JPH0617298Y2 - ウエハカウンタ - Google Patents

ウエハカウンタ

Info

Publication number: JPH0617298Y2
Authority: JP; Japan
Prior art keywords: wafer; plate; detection plate; guide; switch
Prior art date: 1987-12-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP20022687U

Other languages

English (en)

Japanese (ja)

Other versions

JPH01104725U (da

Inventor

章三伊藤

譲佐々原

伸中巻

Original Assignee

東京エレクトロン東北株式会社

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-12-29

Filing date

1987-12-29

Publication date

1994-05-02

1987-12-29 Application filed by 東京エレクトロン東北株式会社 filed Critical 東京エレクトロン東北株式会社

1987-12-29 Priority to JP20022687U priority Critical patent/JPH0617298Y2/ja

1989-07-14 Publication of JPH01104725U publication Critical patent/JPH01104725U/ja

1994-05-02 Application granted granted Critical

1994-05-02 Publication of JPH0617298Y2 publication Critical patent/JPH0617298Y2/ja

2002-12-29 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

238000001514 detection method Methods 0.000 claims description 35
230000001105 regulatory effect Effects 0.000 claims description 4
YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
229910052731 fluorine Inorganic materials 0.000 claims 1
239000011737 fluorine Substances 0.000 claims 1
239000011347 resin Substances 0.000 claims 1
229920005989 resin Polymers 0.000 claims 1
235000012431 wafers Nutrition 0.000 description 64
238000004140 cleaning Methods 0.000 description 3
239000004809 Teflon Substances 0.000 description 2
229920006362 Teflon® Polymers 0.000 description 2
239000012535 impurity Substances 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
239000004065 semiconductor Substances 0.000 description 2
239000000126 substance Substances 0.000 description 2
239000002253 acid Substances 0.000 description 1
238000007598 dipping method Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
238000012423 maintenance Methods 0.000 description 1
238000000034 method Methods 0.000 description 1

JP20022687U 1987-12-29 1987-12-29 ウエハカウンタ Expired - Lifetime JPH0617298Y2 (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP20022687U JPH0617298Y2 (ja)	1987-12-29	1987-12-29	ウエハカウンタ

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP20022687U JPH0617298Y2 (ja)	1987-12-29	1987-12-29	ウエハカウンタ

Publications (2)

Publication Number	Publication Date
JPH01104725U JPH01104725U (da)	1989-07-14
JPH0617298Y2 true JPH0617298Y2 (ja)	1994-05-02

Family

ID=31490645

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP20022687U Expired - Lifetime JPH0617298Y2 (ja)	1987-12-29	1987-12-29	ウエハカウンタ

Country Status (1)

Country	Link
JP (1)	JPH0617298Y2 (da)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN117810073A (zh) *	2022-09-23	2024-04-02	重庆康佳光电科技有限公司	蚀刻装置及控制方法

1987
- 1987-12-29 JP JP20022687U patent/JPH0617298Y2/ja not_active Expired - Lifetime

Also Published As

Publication number	Publication date
JPH01104725U (da)	1989-07-14

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