JPH061694A - Diamond member and manufacturing method thereof - Google Patents
Diamond member and manufacturing method thereofInfo
- Publication number
- JPH061694A JPH061694A JP18994192A JP18994192A JPH061694A JP H061694 A JPH061694 A JP H061694A JP 18994192 A JP18994192 A JP 18994192A JP 18994192 A JP18994192 A JP 18994192A JP H061694 A JPH061694 A JP H061694A
- Authority
- JP
- Japan
- Prior art keywords
- diamond
- substrate
- layer
- vapor phase
- phase growth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
(57)【要約】
【目的】 気相合成法によって微粒かつ緻密で耐熱性・
耐酸化性の高いダイヤモンド部材を得ることを目的とす
る。
【構成】 気相成長によりダイヤモンドを合成する基板
1上にSiC層2を成膜した後、気相成長によりダイヤ
モンド層3を合成し、その後に基材1の一部または全部
を除去して得られるSiC層2を有するダイヤモンド部
材4。
(57) [Abstract] [Purpose] Fine-grained and dense heat resistance
The purpose is to obtain a diamond member having high oxidation resistance. [Structure] Obtained by forming a SiC layer 2 on a substrate 1 for synthesizing diamond by vapor phase growth, synthesizing a diamond layer 3 by vapor phase growth, and then removing a part or all of the base material 1. A diamond member 4 having a SiC layer 2 formed therein.
Description
【0001】[0001]
【産業上の利用分野】本発明は、気相合成法により得ら
れる微粒かつ緻密で耐熱性・耐酸化性の高いダイヤモン
ド部材とその製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fine and dense diamond member obtained by a vapor phase synthesis method and having high heat resistance and oxidation resistance, and a method for producing the same.
【0002】[0002]
【従来の技術】ダイヤモンドは高い硬度、大きな熱伝導
性、優れた耐食性等の性質を有しており、その性質を利
用してダイヤモンド膜は現在おもに切削工具などに用い
られている。この際、粒径の細かい緻密な膜が切削性能
のよいことが知られており、又、耐熱性・耐酸化性が特
に要求されている。更に、ダイヤモンド膜を光学窓など
に使用する超薄膜として作成する際にも、微粒で緻密な
膜が要求されている。2. Description of the Related Art Diamond has properties such as high hardness, high thermal conductivity, and excellent corrosion resistance. Utilizing these properties, diamond films are mainly used for cutting tools at present. At this time, it is known that a dense film having a small particle size has good cutting performance, and heat resistance and oxidation resistance are particularly required. Further, when forming a diamond film as an ultrathin film used for an optical window or the like, a fine and dense film is required.
【0003】従来、気相合成法によりダイヤモンド膜を
成膜する際、ダイヤモンドの核発生密度を増大させるた
めに、蒸着前にダイヤモンド砥粒を用いて図2で示す基
材1に傷つけ処理を行い成長初期のダイヤモンド結晶核
を増大させることによって微粒で緻密なダイヤモンド多
結晶体からなるダイヤモンド膜5を得る工夫が行われて
きた。また耐熱性・耐酸化性についてはダイヤモンド結
晶の純度を向上させることで改善されてきた。Conventionally, when a diamond film is formed by a vapor phase synthesis method, in order to increase the nucleation density of diamond, a diamond abrasive grain is used to damage a substrate 1 shown in FIG. 2 before vapor deposition. The diamond film 5 made of a fine and dense diamond polycrystal has been devised by increasing the diamond crystal nuclei in the initial stage of growth. Heat resistance and oxidation resistance have been improved by improving the purity of diamond crystals.
【0004】[0004]
【発明が解決しようとする課題】しかし、傷つけ処理だ
けではダイヤモンド膜5におけるダイヤモンドの核発生
密度は109 /cm2 程度までが限界であって、結晶粒
径は0.4μm程度であった。また、ダイヤモンドは炭
素のみで構成されており、600℃以上では容易に空気
中の酸素と反応するため、耐熱性・耐酸化性には本質的
に限界があった。However, the diamond nucleation density in the diamond film 5 is limited to about 10 9 / cm 2 and the crystal grain size is about 0.4 μm only by the scratching treatment. Further, since diamond is composed of carbon only and easily reacts with oxygen in the air at 600 ° C. or higher, heat resistance and oxidation resistance are essentially limited.
【0005】[0005]
【課題を解決するための手段】この発明は、ダイヤモン
ドを成長させる基板上に、ダイヤモンド成長前にSiC
層を形成し、ダイヤモンドとして堆積しようとする炭素
が基板と反応したり、基板中へ拡散したりすることを抑
制してダイヤモンドの核発生密度を増大させ、かつ基板
の一部または全部を除去してこのSiC層を耐熱性・耐
酸化性が要求される部分に使用することで大気中で10
00℃以上の耐熱性・耐酸化性を有するダイヤモンド部
材を得るものである。According to the present invention, a SiC is formed on a substrate on which diamond is grown before the diamond is grown.
A layer is formed to suppress the reaction of carbon, which is to be deposited as diamond, with the substrate and its diffusion into the substrate to increase the nucleation density of diamond, and to remove part or all of the substrate. By using the SiC layer in the area where heat resistance and oxidation resistance are required, 10
A diamond member having heat resistance and oxidation resistance of 00 ° C. or higher is obtained.
【0006】[0006]
【作用】ダイヤモンドの核発生密度を増加させて微粒の
ダイヤモンド多結晶体を得るにはダイヤモンド砥粒など
による傷つけ処理以外に、基板上・基板中への炭素の反
応・拡散を抑える必要がある。炭素が基板中に取り込ま
れることなくダイヤモンドの成長に有効に用いられるた
めには、基板の材料として炭素と反応しにくく、炭素の
拡散係数が小さい材料を用いることが望ましい。In order to increase the nucleation density of diamond to obtain a fine-grained diamond polycrystal, it is necessary to suppress carbon reaction / diffusion on / in the substrate in addition to the scratching treatment with diamond abrasive grains. In order for carbon to be effectively used for diamond growth without being taken into the substrate, it is desirable to use a material that does not easily react with carbon and has a small carbon diffusion coefficient as the substrate material.
【0007】炭化物は一般に融点が高いため、炭素の拡
散係数が小さく炭素が基板中に拡散するのを防ぐ働きを
し、更にSiC,WC,TaCなどの飽和炭化物を用い
ることによってこれ以上炭素と反応することがなく微粒
のダイヤモンドを成長させるのに適当な基板となる。Since carbides generally have a high melting point, they have a small diffusion coefficient of carbon and work to prevent carbon from diffusing into the substrate. Further, by using saturated carbides such as SiC, WC, and TaC, they react with carbon further. It is a suitable substrate for growing fine diamond without any damage.
【0008】このような炭化物層をSi,W,Moなど
の基板上に薄膜として形成し更にその上にダイヤモンド
を成長させると、バルクの炭化物を基板としたのと同等
の効果があり、更に基板を除去することによって耐熱性
・耐酸化性の高い炭化物の被覆を持ったダイヤモンド部
材が得られる。When such a carbide layer is formed as a thin film on a substrate of Si, W, Mo or the like and diamond is further grown thereon, the same effect as that of a bulk carbide is obtained. By removing the above, a diamond member having a carbide coating with high heat resistance and high oxidation resistance can be obtained.
【0009】発明者らはこのような炭化物層としてSi
Cの薄膜が最も適していることを見いだした。このSi
C層の厚さは少なくとも0.005μm以上必要であ
る。The present inventors have made Si such a carbide layer.
We have found that a thin film of C is most suitable. This Si
The thickness of the C layer must be at least 0.005 μm or more.
【0010】[0010]
【実施例】以下、この発明の実施例を図1に基づいて説
明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.
【0011】図1に示すように、鏡面研磨したSi基板
1に公知の熱CVD法により、0.05μmのSiC層
2を形成する。その基板に1500メッシュのダイヤモ
ンド砥粒で傷つけ処理を行い、公知のマイクロ波CVD
法によってダイヤモンド層3を10μm成長させた。As shown in FIG. 1, a 0.05 μm SiC layer 2 is formed on a mirror-polished Si substrate 1 by a known thermal CVD method. The substrate is scratched with 1500-mesh diamond abrasive grains, and then the known microwave CVD is performed.
The diamond layer 3 was grown to a thickness of 10 μm by the method.
【0012】このダイヤモンド薄膜表面を電子顕微鏡で
観察したところ、核発生密度が1011/cm2 と従来よ
り2桁程度高く、成長終了時点で粒径0.1μm程度の
緻密な結晶からなるダイヤモンド層3を形成することが
できた。Observation of the surface of the diamond thin film with an electron microscope revealed that the nucleation density was 10 11 / cm 2, which was about two orders of magnitude higher than that of the prior art, and a diamond layer consisting of dense crystals with a grain size of about 0.1 μm at the end of growth. 3 could be formed.
【0013】更に、このダイヤモンド層3についている
Si基材を酸で除去して、ダイヤモンド層3の片側にS
iC層2のついているダイヤモンド部材4を得た。この
部材4のSiC層2で被覆されている側を大気中100
0℃の雰囲気に1時間さらしたが全く重量減少はみられ
なかった。Further, the Si base material on the diamond layer 3 is removed with an acid, and S on one side of the diamond layer 3 is removed.
A diamond member 4 having the iC layer 2 was obtained. The side of the member 4 covered with the SiC layer 2 is 100
When exposed to an atmosphere of 0 ° C. for 1 hour, no weight reduction was observed.
【0014】尚、この発明において、気相合成によりダ
イヤモンドおよびSiCを成長させる方法は熱CVD、
プラズマCVDなどこれまで知られているいかなる方法
でも良い。In the present invention, the method for growing diamond and SiC by vapor phase synthesis is thermal CVD,
Any known method such as plasma CVD may be used.
【0015】[0015]
【発明の効果】以上説明したように、この発明によれ
ば、微粒かつ緻密で耐熱性・耐酸化性の高いダイヤモン
ド部材を形成することが可能となった。As described above, according to the present invention, it becomes possible to form a diamond member which is fine and dense and has high heat resistance and oxidation resistance.
【図面の簡単な説明】[Brief description of drawings]
【図1】この発明によるダイヤモンドの気相合成の様子
を示す正面図である。FIG. 1 is a front view showing a state of vapor phase synthesis of diamond according to the present invention.
【図2】従来法によるダイヤモンドの気相合成の様子を
示す正面図である。FIG. 2 is a front view showing a state of vapor phase synthesis of diamond by a conventional method.
【符号の説明】 1 基板 2 SiC層 3 ダイヤモンド層 4 ダイヤモンド部材[Explanation of symbols] 1 substrate 2 SiC layer 3 diamond layer 4 diamond member
Claims (2)
ダイヤモンドの少なくとも基板との界面であった側にS
iC層を有するダイヤモンド部材。1. S on the side of at least the interface of the diamond grown by vapor phase growth on the substrate with the substrate.
A diamond member having an iC layer.
基板上にSiC層を成膜した後、気相成長によりダイヤ
モンドを合成し、その後に基材の一部または全部を除去
してSiC層を有するダイヤモンド部材を得るダイヤモ
ンド部材の製造法。2. A SiC layer is formed on a substrate for synthesizing diamond by vapor phase growth, diamond is synthesized by vapor phase growth, and then a part or all of a base material is removed to have a SiC layer. A method for manufacturing a diamond member for obtaining a diamond member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18994192A JPH061694A (en) | 1992-06-23 | 1992-06-23 | Diamond member and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18994192A JPH061694A (en) | 1992-06-23 | 1992-06-23 | Diamond member and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH061694A true JPH061694A (en) | 1994-01-11 |
Family
ID=16249774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18994192A Pending JPH061694A (en) | 1992-06-23 | 1992-06-23 | Diamond member and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH061694A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0891992A (en) * | 1994-09-28 | 1996-04-09 | Toyo Kohan Co Ltd | Production of diamond-coated brazed product |
| JP2012015229A (en) * | 2010-06-30 | 2012-01-19 | Sumitomo Electric Ind Ltd | Method of producing silicon carbide semiconductor device |
-
1992
- 1992-06-23 JP JP18994192A patent/JPH061694A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0891992A (en) * | 1994-09-28 | 1996-04-09 | Toyo Kohan Co Ltd | Production of diamond-coated brazed product |
| JP2012015229A (en) * | 2010-06-30 | 2012-01-19 | Sumitomo Electric Ind Ltd | Method of producing silicon carbide semiconductor device |
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