JPH06170355A - Method for treating waste water containing hydrogen peroxide in semiconductor manufacturing process - Google Patents
Method for treating waste water containing hydrogen peroxide in semiconductor manufacturing processInfo
- Publication number
- JPH06170355A JPH06170355A JP32353092A JP32353092A JPH06170355A JP H06170355 A JPH06170355 A JP H06170355A JP 32353092 A JP32353092 A JP 32353092A JP 32353092 A JP32353092 A JP 32353092A JP H06170355 A JPH06170355 A JP H06170355A
- Authority
- JP
- Japan
- Prior art keywords
- hydrogen peroxide
- catalase
- semiconductor manufacturing
- wastewater
- waste water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Removal Of Specific Substances (AREA)
Abstract
(57)【要約】
【目的】 過酸化水素の他にカタラーゼ阻害物質を含
有する半導体製造排水においても、カタラーゼを有効に
作用させて、簡単に、しかも効率よく過酸化水素を分解
除去する。
【構成】 過酸化水素を含む半導体製造排水をpH8〜
11にpH調整した後、カタラーゼと接触させて過酸化
水素を分解する。(57) [Summary] [Objective] Even in wastewater for semiconductor production containing a catalase inhibitor in addition to hydrogen peroxide, catalase effectively acts to decompose and remove hydrogen peroxide easily and efficiently. [Structure] Semiconductor manufacturing wastewater containing hydrogen peroxide has a pH of 8 to
After adjusting the pH to 11, it is contacted with catalase to decompose hydrogen peroxide.
Description
【0001】[0001]
【産業上の利用分野】本発明は過酸化水素をカタラーゼ
により分解除去する過酸化水素を含む半導体製造排水の
処理方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for treating semiconductor manufacturing wastewater containing hydrogen peroxide, which decomposes and removes hydrogen peroxide by catalase.
【0002】[0002]
【従来の技術】半導体製造工場から排出される排水には
過酸化水素を含むものがある。排水中に過酸化水素が含
まれていると、排水を処理する際に凝集沈殿汚泥の浮上
を引き起こしたり、またCOD源となる等の理由から、
過酸化水素を排水中から除去する必要がある。2. Description of the Related Art Some waste water discharged from semiconductor manufacturing plants contains hydrogen peroxide. When the wastewater contains hydrogen peroxide, it causes flotation of coagulation sedimentation sludge when the wastewater is treated, and also serves as a COD source.
Hydrogen peroxide needs to be removed from the waste water.
【0003】従来、このような過酸化水素を含む排水中
の過酸化水素を除去するために、亜硫酸ナトリウム、亜
硫酸水素ナトリウム等の還元剤や、過酸化水素を特異的
に分解する酵素であるカタラーゼを用いた処理が行われ
ている。Conventionally, in order to remove hydrogen peroxide in wastewater containing such hydrogen peroxide, a reducing agent such as sodium sulfite and sodium bisulfite, and catalase which is an enzyme that specifically decomposes hydrogen peroxide. Is being processed.
【0004】しかし、亜硫酸ナトリウムまたは亜硫酸水
素ナトリウムを使用する方法では、過酸化水素1モルに
対して1モルの亜硫酸ナトリウムまたは亜硫酸水素ナト
リウムが反応するので、大量の薬剤を添加する必要があ
り、このためコスト高になるとともに、塩類濃度が上昇
するという問題点がある。また変動する過酸化水素濃度
に応じて必要量の薬剤を添加するのが難しく、過剰に添
加すると残存する亜硫酸ナトリウムまたは亜硫酸水素ナ
トリウムが処理水のCOD値を上昇させるという問題点
もある。However, in the method using sodium sulfite or sodium bisulfite, since 1 mol of sodium sulfite or sodium bisulfite reacts with 1 mol of hydrogen peroxide, it is necessary to add a large amount of chemicals. Therefore, there is a problem that the cost becomes high and the salt concentration rises. Further, it is difficult to add a necessary amount of chemicals according to the fluctuating hydrogen peroxide concentration, and if added excessively, residual sodium sulfite or sodium hydrogen sulfite raises the COD value of the treated water.
【0005】カタラーゼを使用する方法は、カタラーゼ
が優れた生物触媒であり、常温での処理効率が非常に高
いという利点があるが、半導体製造工場より排出される
ウエハープロセス排水等にはフッ素イオン等のカタラー
ゼ阻害物質が含有されており、過酸化水素の分解速度が
大きく低下する場合がある。この対策として、フッ素イ
オンに耐性のあるカタラーゼを使用したり、アルカリ性
カルシウム化合物を添加して排水中のフッ素イオンをフ
ッ化カルシウムとして固液分離した後にカタラーゼと接
触させる方法が採用されている。しかし、フッ素イオン
を除去しても、カタラーゼが有効に作用しない場合があ
り、効率よく過酸化水素が除去できないという問題点が
ある。The method using catalase has the advantage that catalase is an excellent biocatalyst and the treatment efficiency at room temperature is very high. However, in the wafer process wastewater discharged from a semiconductor manufacturing plant, fluorine ions, etc. Since it contains the catalase inhibitor, the decomposition rate of hydrogen peroxide may be significantly reduced. As a countermeasure against this, a method of using catalase resistant to fluoride ion or a method of adding an alkaline calcium compound to solid-liquid separate the fluoride ion in the waste water into calcium fluoride and then contacting with catalase is adopted. However, even if the fluoride ion is removed, catalase may not work effectively, and there is a problem that hydrogen peroxide cannot be removed efficiently.
【0006】[0006]
【発明が解決しようとする課題】本発明の目的は、上記
問題点を解決するため、カタラーゼ阻害物質を含有する
排水においても、カタラーゼを有効に作用させて、簡単
に、しかも効率よく過酸化水素を分解除去できる過酸化
水素を含む半導体製造排水の処理方法を提案することで
ある。SUMMARY OF THE INVENTION In order to solve the above problems, the object of the present invention is to allow catalase to act effectively even in waste water containing a catalase inhibitor so that hydrogen peroxide can be easily and efficiently produced. It is an object of the present invention to propose a method for treating semiconductor manufacturing wastewater containing hydrogen peroxide capable of decomposing and removing hydrogen peroxide.
【0007】[0007]
【課題を解決するための手段】通常のカタラーゼの作用
最適pHは中性付近にある(「化学大辞典」、共立出版
(株)、1987年2月15日発行、「カタラーゼ」の
項)。従って、カタラーゼ阻害物質を含まない排水を処
理する場合は、中性付近にpH調整すれば酵素活性には
ほとんど差はなく、カタラーゼにより過酸化水素を分解
できる。しかし、半導体製造排水を処理する場合、排水
をカタラーゼの作用最適pHに調整して処理してもカタ
ラーゼが有効に作用しない場合がある。この原因を調査
した結果、このような半導体製造排水にはカタラーゼ阻
害物質が含まれており、この阻害物質がカタラーゼを阻
害していることが判明した。さらに、このような阻害の
程度はpHにより大きく影響されることが判明した。本
発明者らはこのような知見に基づいて本発明を完成し
た。[Means for Solving the Problems] The optimum pH of action of normal catalase is in the vicinity of neutrality ("Chemical Dictionary", Kyoritsu Shuppan Co., Ltd., February 15, 1987, "catalase"). Therefore, when treating wastewater containing no catalase inhibitor, if the pH is adjusted to near neutral, there is almost no difference in enzyme activity, and hydrogen peroxide can be decomposed by catalase. However, in the case of treating semiconductor manufacturing wastewater, catalase may not work effectively even if the wastewater is adjusted to an optimum pH for treating catalase and treated. As a result of investigating the cause, it has been found that such a semiconductor manufacturing wastewater contains a catalase inhibitor, and that this inhibitor inhibits catalase. Furthermore, it was found that the degree of such inhibition was greatly influenced by pH. The present inventors have completed the present invention based on such findings.
【0008】すなわち本発明は、過酸化水素を含む半導
体製造排水をカタラーゼと接触させて過酸化水素を分解
除去する排水の処理方法において、前記過酸化水素を含
む半導体製造排水をpH8〜11にpH調整することを
特徴とする過酸化水素を含む半導体製造排水の処理方法
である。That is, according to the present invention, in a method for treating wastewater containing hydrogen peroxide, the wastewater for semiconductor production is contacted with catalase to decompose and remove hydrogen peroxide. A method for treating semiconductor manufacturing wastewater containing hydrogen peroxide, which is characterized in that the method is adjusted.
【0009】本発明において処理の対象となる排水は、
半導体製造過程から排出され、過酸化水素のほかに、カ
タラーゼの酵素活性を阻害するカタラーゼ阻害物質を含
有する排水である。半導体製造過程で排出される排水中
に含まれるカタラーゼ阻害物質は、ヒドロキシルアミン
その他の還元物質であると認められる。本発明の処理方
法が適用できる過酸化水素を含む半導体製造排水の具体
的なものとして、半導体プロセス排水等の半導体製造工
場から排出される排水などがあげられる。The waste water to be treated in the present invention is
Wastewater discharged from the semiconductor manufacturing process and containing, in addition to hydrogen peroxide, a catalase inhibitor that inhibits the enzymatic activity of catalase. The catalase inhibitor contained in the wastewater discharged during the semiconductor manufacturing process is recognized as hydroxylamine and other reducing substances. Specific examples of semiconductor manufacturing wastewater containing hydrogen peroxide to which the treatment method of the present invention can be applied include wastewater discharged from semiconductor manufacturing factories such as semiconductor process wastewater.
【0010】本発明の処理方法は、被処理水をカタラー
ゼと接触させ、カタラーゼの酵素活性により被処理水中
の過酸化水素を分解する際、被処理水のpHを8〜1
1、好ましくは9〜11にpH調整して行う方法であ
る。このようにカタラーゼの作用可能なpH範囲内であ
って、強アルカリ性側のpHにおいてカタラーゼ処理す
ることにより、阻害物質による阻害の程度を大幅に軽減
することができる。pHが8未満になると阻害軽減の程
度が小さく、また11を超えると、通常カタラーゼの作
用可能なpH範囲外となるため好ましくない。In the treatment method of the present invention, when the water to be treated is brought into contact with catalase and the hydrogen peroxide in the water to be treated is decomposed by the enzymatic activity of catalase, the pH of the water to be treated is 8 to 1.
The pH is adjusted to 1, preferably 9 to 11. In this way, by performing the catalase treatment within the pH range in which catalase can act and the pH is on the strongly alkaline side, the degree of inhibition by the inhibitor can be greatly reduced. When the pH is less than 8, the degree of inhibition reduction is small, and when it is more than 11, it is usually outside the pH range in which catalase can act.
【0011】pHの調整はpH調整剤を被処理水中に添
加して行う。これはカタラーゼ処理する前に行うことも
できるし、カタラーゼ処理と同時に行うこともできる。
pH調整剤としては、水酸化ナトリウム、水酸化カリウ
ム、水酸化カルシウム等のアルカリ;塩酸、硫酸等の
酸;pH緩衝液などがあげられる。The pH is adjusted by adding a pH adjusting agent to the water to be treated. This can be performed before the catalase treatment or can be performed simultaneously with the catalase treatment.
Examples of the pH adjusting agent include alkali such as sodium hydroxide, potassium hydroxide and calcium hydroxide; acids such as hydrochloric acid and sulfuric acid; and pH buffer solution.
【0012】カタラーゼ処理は公知の方法を採用でき、
例えば10万ユニット/mlのカタラーゼの場合、ほぼ
次の量のカタラーゼを添加して行うことができる。なお
1ユニットは過酸化水素濃度が150mg/lのとき、
30℃で1分間に1マイクロモルの過酸化水素を分解す
る酵素量である。A known method can be used for the catalase treatment,
For example, in the case of 100,000 units / ml of catalase, it can be carried out by adding about the following amount of catalase. If 1 unit of hydrogen peroxide is 150mg / l,
It is the amount of enzyme that decomposes 1 micromol of hydrogen peroxide per minute at 30 ° C.
【0013】被処理水中の過酸化水素濃度が10〜15
0mg/lのときの添加量:50mg/l、被処理水中
の過酸化水素濃度が150〜250mg/lのときの添
加量:100mg/l、被処理水中の過酸化水素濃度が
250〜500mg/lのときの添加量:300mg/
l以上。The concentration of hydrogen peroxide in the water to be treated is 10 to 15
Addition amount when 0 mg / l: 50 mg / l, hydrogen peroxide concentration in the water to be treated is 150 to 250 mg / l: 100 mg / l, hydrogen peroxide concentration in the water to be treated is 250 to 500 mg / l Addition amount when 1: 300 mg /
l or more.
【0014】カタラーゼ添加時、水温は0〜50℃、好
ましくは25〜37℃とするのが望ましい。このような
条件においてカタラーゼの酵素活性は高くなる。When adding catalase, the water temperature is preferably 0 to 50 ° C, preferably 25 to 37 ° C. Under such conditions, the enzymatic activity of catalase becomes high.
【0015】カタラーゼ添加した被処理水は、撹拌下に
5〜30分間、好ましくは10〜15分間反応させるこ
とにより、過酸化水素はカタラーゼにより分解除去され
る。このとき被処理水のpHは前記範囲に調整されてい
るので、阻害物質による阻害の程度は大幅に軽減されて
おり、このため効率よく過酸化水素の分解除去が行われ
る。The treated water added with catalase is reacted for 5 to 30 minutes, preferably 10 to 15 minutes with stirring, whereby hydrogen peroxide is decomposed and removed by catalase. At this time, since the pH of the water to be treated is adjusted to the above range, the degree of inhibition by the inhibitor is greatly reduced, and therefore, hydrogen peroxide can be decomposed and removed efficiently.
【0016】カタラーゼで過酸化水素を分解除去した後
は、例えば金属を除去するため、カルシウム化合物、ア
ルミニウム化合物、鉄化合物等の無機凝集剤および/ま
たはポリアクリルアミド等の高分子凝集剤などを添加し
て凝集沈殿処理を行うことができる。なお凝集剤として
アルミニウム塩、鉄塩等を用いた場合、凝集沈殿処理は
通常pH6.5〜7.5で行われるので、pHの再調整
が必要であるが、凝集剤として石灰等を用いる場合はさ
らに高いpH範囲で凝集処理が行われるので、pHの再
調整は必要なくなる。After decomposing and removing hydrogen peroxide with catalase, for example, in order to remove metals, inorganic flocculants such as calcium compounds, aluminum compounds and iron compounds and / or polymer flocculants such as polyacrylamide are added. Aggregation treatment can be performed. When aluminum salt, iron salt, etc. are used as the coagulant, the coagulation-sedimentation treatment is usually performed at pH 6.5 to 7.5, so it is necessary to readjust the pH, but when using lime etc. as the coagulant. Since the coagulation treatment is performed in a higher pH range, it is not necessary to readjust the pH.
【0017】[0017]
【実施例】次に本発明の実施例について説明する。 比較例1 水道水に過酸化水素を150mg/lとなるように溶解
し、リン酸緩衝液および炭酸緩衝液でpHを表1に示す
値に調整した。これに栗田工業(株)製のカタラーゼ
クリバータK300(登録商標、酵素活性100000
ユニット/ml、最適pH6〜11)を50mg/lと
なるように添加し、30℃で過酸化水素の分解を行っ
た。5分後の反応速度(K)を下式より求めた。結果を
表1に示す。 ln(C/C0)=−Kt C0:初期過酸化水素濃度 C :t分後の過酸化水素濃度 Kt :t分後の反応速度EXAMPLES Next, examples of the present invention will be described. Comparative Example 1 Hydrogen peroxide was dissolved in tap water to a concentration of 150 mg / l, and the pH was adjusted to the values shown in Table 1 with a phosphate buffer solution and a carbonate buffer solution. Catalase manufactured by Kurita Water Industries Ltd.
Krivata K300 (registered trademark, enzyme activity 100000
Unit / ml, optimum pH 6-11) was added so as to be 50 mg / l, and hydrogen peroxide was decomposed at 30 ° C. The reaction rate (K) after 5 minutes was calculated from the following formula. The results are shown in Table 1. ln (C / C 0 ) = − Kt C 0 : initial hydrogen peroxide concentration C: hydrogen peroxide concentration after t minutes Kt: reaction rate after t minutes
【0018】[0018]
【表1】 [Table 1]
【0019】表1から、水道水の場合は酵素の最適pH
であるpH6〜11の範囲で反応速度が速く(酵素活性
が高く)、特にpH6〜7でも反応速度が速く、pH6
〜11の範囲において反応速度にあまり差がないことが
わかる。pH5.5および11.5の場合は、酵素の最
適pHの範囲外なので反応速度が遅い。From Table 1, in the case of tap water, the optimum pH of the enzyme
The reaction rate is high in the range of pH 6 to 11 (enzyme activity is high), and the reaction rate is high even at pH 6 to 7,
It can be seen that there is not much difference in reaction rate in the range of -11. At pH 5.5 and 11.5, the reaction rate is slow because it is outside the optimum pH range of the enzyme.
【0020】実施例1 水道水の代りに半導体製造排水(過酸化水素含有量15
0mg/l、pH2.5)を用いて比較例1と同様にし
て反応速度を求めた。なおpHの調整は塩酸または水酸
化ナトリウムにより行った。結果を表2に示す。Example 1 Wastewater from semiconductor manufacturing (hydrogen peroxide content: 15
The reaction rate was determined in the same manner as in Comparative Example 1 using 0 mg / l, pH 2.5). The pH was adjusted with hydrochloric acid or sodium hydroxide. The results are shown in Table 2.
【0021】[0021]
【表2】 [Table 2]
【0022】表2から、半導体製造排水の場合は酵素の
最適pHの範囲内であってもpH6〜7においては反応
速度が遅く、酵素が阻害されていることがわかる。とこ
ろがpH8〜11の範囲では、pH6〜7に比べて反応
速度は速く、阻害の程度が大幅に軽減されていることが
わかる。From Table 2, it can be seen that in the case of semiconductor manufacturing wastewater, the reaction rate is slow and the enzyme is inhibited at pH 6 to 7 even within the optimum pH range of the enzyme. However, in the pH range of 8 to 11, the reaction rate is faster than in the pH range of 6 to 7, and the degree of inhibition is significantly reduced.
【0023】表1と表2の結果を比較すると、pH8〜
11の範囲においても表2の結果が表1の結果に比べて
小さくなっており、阻害が完全に取り除かれたわけでは
ないが、pH6〜7における落ち込みに比べればその程
度は小さく、pH8〜11の範囲において阻害の程度が
大幅に軽減されていることがわかる。Comparing the results of Table 1 and Table 2, pH 8 to
In the range of 11 as well, the results of Table 2 are smaller than the results of Table 1, and although the inhibition was not completely removed, the degree was smaller than the drop at pH 6 to 7, and that of pH 8 to 11 was small. It can be seen that the degree of inhibition is greatly reduced in the range.
【0024】実施例2 実施例1と同じ半導体製造排水に他の市販のカタラーゼ
を5000ユニット/liter添加し、比較例1と同様に
して反応速度を求めた。結果を表3に示す。Example 2 Another unit of commercial catalase was added to the same semiconductor production wastewater as in Example 1 at 5000 units / liter, and the reaction rate was determined in the same manner as in Comparative Example 1. The results are shown in Table 3.
【0025】[0025]
【表3】 [Table 3]
【0026】[0026]
【発明の効果】以上の通り、本発明によれば、過酸化水
素を含む半導体製造排水をpH8〜11に調整してカタ
ラーゼと接触させるようにしたので、簡単で、しかも効
率よく過酸化水素を分解除去できる。As described above, according to the present invention, since the semiconductor manufacturing wastewater containing hydrogen peroxide is adjusted to pH 8 to 11 and brought into contact with catalase, hydrogen peroxide can be easily and efficiently produced. Can be disassembled and removed.
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成4年12月3日[Submission date] December 3, 1992
【手続補正1】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0017[Correction target item name] 0017
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0017】[0017]
【実施例】次に本発明の実施例について説明する。 比較例1 水道水に過酸化水素を150mg/lとなるように溶解
し、リン酸緩衝液および炭酸緩衝液でpHを表1に示す
値に調整した。これに栗田工業(株)製のカタラーゼ
クリバータK300(登録商標、酵素活性100000
ユニット/ml、最適pH6〜11)を50mg/lと
なるように添加し、30℃で過酸化水素の分解を行っ
た。5分後の反応速度(K)を下式より求めた。結果を
表1に示す。 ln(C/C0)=−Kt C0:初期過酸化水素濃度 C :t分後の過酸化水素濃度K :反応速度 t :時間(分) EXAMPLES Next, examples of the present invention will be described. Comparative Example 1 Hydrogen peroxide was dissolved in tap water to a concentration of 150 mg / l, and the pH was adjusted to the values shown in Table 1 with a phosphate buffer solution and a carbonate buffer solution. Catalase manufactured by Kurita Water Industries Ltd.
Krivata K300 (registered trademark, enzyme activity 100000
Unit / ml, optimum pH 6-11) was added so as to be 50 mg / l, and hydrogen peroxide was decomposed at 30 ° C. The reaction rate (K) after 5 minutes was calculated from the following formula. The results are shown in Table 1. ln (C / C 0 ) = − Kt C 0 : initial hydrogen peroxide concentration C: hydrogen peroxide concentration after t minutes K: reaction rate t: time (minutes)
───────────────────────────────────────────────────── フロントページの続き (72)発明者 沼倉 孝男 東京都新宿区西新宿3丁目4番7号 栗田 工業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takao Numakura 3-4-7 Nishishinjuku, Shinjuku-ku, Tokyo Kurita Industry Co., Ltd.
Claims (1)
ラーゼと接触させて過酸化水素を分解除去する排水の処
理方法において、 前記過酸化水素を含む半導体製造排水をpH8〜11に
pH調整することを特徴とする過酸化水素を含む半導体
製造排水の処理方法。1. A method for treating wastewater, which comprises removing hydrogen peroxide containing semiconductor by contacting it with catalase to decompose and remove hydrogen peroxide, wherein the pH of semiconductor production wastewater containing hydrogen peroxide is adjusted to pH 8-11. A method for treating semiconductor manufacturing wastewater containing hydrogen peroxide, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32353092A JP3246011B2 (en) | 1992-12-03 | 1992-12-03 | Method for treating semiconductor manufacturing wastewater containing hydrogen peroxide |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32353092A JP3246011B2 (en) | 1992-12-03 | 1992-12-03 | Method for treating semiconductor manufacturing wastewater containing hydrogen peroxide |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06170355A true JPH06170355A (en) | 1994-06-21 |
| JP3246011B2 JP3246011B2 (en) | 2002-01-15 |
Family
ID=18155729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32353092A Expired - Fee Related JP3246011B2 (en) | 1992-12-03 | 1992-12-03 | Method for treating semiconductor manufacturing wastewater containing hydrogen peroxide |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3246011B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08132063A (en) * | 1994-11-10 | 1996-05-28 | Mitsubishi Gas Chem Co Inc | Method for treating wastewater containing hydrogen peroxide |
| JP2002282874A (en) * | 2001-03-26 | 2002-10-02 | Japan Organo Co Ltd | Wastewater treating device |
| JP2003225677A (en) * | 2002-02-06 | 2003-08-12 | Japan Organo Co Ltd | Method for treating drainage containing fluorine and hydrogen peroxide |
| JP2007222743A (en) * | 2006-02-22 | 2007-09-06 | Matsushita Environment Airconditioning Eng Co Ltd | Method of ph adjustment and treatment apparatus for hydrogen peroxide-containing waste liquid |
| JP2014104410A (en) * | 2012-11-27 | 2014-06-09 | Japan Organo Co Ltd | Processing unit of ammonia inclusion discharge water and processing method of ammonia inclusion discharge water |
| JP2017051954A (en) * | 2016-12-16 | 2017-03-16 | オルガノ株式会社 | Ammonia-containing wastewater treatment apparatus and ammonia-containing wastewater treatment method |
-
1992
- 1992-12-03 JP JP32353092A patent/JP3246011B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08132063A (en) * | 1994-11-10 | 1996-05-28 | Mitsubishi Gas Chem Co Inc | Method for treating wastewater containing hydrogen peroxide |
| JP2002282874A (en) * | 2001-03-26 | 2002-10-02 | Japan Organo Co Ltd | Wastewater treating device |
| JP2003225677A (en) * | 2002-02-06 | 2003-08-12 | Japan Organo Co Ltd | Method for treating drainage containing fluorine and hydrogen peroxide |
| JP2007222743A (en) * | 2006-02-22 | 2007-09-06 | Matsushita Environment Airconditioning Eng Co Ltd | Method of ph adjustment and treatment apparatus for hydrogen peroxide-containing waste liquid |
| JP2014104410A (en) * | 2012-11-27 | 2014-06-09 | Japan Organo Co Ltd | Processing unit of ammonia inclusion discharge water and processing method of ammonia inclusion discharge water |
| JP2017051954A (en) * | 2016-12-16 | 2017-03-16 | オルガノ株式会社 | Ammonia-containing wastewater treatment apparatus and ammonia-containing wastewater treatment method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3246011B2 (en) | 2002-01-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109336290A (en) | A kind of copper ammonia waste liquid treatment method | |
| JPH06170355A (en) | Method for treating waste water containing hydrogen peroxide in semiconductor manufacturing process | |
| JP3112613B2 (en) | Treatment of wastewater containing fluorine and phosphorus | |
| JP4106415B2 (en) | Treatment method of wastewater containing cyanide | |
| JP3229277B2 (en) | Wastewater treatment method | |
| JP2006218354A (en) | Treatment method for fluorine-containing wastewater | |
| JPH09141274A (en) | Advanced treatment method for phosphorus-containing wastewater | |
| JP2021053620A (en) | Treatment method for cyanide-containing wastewater | |
| JP2598456B2 (en) | Treatment method for phosphate-containing water | |
| KR100390159B1 (en) | Treatment agent and method for treating industrial waste-water including flourine | |
| JP5990717B1 (en) | Cyanogen-containing wastewater treatment agent and cyanide-containing wastewater treatment method using the same | |
| JPH0699181A (en) | Method for treating waste liquid containing decomposition-resistant organic substance | |
| JP2005313112A (en) | Method for treating waste water containing cyanogen | |
| JP4608868B2 (en) | Treatment method for fluorine-containing wastewater | |
| JP2005296863A (en) | Method for treating waste liquid containing thiourea and apparatus | |
| JPS6224157B2 (en) | ||
| JPH0722752B2 (en) | Wafer process wastewater treatment method | |
| WO1982003722A1 (en) | Process for treating liquid radioactive waste | |
| WO1990015026A1 (en) | Process for reduction of hexavalent chromium | |
| JPH10113670A (en) | Method for treating a solution containing hydrogen peroxide and peracetic acid | |
| JP2003251367A (en) | Method for treating selenic acid-containing wastewater and treating agent used therefor | |
| JPH08141578A (en) | Wastewater treatment method | |
| JP4726216B2 (en) | Fluorine / phosphorus treatment method and apparatus for water containing chelating agent | |
| JP3304400B2 (en) | Treatment method for acidic fluorine-containing water | |
| JP2005305273A (en) | Method and apparatus for treating fluorine-containing wastewater |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071102 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 7 Free format text: PAYMENT UNTIL: 20081102 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081102 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091102 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 9 Free format text: PAYMENT UNTIL: 20101102 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101102 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111102 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 10 Free format text: PAYMENT UNTIL: 20111102 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 11 Free format text: PAYMENT UNTIL: 20121102 |
|
| LAPS | Cancellation because of no payment of annual fees |