックス、
または希土類磁石等の磁性金属製品等の被加工材は、粉
末冶金法により、原料粉末を成形、焼結して製造される
が、複雑な形状製品や寸法精度の厳しい製品では、最終
形状寸法に製造することが困難である場合が多く、その
ため、素材の一部またはは全面を切削、研削等の成形加
工が施される。
2. Description of the Related Art Conventionally, Al 2 O 3 based or ZrO 2 based substrates for magnetic heads, or optical ceramics such as PLZT used for displays and optical shutters,
Alternatively, work materials such as magnetic metal products such as rare earth magnets are manufactured by molding and sintering raw material powders by the powder metallurgy method. In many cases, it is difficult to manufacture, and therefore, a part or the whole surface of the material is subjected to forming processing such as cutting or grinding.

【0003】前記被加工材の成形加工は、一般にダイヤ
モンド砥粒をメタルボンドした回転砥石が広く用いら
れ、被加工材に砥粒面を回転接触させて研削加工する。
Generally, a rotary grindstone in which diamond abrasive grains are metal-bonded is widely used for forming the workpiece, and the abrasive grain surface is brought into rotary contact with the workpiece to perform grinding.

【0004】[0004]

【発明が解決しようとする課題】ダイヤモンド砥粒をメ
タルボンドした回転砥石は、切削、研削等加工の進行に
伴い、砥粒の目潰れ、目詰まりを生じ、チッピング、加
工変質層を生じ、そのため切削、研削作業を中断して、
機械的にドレッシングする必要がある。
The rotary grindstone to which the diamond abrasive grains are metal-bonded, the abrasive grains are crushed or clogged with the progress of machining such as cutting and grinding, resulting in chipping and process-altered layers. Interrupt the cutting and grinding work,
Needs to be dressed mechanically.

【0005】また、ダイヤモンド砥粒の砥粒粒度が小さ
く、単位時間当りの切削、研削量が多い程、砥石の目潰
れ、目詰まりは顕著となり、ドレッシング時間及び付帯
作業が増加して、生産性を阻害する問題があった。
Further, the smaller the abrasive grain size of the diamond abrasive grains and the larger the amount of cutting and grinding per unit time, the more the grinding stones are crushed and clogged, and the dressing time and incidental work are increased to increase the productivity. There was a problem that hindered.

【0006】この発明は、従来のダイヤモンド砥粒をメ
タルボンドした回転砥石による切削、研削加工法のかか
る問題点を解決し、セラミックス、金属及びプラスチッ
ク又はこれらの複合体等の高品質且つ高能率の切削、研
削加工が可能な研削方法とその装置の提供を目的として
いる。
The present invention solves the above problems of the conventional method of cutting and grinding with a rotary grindstone in which diamond abrasive grains are metal-bonded, and has high quality and high efficiency of ceramics, metals and plastics or composites thereof. The purpose of the present invention is to provide a grinding method capable of cutting and grinding and a device therefor.

【0007】[0007]

【課題を解決するための手段】この発明は、円周端面及
び所要部に砥粒を塗布固着した加工用回転砥石を有する
研削加工装置を回転させ、被加工材に砥粒面を回転接触
させて研削加工する被加工材の研削加工法において、加
工用回転砥石の中心側から円周端面への1ヶ所あるいは
複数ヶ所の通液溝を片面または両面に配設し、該通液溝
へ連通する通液孔を研削加工装置内に配置しかつ冷却媒
体の供給源に接続し、回転砥石の回転時の遠心力により
前記通液溝より平均粒径0.005μm〜50μmの微
細遊離砥粒を混入した冷却媒体を噴射しながら被加工材
を研削することを特徴とする被加工材の研削加工法であ
る。
SUMMARY OF THE INVENTION The present invention rotates a grinding machine having a rotating grindstone for processing in which abrasive grains are applied and fixed to the circumferential end surface and a required portion, and the abrasive grain surface is brought into rotary contact with a workpiece. In the grinding method of the workpiece to be ground, one or more liquid passage grooves from the center side of the rotating grindstone for processing to the circumferential end surface are arranged on one side or both sides and communicated with the liquid passage groove. The liquid passing holes are arranged in the grinding apparatus and connected to the supply source of the cooling medium, and the fine free abrasive grains having an average particle diameter of 0.005 μm to 50 μm are discharged from the liquid passing groove by the centrifugal force during the rotation of the rotary grindstone. It is a method of grinding a work material, characterized in that the work material is ground while jetting a mixed cooling medium.

【0008】また、この発明は、一方端側にフランジ部
とそれより小径の円筒部を同軸配置した固定用フランジ
部材の他方端に回転軸を固着して回転自在に支持し、固
定用フランジ部材の円筒部に円周端面及び所要部に砥粒
を塗布固着したリング状の加工用回転砥石を嵌挿通し、
さらにリング状締付けフランジを介して円筒部外周面に
螺合する締付金具にて該回転砥石を固定する構成からな
り、該回転砥石の中心側から円周端面への1ヶ所あるい
は複数ヶ所の通液溝が片面または両面に配設され、該通
液溝へ連通する通液孔を研削加工装置内に配置し、回転
砥石の回転時の遠心力により前記通液溝より平均粒径
0.005μm〜50μmの微細遊離砥粒を混入した冷
却媒体を噴射可能にしたことを特徴とする被加工材の研
削加工装置である。
According to the present invention, a fixing flange member having a flange portion and a cylindrical portion having a diameter smaller than that coaxially arranged on one end side is fixed to the other end to rotatably support a rotary shaft, and the fixing flange member. Insert the ring-shaped rotating grindstone with abrasive grains applied and fixed to the circumferential end surface and the required part on the cylindrical part of
Further, the rotary grindstone is fixed by a clamp fitting that is screwed onto the outer peripheral surface of the cylindrical portion via a ring-shaped tightening flange, and one or more passages from the center side of the rotary grindstone to the circumferential end surface are provided. The liquid groove is provided on one side or both sides, and the liquid passage hole communicating with the liquid passage groove is arranged in the grinding processing device, and the average particle diameter is 0.005 μm from the liquid passage groove due to the centrifugal force during the rotation of the rotary grindstone. A grinding processing apparatus for a work material, characterized in that a cooling medium mixed with fine free abrasive grains of ˜50 μm can be jetted.

【0009】この発明において、被加工材としてはAl
23系、ZrO2系等の磁気ヘッド用基板やPLZT等
の光学セラミックス又は希土類磁石等の金属、合金、あ
るいはプラスチックス板及びこれらの複合体等、切削や
研削を必要とする材料の全てを包含する。また、加工用
回転砥石の砥粒には、硬質の砥粒であればいずれのもの
でもよいが、一般に平均粒度1μm〜200μmのダイ
ヤモンド砥粒を所要面にメタルボンドして塗布固着した
回転砥石が好ましい。
In the present invention, the material to be processed is Al
All materials that require cutting and grinding, such as magnetic head substrates such as 2 O 3 and ZrO 2 systems, optical ceramics such as PLZT, metals and alloys such as rare earth magnets, plastics plates and composites thereof. Includes. Further, as the abrasive grains of the processing rotary grindstone, any one may be used as long as it is a hard abrasive grain, but in general, a rotary grindstone in which diamond abrasive grains having an average grain size of 1 μm to 200 μm are metal-bonded to a required surface and applied and fixed is used. preferable.

【0010】この発明において、冷却媒体としては水、
有機溶媒が好ましく、又冷却媒体に混入する遊離砥粒と
しては平均粒径0.005μm〜50μmのSiO2
Al23、MgO、CeO2、ダイヤモンド微粉を1w
t%〜20wt%混入することが好ましい。遊離砥粒の
平均粒径は砥石を構成する砥粒の平均粒度に対して1/
2〜1/200程度が好ましい。この発明において、冷
却媒体への遊離砥石の混入量が1wt%未満では遊離砥
粒の混入効果が得られず、また20wt%を超えるとフ
ランジのバランスが得られ難く、沈殿粒により冷却媒体
の供給部がつまる恐れがあり、好ましくない。さらに冷
却媒体の噴射量は砥石粒度、切り込み深さ、送り速度等
の研削条件や研削目的によって大きく変動するので、研
削条件、研削目的によって適宜選定すればよい。
In the present invention, water is used as the cooling medium,
An organic solvent is preferable, and free abrasive grains mixed in the cooling medium include SiO 2 having an average particle size of 0.005 μm to 50 μm,
Al 2 O 3 , MgO, CeO 2 , diamond fine powder 1w
It is preferable to mix t% to 20 wt%. The average particle size of loose abrasive grains is 1 / the average particle size of the abrasive grains that make up the grindstone.
It is preferably about 2 to 1/200. In the present invention, if the amount of the free grindstone mixed into the cooling medium is less than 1 wt%, the effect of mixing the free abrasive grains cannot be obtained, and if it exceeds 20 wt%, it is difficult to obtain the balance of the flange, and the precipitation grains cause the supply of the cooling medium. This is not preferable because it may clog the parts. Further, the injection amount of the cooling medium greatly varies depending on the grinding conditions such as the grindstone grain size, the cutting depth, and the feed rate, and the purpose of grinding, so it may be appropriately selected depending on the grinding condition and purpose of grinding.

【0011】この発明による研削加工装置の一例を図1
に基づいて詳述する。軸芯部を回転軸5にボルト止めさ
れた固定用フランジ部材1は、一方端側にフランジ部2
とそれより小径の円筒部3を同軸配置した構成からな
り、回転軸は図示しないモーターにて回転駆動される。
固定用フランジ部材1の円筒部3に円周端面及び所要部
に砥粒を塗布固着したリング状の加工用回転砥石10を
嵌挿通し、さらにリング状締付けフランジ6を介して円
筒部外周面に螺合する締付金具7にて該回転砥石1を固
定する構成からなる。加工用回転砥石10には、その両
面に中心側から円周端面へ達する1ヶ所あるいは複数ヶ
所の通液溝11が配設され、該通液溝11と円筒部3に
設けた通液孔4とが連通し、通液孔4は円筒部3内で図
示しない冷却媒体の供給源と接続される。以上の構成に
より、該回転砥石10の回転時の遠心力にて、平均粒径
0.005μm〜50μmの微細遊離砥粒を混入した冷
却媒体が供給源から通液孔4を通り前記通液溝11より
噴射される。
An example of a grinding apparatus according to the present invention is shown in FIG.
Based on. The fixing flange member 1 having the shaft core portion bolted to the rotary shaft 5 has a flange portion 2 on one end side.
And a cylindrical portion 3 having a smaller diameter than that, arranged coaxially, and the rotation shaft is driven to rotate by a motor (not shown).
A ring-shaped processing grindstone 10 having abrasive grains applied and fixed to the circumferential end surface and a required portion is inserted into the cylindrical portion 3 of the fixing flange member 1, and further, the ring-shaped tightening flange 6 is provided to the outer peripheral surface of the cylindrical portion. The rotary whetstone 1 is fixed by a tightening metal fitting 7 that is screwed. The machining rotary grindstone 10 is provided with one or a plurality of liquid passage grooves 11 extending from the center side to the circumferential end face on both surfaces thereof, and the liquid passage groove 11 and the liquid passage holes 4 provided in the cylindrical portion 3. , And the liquid passage hole 4 is connected to a supply source of a cooling medium (not shown) in the cylindrical portion 3. With the above configuration, the cooling medium mixed with the fine free abrasive grains having an average particle size of 0.005 μm to 50 μm passes from the supply source through the liquid passage hole 4 by the centrifugal force during the rotation of the rotary grindstone 10 and the liquid passage groove. It is jetted from 11.

【0012】この発明による研削加工装置の加工用回転
砥石10を回転させながら移送する被加工材20表面に
接触し、加工作業点に対して、特定の平均粒径の遊離砥
粒を混入した冷却媒体を噴射して研削するが、通常、外
部ノズル30により加工用回転砥石10と被加工材20
の接触部に向かって冷却媒体を噴射する必要はないが、
研削条件によっては、切削、研削に伴う回転砥石1の発
熱防止と共にから回転砥石1の砥粒の脱落防止及び異常
磨耗を抑制できると共に切削焼け、チッピング発生及び
加工変質層生成防止のため、外部ノズル30より該接触
部に向かって冷却媒体を噴射することが好ましい。
Cooling in which free grinding particles having a specific average particle diameter are mixed with respect to the processing work point by coming into contact with the surface of the workpiece 20 to be transferred while rotating the processing rotary grindstone 10 of the grinding apparatus according to the present invention. The medium is jetted to grind, but normally, the rotating grindstone 10 for processing and the workpiece 20 are processed by the external nozzle 30.
It is not necessary to inject the cooling medium toward the contact part of
Depending on the grinding conditions, in addition to preventing heat generation of the rotary grindstone 1 due to cutting and grinding, it is possible to prevent the abrasive grains of the rotary grindstone 1 from falling off and to suppress abnormal wear, and to prevent cutting burn, chipping occurrence and work-affected layer formation, an external nozzle. It is preferable to inject the cooling medium from 30 toward the contact portion.

【0013】[0013]

【作用】発明者は従来の切削、研削法の問題点を解決す
るために種々検討した結果、加工砥石を構成する砥粒と
被加工材とが干渉する加工作業点に冷却媒体を強制的に
供給するための特殊構造の研削工具を知見したもので、
前記研削加工装置を用いて、冷却媒体中に特定の平均粒
度を有する微細な遊離砥粒を混入して、前記加工作業点
に噴射冷却し、また、必要に応じて加工用回転砥石と被
加工材との接触部に外部ノズルより、冷却水あるいは有
機溶媒または前記研削加工装置より噴射の同一の冷却媒
体を噴射することにより、切削、研削により発熱のため
砥石を構成する砥粒の脱粒及び異常磨耗を抑制できると
共に研削焼けやチッピング、加工変質層の生成を極力減
少して、高能率に切削、研削等の加工をすることができ
る。
As a result of various studies to solve the problems of the conventional cutting and grinding methods, the inventor forced the cooling medium to the working point where the abrasive grains forming the working grindstone interfere with the workpiece. We have found a specially designed grinding tool for supply,
By using the grinding apparatus, fine free abrasive grains having a specific average particle size are mixed in a cooling medium, and are jet-cooled to the working point, and, if necessary, a rotary grindstone for processing and a workpiece. By spraying cooling water or organic solvent or the same cooling medium sprayed from the grinding machine from an external nozzle to the contact part with the material, the abrasive grains constituting the grindstone are exfoliated and abnormal due to heat generation by cutting and grinding. It is possible to suppress abrasion, reduce grinding burn, chipping, and generation of a work-affected layer as much as possible, and perform processing such as cutting and grinding with high efficiency.

【0014】特に、この発明においては、研削工具より
噴射の冷却媒体中に混入の微細な遊離砥粒により、砥石
を構成する砥粒の突出量を見掛け上小さくでき、砥石内
のボンド材は加工中に研削力に応じて、適宜、削り取る
ための砥粒突出量を一定に保つ効果があると共に、砥石
ボンド材や切り屑が砥石表面に付着することを防止でき
る効果がある。
In particular, according to the present invention, the amount of protrusion of the abrasive grains constituting the grindstone can be apparently reduced by the fine free abrasive grains mixed in the cooling medium sprayed from the grinding tool, and the bond material in the grindstone is processed. According to the grinding force, there is an effect that the amount of protrusion of the abrasive grains for shaving is appropriately kept constant, and an effect that the grindstone bond material and chips are prevented from adhering to the grindstone surface.

【0015】[0015]

【実施例】【Example】

実施例1 前述した図1のこの発明による研削加工装置を用い、被
加工材として寸法長さ40mm×幅40mm×厚2.8
mmのAl2370原子%−Tic30原子%からなる
セラミックス板に溝深さ1.0mm×溝幅1.2mmの
溝加工を行った。その時の加工用回転砥石は砥粒として
平均粒径20μmのダイヤモンド砥粒を用い、リング状
の寸法外径100mm×内径50mm×厚み1.2mm
であった。加工用回転砥石の端面に幅4.0mm×深さ
0.3mmの通液溝を各々6ヶ所配没した。加工用回転
砥石の回転数8000rpm、被加工材の移動速度20
mm/minにて接触させ、平均粒径3μmのSiO2
微粉を遊離砥粒としてを冷却水に5wt%混入した冷却
媒体を加工作業点に1.5l/minの流量で噴射する
と共に外部ノズルより、砥石と被加工材の接触部に流量
4l/minにて噴射しながら研削加工を行った。得ら
れた溝部にはチッピングは発生せず、また研削の進行に
伴う研削抵抗値の増加が抑制され、ドレッシングインタ
ーバルを長くすることができた。研削の進行に伴う砥石
表面状況を観察した結果、砥石内のボンド剤による目潰
れもなく、砥粒の突出が一定に保たれた。
Example 1 Using the grinding apparatus according to the present invention shown in FIG. 1 as described above, as a material to be processed, a dimension length 40 mm × width 40 mm × thickness 2.8.
A ceramic plate composed of 70 atomic% of Al 2 O 3 and 30 atomic% of Tic was processed to have a groove depth of 1.0 mm and a groove width of 1.2 mm. The rotary grindstone for processing at that time uses diamond abrasive grains having an average particle diameter of 20 μm as the abrasive grains, and has a ring-shaped dimension of outer diameter 100 mm × inner diameter 50 mm × thickness 1.2 mm.
Met. Six liquid passages each having a width of 4.0 mm and a depth of 0.3 mm were submerged in the end face of the rotary grindstone for processing. Rotational speed of rotating grindstone for processing 8000 rpm, moving speed of workpiece 20
SiO 2 with an average particle size of 3 μm
Coolant mixed with 5 wt% of fine powder as free abrasive grains in cooling water is jetted to the working point at a flow rate of 1.5 l / min, and a flow rate of 4 l / min from the external nozzle to the contact area between the grindstone and the workpiece. Grinding was performed while spraying. No chipping occurred in the obtained groove portion, and an increase in grinding resistance value with the progress of grinding was suppressed, and the dressing interval could be lengthened. As a result of observing the surface condition of the grindstone as the grinding progressed, the protrusion of the abrasive grains was kept constant without any crushing by the bonding agent in the grindstone.

【0016】実施例2 前述した図1のこの発明による研削加工装置を用い、被
加工材としてPLZT材(62ZrO2−38TiO2
9LaO−91PbO2)の寸法長さ100mm×幅50
mm×厚み0.5mmの試験片に溝深さ120μm、溝
幅0.6mmの溝加工を行った。その時の加工用回転砥
石は砥粒として平均粒径20μmのダイヤモンド砥粒を
用い、リング状の寸法外径100mm×内径50mm×
厚み0.6mmであった。加工用回転砥石の端面に幅
4.0mm×深さ0.2mmの通液溝を各々6ヶ所配没
した。加工用回転砥石の回転数30000rpm、被加
工材の移動速度は300mm/minにて接触させ、平
均粒径3μmのSiO2微粉を遊離砥粒としてを冷却水
に5wt%混入した冷却媒体を加工作業点に1l/mi
nの流量で噴射すると共に外部ノズルより、砥石と被加
工材の接触部に流量1l/minにて噴射しながら研削
加工を行った。得られた被加工材の溝部にはチッピング
は発生せず、また研削溝の底部及び側部に発生した加工
歪層は少なく、また砥石表面状況は加工進行後も、初期
状況と変化がなかった。
[0016] using a grinding machining apparatus according to the present invention of Figure 1 Example 2 described above, PLZT material as a workpiece (62ZrO 2 -38TiO 2 -
Dimensions of 9LaO-91PbO 2) length 100 mm x width 50
A groove having a groove depth of 120 μm and a groove width of 0.6 mm was processed on a test piece having a size of mm × 0.5 mm. At that time, the rotary grindstone for processing uses diamond abrasive grains having an average particle diameter of 20 μm as abrasive grains, and has a ring-shaped dimension of outer diameter 100 mm × inner diameter 50 mm ×
The thickness was 0.6 mm. Six liquid passage grooves each having a width of 4.0 mm and a depth of 0.2 mm were submerged in the end face of the rotary grindstone for processing at 6 positions. The rotation speed of the rotating grindstone for processing is 30,000 rpm, the moving speed of the work material is 300 mm / min, and the cooling medium is made by mixing 5 wt% of SiO 2 fine powder with an average particle diameter of 3 μm as free abrasive particles into cooling water. 1 l / mi to the point
Grinding was performed while spraying at a flow rate of n and spraying from an external nozzle to the contact portion between the grindstone and the workpiece at a flow rate of 1 l / min. No chipping occurred in the groove portion of the obtained work material, and there were few processing strain layers generated in the bottom and side portions of the grinding groove, and the grindstone surface condition did not change from the initial condition even after the processing progressed. .

【0017】実施例3 前述した図1のこの発明による研削加工装置を用い、被
加工材として、Nd15at%−B7at%−Fe残系
磁石の寸法長さ10mm×幅20mm×厚み20mmの
試験片に溝深さ10mm溝幅1.2mmの溝加工を行っ
た。その時の加工用回転砥石は砥粒として平均粒径40
μmのダイヤモンド砥粒を用い、リング状の寸法外径1
00mm×内径50mm×厚み1.2mmであった。加
工用回転砥石の端面に幅4.0mm×深さ0.2mmの
通液溝を各々6ヶ所配没した。加工用回転砥石の回転数
8000rpm、被加工材の移動速度は10m/min
にて平均粒径3μmのSiO2微粉を遊離砥粒としてを
冷却水に5wt%混入した冷却媒体を加工作業点に5l
/minの流量で噴射すると共に外部ノズルより、砥石
と被加工材の接触部に流量20l/minにて噴射しな
がら研削加工を行った。得られた被加工材の溝部は、チ
ッピングの発生がなく、研削の進行に伴う研削焼付けや
研削抵抗値の急激な増加がなく、又砥石表面には被加工
材の切り屑が付着しておらず、安定した加工の維持がで
きた。
Example 3 Using the grinding apparatus according to the present invention shown in FIG. 1 as described above, a test piece of Nd15at% -B7at% -Fe residual magnet having a length of 10 mm, a width of 20 mm and a thickness of 20 mm was used as a material to be processed. A groove having a groove depth of 10 mm and a groove width of 1.2 mm was processed. The rotating grindstone for processing at that time has an average grain size of 40 as abrasive grains.
Ring-shaped outer diameter 1 using diamond abrasive grains of μm
It was 00 mm × inner diameter 50 mm × thickness 1.2 mm. Six liquid passage grooves each having a width of 4.0 mm and a depth of 0.2 mm were submerged in the end face of the rotary grindstone for processing at 6 positions. The rotation speed of the processing grindstone is 8000 rpm, and the moving speed of the workpiece is 10 m / min.
At 5 liters, a cooling medium containing 5 wt% of SiO 2 fine powder with an average particle diameter of 3 μm as free abrasive grains in cooling water was added to the working point.
Grinding was performed while jetting at a flow rate of / min and jetting at a flow rate of 20 l / min from the external nozzle to the contact portion between the grindstone and the workpiece. The groove of the obtained work material did not cause chipping, there was no grinding baking or sharp increase in grinding resistance value with the progress of grinding, and the chips of the work material did not adhere to the grindstone surface. In other words, stable processing could be maintained.

【0018】[0018]

【発明の効果】この発明は、冷却媒体中に特定の平均粒
度を有する微細な遊離砥粒を混入して、加工用回転砥石
の円周端面より加工用回転砥石と被加工材との接触部に
噴射冷却し、また、必要に応じて加工用回転砥石と被加
工材との接触部に外部ノズルより、冷却水あるいは有機
溶媒または前記研削加工装置より噴射の同一の冷却媒体
を噴射することにより、切削、研削により発熱のため砥
石を構成する砥粒の脱粒及び異常磨耗を抑制できると共
に研削焼けやチッピング、加工変質層の生成を極力減少
して、高能率に切削、研削等の加工をすることができ
る。
According to the present invention, fine free abrasive grains having a specific average particle size are mixed in a cooling medium, and a contact portion between a rotary grinding stone for machining and a work material is contacted from a circumferential end surface of the rotary grinding stone for machining. By spray cooling to, and, if necessary, by spraying the same cooling medium of cooling water or an organic solvent or the above grinding machine from the external nozzle to the contact portion between the processing grindstone and the workpiece. Since the heat generated by cutting and grinding can suppress the shedding and abnormal wear of the abrasive grains that make up the grindstone, grinding burn and chipping, and the generation of work-affected layers can be reduced as much as possible to perform cutting and grinding with high efficiency. be able to.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明による研削加工装置の一例を示す一部
縦断説明図である。
FIG. 1 is a partially longitudinal explanatory view showing an example of a grinding apparatus according to the present invention.

【符号の説明】[Explanation of symbols]

1 固定用フランジ部材 2 フランジ部 3 円筒部 4 通液孔 5 回転軸 6 締付けフランジ 7 締付金具 10 加工用回転砥石 11 通液溝 20 被加工材 30 外部ノズル 1 Fixed Flange Member 2 Flange Part 3 Cylindrical Part 4 Liquid Penetration Hole 5 Rotating Shaft 6 Tightening Flange 7 Tightening Metal Fitting 10 Rotating Grinding Stone for Processing 11 Liquid Groove 20 Work Material 30 External Nozzle

フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 C22C 38/00 Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location C22C 38/00

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 円周端面及び所要部に砥粒を塗布固着し
た加工用回転砥石を有する研削加工装置を回転させ、被
加工材に砥粒面を回転接触させて研削加工する被加工材
の研削加工法において、加工用回転砥石の中心側から円
周端面への1ヶ所あるいは複数ヶ所の通液溝を片面また
は両面に配設し、該通液溝へ連通する通液孔を研削加工
装置内に配置しかつ冷却媒体の供給源に接続し、回転砥
石の回転時の遠心力により前記通液溝より平均粒径0.
005μm〜50μmの微細遊離砥粒を混入した冷却媒
体を噴射しながら被加工材を研削することを特徴とする
被加工材の研削加工法。
1. A work piece to be ground by rotating a grinding machine having a rotating grindstone for processing, in which abrasive grains are applied and fixed to a circumferential end face and a required portion, to bring the abrasive grain surface into rotary contact with the work piece for grinding. In the grinding method, one or more liquid passage grooves from the center side of the rotating grindstone for processing to the circumferential end surface are provided on one side or both sides, and a liquid passage hole communicating with the liquid passage groove is formed in the grinding device. And the average particle size of 0.
A method of grinding a work material, which comprises grinding a work material while jetting a cooling medium mixed with fine free abrasive grains of 005 μm to 50 μm.
【請求項2】 一方端側にフランジ部とそれより小径の
円筒部を同軸配置した固定用フランジ部材の他方端に回
転軸を固着して回転自在に支持し、固定用フランジ部材
の円筒部に円周端面及び所要部に砥粒を塗布固着したリ
ング状の加工用回転砥石を嵌挿通し、さらにリング状締
付けフランジを介して円筒部外周面に螺合する締付金具
にて該回転砥石を固定する構成からなり、該回転砥石の
中心側から円周端面への1ヶ所あるいは複数ヶ所の通液
溝が片面または両面に配設され、該通液溝へ連通する通
液孔を研削加工装置内に配置し、回転砥石の回転時の遠
心力により前記通液溝より平均粒径0.005μm〜5
0μmの微細遊離砥粒を混入した冷却媒体を噴射可能に
したことを特徴とする被加工材の研削加工装置。
2. A rotary shaft is fixed to the other end of a fixing flange member in which a flange portion and a cylindrical portion having a diameter smaller than that are coaxially arranged on one end side, and is rotatably supported by the fixing flange member. Insert a ring-shaped rotating grindstone with abrasive grains applied and fixed to the circumferential end surface and the required part, and further tighten the rotating grindstone with a tightening fitting that is screwed onto the outer peripheral surface of the cylindrical part via a ring-shaped tightening flange. It is configured to be fixed, and one or a plurality of liquid passage grooves from the center side of the rotary grindstone to the circumferential end face are arranged on one side or both sides, and a liquid passage hole communicating with the liquid passage groove is ground and machined. The average particle diameter is 0.005 μm to 5 from the liquid passage groove by the centrifugal force generated when the rotating grindstone is rotated.
A grinding apparatus for a work piece, which is capable of jetting a cooling medium mixed with 0 μm fine free abrasive grains.
JP34162192A 1992-11-27 1992-11-27 Grinding working method for workpiece and device therefor Pending JPH06155293A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34162192A JPH06155293A (en) 1992-11-27 1992-11-27 Grinding working method for workpiece and device therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34162192A JPH06155293A (en) 1992-11-27 1992-11-27 Grinding working method for workpiece and device therefor

Publications (1)

Publication Number Publication Date
JPH06155293A true JPH06155293A (en) 1994-06-03

Family

ID=18347506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34162192A Pending JPH06155293A (en) 1992-11-27 1992-11-27 Grinding working method for workpiece and device therefor

Country Status (1)

Country Link
JP (1) JPH06155293A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7384329B2 (en) 2006-05-23 2008-06-10 Saint-Gobain Abrasives Technology Company Coolant delivery system for grinding tools
CN110774169A (en) * 2018-07-31 2020-02-11 台湾积体电路制造股份有限公司 Polishing apparatus, surface dressing apparatus, and polishing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7384329B2 (en) 2006-05-23 2008-06-10 Saint-Gobain Abrasives Technology Company Coolant delivery system for grinding tools
CN110774169A (en) * 2018-07-31 2020-02-11 台湾积体电路制造股份有限公司 Polishing apparatus, surface dressing apparatus, and polishing method
CN110774169B (en) * 2018-07-31 2022-01-04 台湾积体电路制造股份有限公司 Polishing apparatus, surface dressing apparatus, and polishing method
US12020946B2 (en) 2018-07-31 2024-06-25 Taiwan Semiconductor Manufacturing Co., Ld. Chemical mechanical polishing apparatus

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