JPH061944A - Resin composition for coating and resin composition for color filter protection film produced by using the composition - Google Patents
Resin composition for coating and resin composition for color filter protection film produced by using the compositionInfo
- Publication number
- JPH061944A JPH061944A JP15991092A JP15991092A JPH061944A JP H061944 A JPH061944 A JP H061944A JP 15991092 A JP15991092 A JP 15991092A JP 15991092 A JP15991092 A JP 15991092A JP H061944 A JPH061944 A JP H061944A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- resin composition
- coating
- composition
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 58
- 239000011342 resin composition Substances 0.000 title claims abstract description 21
- 239000000203 mixture Substances 0.000 title description 26
- 239000008199 coating composition Substances 0.000 title 1
- 239000011248 coating agent Substances 0.000 claims abstract description 55
- -1 N-substituted maleimide Chemical class 0.000 claims abstract description 31
- 239000003822 epoxy resin Substances 0.000 claims abstract description 17
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 17
- 229920006026 co-polymeric resin Polymers 0.000 claims abstract description 15
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 9
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 8
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 6
- 230000001681 protective effect Effects 0.000 claims description 14
- 239000002253 acid Substances 0.000 claims description 10
- 150000008065 acid anhydrides Chemical class 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- 239000000126 substance Substances 0.000 abstract description 13
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 abstract description 5
- 150000001735 carboxylic acids Chemical class 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 52
- 239000000243 solution Substances 0.000 description 26
- 239000002904 solvent Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 19
- 239000011521 glass Substances 0.000 description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 15
- 239000000758 substrate Substances 0.000 description 15
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- 238000002834 transmittance Methods 0.000 description 11
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 10
- 238000001723 curing Methods 0.000 description 9
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 239000004843 novolac epoxy resin Substances 0.000 description 8
- 241000272814 Anser sp. Species 0.000 description 7
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 6
- 229930003836 cresol Natural products 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000006087 Silane Coupling Agent Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 5
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 4
- 238000013007 heat curing Methods 0.000 description 4
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000004043 dyeing Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920002454 poly(glycidyl methacrylate) polymer Polymers 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 238000010526 radical polymerization reaction Methods 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 2
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 2
- 150000008360 acrylonitriles Chemical class 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- STZIXLPVKZUAMV-UHFFFAOYSA-N cyclopentane-1,1,2,2-tetracarboxylic acid Chemical compound OC(=O)C1(C(O)=O)CCCC1(C(O)=O)C(O)=O STZIXLPVKZUAMV-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003759 ester based solvent Substances 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000005453 ketone based solvent Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 150000003440 styrenes Chemical class 0.000 description 2
- HJUGFYREWKUQJT-UHFFFAOYSA-N tetrabromomethane Chemical compound BrC(Br)(Br)Br HJUGFYREWKUQJT-UHFFFAOYSA-N 0.000 description 2
- 125000005591 trimellitate group Chemical group 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- OLQWMCSSZKNOLQ-ZXZARUISSA-N (3s)-3-[(3r)-2,5-dioxooxolan-3-yl]oxolane-2,5-dione Chemical group O=C1OC(=O)C[C@H]1[C@@H]1C(=O)OC(=O)C1 OLQWMCSSZKNOLQ-ZXZARUISSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- DABFKTHTXOELJF-UHFFFAOYSA-N 1-propylpyrrole-2,5-dione Chemical compound CCCN1C(=O)C=CC1=O DABFKTHTXOELJF-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- BJINVQNEBGOMCR-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethyl acetate Chemical compound COCCOCCOC(C)=O BJINVQNEBGOMCR-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical class ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- ODGCZQFTJDEYNI-UHFFFAOYSA-N 2-methylcyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1(C)C=CCCC1C(O)=O ODGCZQFTJDEYNI-UHFFFAOYSA-N 0.000 description 1
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical class O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 description 1
- RTANHMOFHGSZQO-UHFFFAOYSA-N 4-methoxy-2,4-dimethylpentanenitrile Chemical compound COC(C)(C)CC(C)C#N RTANHMOFHGSZQO-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- IQYMRQZTDOLQHC-ZQTLJVIJSA-N [(1R,4S)-2-bicyclo[2.2.1]heptanyl] prop-2-enoate Chemical compound C1C[C@H]2C(OC(=O)C=C)C[C@@H]1C2 IQYMRQZTDOLQHC-ZQTLJVIJSA-N 0.000 description 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 1
- SKKHNUKNMQLBTJ-QIIDTADFSA-N [(1s,4r)-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@H]2C(OC(=O)C(=C)C)C[C@@H]1C2 SKKHNUKNMQLBTJ-QIIDTADFSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- SQHOHKQMTHROSF-UHFFFAOYSA-N but-1-en-2-ylbenzene Chemical compound CCC(=C)C1=CC=CC=C1 SQHOHKQMTHROSF-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- HNBQFKZSMFFZQY-UHFFFAOYSA-L chembl1559341 Chemical compound [Na+].[Na+].C1=CC(C)=CC=C1S(=O)(=O)OC1=CC=C(N=NC=2C(=CC(=CC=2)C=2C=C(C)C(N=NC=3C4=C(C=C(C=C4C=CC=3O)S([O-])(=O)=O)S([O-])(=O)=O)=CC=2)C)C=C1 HNBQFKZSMFFZQY-UHFFFAOYSA-L 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- LJZJMIZQMNDARW-UHFFFAOYSA-N decan-3-yl 2-methylprop-2-enoate Chemical compound CCCCCCCC(CC)OC(=O)C(C)=C LJZJMIZQMNDARW-UHFFFAOYSA-N 0.000 description 1
- NHAQFLFLZGBOBG-UHFFFAOYSA-N decan-3-yl prop-2-enoate Chemical compound CCCCCCCC(CC)OC(=O)C=C NHAQFLFLZGBOBG-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 125000006159 dianhydride group Chemical group 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 239000004845 glycidylamine epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- KETWBQOXTBGBBN-UHFFFAOYSA-N hex-1-enylbenzene Chemical compound CCCCC=CC1=CC=CC=C1 KETWBQOXTBGBBN-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000012690 ionic polymerization Methods 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- DAZXVJBJRMWXJP-UHFFFAOYSA-N n,n-dimethylethylamine Chemical compound CCN(C)C DAZXVJBJRMWXJP-UHFFFAOYSA-N 0.000 description 1
- ZUHZZVMEUAUWHY-UHFFFAOYSA-N n,n-dimethylpropan-1-amine Chemical compound CCCN(C)C ZUHZZVMEUAUWHY-UHFFFAOYSA-N 0.000 description 1
- ZWRDBWDXRLPESY-UHFFFAOYSA-N n-benzyl-n-ethylethanamine Chemical compound CCN(CC)CC1=CC=CC=C1 ZWRDBWDXRLPESY-UHFFFAOYSA-N 0.000 description 1
- SMBYUOXUISCLCF-UHFFFAOYSA-N n-ethyl-n-methylpropan-1-amine Chemical compound CCCN(C)CC SMBYUOXUISCLCF-UHFFFAOYSA-N 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- FZYCEURIEDTWNS-UHFFFAOYSA-N prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC=C1.CC(=C)C1=CC=CC=C1 FZYCEURIEDTWNS-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical class C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000001226 reprecipitation Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 238000010558 suspension polymerization method Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Optical Filters (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、コーティング用樹脂組
成物およびこれを用いたカラーフィルタ保護膜用樹脂組
成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating resin composition and a color filter protective film resin composition using the same.
【0002】[0002]
【従来の技術】各種物品の表面の劣化や損傷を防止する
目的でコーティング膜を形成することがしばしば行われ
ている。このような、コーティング膜においては、平滑
な塗膜が得られること、基体との密着性が高いこと、強
靱であること、耐水性及び耐薬品性、耐溶剤性が優れて
いること、耐熱性及び耐光性が高くて長期間変質を起こ
さないこと等の性能が要求される。2. Description of the Related Art A coating film is often formed for the purpose of preventing deterioration and damage of the surface of various articles. In such coating film, a smooth coating film can be obtained, high adhesion to the substrate, toughness, excellent water resistance, chemical resistance, solvent resistance, heat resistance In addition, it is required to have performance such as high light resistance and no deterioration for a long period of time.
【0003】また、近年では液晶表示素子、太陽電池、
光ディスク等に用いられるコーティング膜として前述の
性能に加えて透明性等の要求される用途が増加してい
る。In recent years, liquid crystal display devices, solar cells,
As a coating film used for optical disks and the like, applications requiring transparency and the like in addition to the above-mentioned performance are increasing.
【0004】例えば、近年、カラーフィルタを内蔵した
カラー液晶表示素子が種々発表されている。このカラー
液晶表示素子の作製にあたっては、ガラス等の透明基板
上にカラーフィルタを設け、この上にインジウムチンオ
キシド(ITO)等からなる無機薄膜を蒸着し、フォト
リソグラフィー法によってパターニングして透明電極を
形成した後、さらにこの上に液晶を配置する方法が主流
となりつつある。この場合、カラーフィルタには、この
上にITOを蒸着して、フォトリソグラフィー法で透明
電極を形成するプロセスに耐え得るだけの耐熱性、耐薬
品性が備わっていないため、ITOを蒸着する前にカラ
ーフィルタ上に保護膜を形成しておく必要がある。For example, in recent years, various color liquid crystal display devices incorporating a color filter have been announced. In the production of this color liquid crystal display element, a color filter is provided on a transparent substrate such as glass, an inorganic thin film made of indium tin oxide (ITO) or the like is vapor-deposited thereon, and a transparent electrode is formed by patterning by a photolithography method. After the formation, a method of disposing liquid crystal on the liquid crystal is becoming mainstream. In this case, the color filter does not have sufficient heat resistance and chemical resistance to withstand the process of depositing ITO on the color filter and forming the transparent electrode by the photolithography method. It is necessary to form a protective film on the color filter.
【0005】このカラーフィルタ保護膜に要求される特
性としては、耐熱性、耐薬品性の他にガラス基板やカラ
ーフィルタとの密着性、コーティング性、透明性、耐傷
性等があげられる。このうち耐熱性は、保護膜上にIT
O等の透明電極を蒸着によって形成する際に、保護膜表
面が、通常200℃以上に加熱されるため、この条件下
で安定であることが必要である。Properties required of this color filter protective film include heat resistance and chemical resistance, as well as adhesion to a glass substrate or a color filter, coating properties, transparency, and scratch resistance. Of these, heat resistance is
When forming a transparent electrode such as O by vapor deposition, the surface of the protective film is usually heated to 200 ° C. or higher, and therefore it is necessary that the surface is stable under these conditions.
【0006】このような耐熱性、耐薬品性等に優れたコ
ーティング用材料としては、特開昭58−196506
号公報や特開昭62−119501号公報記載のアクリ
ル系樹脂、特開昭60−216307号公報記載のポリ
グリシジルメタクリレート系樹脂、特開昭63−131
103号公報記載のメラミン樹脂、エポキシ樹脂、その
他ポリイミド樹脂等が提案されている。As a coating material having such excellent heat resistance and chemical resistance, there is disclosed in Japanese Patent Laid-Open No. 58-196506.
Acrylic resins described in JP-A-62-119501, polyglycidyl methacrylate-based resins described in JP-A-60-216307, and JP-A-63-131.
A melamine resin, an epoxy resin, and other polyimide resins described in Japanese Patent Laid-Open No. 103 have been proposed.
【0007】[0007]
【発明が解決しようとする課題】しかしながら、従来提
案されている材料ではそれぞれ欠点があり、全ての要求
特性を満足するバランスのとれた材料は無い。However, the materials proposed hitherto have respective drawbacks, and there is no well-balanced material satisfying all the required characteristics.
【0008】例えば、アクリル系樹脂では耐熱性が不十
分であり、ITO等の蒸着時に膜の表面にシワやクラッ
クを生じるという問題がある。For example, acrylic resins have insufficient heat resistance, and there is a problem that wrinkles and cracks are generated on the surface of the film during the vapor deposition of ITO or the like.
【0009】ポリグリシジルメタクリレート系樹脂で
は、ガラス基板等との密着性が不十分であり、液晶素子
組立てプロセス中にハガレを生じたり、カラーフィルタ
層に薬品等が侵入することを十分に阻止することができ
ない。The polyglycidyl methacrylate resin is insufficient in adhesion to a glass substrate or the like, and must sufficiently prevent peeling during the liquid crystal element assembling process and prevent chemicals from entering the color filter layer. I can't.
【0010】メラミン樹脂は、比較的耐熱性は高いもの
のガラス基板やカラーフィルタとの密着性が極端に悪
く、基板やフィルタ上でハジキを生じ易い。Although melamine resin has relatively high heat resistance, it has extremely poor adhesion to a glass substrate or a color filter, and is likely to cause cissing on the substrate or filter.
【0011】エポキシ樹脂は密着性の良いものは、耐熱
性が不十分であり、耐熱性の高いものは密着性やコーテ
ィング性が劣るため要求特性のバランスをとることがで
きない。またポリイミド樹脂は、透明性が不十分な上
に、ワニスの保存安定性に欠ける点や、カラーフィルタ
を浸すような溶剤しか使用できないというような問題点
がある。If the epoxy resin has good adhesion, the heat resistance is insufficient, and if the epoxy resin has high heat resistance, the adhesion and coating properties are poor, so that the required properties cannot be balanced. Further, the polyimide resin has problems that it is insufficient in transparency, lacks in storage stability of the varnish, and can use only a solvent for immersing the color filter.
【0012】本発明の目的は上記従来材料の欠点を解決
し耐熱性、耐薬品性、密着性、コーティング性、透明
性、耐傷性等の全ての要求特性を満足し得るバランスの
とれた新規なコーティング用樹脂組成物であって低温硬
化が可能なものおよびこれを用いたカラーフィルタ保護
膜用樹脂組成物を提供するものである。The object of the present invention is to solve the drawbacks of the above-mentioned conventional materials and to achieve a well-balanced and novel new material which can satisfy all the required properties such as heat resistance, chemical resistance, adhesiveness, coating property, transparency and scratch resistance. A resin composition for coating, which can be cured at a low temperature, and a resin composition for a color filter protective film using the same.
【0013】[0013]
【課題を解決するための手段】本発明におけるコーティ
ング用樹脂組成物は、 A、(1)N置換マレイミド、および(2)アクリル酸
またはメタクリル酸を共重合してなる共重合樹脂、 B、分子内にエポキシ基を2以上有するエポキシ樹脂な
らびに C、第三級アミン化合物を含有してなるものである。こ
のコーティング用樹脂組成物は、特にカラーフィルタ保
護膜用樹脂組成物に適している。The coating resin composition in the present invention comprises: A, (1) N-substituted maleimide, and (2) a copolymer resin obtained by copolymerizing acrylic acid or methacrylic acid, B, a molecule. It contains an epoxy resin having two or more epoxy groups, C, and a tertiary amine compound. This coating resin composition is particularly suitable for a color filter protective film resin composition.
【0014】本発明におけるA成分である共重合樹脂を
構成するモノマー成分としてのN置換マレイミドとして
は、公知のものが使用できるが、Nメチルマレイミド、
Nエチルマレイミド、Nプロピルマレイミド、Nブチル
マレイミド等のNアルキル基置換マレイミド、Nシクロ
ヘキシルマレイミド等のNシクロアルキル基置換マレイ
ミド、NフェニルマレイミドおよびNアルキル基置換フ
ェニルマレイミドからなる群より選ばれる少なくとも1
種の化合物を使用することが、耐熱性および基材との密
着性の観点から好ましい。これらのうちでもNシクロヘ
キシルマレイミドおよびNフェニルマレイミドが特に好
ましい。A成分である共重合樹脂中におけるAs the N-substituted maleimide as a monomer component constituting the copolymer resin which is the component A in the present invention, known ones can be used, but N-methylmaleimide,
At least one selected from the group consisting of N-alkyl group-substituted maleimides such as N-ethylmaleimide, N-propylmaleimide, and N-butylmaleimide, N-cycloalkyl-group-substituted maleimides such as N-cyclohexylmaleimide, N-phenylmaleimide and N-alkyl-substituted phenylmaleimide.
From the viewpoint of heat resistance and adhesiveness to a substrate, it is preferable to use a compound of a kind. Of these, N-cyclohexylmaleimide and N-phenylmaleimide are particularly preferable. In the copolymer resin which is the component A
【0015】アクリル酸またはメタクリル酸を使用する
際、これらを併用してもよい。When acrylic acid or methacrylic acid is used, these may be used together.
【0016】(1)N置換マレイミドまたは(2)アク
リル酸若しくはメタクリル酸と共重合可能な他の不飽和
単量体(3)をA成分の共重合樹脂のモノマー成分とし
て使用してもよい。このような不飽和単量体としては、
不飽和脂肪酸エステル、芳香族ビニル化合物、シアン化
ビニル化合物等がある。(1) N-substituted maleimide or (2) another unsaturated monomer (3) copolymerizable with acrylic acid or methacrylic acid may be used as the monomer component of the copolymer resin of component A. As such an unsaturated monomer,
There are unsaturated fatty acid esters, aromatic vinyl compounds, vinyl cyanide compounds and the like.
【0017】上記不飽和脂肪酸エステルとしては、アク
リル酸メチル、アクリル酸エチル、アクリル酸ブチル、
アクリル酸2−エチルヘキシル等のアクリル酸アルキル
エステル、アクリル酸シクロヘキシル、アクリル酸トリ
シクロ〔5.2.1.02,6〕デカ−8−イル、アクリ
ル酸イソボルニル、アクリル酸ノルボルニル等のアクリ
ル酸シクロアルキルエステル、アクリル酸フェニル、ア
クリル酸ベンジル等のアクリル酸芳香族エステル、アク
リル酸グリシジル、アクリル酸2−ヒドロキシエチル等
のアクリル酸エステル、メタクリル酸メチル、メタクリ
ル酸エチル、メタクリル酸ブチル、メタクリル酸2−エ
チルヘキシル等のメタクリル酸アルキルエステル、メタ
クリル酸シクロヘキシル、メタクリル酸トリシクロ
〔5.2.1.02,6〕デカ−8−イル、メタクリル酸
イソボルニル、メタクリル酸ノルボルニル等のメタクリ
ル酸シクロアルキルエステル、メタクリル酸フェニル、
メタクリル酸ベンジル等のメタクリル酸芳香族エステ
ル、メタクリル酸グリシジル、メタクリル酸2−ヒドロ
キシエチル等のメタクリル酸エステルなどがある。Examples of the unsaturated fatty acid ester include methyl acrylate, ethyl acrylate, butyl acrylate,
Acrylic acid alkyl ester such as 2-ethylhexyl acrylate, cyclohexyl acrylate, tricyclo [5.2.1.0 2,6 ] deca-8-yl acrylate, isobornyl acrylate, norbornyl acrylate and the like cycloalkyl acrylate Ester, phenyl acrylate, aromatic acrylate such as benzyl acrylate, glycidyl acrylate, acrylate such as 2-hydroxyethyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, 2-ethylhexyl methacrylate Methacrylic acid alkyl esters such as, cyclohexyl methacrylate, tricyclo [5.2.1.0 2,6 ] deca-8-yl, isobornyl methacrylate, norbornyl methacrylate and other cycloalkyl methacrylates Tell, phenyl methacrylate,
There are methacrylic acid aromatic esters such as benzyl methacrylate, glycidyl methacrylate, and methacrylic acid esters such as 2-hydroxyethyl methacrylate.
【0018】前記芳香族ビニル化合物としては、スチレ
ン又はα−メチルスチレン、α−エチルスチレン等のα
−置換スチレン、クロロスチレン、ビニルトルエン、t
−ブチルスチレン等の核置換スチレンなどがある。Examples of the aromatic vinyl compound include styrene and α-methylstyrene, α-ethylstyrene and the like α.
-Substituted styrene, chlorostyrene, vinyltoluene, t
-Nuclear substituted styrene such as butyl styrene.
【0019】シアン化ビニル化合物としては、アクリロ
ニトリル、メタクリロニトリル等がある。Examples of vinyl cyanide compounds include acrylonitrile and methacrylonitrile.
【0020】(1)N置換マレイミド、(2)アクリル
酸またはメタクリル酸および(3)他の不飽和単量体
は、これらの総量を基準としてそれぞれ、20〜70重
量%、5〜30重量%及び0〜50重量%の割合で全体
が100重量%になるように使用することが好ましい。
(1)N置換マレイミドが少なすぎると得られるコーテ
ィング膜の耐熱性が不十分となる傾向があり、逆に多す
ぎると密着性やコーティング性に不都合を生じる傾向が
ある。(2)アクリル酸またはメタクリル酸が少なすぎ
ると、得られる硬化物の耐熱性、耐傷性が不十分となる
傾向があり、逆に多すぎるとコーティング性や硬化物の
耐薬品性が低下する傾向がある。(3)他の不飽和単量
体が多すぎると本発明の効果が不十分となりやすい。The (1) N-substituted maleimide, (2) acrylic acid or methacrylic acid and (3) other unsaturated monomers are 20 to 70% by weight and 5 to 30% by weight, respectively, based on the total amount thereof. And 0 to 50% by weight are preferably used so that the total amount becomes 100% by weight.
(1) When the amount of N-substituted maleimide is too small, the heat resistance of the obtained coating film tends to be insufficient, and conversely, when it is too large, the adhesion and coating properties tend to be inconvenient. (2) When the amount of acrylic acid or methacrylic acid is too small, the heat resistance and scratch resistance of the obtained cured product tend to be insufficient, and conversely when it is too large, the coating properties and the chemical resistance of the cured product tend to decrease. There is. (3) If the amount of other unsaturated monomers is too large, the effect of the present invention tends to be insufficient.
【0021】これらの(1)N置換マレイミド、(2)
アクリル酸またはメタクリル酸および(3)他の不飽和
単量体を共重合するにあたっては、ラジカル重合やイオ
ン重合等の公知の方法を使用できる。例えば、重合開始
剤の存在下で塊状重合法、溶液重合法、懸濁重合法、乳
化重合法等の方法で製造することができる。These (1) N-substituted maleimides, (2)
In copolymerizing acrylic acid or methacrylic acid and (3) another unsaturated monomer, known methods such as radical polymerization and ionic polymerization can be used. For example, it can be produced by a method such as a bulk polymerization method, a solution polymerization method, a suspension polymerization method or an emulsion polymerization method in the presence of a polymerization initiator.
【0022】上記重合開始剤としては例えば、過酸化ベ
ンゾイル、過酸化ラウロイル、ジ−t−ブチルペルオキ
シヘキサヒドロフタレート、t−ブチルペルオキシ−2
−エチルヘキサノエート、1,1−ジ−t−ブチルペル
オキシ−3,3,5−トリメチルシクロヘキサン等の有
機過酸化物、アゾビスイソブチロニトリル、アゾビス−
4−メトキシ−2,4−ジメチルバレロニトリル、アゾ
ビスシクロヘキサノン−1−カルボニトリル、アゾジベ
ンゾイル等のアゾ化合物、過硫酸カリウム、過硫酸アン
モニウムに代表される水溶性触媒及び過酸化物あるいは
過硫酸塩と還元剤の組み合わせによるレドックス触媒
等、通常のラジカル重合に使用できるものはいずれも使
用することができる。重合触媒は前記モノマーの総量に
対して0.01〜10重量%の範囲で使用するのが好ま
しい。Examples of the above-mentioned polymerization initiator include benzoyl peroxide, lauroyl peroxide, di-t-butylperoxyhexahydrophthalate and t-butylperoxy-2.
-Ethyl hexanoate, 1,1-di-t-butylperoxy-3,3,5-trimethylcyclohexane and other organic peroxides, azobisisobutyronitrile, azobis-
Azo compounds such as 4-methoxy-2,4-dimethylvaleronitrile, azobiscyclohexanone-1-carbonitrile and azodibenzoyl, water-soluble catalysts represented by potassium persulfate and ammonium persulfate, and peroxides or persulfates. Any redox catalyst that can be used in ordinary radical polymerization, such as a redox catalyst obtained by combining a solvent and a reducing agent, can be used. The polymerization catalyst is preferably used in the range of 0.01 to 10% by weight based on the total amount of the above monomers.
【0023】また、重合調節剤としてメルカプタン系化
合物、チオグリコール、四臭化炭素、α−メチルスチレ
ンダイマー等が分子量調節のために必要に応じて添加す
ることができる。Further, a mercaptan compound, thioglycol, carbon tetrabromide, α-methylstyrene dimer and the like can be added as a polymerization regulator as necessary for controlling the molecular weight.
【0024】重合温度は0〜200℃の範囲で選択する
のが好ましく、特に50〜120℃であるのが好まし
い。The polymerization temperature is preferably selected in the range of 0 to 200 ° C, particularly preferably 50 to 120 ° C.
【0025】溶液重合における溶媒としては、通常のラ
ジカル重合に使用される溶媒が使用できる。具体例とし
ては、ベンゼン、トルエン、キシレン等の芳香族系溶
剤;アセトン、メチルエチルケトン、メチルイソブチル
ケトン、シクロヘキサノン等のケトン系溶剤;ジエチル
エーテル、イソプロピルエーテル、テトラヒドロフラ
ン、ジオキサン、エチレングリコールジメチルエーテ
ル、エチレングリコールジエチルエーテル、ジエチレン
グリコールジメチルエーテル、ジチレングリコールジエ
チルエーテル等のエーテル系溶剤;酢酸エチル、酢酸−
n−プロピル、酢酸イソプロピル、酢酸−n−ブチル、
エチレングリコールモノメチルエーテルアセタート、エ
チレングリコールモノエチルエーテルアセタート、エチ
レングリコールモノブチルエーテルアセタート、ジエチ
レングリコールモノメチルエーテルアセタート、ジエチ
レングリコールモノエチルエーテルアセタート、プロピ
レングリコールモノメチルエーテルアセタート、プロピ
レングリコールモノエチルエーテルアセタート、γ−ブ
チロラクトン等のエステル系溶剤;ジメチルホルムアミ
ド、ジメチルアセトアミド、N−メチルピロリドン等の
アミド系溶剤などが挙げられる。これらの溶剤のうち、
エステル系溶剤及びケトン系溶剤が好ましく、単独で、
または、2種類以上を混合して使用することができる。
なお、通常、コーティング用樹脂組成物として用いる場
合は溶剤を含有しているので同じ溶剤を用いて溶液重合
法によって重合するのが好ましいが、重合体製造後メタ
ノール再沈法等の方法によりポリマを単離し、他の溶剤
に溶解して使用に供することも可能である。As the solvent in the solution polymerization, the solvent used in ordinary radical polymerization can be used. Specific examples include aromatic solvents such as benzene, toluene and xylene; ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone; diethyl ether, isopropyl ether, tetrahydrofuran, dioxane, ethylene glycol dimethyl ether, ethylene glycol diethyl ether. , Ether solvents such as diethylene glycol dimethyl ether and diethylene glycol diethyl ether; ethyl acetate, acetic acid-
n-propyl, isopropyl acetate, -n-butyl acetate,
Ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, Examples include ester solvents such as γ-butyrolactone; amide solvents such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone. Of these solvents,
Ester solvent and ketone solvent are preferred, alone,
Alternatively, two or more kinds can be mixed and used.
In addition, usually, when used as a coating resin composition, since it contains a solvent, it is preferable to polymerize by a solution polymerization method using the same solvent, but the polymer is prepared by a method such as methanol reprecipitation method after polymer production. It is also possible to isolate and dissolve in another solvent before use.
【0026】本発明におけるB成分である分子内にエポ
キシ基を2以上有するエポキシ樹脂としては、ビスフェ
ノールA型液状エポキシ樹脂、ビスフェノールA型固型
エポキシ樹脂、ビスフェノールF型エポキシ樹脂、フェ
ノールノボラックエポキシ樹脂、クレゾールノボラック
エポキシ樹脂、脂環式エポキシ樹脂、グリシジルエステ
ル系エポキシ樹脂、グリシジルアミン系エポキシ樹脂、
複素環式エポキシ樹脂などがあるが、耐熱性及び密着性
の点からフェノールノボラックエポキシ樹脂およびクレ
ゾールノボラックエポキシ樹脂が特に好ましい。The epoxy resin having two or more epoxy groups in the molecule which is the component B in the present invention includes bisphenol A type liquid epoxy resin, bisphenol A type solid epoxy resin, bisphenol F type epoxy resin, phenol novolac epoxy resin, Cresol novolac epoxy resin, alicyclic epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin,
Although there are heterocyclic epoxy resins and the like, phenol novolac epoxy resin and cresol novolac epoxy resin are particularly preferable in terms of heat resistance and adhesion.
【0027】本発明におけるC成分である第三級アミン
化合物としては、トリメチルアミン、トリエチルアミ
ン、トリブチルアミン、ジメチルエチルアミン、ジメチ
ルプロピルアミン、メチルエチルプロピルアミン、ベン
ジルジメチルアミン、ベンジルジエチルアミン、ピリジ
ン、トリエタノールアミン、N,N′−ジメチルエタノ
ールアミン、N,N′−ジエチルエタノールアミン、
2,4,6−トリス−(ジメチルアミノメチル)フェノ
ール等がある。なかでも、炭素数5〜20第三級アミン
化合物が加熱硬化時に揮散しにくく、しかも硬化促進剤
としての活性が高いことから好ましい。The tertiary amine compound which is the C component in the present invention includes trimethylamine, triethylamine, tributylamine, dimethylethylamine, dimethylpropylamine, methylethylpropylamine, benzyldimethylamine, benzyldiethylamine, pyridine, triethanolamine, N, N'-dimethylethanolamine, N, N'-diethylethanolamine,
2,4,6-tris- (dimethylaminomethyl) phenol and the like. Among them, a C 5-20 tertiary amine compound is preferred because it is less likely to volatilize during heat curing and has a high activity as a curing accelerator.
【0028】本発明のコーティング用樹脂組成物には、
必要に応じて、A成分、B成分およびC成分以外にも種
々の成分(D成分)を使用することができる。D成分と
して多価カルボン酸無水物および多価カルボン酸からな
る群より選ばれる少なくとも1種の化合物を使用するこ
とが、耐熱性、耐傷性向上の点から好ましい。The coating resin composition of the present invention comprises:
If necessary, various components (D component) can be used in addition to the A component, the B component and the C component. From the viewpoint of improving heat resistance and scratch resistance, it is preferable to use at least one compound selected from the group consisting of polycarboxylic acid anhydrides and polycarboxylic acids as the component D.
【0029】上記多価カルボン酸無水物としては、無水
イタコン酸、無水マレイン酸、無水コハク酸、無水シト
ラコン酸、無水ドデセニルコハク酸、無水テトラヒドロ
フタル酸、無水ヘキサヒドロフタル酸、無水メチルテト
ラヒドロフタル酸、無水メチルヘキサヒドロフタル酸、
無水エンドメチレンテトラヒドロフタル酸、無水メチル
エンドメチレンテトラヒドロフタル酸等の脂肪族ジカル
ボン酸無水物;シクロペンタンテトラカルボン酸二無水
物、1,2,3,4−ブタンテトラカルボン酸二無水物
等の脂肪族多価カルボン酸二無水物;無水フタル酸、無
水トリメット酸、無水ピロメリット酸、無水ベンゾフェ
ノンテトラカルボン酸、3,3′,4,4′−ジフェニ
ルスルホンテトラカルボン酸二無水物等の芳香族多価カ
ルボン酸無水物;エチレングリコールビストリメリテー
ト、グリセリントリストリメリテート等のエステル基含
有酸無水物などを挙げることができる。また上記多価カ
ルボン酸としては、イタコン酸、マレイン酸、コハク
酸、シトラコン酸、テトラヒドロフタル酸、ヘキサヒド
ロフタル酸、メチルテトラヒドロフタル酸、シクロペン
タンテトラカルボン酸等の脂肪族多価カルボン酸;フタ
ル酸、テレフタル酸、イソフタル酸、トリメリット酸、
ピロメリット酸、ベンゾフェノンテトラカルボン酸等の
芳香族多価カルボン酸などを挙げることができる。The polyvalent carboxylic acid anhydrides include itaconic anhydride, maleic anhydride, succinic anhydride, citraconic anhydride, dodecenyl succinic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, Methyl hexahydrophthalic anhydride,
Aliphatic dicarboxylic acid anhydrides such as endomethylenetetrahydrophthalic anhydride and methylendomethylenetetrahydrophthalic anhydride; Fats such as cyclopentanetetracarboxylic dianhydride and 1,2,3,4-butanetetracarboxylic dianhydride Group polycarboxylic acid dianhydrides; aromatics such as phthalic anhydride, trimetic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic acid anhydride, 3,3 ', 4,4'-diphenylsulfone tetracarboxylic acid dianhydride Polyhydric carboxylic acid anhydrides; ester group-containing acid anhydrides such as ethylene glycol bis trimellitate and glycerin tris trimellitate can be mentioned. Examples of the polycarboxylic acid include aliphatic polycarboxylic acids such as itaconic acid, maleic acid, succinic acid, citraconic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methyltetrahydrophthalic acid and cyclopentanetetracarboxylic acid; phthalic acid. Acid, terephthalic acid, isophthalic acid, trimellitic acid,
Examples thereof include aromatic polyvalent carboxylic acids such as pyromellitic acid and benzophenonetetracarboxylic acid.
【0030】上記多価カルボン酸無水物および多価カル
ボン酸は1種類のみで用いても、2種類以上を組み合わ
せてもよい。耐熱性の点から芳香族多価カルボン酸無水
物および芳香族多価カルボン酸は耐熱性の点から好まし
く、耐熱性と溶剤に対する溶解性のバランスの点から無
水トリメリット酸が特に好ましい。The polyvalent carboxylic acid anhydride and polyvalent carboxylic acid may be used alone or in combination of two or more. From the viewpoint of heat resistance, aromatic polycarboxylic acid anhydrides and aromatic polycarboxylic acids are preferable from the viewpoint of heat resistance, and trimellitic anhydride is particularly preferable from the viewpoint of the balance between heat resistance and solubility in solvents.
【0031】本発明の組成物において、A成分の共重合
樹脂100重量部に対してB成分のエポキシ樹脂30〜
300重量部を配合することが好ましい。B成分のエポ
キシ樹脂が少な過ぎると耐薬品性が不十分となる傾向が
あり、多過ぎる場合は密着性が低下する傾向がある。C
成分の第三級アミン化合物は、B成分のエポキシ樹脂1
00重量部に対して0.01〜10重量部使用するのが
好ましく、特に0.1〜5重量部使用するのが好まし
い。C成分の第三級アミン化合物が少な過ぎるとと低温
で硬化しにくくなる傾向があり、多過ぎる場合は塗膜の
高度、耐熱性が低下する傾向がある。前記D成分のうち
多価カルボン酸無水物または多価カルボン酸は、A成分
である共重合樹脂100重量部に対して0〜50重量部
の範囲で使用することが好ましい。多価カルボン酸無水
物または多価カルボン酸が多すぎるとコーティング性、
耐薬品性等が低下する傾向がある。使用の効果を発揮さ
せるためには5重量部以上使用することが好ましい。In the composition of the present invention, 30 parts by weight of the component B epoxy resin is added to 100 parts by weight of the component A copolymer resin.
It is preferable to add 300 parts by weight. If the amount of the component B epoxy resin is too small, the chemical resistance tends to be insufficient, and if it is too large, the adhesion tends to decrease. C
The tertiary amine compound as the component is the epoxy resin 1 as the component B.
It is preferable to use 0.01 to 10 parts by weight, especially 0.1 to 5 parts by weight, relative to 00 parts by weight. If the amount of the tertiary amine compound as the component C is too small, it tends to be difficult to cure at low temperature, and if the amount is too large, the coating film tends to have a high degree of deterioration and heat resistance. The polyvalent carboxylic acid anhydride or polyvalent carboxylic acid in the component D is preferably used in the range of 0 to 50 parts by weight with respect to 100 parts by weight of the copolymer resin as the component A. If polycarboxylic acid anhydride or polycarboxylic acid is too much, coating property,
The chemical resistance tends to decrease. In order to exert the effect of use, it is preferable to use 5 parts by weight or more.
【0032】また、本発明の組成物の密着性を向上させ
るために、この組成物にカップリング剤を添加すること
ができる。カップリング剤としては、官能性シランカッ
プリング剤が好ましくビニル基、メタクリロイル基、水
酸基、カルボキシル基、アミノ基、イソシアネート基、
エポキシ基等の反応性置換基を有するシランカップリン
グ剤、具体的にはビニルトリメトキシシラン、ビニルト
リエトキシシラン、γ−メタクリロキシプロピルトリメ
トキシシラン、γ−イソシアナートプロピルトリエトキ
シシラシ、γ−グリシドキシプロピルトリメトキシシラ
ン等が挙げられ、特にエポキシ基を有するシランカップ
リング剤が接着性、耐溶剤性等に優れているため好まし
い。これらの官能性シランカップリング剤は、1種類の
みで用いても、2種類以上を組み合わせても良い。官能
性シランカップリング剤の使用量は、A成分の共重合樹
脂とB成分のエポキシ樹脂との合計量を100重量部と
した場合、0〜10重量部の範囲が好ましい。多すぎる
と耐薬品性等が低下する傾向がある。また、使用の効果
を発揮させるためには0.1重量部以上使用することが
好ましい。A coupling agent may be added to the composition of the present invention in order to improve the adhesion thereof. The coupling agent is preferably a functional silane coupling agent vinyl group, methacryloyl group, hydroxyl group, carboxyl group, amino group, isocyanate group,
A silane coupling agent having a reactive substituent such as an epoxy group, specifically vinyltrimethoxysilane, vinyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-glyce. Examples thereof include sidoxypropyltrimethoxysilane and the like. Particularly, a silane coupling agent having an epoxy group is preferable because it has excellent adhesiveness and solvent resistance. These functional silane coupling agents may be used alone or in combination of two or more. The amount of the functional silane coupling agent used is preferably in the range of 0 to 10 parts by weight when the total amount of the component A copolymer resin and the component B epoxy resin is 100 parts by weight. If it is too much, the chemical resistance tends to decrease. Further, in order to exert the effect of use, it is preferable to use 0.1 part by weight or more.
【0033】本発明の組成物は、通常、溶剤に溶解して
塗布し、加熱硬化させることによって塗膜を形成させる
ことができる。溶剤としては、本発明の組成物を溶解
し、かつこれらの成分と反応しないものであれば、特に
限定されるものではない。具体的には、本発明のA成分
である共重合樹脂を、溶液重合させる際の溶媒として例
示した溶剤が挙げられる。これらの溶剤のうちエステル
系溶剤及びケトン系溶剤が好ましく、単独でまたは2種
類以上を混合して使用することができる。The composition of the present invention can be usually formed into a coating film by dissolving it in a solvent and applying it, followed by heating and curing. The solvent is not particularly limited as long as it dissolves the composition of the present invention and does not react with these components. Specific examples thereof include the solvents exemplified as the solvent for solution polymerization of the copolymer resin which is the component A of the present invention. Of these solvents, ester solvents and ketone solvents are preferable, and they can be used alone or in admixture of two or more.
【0034】本発明の組成物を溶剤に溶解して、組成物
溶液を調整する方法は特に限定されるものではなく、全
成分を同時に溶剤に溶解して組成物溶液を調整してもよ
く、必要に応じて各成分を適宜2つ以上の溶液としてお
いて、使用時にこれらを混合して組成物溶液としてもよ
い。このようにして組成物溶液を調整する場合の溶剤の
使用量は、塗布に供せられる最終的な組成物溶液全量の
うちの50〜95重量%とすることが好ましい。50重
量%未満では固形分濃度が高すぎて塗膜のレベリング性
が低下したり、塗膜の透明性が低下したりする場合があ
り、一方95重量%を超える場合は固形分濃度が低すぎ
て塗膜の耐薬品性等が不十分となる場合がある。また、
本発明の組成物には必要に応じて、一般のエポキシ樹脂
の硬化に使用される硬化促進剤、酸化防止剤や紫外線吸
収剤等の安定剤等を透明性を損なわない程度に添加して
もよい。The method of dissolving the composition of the present invention in a solvent to prepare a composition solution is not particularly limited, and all components may be dissolved in a solvent at the same time to prepare a composition solution. If necessary, two or more solutions may be prepared for each component, and these may be mixed at the time of use to form a composition solution. When the composition solution is prepared as described above, the amount of the solvent used is preferably 50 to 95% by weight of the total amount of the final composition solution used for coating. If it is less than 50% by weight, the solid content concentration is too high, and the leveling property of the coating film may be lowered, or the transparency of the coating film may be reduced, while if it exceeds 95% by weight, the solid content concentration is too low. Therefore, the chemical resistance of the coating film may be insufficient. Also,
If necessary, the composition of the present invention may be added with a curing accelerator used for curing a general epoxy resin, a stabilizer such as an antioxidant or an ultraviolet absorber, etc., to the extent that transparency is not impaired. Good.
【0035】本発明の組成物溶液を塗布する方法は特に
制限されず、浸漬法、スプレー法、ロールコート法、回
転塗布法等の他、スクリーン印刷、オフセット印刷等の
印刷による塗布法法等がある。本発明の組成物の加熱硬
化条件は組成物の各成分の具体的種類、配合割合等によ
って適宜選択されるが、通常、50〜300℃で0.1
〜10時間、好ましくは100〜250℃で1〜5時間
程度である。The method of applying the composition solution of the present invention is not particularly limited, and may include a dipping method, a spray method, a roll coating method, a spin coating method, and a coating method such as screen printing and offset printing. is there. The heat curing conditions for the composition of the present invention are appropriately selected depending on the specific type of each component of the composition, the compounding ratio, etc., but are usually 0.1 at 50 to 300 ° C.
-10 hours, preferably 1 to 5 hours at 100 to 250 ° C.
【0036】本発明の組成物により形成されるコーティ
ング膜はガラス、金属、プラスチック等の種々の材料に
対して優れた密着性を示し、平滑、強靱で耐光性、耐熱
性、耐水性、耐溶剤性、透明性に優れているため、各種
物品のコーティング膜として有用である。特にカラーフ
ィルタ保護膜として、ゼラチン、グリュー、ポリビニル
アルコール、アクリル系樹脂等の種々のバインダー樹脂
を染料による染色や、顔料分散によって着色して得られ
る種々のカラーフィルタの表面保護層、防染保護層とし
て有用である。カラーフィルタ保護膜として用いる場合
は加熱硬化後の膜厚が0.05〜30μm、好ましくは
0.1〜10μm程度となるように、適宜、塗布して用
いることができる。The coating film formed from the composition of the present invention exhibits excellent adhesion to various materials such as glass, metal and plastic, and is smooth and tough, and has light resistance, heat resistance, water resistance and solvent resistance. Since it has excellent properties and transparency, it is useful as a coating film for various articles. In particular, as a color filter protective film, a surface protective layer or a dye protective layer of various color filters obtained by dyeing various binder resins such as gelatin, glue, polyvinyl alcohol, and acrylic resin with a dye or coloring by dispersing a pigment. Is useful as When it is used as a color filter protective film, it can be appropriately applied and used so that the film thickness after heat curing is 0.05 to 30 μm, preferably 0.1 to 10 μm.
【0037】従来技術では、コーティング性、密着性、
耐熱性等の全ての要求特性を満足させるものはなかった
が、本発明における組成物は、特定の構造の化合物を組
み合わせることにより、これらの各要求特性をバランス
良く満足させることができる。これだけでなく、本発明
における組成物は、優れた低温硬化性示す、例えば、1
70℃以下の硬化温度でも充分に優れた特性を示す。特
に、第三級アミンは、他の硬化促進剤、例えば、ホスフ
ィン類、イミダゾール類、よりも低温硬化性において優
れている。In the prior art, coating properties, adhesion,
Although none of them satisfy all the required properties such as heat resistance, the composition of the present invention can satisfy each of these required properties in a well-balanced manner by combining a compound having a specific structure. Not only this, the compositions of the present invention exhibit excellent low temperature curability, eg, 1
It exhibits sufficiently excellent characteristics even at a curing temperature of 70 ° C or lower. In particular, tertiary amines are superior to other curing accelerators such as phosphines and imidazoles in low temperature curability.
【0038】[0038]
【実施例】以下実施例により本発明を具体的に説明する
が、本発明はこれら実施例によって限定されるものでは
ない。 実施例1 撹拌機、温度計、窒素導入管、還流冷却器、滴下ロート
の備わった1lフラスコにセロソルブアセテート(アセ
トキシエトキシエタン)100重量部を仕込みフラスコ
内を窒素置換した。N−フェニルマレイミド75重量
部、メタクリル酸30重量部、メタクリル酸メチル45
重量部、アゾビスイソブチロニトリル0.6重量部をセ
ロソルブアセテート350重量部に溶解し、前述の1l
フラスコに窒素気流中80℃で3時間かけて滴下した。
さらに80℃で5時間撹拌した後、120℃に昇温して
2時間保った。得られた共重合樹脂溶液は粘度が43ポ
アズ(25℃)であり、不揮発分が25.4重量%(1
80℃、1h、JIS C−2103に準拠)、酸価3
2.5(mgKOH/g)であった。EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. Example 1 A 1-liter flask equipped with a stirrer, a thermometer, a nitrogen inlet tube, a reflux condenser, and a dropping funnel was charged with 100 parts by weight of cellosolve acetate (acetoxyethoxyethane), and the inside of the flask was replaced with nitrogen. N-phenylmaleimide 75 parts by weight, methacrylic acid 30 parts by weight, methyl methacrylate 45
Parts by weight and 0.6 parts by weight of azobisisobutyronitrile are dissolved in 350 parts by weight of cellosolve acetate,
The mixture was added dropwise to the flask at 80 ° C. over 3 hours in a nitrogen stream.
After further stirring at 80 ° C for 5 hours, the temperature was raised to 120 ° C and kept for 2 hours. The obtained copolymer resin solution had a viscosity of 43 poise (25 ° C.) and a nonvolatile content of 25.4 wt% (1
80 ° C, 1h, according to JIS C-2103), acid value 3
It was 2.5 (mgKOH / g).
【0039】この共重合樹脂溶液400重量部にクレゾ
ールノボラックエポキシ樹脂〔EOCN−102S;日
本化薬(株)商品名、エポキシ当量214(g/e
q)、軟化点75℃〕50重量部、無水トリメリット酸
10重量部、ベンジルジメチルアミン1.0重量部、γ
−グリシドキシプロピルトリメトキシシラン〔SH−6
040;東レ・ダウコーニング・シリコーン(株)商品
名〕1.6重量部、セロソルブアセテート375重量部
を加えて室温で均一に混合、溶解させた。得られた溶液
は粘度が57センチポアズ(25℃)であり、不揮発分
20.2重量%(180℃、1h)であった。400 parts by weight of this copolymer resin solution was mixed with cresol novolac epoxy resin [EOCN-102S; trade name of Nippon Kayaku Co., Ltd., epoxy equivalent 214 (g / e).
q), softening point 75 ° C.] 50 parts by weight, trimellitic anhydride 10 parts by weight, benzyldimethylamine 1.0 part by weight, γ
-Glycidoxypropyltrimethoxysilane [SH-6
040; trade name of Toray Dow Corning Silicone Co., Ltd.] 1.6 parts by weight and 375 parts by weight of cellosolve acetate were added and uniformly mixed and dissolved at room temperature. The obtained solution had a viscosity of 57 centipoise (25 ° C.) and a nonvolatile content of 20.2 wt% (180 ° C., 1 h).
【0040】この溶液を、孔径0.2μmのメンブラン
フィルタで濾過した後、スピンコーターを用いてガラス
板(ダウコーニング社 7059材、無アルカリガラ
ス)上に回転数1,000rpmで回転塗布した。塗布
後ガラス板を160℃の恒温槽にて1時間加熱処理し、
塗膜を硬化させた。得られた塗膜の表面は極めて平滑で
あり、ピンホール等は全く見られなかった。触針式膜厚
計〔Surfcom;東京精密(株)商品名〕によって
測定した膜厚は2.0μmであった。This solution was filtered through a membrane filter having a pore size of 0.2 μm, and then spin coated on a glass plate (Dow Corning 7059 material, alkali-free glass) at a rotation speed of 1,000 rpm using a spin coater. After coating, heat the glass plate in a constant temperature bath at 160 ° C for 1 hour,
The coating was cured. The surface of the obtained coating film was extremely smooth, and pinholes and the like were not observed at all. The film thickness measured by a stylus type film thickness meter [Surfcom; trade name of Tokyo Seimitsu Co., Ltd.] was 2.0 μm.
【0041】このようにして作製した塗膜について以下
の試験を行った。塗膜のガラス板との密着性を調べるた
めにテープ剥離によるゴバン目試験(JIS−K−54
00)を行なった。その結果、残存数100/100で
あり、剥離は全く見られなかった。The following tests were conducted on the coating film thus produced. In order to examine the adhesion of the coating film to the glass plate, a tape-like test by peeling the tape (JIS-K-54
00) was performed. As a result, the remaining number was 100/100, and peeling was not observed at all.
【0042】次に塗膜の400nm〜800nmにおけ
る吸収スペクトルを塗布したものと同じガラス板をリフ
ァレンスとして測定したところ、光線透過率は全領域で
90%以上であった。Next, when the same glass plate as the one coated with the absorption spectrum at 400 nm to 800 nm of the coating film was measured as a reference, the light transmittance was 90% or more in the entire region.
【0043】また、この塗膜をつけたガラス板をプレッ
シャークッカーテスト(120℃、2気圧)10時間
(以下、PCT処理という)、N−メチルピロリドン中
に室温で30分浸漬(以下、NMP処理という)、5%
水酸化ナトリウム水溶液(以下、NaOH処理という)
に室温で30分浸漬及び250℃のキヤオーブン中に1
時間放置(以下、250℃処理という)の処理を別々に
行い、各処理後で上記のゴバン目試験及び光線透過率の
測定を行った。これらの結果を塗膜製造直後(硬化直
後)の試験結果と比較したところ、いずれの場合も接着
性や光線透過率は良好であった。なお、ゴバン目試験結
果を表1に及び光線透過率試験結果を表2に示す。A glass plate having this coating film was subjected to a pressure cooker test (120 ° C., 2 atm) for 10 hours (hereinafter referred to as PCT treatment) and immersed in N-methylpyrrolidone at room temperature for 30 minutes (hereinafter referred to as NMP treatment). 5%)
Aqueous sodium hydroxide solution (hereinafter referred to as NaOH treatment)
Soak for 30 minutes at room temperature in a oven at 250 ° C for 1
The treatment of leaving for a time (hereinafter referred to as 250 ° C. treatment) was performed separately, and after each treatment, the above-described scoring test and measurement of light transmittance were performed. When these results were compared with the test results immediately after coating film production (immediately after curing), adhesiveness and light transmittance were good in all cases. Table 1 shows the results of the goose eye test and Table 2 shows the results of the light transmittance test.
【0044】実施例2 撹拌機、温度計、窒素導入管、還流冷却器、滴下ロート
の備わった1リットルフラスコにセロソルブアセテート
75重量部を仕込みフラスコ内を窒素置換した。N−フ
ェニルマレイミド105重量部、メタクリル酸30重量
部、メタクリル酸トリシクロ〔5.2.1.02,6〕デ
カ−8−イル45重量部、アゾビスイソブチロニトリル
0.6重量部をセロソルブアセテート350重量部に溶
解し、前述の1リットルフラスコに窒素気流中80℃で
3時間かけて滴下した。さらに80℃で5時間撹拌した
後、アゾビスイソブチロニトリル0.3重量部を加え、
120℃に昇温して2時間保った。得られた共重合樹脂
溶液は粘度が40ポアズ(25℃)であり、不揮発分が
25.0重量%(180℃、1h)、酸価32.9(m
gKOH/g)であった。Example 2 A 1-liter flask equipped with a stirrer, a thermometer, a nitrogen inlet tube, a reflux condenser, and a dropping funnel was charged with 75 parts by weight of cellosolve acetate, and the inside of the flask was replaced with nitrogen. 105 parts by weight of N-phenylmaleimide, 30 parts by weight of methacrylic acid, 45 parts by weight of tricyclo [5.2.1.0 2,6 ] dec-8-yl methacrylate, 0.6 part by weight of azobisisobutyronitrile. It was dissolved in 350 parts by weight of cellosolve acetate and added dropwise to the aforementioned 1 liter flask in a nitrogen stream at 80 ° C. over 3 hours. After further stirring at 80 ° C. for 5 hours, 0.3 part by weight of azobisisobutyronitrile was added,
The temperature was raised to 120 ° C. and kept for 2 hours. The obtained copolymer resin solution has a viscosity of 40 poise (25 ° C.), a nonvolatile content of 25.0 wt% (180 ° C., 1 h), and an acid value of 32.9 (m).
gKOH / g).
【0045】この共重合樹脂溶液400重量部にクレゾ
ールノボラックエポキシ樹脂〔EOCN−103S;日
本化薬(株)、エポキシ当量218(g/eq)、軟化
点85℃〕100重量部、無水トリメリット酸20重量
部、ベンジルジメチルアミン1.0重量部、γ−グリシ
ドキシプロピルトリメトキシシラン〔SH−6040;
東レ・ダウコーニング・シリコーン(株)商品名〕2.
2重量部、セロソルブアセテート500重量部を加えて
室温で均一に混合、溶解させた。得られた溶液は粘度が
42センチポアズ(25℃)、不揮発分(180℃、1
h)21.5重量%であった。得られた溶液を実施例1
と同様にガラス上に塗布、加熱硬化して、塗膜の各種特
性試験を行った。ゴバン目試験結果を表1に及び光線透
過率試験結果を表2に示す。To 400 parts by weight of this copolymer resin solution, 100 parts by weight of cresol novolac epoxy resin [EOCN-103S; Nippon Kayaku Co., Ltd., epoxy equivalent 218 (g / eq), softening point 85 ° C.], trimellitic anhydride 20 parts by weight, benzyldimethylamine 1.0 part by weight, γ-glycidoxypropyltrimethoxysilane [SH-6040;
Toray Dow Corning Silicone Co., Ltd. product name] 2.
2 parts by weight and 500 parts by weight of cellosolve acetate were added and uniformly mixed and dissolved at room temperature. The obtained solution has a viscosity of 42 centipoise (25 ° C) and a nonvolatile content (180 ° C, 1
h) It was 21.5% by weight. The obtained solution was used in Example 1.
In the same manner as above, coating on glass and heat curing were performed, and various characteristics tests of the coating film were conducted. Table 1 shows the results of the goose eye test and Table 2 shows the results of the light transmittance test.
【0046】実施例3 撹拌機、温度計、窒素導入管、還流冷却器、滴下ロート
の備わった1lフラスコにセロソルブアセテート100
重量部を仕込みフラスコ内を窒素置換した。N−シクロ
ヘキシルマレイミド90重量部、メタクリル酸30重量
部、アクリル酸エチル30重量部、アゾビスイソブチロ
ニトリル0.6重量部をセロソルブアセテート350重
量部に溶解し、前述の1lフラスコに窒素気流中80℃
で3時間かけて滴下した。さらに80℃で5時間撹拌し
た後、120℃に昇温して2時間保った。Example 3 Cellosolve acetate 100 was added to a 1-liter flask equipped with a stirrer, a thermometer, a nitrogen inlet tube, a reflux condenser and a dropping funnel.
Part by weight was charged and the inside of the flask was replaced with nitrogen. 90 parts by weight of N-cyclohexylmaleimide, 30 parts by weight of methacrylic acid, 30 parts by weight of ethyl acrylate, and 0.6 parts by weight of azobisisobutyronitrile were dissolved in 350 parts by weight of cellosolve acetate, and the solution was introduced into a 1 l flask in a nitrogen stream. 80 ° C
Was added dropwise over 3 hours. After further stirring at 80 ° C for 5 hours, the temperature was raised to 120 ° C and kept for 2 hours.
【0047】得られた共重合樹脂溶液400重量部にク
レゾールノボラックエポキシ樹脂〔EOCN−102
S;日本化薬(株)商品名〕50重量部、無水トリメリ
ット酸10重量部、ベンジルジメチルアミン0.5重量
部、γ−グリシドキシプロピルトリメトキシシラン〔S
H−6040東レ・ダウコーニング・シリコーン(株)
商品名〕1.6重量部、セロソルブアセテート375重
量部を加えて室温で均一に混合、溶解させた。得られた
溶液は粘度が71センチポアズ(25℃)、不揮発分2
0.6重量%(180℃、1h)であった。得られた溶
液を、実施例1と同様にしてガラス上に塗布、加熱硬化
して、塗膜の各種特性試験を行った。ゴバン目試験結果
を表1に及び光線透過率試験結果を表2に示す。400 parts by weight of the obtained copolymer resin solution was added to cresol novolac epoxy resin [EOCN-102.
S; trade name of Nippon Kayaku Co., Ltd.] 50 parts by weight, trimellitic anhydride 10 parts by weight, benzyldimethylamine 0.5 parts by weight, γ-glycidoxypropyltrimethoxysilane [S
H-6040 Toray Dow Corning Silicone Co., Ltd.
Trade name] 1.6 parts by weight and 375 parts by weight of cellosolve acetate were added and uniformly mixed and dissolved at room temperature. The obtained solution has a viscosity of 71 centipoise (25 ° C) and a nonvolatile content of 2
It was 0.6% by weight (180 ° C., 1 h). The obtained solution was coated on glass and heat-cured in the same manner as in Example 1 to test various characteristics of the coating film. Table 1 shows the results of the goose eye test and Table 2 shows the results of the light transmittance test.
【0048】比較例1 クレゾールノボラックエポキシ樹脂(日本化薬(株)E
OCN−103S)10重量部、無水トリメリット酸3
重量部、γ−グリシドキシプロピルトリメトキシシラン
(東レ・ダウコーニング・シリコーン(株)SH−60
40)0.1重量部、セロソルブアセテート40重量部
を室温で均一に混合溶解し、得られた溶液を実施例1と
同様にしてガラス板上に塗布、加熱硬化して、塗膜の各
種特性試験を行った。ゴバン目試験結果を表1に及び光
線透過率試験結果を表2に示す。Comparative Example 1 Cresol novolac epoxy resin (Nippon Kayaku Co., Ltd. E
OCN-103S) 10 parts by weight, trimellitic anhydride 3
Parts by weight, γ-glycidoxypropyltrimethoxysilane (SH-60, Toray Dow Corning Silicone Co., Ltd.)
40) 0.1 parts by weight and 40 parts by weight of cellosolve acetate were uniformly mixed and dissolved at room temperature, and the obtained solution was applied on a glass plate and cured by heating in the same manner as in Example 1 to obtain various characteristics of the coating film. The test was conducted. Table 1 shows the results of the goose eye test and Table 2 shows the results of the light transmittance test.
【0049】比較例2 実施例1において効果促進剤であるベンジルジメチルア
ミンを使用しないこと以外は、実施例1のとおり行っ
た。塗膜の各種特性試験を行った。ゴバン目試験結果を
表1に及び光線透過率試験結果を表2に示す。Comparative Example 2 The procedure of Example 1 was repeated, except that the effect promoter benzyldimethylamine was not used. Various characteristics tests of the coating film were conducted. Table 1 shows the results of the goose eye test and Table 2 shows the results of the light transmittance test.
【0050】比較例3 ポリメタクリル酸グリシジル(ポリスチレン換算重量平
均分子量約80,000)6g、無水トリメリット酸
0.6g、γ−グリシドキシプロピルトリメトキシシラ
ン〔SH−6040;東レ・ダウコーニング・シリコー
ン(株)商品名〕0.3g、セロソルブアセテート35
重量部を室温で均一に混合溶解し、得られた溶液を実施
例1と同様にしてガラス上に塗布、加熱硬化して、塗膜
の各種特性試験を行った。ゴバン目試験結果を表1に及
び光線透過率試験結果を表2に示す。Comparative Example 3 6 g of polyglycidyl methacrylate (weight average molecular weight in terms of polystyrene: about 80,000), 0.6 g of trimellitic anhydride, γ-glycidoxypropyltrimethoxysilane [SH-6040; Toray Dow Corning. Trade name of Silicone Co., Ltd.] 0.3 g, cellosolve acetate 35
Parts by weight were uniformly mixed and dissolved at room temperature, and the obtained solution was coated on glass and cured by heating in the same manner as in Example 1, and various characteristics tests of coating films were conducted. Table 1 shows the results of the goose eye test and Table 2 shows the results of the light transmittance test.
【0051】比較例4 実施例1において効果促進剤であるベンジルジメチルア
ミンの代わりにトリフェニルホスフィンを使用したこと
以外は、実施例1のとおり行った。塗膜の各種特性試験
を行った。ゴバン目試験結果を表1に及び光線透過率試
験結果を表2に示す。Comparative Example 4 The procedure of Example 1 was repeated except that triphenylphosphine was used in place of benzyldimethylamine as the effect accelerator in Example 1. Various characteristics tests of the coating film were conducted. Table 1 shows the results of the goose eye test and Table 2 shows the results of the light transmittance test.
【0052】[0052]
【表1】 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 表1 ゴバン目試験結果(残存数/100) ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 硬化直後 PCT NMP NaOH 250℃ 処理後 処理後 処理後 処理後 ─────────────────────────────────── 実施例1 100/100 100/100 100/100 100/100 100/100 実施例2 100/100 100/100 100/100 100/100 100/100 実施例3 100/100 100/100 100/100 100/100 100/100 比較例1 100/100 0/100 100/100 100/100 100/100 比較例2 100/100 10/100 100/100 50/100 100/100 比較例3 100/100 0/100 100/100 0/100 100/100 比較例4 100/100 0/100 100/100 30/100 100/100 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━[Table 1] ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Table 1 Gobang eye test results (remaining number / 100 ) ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Immediately after curing PCT NMP NaOH 250 ℃ After treatment After treatment After treatment After treatment After ─────────────────────────────────── Example 1 100/100 100/100 100/100 100 / 100 100/100 Example 2 100/100 100/100 100/100 100/100 100/100 Example 3 100/100 100/100 100/100 100/100 100/100 Comparative Example 1 100/100 0/100 100 / 100 100/100 100/100 Comparative example 2 100/100 10/100 100/100 50/100 100/100 Comparative example 3 100/100 0/100 100/100 0/100 100/100 Comparative example 4 100/100 0/100 100/100 30/100 100/100 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━
【0053】[0053]
【表2】 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 表1 光線透過率試験結果(400〜800nm) ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 硬化直後 PCT NMP NaOH 250℃ 処理後 処理後 処理後 処理後 ─────────────────────────────────── 実施例1 90%以上 90%以上 90%以上 90%以上 90%以上 実施例2 90%以上 90%以上 90%以上 90%以上 90%以上 実施例3 90%以上 90%以上 90%以上 90%以上 90%以上 比較例1 90%以上 90%以上 90%以上 80% 90%以上 比較例2 90%以上 90%以上 90%以上 80% 90%以上 比較例3 90%以上 90%以上 80% 50%以下 90%以上 比較例4 90%以上 90%以上 90%以上 80% 90%以上 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━[Table 2] ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Table 1 Light transmittance test results (400 to 800 nm ) ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Immediately after curing PCT NMP NaOH 250 ℃ After treatment After treatment After treatment After treatment After ─────────────────────────────────── Example 1 90% or more 90% or more 90% or more 90% 90% or more Example 2 90% or more 90% or more 90% or more 90% or more 90% or more Example 3 90% or more 90% or more 90% or more 90% or more 90% or more Comparative Example 1 90% or more 90% or more 90 80% 90% or more Comparative Example 2 90% or more 90% or more 90% or more 80% 90% or more Comparative Example 3 90% or more 90% or more 80% 50% or less 90% or more Comparative Example 4 90% or more 90% or more 90% or more 80% 90% or more ━━━━━━━━━━━━━━━━━━━━━━━━━━━━ ━━━━━━
【0054】比較例5 実施例1において効果促進剤であるベンジルジメチルア
ミンの代わりに2−エチル−4−メチルイミダゾールを
使用したこと以外は、実施例1のとおり行い、塗膜の各
種特性試験前の組成物溶液を得た。この組成物溶液は2
−エチル−4−メチルイミダゾールが溶解しないため白
濁していた。Comparative Example 5 The procedure of Example 1 was repeated except that 2-ethyl-4-methylimidazole was used in place of benzyldimethylamine which was an effect accelerator in Example 1, and the various properties of the coating film were not tested. A composition solution of This composition solution is 2
-Ethyl-4-methylimidazole did not dissolve and was cloudy.
【0055】実施例1〜3及び比較例1〜4で形成した
塗膜を使用し、さらに次の試験をした。 試験例 実施例1〜3及び比較例1〜4で形成した塗膜を250
℃のギヤオーブン中に1時間放置後、膜厚測定を行い、
膜厚の減少率〔(試験後の膜厚/試験前の膜厚)×10
0%〕を計算した。この結果を表3に示す。The following tests were further conducted using the coating films formed in Examples 1 to 3 and Comparative Examples 1 to 4. Test Example The coating films formed in Examples 1 to 3 and Comparative Examples 1 to 4 are 250
After left in a gear oven at ℃ for 1 hour, measure the film thickness,
Reduction rate of film thickness [(film thickness after test / film thickness before test) × 10
0%] was calculated. The results are shown in Table 3.
【表3】 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 表2 膜厚の減少率 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 実施例1 0.5% 実施例2 0.6% 実施例3 0.8% 比較例1 5.0% 比較例2 3.0% 比較例3 7.5% 比較例4 2.5% ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━[Table 3] ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Table 2 Reduction rate of film thickness ━━━ ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Example 1 0.5% Example 2 0.6% Example 3 0.8% Comparative Example 1 5.0% Comparative Example 2 3.0% Comparative Example 3 7.5% Comparative Example 4 2.5% ━━━━━━━━━━━━━━━━━━━ ━━━━━━━━━━━━━━━━━━
【0056】実施例4 実施例1〜3で調製した組成物溶液を用いてカラーフィ
ルタ基材への適性を調べた。試験法としては一般的に知
られている方法でカラーフィルタ基材を作製し、この基
材上への塗布性と耐熱性を調べた。カラーフィルタ基材
の作製はまず透明ガラス基板上にゼラチン−重クロム酸
アンモニウム(10:1、重量比)の水溶液を乾燥後の
膜厚が1μmとなるように回転塗布した後、80℃で1
0分間乾燥し、得られた塗膜に紫外線を照射した後、純
水で現像することにより、染色基質層を得た。これを下
記組成の赤色染色浴に浸漬し、水洗後、150℃で30
分間乾燥することにより、赤色に染色されたカラーフィ
ルタ基材を形成した。 染色浴の組成 スミノール・ミリングレッドRS(住友化学(株)製) 2g 酢酸 3g 蒸留水 100gExample 4 The composition solutions prepared in Examples 1 to 3 were used to examine suitability for color filter substrates. As a test method, a color filter substrate was prepared by a generally known method, and the coating property and heat resistance on this substrate were examined. The color filter substrate was prepared by first spin-coating a transparent glass substrate with an aqueous solution of gelatin-ammonium dichromate (10: 1, weight ratio) so that the film thickness after drying was 1 μm, and then at 80 ° C. for 1 hour.
After being dried for 0 minutes, the resulting coating film was irradiated with ultraviolet rays and then developed with pure water to obtain a dyed substrate layer. This is immersed in a red dyeing bath of the following composition, washed with water, and then at 150 ° C. for 30 minutes.
A color filter substrate dyed red was formed by drying for a minute. Composition of dyeing bath Suminol Milling Red RS (Sumitomo Chemical Co., Ltd.) 2g Acetic acid 3g Distilled water 100g
【0057】次に、このカラーフィルタ基材上に前記組
成物溶液を2,000rpmで回転塗布し、180℃で
1時間乾燥することにより保護層を形成した。このよう
にして作製された保護膜つきカラーフィルタ上に、イン
ジウムチンオキシド(ITO)を常法に従い蒸着した
後、ホトリソグラフィーによりパターニングした。この
ITOのパターンを有するカラーフィルタを光学顕微鏡
で詳細に観察したが、カラーフィルタや保護膜にシワや
クラック等は全く認められず、カラーフィルタと保護膜
との接着性、密着性も良好であった。Next, the composition solution was spin-coated on this color filter substrate at 2,000 rpm and dried at 180 ° C. for 1 hour to form a protective layer. Indium tin oxide (ITO) was vapor-deposited on the thus-prepared color filter with a protective film by a conventional method, and then patterned by photolithography. The color filter having this ITO pattern was observed in detail with an optical microscope, but no wrinkles or cracks were observed on the color filter or the protective film, and the adhesiveness and adhesion between the color filter and the protective film were good. It was
【0058】[0058]
【発明の効果】請求項1または請求項2におけるコーテ
ィング用樹脂組成物は、低温硬化が可能で、しかもその
組成物から形成される塗膜は、平滑であり、透明性、接
着性、耐水性、耐薬品性、耐熱性、耐傷性等に極めて優
れている。請求項3におけるカラーフィルタ保護膜用樹
脂組成物は、請求項1または請求項2におけるコーティ
ング用樹脂組成物を含有してなり、カラーフィルタ保護
膜用として有用であり、前記樹脂組成物と同様の効果を
有する。The coating resin composition according to claim 1 or 2 can be cured at a low temperature, and the coating film formed from the composition is smooth and has transparency, adhesiveness and water resistance. Excellent in chemical resistance, heat resistance and scratch resistance. The resin composition for a color filter protective film according to claim 3 contains the resin composition for coating according to claim 1 or 2, is useful as a color filter protective film, and is the same as the above resin composition. Have an effect.
Claims (3)
共重合樹脂、 B、分子内にエポキシ基を2以上有するエポキシ樹脂な
らびに C、第三級アミン化合物を含有してなるコーティング用
樹脂組成物。1. A copolymer resin obtained by copolymerizing A, (1) N-substituted maleimide, and (2) acrylic acid or methacrylic acid, B, an epoxy resin having two or more epoxy groups in the molecule, and C, A coating resin composition containing a tertiary amine compound.
び多価カルボン酸からなる群より選ばれる少なくとも1
種の化合物を含有してなる請求項1記載のコーティング
用樹脂組成物。2. Further, at least one selected from the group consisting of D, polycarboxylic acid anhydride and polycarboxylic acid.
The coating resin composition according to claim 1, which comprises one kind of compound.
ング用樹脂組成物を含有してなるカラーフィルタ保護膜
用樹脂組成物。3. A resin composition for a color filter protective film, comprising the coating resin composition according to claim 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15991092A JPH061944A (en) | 1992-06-19 | 1992-06-19 | Resin composition for coating and resin composition for color filter protection film produced by using the composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15991092A JPH061944A (en) | 1992-06-19 | 1992-06-19 | Resin composition for coating and resin composition for color filter protection film produced by using the composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH061944A true JPH061944A (en) | 1994-01-11 |
Family
ID=15703840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15991092A Pending JPH061944A (en) | 1992-06-19 | 1992-06-19 | Resin composition for coating and resin composition for color filter protection film produced by using the composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH061944A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1006621C2 (en) * | 1997-07-18 | 1999-01-19 | Dsm Nv | Radiation curable coating composition. |
| JP2001158816A (en) * | 1999-12-01 | 2001-06-12 | Jsr Corp | Curable composition and color filter protective film |
| US6555593B1 (en) | 1998-01-30 | 2003-04-29 | Albemarle Corporation | Photopolymerization compositions including maleimides and processes for using the same |
| KR100782264B1 (en) * | 2006-08-08 | 2007-12-04 | 제일모직주식회사 | One-component thermosetting resin composition for color filter protective film and color filter using same |
| JP2016029489A (en) * | 2008-10-30 | 2016-03-03 | 住友化学株式会社 | Photosensitive resin composition |
| JP2017115012A (en) * | 2015-12-24 | 2017-06-29 | 株式会社日本触媒 | Polymer and resin composition containing the polymer |
-
1992
- 1992-06-19 JP JP15991092A patent/JPH061944A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1006621C2 (en) * | 1997-07-18 | 1999-01-19 | Dsm Nv | Radiation curable coating composition. |
| WO1999003930A1 (en) * | 1997-07-18 | 1999-01-28 | Dsm N.V. | Radiation-curable coating composition |
| US6555593B1 (en) | 1998-01-30 | 2003-04-29 | Albemarle Corporation | Photopolymerization compositions including maleimides and processes for using the same |
| JP2001158816A (en) * | 1999-12-01 | 2001-06-12 | Jsr Corp | Curable composition and color filter protective film |
| KR100782264B1 (en) * | 2006-08-08 | 2007-12-04 | 제일모직주식회사 | One-component thermosetting resin composition for color filter protective film and color filter using same |
| JP2016029489A (en) * | 2008-10-30 | 2016-03-03 | 住友化学株式会社 | Photosensitive resin composition |
| JP2017115012A (en) * | 2015-12-24 | 2017-06-29 | 株式会社日本触媒 | Polymer and resin composition containing the polymer |
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