JPH0619112A - Production of phase shift mask - Google Patents

Production of phase shift mask

Info

Publication number
JPH0619112A
JPH0619112A JP17680792A JP17680792A JPH0619112A JP H0619112 A JPH0619112 A JP H0619112A JP 17680792 A JP17680792 A JP 17680792A JP 17680792 A JP17680792 A JP 17680792A JP H0619112 A JPH0619112 A JP H0619112A
Authority
JP
Japan
Prior art keywords
shifter
resist
patterning
phase shift
shift mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17680792A
Other languages
Japanese (ja)
Inventor
Taro Saito
太郎 齋藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP17680792A priority Critical patent/JPH0619112A/en
Publication of JPH0619112A publication Critical patent/JPH0619112A/en
Pending legal-status Critical Current

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  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To shorten the time for production by patterning a resist for patterning a shifter to a shape which itself is usable as the shifter, then making inspection. CONSTITUTION:A light shielding film 2 is formed on a glass substrate 3 and is patterned. A shifter material 1 is then formed thereon and a resist 4 is applied thereon. The resist is exposed and developed (so-called patterning) to form the resist 4 to the shape which is usable as the shifter. The inspection is made in the state of having such structure. Then, the removal of the resist 4 and the reapplication thereof are merely necessitated and there is no need for forming the shifter from the shifter material 1 if a defect is discovered at this time. The shorter production process is, therefore, necessitated. This resist is usable as a phase shift mask in the state of the as-inspected structure and, therefore, the use of the resist once in this state in case of a short delivery time or the like and the patterning of the shifter material 1 to the final structure after a time allowance is obtd. are feasible as well.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、半導体装置などの製
造の使用される位相シフトマスクの製造方法の特にシフ
ターの修正工程を中心にした方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a phase shift mask used for manufacturing a semiconductor device or the like, and more particularly to a method centering on a shifter correction step.

【0002】[0002]

【従来の技術】周知のように、位相シフトマスクは、半
導体装置などの製造におけるリソグラフィ工程でのパタ
ーニングのマスクとして使用されるものであり、その構
成は図2に示すように、ガラス基板3上に遮光膜(一般
に材料はクローム:Cr)2がパターニング形成されて
おり、その上に遮光膜2に一部重なるようにシフター
(一般に材料はSOG(スピン オン ガラス)など)
が形成されているものである。
2. Description of the Related Art As is well known, a phase shift mask is used as a patterning mask in a lithography process in manufacturing a semiconductor device or the like, and its structure is on a glass substrate 3 as shown in FIG. A light-shielding film (generally made of chrome: Cr) 2 is patterned and formed on top of which a shifter (generally made of SOG (spin on glass) or the like) is provided so as to partially overlap the light-shielding film 2.
Are formed.

【0003】このような位相シフトマスクの製造は、ま
ず、ガラス基板3の上に遮光膜材を形成してパターニン
グし、遮光膜2を形成し、その上にシフター材を形成
し、パターニングしてシフター1を形成する。無論、パ
ターニングには、レジストを塗布してパターニングして
それをマスクにして遮光膜2、シフター1のパターニン
グを行ない、その後レジストは除去する。従来、このよ
うにして製造する位相シフトマスクの検査は、前述のシ
フター1が形成された後、即ち位相シフトマスクが完全
にできてから行なっている。
In the manufacture of such a phase shift mask, first, a light shielding film material is formed on the glass substrate 3 and patterned to form a light shielding film 2, a shifter material is formed on the light shielding film 2 and patterned. The shifter 1 is formed. As a matter of course, for patterning, a resist is applied and patterned, the light-shielding film 2 and the shifter 1 are patterned using the resist as a mask, and then the resist is removed. Conventionally, the inspection of the thus manufactured phase shift mask is performed after the shifter 1 is formed, that is, after the phase shift mask is completely formed.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、前述し
た製造方法では、シフターの修正が必要な場合(この修
正はかなりの頻度である)、シフターの形成からし直さ
なければならず、製造に要する時間が長くなるという問
題点があった。
However, in the above-described manufacturing method, when the shifter needs to be modified (this modification is quite frequent), the shifter must be formed again, and the time required for the manufacturing is increased. There was a problem that it becomes longer.

【0005】本発明は、前述した位相シフトマスク製作
時間の長時間化を解消するために、シフターのパターニ
ングのためのレジストをパターニングした後に検査をす
るようにし、製作時間の短縮を図ることを目的とするも
のである。
SUMMARY OF THE INVENTION The present invention aims to shorten the manufacturing time by performing an inspection after patterning a resist for patterning a shifter in order to eliminate the above-mentioned long manufacturing time of the phase shift mask. It is what

【0006】[0006]

【課題を解決するための手段】前記目的のために本発明
は、位相シフトマスクの製造にあたり、シフターのパタ
ーニングのためのレジストを、そのレジスト自体シフタ
ーとして使用できる形状(膜厚)に形成して、その後
(即ち、従来のようにシフター材をシフターとした位相
シフトマスクが完成する前に)検査するようにしたもの
である。
To achieve the above object, in the present invention, in manufacturing a phase shift mask, a resist for patterning a shifter is formed into a shape (film thickness) which itself can be used as a shifter. After that, that is, before the completion of the phase shift mask using the shifter material as the shifter as in the conventional case, the inspection is performed.

【0007】[0007]

【作用】前述したように本発明は、シフターのパターニ
ングのためのレジストを、それ自体がシフターとして使
用できるようにパターニングした後検査するようにした
ので、そのとき欠陥が見つかれば、レジストを除去して
再塗布するだけでよく、製造工程の短縮が図れる。
As described above, according to the present invention, the resist for patterning the shifter is inspected after the resist is patterned so that it can be used as a shifter, and if a defect is found at that time, the resist is removed. Therefore, the manufacturing process can be shortened.

【0008】また、この時点での構成で位相シフトマス
クとして使用できる(レジストがシフターとして使用で
きる)ので、短納期などの場合、一旦そのままで使用
し、時間的に余裕ができてからシフター材をパターニン
グしてレジストを除去し、最終的な位相シフトマスクに
するといったこともできる。
Further, since the constitution at this time can be used as a phase shift mask (the resist can be used as a shifter), in the case of a short delivery time, it is used as it is, and the shifter material is used after there is a time margin. It is also possible to perform patterning to remove the resist to form a final phase shift mask.

【0009】[0009]

【実施例】本発明の実施例の製造工程を図1に示し、以
下に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A manufacturing process of an embodiment of the present invention is shown in FIG. 1 and will be described below.

【0010】まず、図1(a)に示すように、従来同
様、ガラス基板3上に遮光膜(材料はCr)2を形成
し、パターニングする。次いで、その上にシフター材
(材料はSOG)1を厚さ4240Å形成し、その上に
レジスト4(シプレイ社製:SAL601 ER4)を
厚さ3040Å塗布する。そして露光を行ない、125
℃、5分のPEB(Post Exposure Ba
ke)を行ない、現像して(いわゆるパターニング)、
図1(b)に示すように、前記レジスト4をシフターと
して使える形に形成する。
First, as shown in FIG. 1A, a light-shielding film (made of Cr) 2 is formed on a glass substrate 3 and patterned as in the conventional case. Next, a shifter material (material is SOG) 1 having a thickness of 4240Å is formed thereon, and a resist 4 (SAL601 ER4 manufactured by Shipley Co., Ltd.) having a thickness of 3040Å is applied thereon. Then, exposure is performed, and 125
PEB (Post Exposure Ba)
ke) and develop (so-called patterning),
As shown in FIG. 1B, the resist 4 is formed in a shape usable as a shifter.

【0011】レジスト4と遮光膜(SOG)2との屈折
率は、それぞれ1.6と1.43であるから、前述した
膜厚であればどちらもシフターとして使えることにな
る。つまり、図1(b)の構造のままでも位相シフトマ
スクとして使用できる。
Since the refractive indexes of the resist 4 and the light-shielding film (SOG) 2 are 1.6 and 1.43, respectively, both of them can be used as shifters if they have the above-mentioned film thicknesses. That is, the structure of FIG. 1B can be used as it is as a phase shift mask.

【0012】従って、この構造にした状態で検査を行な
えば、図1(c)のようにシフター材1をパターニング
した後、つまり最終的な位相シフトマスクにした後検査
したのと同等になる。
Therefore, if the inspection is performed in this state, it is equivalent to the inspection after the shifter material 1 is patterned as shown in FIG. 1C, that is, after the final phase shift mask is formed.

【0013】[0013]

【発明の効果】以上説明したように本発明によれば、シ
フターをパターニングするためのレジストを、それ自体
がシフターとして使用できる形状にパターニングした
後、検査するようにしたので、このときに欠陥が見つか
れば、レジストを除去して再塗布するだけでよく、つま
り、従来のようにシフター材(SOG)から形成し直す
必要はなく、製造工程が短くてすむ。
As described above, according to the present invention, the resist for patterning the shifter is inspected after being patterned into a shape that can be used as a shifter by itself, so that a defect at this time is detected. If found, the resist only needs to be removed and re-coated, that is, it is not necessary to re-form the shifter material (SOG) as in the conventional case, and the manufacturing process can be shortened.

【0014】また、前記レジストはそれ自体がシフター
として使える形状としたので、前記検査した時点の構造
のまま位相シフトマスクとして使用できる。従って、短
納期などの場合、一旦この状態で使用し、時間的に余裕
ができてからシフター材をパターニングして最終の構造
にするといったこともできる。
Further, since the resist itself has a shape that can be used as a shifter, it can be used as a phase shift mask without changing the structure at the time of the inspection. Therefore, in the case of a short delivery time, it is possible to use it in this state once and allow the shifter material to be patterned before the final structure.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例FIG. 1 Example of the present invention

【図2】従来例FIG. 2 Conventional example

【符号の説明】 1 シフター材 2 遮光膜 3 ガラス基板 4 レジスト[Explanation of symbols] 1 shifter material 2 light shielding film 3 glass substrate 4 resist

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 (a)ガラス基板上に遮光膜を形成し、
該遮光膜をパターニングする工程、 (b)前記構造の上全面にシフター材を形成する工程、 (c)前記シフター材の上に、前記シフター材をパター
ニングするためのレジストを、該レジスト自体もシフタ
ーとして使用できる形状に形成する工程、 (d)前記レジスト形成後、検査を行なう工程、 以上の工程を含むことを特徴とする位相シフトマスクの
製造方法。
1. A light-shielding film is formed on a glass substrate,
Patterning the light-shielding film, (b) forming a shifter material on the entire surface of the structure, (c) a resist for patterning the shifter material on the shifter material, and the resist itself is also a shifter And (d) a step of inspecting after forming the resist, and a step of forming the above-described steps.
JP17680792A 1992-07-03 1992-07-03 Production of phase shift mask Pending JPH0619112A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17680792A JPH0619112A (en) 1992-07-03 1992-07-03 Production of phase shift mask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17680792A JPH0619112A (en) 1992-07-03 1992-07-03 Production of phase shift mask

Publications (1)

Publication Number Publication Date
JPH0619112A true JPH0619112A (en) 1994-01-28

Family

ID=16020188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17680792A Pending JPH0619112A (en) 1992-07-03 1992-07-03 Production of phase shift mask

Country Status (1)

Country Link
JP (1) JPH0619112A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100856167B1 (en) * 2001-08-17 2008-09-03 가부시키가이샤 히타치세이사쿠쇼 Manufacturing method of semiconductor apparatus
US7442260B2 (en) 2003-03-19 2008-10-28 Nippon Steel Corooration Grain-oriented electrical steel sheet superior in electrical characteristics and method of production of same
US8790471B2 (en) 2010-07-28 2014-07-29 Nippon Steel & Sumitomo Metal Corporation Grain-oriented electrical steel sheet and manufacturing method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100856167B1 (en) * 2001-08-17 2008-09-03 가부시키가이샤 히타치세이사쿠쇼 Manufacturing method of semiconductor apparatus
US7442260B2 (en) 2003-03-19 2008-10-28 Nippon Steel Corooration Grain-oriented electrical steel sheet superior in electrical characteristics and method of production of same
US8790471B2 (en) 2010-07-28 2014-07-29 Nippon Steel & Sumitomo Metal Corporation Grain-oriented electrical steel sheet and manufacturing method thereof
US9659693B2 (en) 2010-07-28 2017-05-23 Nippon Steel & Sumitomo Metal Corporation Grain-oriented electrical steel sheet and manufacturing method thereof

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