JPH06190815A - Laminate manufacturing hot press mold and manufacture of laminate therewith - Google Patents

Laminate manufacturing hot press mold and manufacture of laminate therewith

Info

Publication number
JPH06190815A
JPH06190815A JP34305292A JP34305292A JPH06190815A JP H06190815 A JPH06190815 A JP H06190815A JP 34305292 A JP34305292 A JP 34305292A JP 34305292 A JP34305292 A JP 34305292A JP H06190815 A JPH06190815 A JP H06190815A
Authority
JP
Japan
Prior art keywords
laminate
hot
mold
die
hot press
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP34305292A
Other languages
Japanese (ja)
Inventor
Shoichi Murazaki
彰一 村崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP34305292A priority Critical patent/JPH06190815A/en
Publication of JPH06190815A publication Critical patent/JPH06190815A/en
Pending legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Moulds, Cores, Or Mandrels (AREA)
  • Press-Shaping Or Shaping Using Conveyers (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Ceramic Capacitors (AREA)

Abstract

PURPOSE:To prevent laminate misalignment at the production of the laminate of laminated ceramic capacitor by laminatingly hot-pressing a plurality of green sheets. CONSTITUTION:The middle mold 10 and the lower mold 20 of a hot-pressing mold are made of shape memory alloy material so as to hot press green sheets 3 and green sheets 4, on each of which internal electrodes 4 are formed, under the condition being laminated to each other at normal temperature. By means of the temperature of a hot press, the shape memory alloy material acts so as to contract the interior of the mold, resulting in forcibly putting respective green sheets 3 in order.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、積層セラミックコン
デンサ、多層基板、セラミックパッケージ等における積
層体製造用熱プレス金型とそれを用いた積層体の製造方
法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hot pressing die for producing a laminated body in a laminated ceramic capacitor, a multilayer substrate, a ceramic package and the like and a method for producing a laminated body using the same.

【0002】[0002]

【従来の技術】従来の積層体製造用熱プレス金型は、図
2,図3に示すように枠状の中金型1と板状の下金型2
とからなり、その構造を積層セラミックコンデンサに適
用した例に基づいて述べる。
2. Description of the Related Art As shown in FIGS. 2 and 3, a conventional hot press die for manufacturing a laminated body comprises a frame-shaped middle die 1 and a plate-shaped lower die 2.
It will be described based on an example in which the structure is applied to a multilayer ceramic capacitor.

【0003】この金型は、グリーンシート3と、内部電
極4を一定位置に印刷したグリーンシート3からなる薄
状シートの外形寸法に対して、積層を容易にするために
100μm程度のクリアランスCをもった内形寸法の熱
プレス金型であり、それを用いて積層・熱プレスを行い
積層体を製造していた。
This mold has a clearance C of about 100 μm for facilitating stacking with respect to the outer dimensions of the thin sheet composed of the green sheet 3 and the green sheet 3 on which the internal electrodes 4 are printed at fixed positions. It was a hot press mold with internal dimensions, and it was used to laminate and heat press to produce a laminate.

【0004】[0004]

【発明が解決しようとする課題】ところで、上記の従来
の積層体製造用熱プレス金型は、グリーンシート3の外
形寸法とのクリアランスを設けるために、図2に示すよ
うに積層する各グリーンシート3が金型内で動き不揃い
となり、内部電極3の位置が各層で異なった状態で熱プ
レスされ、いわゆる積層ズレとなる。
By the way, in the above-mentioned conventional hot press mold for producing a laminated body, each green sheet to be laminated as shown in FIG. 2 in order to provide a clearance with the outer dimension of the green sheet 3. 3 moves in the mold and becomes uneven, and the internal electrodes 3 are hot-pressed in different positions in each layer, resulting in a so-called stacking shift.

【0005】この積層ズレは、積層セラミックコンデン
サにおいては容量小の不良となるばかりでなく、積層精
度が悪化して多層化の妨げとなる。
In the monolithic ceramic capacitor, this misalignment not only causes a defect of small capacity, but also deteriorates the lamination accuracy and hinders the formation of multiple layers.

【0006】[0006]

【課題を解決するための手段】この発明の積層体製造用
熱プレス金型は、金型材料に熱プレス時またはプレヒー
ト時の温度で収縮動作し、金型内形寸法が積層される薄
状シートの外形寸法と同じになるような形状記憶合金を
使用する。
A hot-press die for producing a laminate according to the present invention is a thin die in which a die material is contracted at a temperature during hot-pressing or pre-heating so that an inner die dimension is laminated. Use a shape memory alloy that has the same outer dimensions as the sheet.

【0007】また、この金型使用にあたっては、熱プレ
ス時に金型内形寸法が積層する薄状シートの外形寸法と
同じになる温度を与えて積層体を製造するようにしたも
のである。
Further, in using this die, a laminated body is manufactured by applying a temperature at which the inner dimension of the die becomes the same as the outer dimension of the laminated thin sheets during hot pressing.

【0008】[0008]

【作用】上記の積層体製造用熱プレス金型を用いると、
例えば熱プレス時に所定の温度になると金型の内形寸法
が薄状シートの外形寸法と同寸法になるように形状変化
して、積層されていた薄状シートがそれに伴って揃えら
れる。このことにより、例えばグリーンシートからなる
薄状シートの一定位置に印刷されていた内部電極も揃
い、積層ズレが防止できる。
When the above hot press mold for producing a laminate is used,
For example, at a predetermined temperature during hot pressing, the shape of the die is changed so that the inner dimension of the die becomes the same as the outer dimension of the thin sheet, and the laminated thin sheets are aligned accordingly. As a result, the internal electrodes printed at a fixed position on the thin sheet made of, for example, a green sheet are also aligned, and it is possible to prevent stacking deviation.

【0009】したがって、例えば積層セラミックコンデ
ンサにおける容量小不良、他の積層体での絶縁不足等の
電気的初期不良が防止でき、より多くの積層も容易に行
うことができる。
Therefore, it is possible to prevent electrical initial defects such as a small capacity defect in a monolithic ceramic capacitor and insufficient insulation in other laminated bodies, and more laminating can be easily performed.

【0010】[0010]

【実施例】以下、この発明について図面を参照して説明
する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

【0011】図1は、この発明の一実施例である積層体
製造用熱プレス金型にグリーンシートを積層した状態を
示す断面図である。図において、10は形状記憶合金か
らなる枠状の中金型、20は同じく形状記憶合金からな
る板状の下金型、3は金型内に積層されたグリーンシー
ト、4はグリーンシート3に印刷されている内部電極で
ある。P1は常温時すなわち熱プレス時の温度を与える
前の中金型10の枠部の模造的な位置、P2は同じく熱
プレス時の温度を与える前の下金型20の端部の位置、
Cは常温時に金型内に設けられるクリアランスを示す。
FIG. 1 is a sectional view showing a state in which a green sheet is laminated on a hot pressing mold for producing a laminate, which is an embodiment of the present invention. In the figure, 10 is a frame-shaped middle mold made of a shape memory alloy, 20 is a plate-shaped lower mold made of the same shape memory alloy, 3 is a green sheet laminated in the mold, 4 is a green sheet 3. It is a printed internal electrode. P1 is an imitation position of the frame portion of the middle mold 10 at room temperature, that is, before applying a temperature during hot pressing, and P2 is a position of an end portion of the lower mold 20 before applying a temperature during hot pressing,
C indicates a clearance provided in the mold at room temperature.

【0012】なお、中金型10と下金型20には、熱プ
レス時にその100℃弱の所定の温度でP1およびP2
の位置から図面矢印の方向に縮むか、あるいは変形する
Ti−Ni,Cu−Zn−Ni,Cu−Al−Ni合金
等の形状記憶合金を用いる。
It should be noted that the middle die 10 and the lower die 20 have P1 and P2 at a predetermined temperature of less than 100 ° C. during hot pressing.
Shape memory alloys such as Ti-Ni, Cu-Zn-Ni, and Cu-Al-Ni alloys that shrink or deform in the direction of the drawing from the position of are used.

【0013】以下、この金型を用いた積層セラミックコ
ンデンサの積層体の製造方法について述べると、まず常
温で中金型10と下金型20で形成される金型凹部に、
グリーンシート3と内部電極4を形成したグリーンシー
ト3とを積層する。この時点では中金型10の枠部およ
び下金型の端部はそれぞれP1とP2の位置にあり、ク
リアランスCが設けられているので、従来通りにその積
層は容易にできる。所定数のグリーンシート3を積層し
た後、金型を高温炉等に入れて加熱する。そうすると、
その熱で中金型10の枠部は、図1に示す矢印の方向に
縮み、金型内の各グリーンシート3は強制的に揃えら
れ、内部電極4の位置が各グリーンシート3で整列し、
いわゆる積層ズレは発生しない。そしてこの状態で図示
しない重し等を、積層したグリーンシート3上に乗せ加
圧状態で所定時間熱プレスして、積層体を製造する。
A method of manufacturing a laminated body of a monolithic ceramic capacitor using this mold will be described below. First, in a mold concave portion formed by the middle mold 10 and the lower mold 20 at room temperature,
The green sheet 3 and the green sheet 3 on which the internal electrodes 4 are formed are laminated. At this point, the frame of the middle mold 10 and the ends of the lower mold are located at positions P1 and P2, respectively, and the clearance C is provided, so that the lamination can be easily performed as in the conventional case. After stacking a predetermined number of green sheets 3, the mold is placed in a high temperature furnace or the like and heated. Then,
The heat causes the frame portion of the middle mold 10 to shrink in the direction of the arrow shown in FIG. ,
So-called stacking deviation does not occur. Then, in this state, a weight or the like (not shown) is placed on the laminated green sheets 3 and hot pressed for a predetermined time in a pressurized state to manufacture a laminated body.

【0014】なお、熱プレス時のその温度で形状記憶合
金からなる金型を動作させてもよいし、別の実施例とし
て、プレヒート工程を設けて、その温度でグリーンシー
ト3を整列させ、次いで熱プレスするようにしてもよ
い。この実施例によれば、自由に選べるプレヒート温度
に合わせて形状記憶合金材料を選定できるので、材料選
定に自由度がでる。
The mold made of the shape memory alloy may be operated at that temperature during hot pressing. As another embodiment, a preheating step is provided to align the green sheets 3 at that temperature, and then the green sheet 3 is aligned. You may heat-press. According to this embodiment, since the shape memory alloy material can be selected according to the preheating temperature that can be freely selected, the degree of freedom in material selection is increased.

【発明の効果】以上、説明したように、この発明は熱プ
レス用金型に例えば熱プレス時の温度で金型内寸法が、
積層される薄状シートの外形寸法と同寸法に形状変化す
る形状記憶合金を用いることにより、熱プレス時の温度
で積層された各薄状シートが強制的に揃えられて積層ズ
レを防止し、例えば積層セラミックコンデンサの容量小
不良やその他の積層体における絶縁不良等の電気的初期
特性不良を防止し、また、より多くの積層を容易に行う
ことができる。
As described above, according to the present invention, a die for hot pressing has a dimension within the die at a temperature at the time of hot pressing.
By using a shape memory alloy whose shape changes to the same external dimensions as the thin sheets to be laminated, the thin sheets laminated at the temperature during hot pressing are forcibly aligned and prevented from being misaligned. For example, it is possible to prevent electrical initial characteristic defects such as a small capacity defect of the monolithic ceramic capacitor and other insulation defects in the laminated body, and more laminating can be easily performed.

【図面の簡単な説明】[Brief description of drawings]

【図1】 この発明の積層体製造用熱プレス金型および
金型内に積層されたグリーンシートの断面図。
FIG. 1 is a cross-sectional view of a hot press die for producing a laminate of the present invention and a green sheet laminated in the die.

【図2】 従来の積層体製造用熱プレス金型および金型
内に積層されたグリーンシートの断面図。
FIG. 2 is a cross-sectional view of a conventional hot press die for producing a laminate and a green sheet laminated in the die.

【図3】 従来の積層体製造用熱プレス金型および金型
内に積層されたグリーンシートの斜視図。
FIG. 3 is a perspective view of a conventional hot press die for producing a laminate and a green sheet laminated in the die.

【符号の説明】[Explanation of symbols]

3 グリーンシート(薄状シート) 4 内部電極 10 中金型 20 下金型 C クリアランス 3 Green sheet (thin sheet) 4 Internal electrode 10 Middle mold 20 Lower mold C Clearance

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 H01G 4/12 364 4/30 9375−5E ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H01G 4/12 364 4/30 9375-5E

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】薄状シートを複数枚積層して熱プレスし積
層体を作製するための金型であって、金型材料に熱プレ
ス温度またはプレヒート温度で収縮動作する形状記憶合
金を用いたことを特徴とする積層体製造用熱プレス金
型。
1. A die for laminating a plurality of thin sheets and hot-pressing them to produce a laminate, wherein a shape memory alloy that shrinks at a hot-pressing temperature or a preheating temperature is used as a die material. A hot press mold for producing a laminate, which is characterized in that
【請求項2】上記形状記憶合金がTi−Ni,Cu−Z
n−NiまたはCu−Al−Niであることを特徴とす
る請求項1記載の積層体製造用熱プレス金型。
2. The shape memory alloy is Ti-Ni, Cu-Z.
It is n-Ni or Cu-Al-Ni, The hot press metal mold for laminated body manufacture of Claim 1 characterized by the above-mentioned.
【請求項3】熱プレス温度で収縮動作する形状記憶合金
材料からなる熱プレス金型内に薄状シートを複数枚積層
した後に熱プレスすることを特徴とする積層体製造方
法。
3. A method for producing a laminated body, comprising laminating a plurality of thin sheets in a hot-pressing die made of a shape memory alloy material that shrinks at a hot-pressing temperature and then hot-pressing.
【請求項4】プレヒート温度で収縮動作する形状記憶合
金材料からなる熱プレス金型内に薄状シートを複数枚積
層した後にプレヒートし、その後に熱プレスすることを
特徴とする積層体製造方法。
4. A method for producing a laminate, comprising laminating a plurality of thin sheets in a hot press mold made of a shape memory alloy material that shrinks at a preheating temperature, preheating, and then hot pressing.
JP34305292A 1992-12-24 1992-12-24 Laminate manufacturing hot press mold and manufacture of laminate therewith Pending JPH06190815A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34305292A JPH06190815A (en) 1992-12-24 1992-12-24 Laminate manufacturing hot press mold and manufacture of laminate therewith

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34305292A JPH06190815A (en) 1992-12-24 1992-12-24 Laminate manufacturing hot press mold and manufacture of laminate therewith

Publications (1)

Publication Number Publication Date
JPH06190815A true JPH06190815A (en) 1994-07-12

Family

ID=18358568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34305292A Pending JPH06190815A (en) 1992-12-24 1992-12-24 Laminate manufacturing hot press mold and manufacture of laminate therewith

Country Status (1)

Country Link
JP (1) JPH06190815A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6324970B1 (en) 1997-11-20 2001-12-04 Murata Manufacturing Co., Ltd. Device for pressing a ceramic stacked layer structure
CN106113229A (en) * 2016-06-28 2016-11-16 中国路桥工程有限责任公司 Railway T-shaped beam prefabricated form device and installation, release method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6324970B1 (en) 1997-11-20 2001-12-04 Murata Manufacturing Co., Ltd. Device for pressing a ceramic stacked layer structure
US7325488B2 (en) 1997-11-20 2008-02-05 Murata Manufacturing Co., Ltd. Method of pressing a ceramic stacked layer structure
CN106113229A (en) * 2016-06-28 2016-11-16 中国路桥工程有限责任公司 Railway T-shaped beam prefabricated form device and installation, release method
CN106113229B (en) * 2016-06-28 2018-08-14 中国路桥工程有限责任公司 Railway T-shaped beam prefabricated form device and its installation, release method

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