JPH0619216U - Solid insulated conductor - Google Patents

Abstract

(57) [Summary] [Purpose] To prevent temperature rise and improve current carrying capacity. [Structure] An insulator 2 in which a conductor 1 is molded, a ground layer 3 covering the outer surface of the insulator 2, and a heat pipe 4 having a base 5 attached to the ground layer 3 are provided.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a solid insulated conductor whose surface is grounded.

[0002]

[Prior art]

 In conventional solid insulated conductors, an electrically conductive linear conductor is molded with an epoxy resin insulator, the outer surface of the insulator is covered with a ground layer, and the ground layer has an effect of the electric field on the space in the energized state. To prevent partial discharge and dielectric breakdown.

[0003]

[Problems to be solved by the device]

 In the case of conventional solid insulated conductors, the temperature of the conductor rises due to energization, the temperature of the insulator that molds the conductor also rises, and there is an upper limit temperature for the conductor and the insulator. However, there is a problem that it becomes large and expensive to obtain the required current carrying capacity. The present invention has been made in consideration of the above points, and an object of the present invention is to provide a solid insulated conductor capable of preventing a temperature rise of a conductor and an insulator and improving a current carrying capacity.

[0004]

[Means for Solving the Problems]

 In order to solve the above-mentioned problems, the solid insulated conductor of the present invention comprises an insulator molded with a conductor, a ground layer covering the outer surface of the insulator, and a heat pipe having a base attached to the ground layer. It is a thing.

[0005]

[Action]

 In the solid insulated conductor of the present invention constructed as described above, the ground layer is covered with the insulator molded with the conductor, and the base of the heat pipe is attached to the ground layer. The generated heat is transferred to the base of the heat pipe through the insulator and the ground layer, and is dissipated by the heat pipe, which suppresses the temperature rise of the conductor and the insulator and improves the current carrying capacity.

[0006]

【Example】

 One embodiment will be described with reference to FIGS. 1 and 2. In these figures, 1 is a linear conductor to be energized, 2 is an insulator such as epoxy resin in which the conductor 1 is molded, 3 is the outer surface of the insulator 2 and the surface of the insulator 2 is set to the ground potential. The ground layers 4, 4 are heat pipes, 5 are the bases of the heat pipes 4, and the lower surface is bonded to the ground layer 3. 6 is a fin of the heat pipe 4, 7 is a band wound around the ground layer 3 via the base 5, and the heat pipe 4 is attached to the ground layer 3.

Therefore, the heat of the conductor 1 is transferred to the base portion 5 of the heat pipe 4 through the insulator 2 and the ground layer 3, and is radiated from the fins 6 of the heat pipe 4 to prevent the temperature rise. It is desirable to arrange the required number of heat pipes 4 at a required position. The heat pipe 4 may be attached by a band 7 or a heat conductive adhesive, and an appropriate means is selected. Further, when the lower surface of the base 5 is flat, it is preferable to interpose a heat conductive elastic body between the base 5 and the ground layer 3 in order to improve the adhesion with the ground layer 3.

[0008]

[Effect of device]

 Since the present invention is configured as described above, it has the following effects. In the solid insulated conductor of the present invention, the insulator 2 molded with the conductor 1 is covered with the ground layer 3, and the base portion 5 of the heat pipe 4 is attached to the ground layer 3, so that the conductor 1 does not contact the conductor 1 in the energized state. The generated heat is transmitted to the base portion 5 of the heat pipe 4 through the insulator 2 and the ground layer 3, and can be efficiently dissipated by the heat pipe 4, thus suppressing the temperature rise of the conductor 1 and the insulator 3. It is possible to improve the current carrying capacity, prevent an increase in size, and reduce cost.

[Brief description of drawings]

FIG. 1 is a cutaway front view of an embodiment of the present invention.

FIG. 2 is a sectional plan view of FIG.

[Explanation of symbols]

 1 Conductor 2 Insulator 3 Ground Layer 4 Heat Pipe 5 Base

Claims (1)

[Scope of utility model registration request] 1. A solid insulated conductor comprising an insulator molded with a conductor, a ground layer covering the outer surface of the insulator, and a heat pipe having a base attached to the ground layer.