JPH06200372A - Sputtering device - Google Patents
Sputtering deviceInfo
- Publication number
- JPH06200372A JPH06200372A JP36038892A JP36038892A JPH06200372A JP H06200372 A JPH06200372 A JP H06200372A JP 36038892 A JP36038892 A JP 36038892A JP 36038892 A JP36038892 A JP 36038892A JP H06200372 A JPH06200372 A JP H06200372A
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- closing
- opening
- sputtering apparatus
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Physical Vapour Deposition (AREA)
Abstract
(57)【要約】
【目的】 電極部（カソード部等）の開閉時の危険をな
くし、安全に、かつ作業性良く電極部の開閉を行うこと
ができ、装置メンテナンス時や、ターゲットの交換時等
にカソード部等を開閉する必要のある時も、これを安全
に、かつ作業性良く遂行できるスパッタ装置を提供す
る。
【構成】 カソード部等電極部１を開閉する構造のアル
ミニウム等スパッタ装置であって、電極部の開閉時のシ
ョックアブソーバー機構２を設ける。
(57) [Summary] [Purpose] The danger of opening and closing the electrode part (cathode part, etc.) can be eliminated, and the electrode part can be opened and closed safely and with good workability, during device maintenance or when replacing the target. (EN) Provided is a sputtering device which can safely and efficiently perform opening / closing of a cathode part and the like. A sputtering apparatus for aluminum or the like having a structure for opening and closing an electrode part 1 such as a cathode part, and a shock absorber mechanism 2 for opening and closing the electrode part is provided.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、スパッタ装置に関す
る。本発明は、例えば各種の半導体装置の製造プロセス
等において、配線材料（アルミニウム等）その他の材料
をスパッタ形成する場合に用いるスパッタ装置として利
用することができる。FIELD OF THE INVENTION The present invention relates to a sputtering apparatus. INDUSTRIAL APPLICABILITY The present invention can be utilized as a sputtering device used when forming a wiring material (aluminum or the like) and other materials by sputtering in various semiconductor device manufacturing processes and the like.
【０００２】[0002]
【従来の技術及びその問題点】半導体装置などの電子材
料等の製造プロセスに用いるスパッタ装置には、電極部
を開閉する構造のものがある。代表的には、カソード部
が開閉される構造のスパッタ装置が一般に採用されてい
る。このような構造のスパッタ装置は、装置のメンテナ
ンス時や、ターゲットの交換時にカソード部を開閉す
る。2. Description of the Related Art A sputtering apparatus used in a manufacturing process of electronic materials such as semiconductor devices has a structure in which an electrode portion is opened and closed. Typically, a sputtering device having a structure in which the cathode part is opened and closed is generally adopted. The sputtering apparatus having such a structure opens and closes the cathode portion during maintenance of the apparatus and replacement of the target.
【０００３】ところがカソード部は一般に相当の重量が
あり、カソード部の開閉は危険な作業となっている。However, since the cathode part generally has a considerable weight, opening and closing the cathode part is a dangerous work.
【０００４】すなわち、装置メンテナンス時や、ターゲ
ット（アルミニウムターゲット等）の交換時にカソード
部を開閉する必要があるが、その開閉作業は作業員によ
る人手で行っているので、カソード部が重いためその開
閉は危険を伴うおそれがある。かつカソード部が重いこ
とにより、その開閉作業は重労働である。例えば定期メ
ンテナンスは５日に１回程度行うので、この開閉作業は
かなり頻繁になされるものであり、上記問題は現実的に
非常に重要である。That is, it is necessary to open and close the cathode portion during maintenance of the apparatus or replacement of the target (aluminum target, etc.), but since the opening and closing work is performed manually by the worker, the opening and closing of the cathode portion is heavy. Can be dangerous. Moreover, since the cathode part is heavy, the opening and closing work is a heavy labor. For example, since the periodical maintenance is performed about once every 5 days, this opening and closing work is performed quite frequently, and the above problem is actually very important.
【０００５】図２に示すのは、従来のこの種のスパッタ
装置の一例である。電極部１であるカソード部（スパッ
タのガンの部分）が扉状になって、これが装置本体１０
に対して開閉される構造になっている。図２（ａ）はカ
ソード部扉（電極部１）が閉の状態を示し、図２（ｂ）
はカソード部扉（電極部１）が開の状態を示す。この図
２（ｂ）の状態にカソード部扉（電極部１）を開くとき
に、上述した問題が生ずる。図２中符号１１は把手であ
って、作業者はここを把持して、開閉の操作を行う。FIG. 2 shows an example of a conventional sputtering apparatus of this type. The cathode portion (sputtering gun portion), which is the electrode portion 1, has a door shape, and this is the main body 10 of the apparatus.
It has a structure that can be opened and closed. FIG. 2A shows a state in which the cathode door (electrode portion 1) is closed, and FIG.
Indicates a state where the cathode door (electrode portion 1) is open. When the cathode door (electrode portion 1) is opened in the state of FIG. 2 (b), the above-mentioned problem occurs. Reference numeral 11 in FIG. 2 is a handle, and an operator grips the handle to perform opening / closing operations.
【０００６】[0006]
【発明の目的】本発明は、上記従来技術の問題点を解決
して、電極部（カソード部等）を開閉する構造のスパッ
タ装置について、開閉時の危険をなくし、安全に、かつ
作業性良く電極部の開閉を行うことができ、よって装置
メンテナンス時や、ターゲットの交換時等にカソード部
等の電極部を開閉する必要のある時も、これを安全に、
かつ作業性良く遂行することができるようにしたスパッ
タ装置を提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art and to provide a sputtering apparatus having a structure for opening and closing an electrode part (cathode part, etc.), which eliminates the danger of opening and closing, and is safe and has good workability. It is possible to open and close the electrode part, so even when it is necessary to open and close the electrode part such as the cathode part during device maintenance or when replacing the target, this can be safely done.
It is also an object of the present invention to provide a sputtering apparatus that can be performed with good workability.
【０００７】[0007]
【問題点を解決するための手段】本出願の請求項１の発
明は、電極部を開閉する構造のスパッタ装置において、
該電極部の開閉時のショックアブソーバー機構を設けた
ことを特徴とするスパッタ装置であって、これにより上
記目的を達成するものである。The invention according to claim 1 of the present application is a sputtering apparatus having a structure for opening and closing an electrode part,
A sputtering apparatus having a shock absorber mechanism for opening and closing the electrode section, which achieves the above object.
【０００８】本出願の請求項２の発明は、電極部がカソ
ード部である請求項１に記載のスパッタ装置であって、
これにより上記目的を達成するものである。The invention of claim 2 of the present application is the sputtering apparatus according to claim 1, wherein the electrode part is a cathode part.
This achieves the above object.
【０００９】本出願の請求項３の発明は、アルミニウム
系材料（アルミニウムや、シリコン含有アルミニウムな
どのアルミニウム合金等、アルミニウムが主成分となっ
ているもの）のスパッタ装置である請求項１または２に
記載のスパッタ装置であって、これにより上記目的を達
成するものである。The invention according to claim 3 of the present application is a sputtering apparatus for an aluminum material (aluminum, aluminum alloys such as silicon-containing aluminum, and the like having aluminum as a main component). The sputtering apparatus described above achieves the above object.
【００１０】[0010]
【作用】本発明のスパッタ装置は、その電極部の開閉時
のショックアブソーバー機構を設けたものであるので、
カソード等の電極部が重く、扱いにくいものである場合
も、電極部の開閉が安全に、かつ作業性良く行われる。Since the sputtering apparatus of the present invention is provided with the shock absorber mechanism for opening and closing the electrode portion,
Even when the electrode portion such as the cathode is heavy and difficult to handle, the opening and closing of the electrode portion can be performed safely and with good workability.
【００１１】[0011]
【実施例】以下本発明の実施例について、図面を参照し
て説明する。なお当然のことではあるが、本発明は実施
例により限定を受けるものではない。Embodiments of the present invention will be described below with reference to the drawings. Of course, the present invention is not limited to the embodiments.
【００１２】実施例１ この実施例は、本発明を、半導体装置の製造プロセスに
用いるスパッタ装置であって、カソード部が開閉される
構造のスパッタ装置に適用した。Example 1 In this example, the present invention was applied to a sputtering apparatus used in a manufacturing process of a semiconductor device and having a structure in which a cathode portion is opened and closed.
【００１３】特にこの実施例のスパッタ装置は、半導体
装置ウェハ表面にアルミニウムをスパッタ方式で堆積す
る装置で、高真空（５×１０-7Ｔｏｒｒ以下）でアルゴ
ンガスを流し、一定圧力を保ち、ウェハ１枚ずつアルミ
ニウムをスパッタ堆積させる装置である。Particularly, the sputtering apparatus of this embodiment is an apparatus for depositing aluminum on the surface of a semiconductor device wafer by a sputtering method. Argon gas is caused to flow under high vacuum (5 × 10 −7 Torr or less) to maintain a constant pressure. This is an apparatus for sputter depositing aluminum one by one.
【００１４】本実施例のスパッタ装置は、図１に示すよ
うに、電極部１（ここではカソード部）を開閉する構造
のスパッタ装置であって（スパッタ反応室を有する装置
本体を符号１０で示す）、該電極部１の開閉時のショッ
クアブソーバー機構２を設けたものである。As shown in FIG. 1, the sputtering apparatus of this embodiment is a sputtering apparatus having a structure for opening and closing the electrode section 1 (here, the cathode section) (the apparatus main body having a sputtering reaction chamber is indicated by reference numeral 10). ), And a shock absorber mechanism 2 for opening and closing the electrode portion 1 is provided.
【００１５】本実施例におけるショックアブソーバー機
構２は、筒状部２１（ここでは３センチメートル程度の
径の丸パイプ）とこの筒状部２１内を入り子状にスライ
ド自在になっている棒状部２２（ここでは丸棒あるいは
丸パイプ）とを有し、棒状部２２が筒状部２１内に収ま
って行くときに、ショックの吸収（緩衝）がなされる。
この機構は、ショックアブソーバーとして知られている
機構の適宜のものを選択して構成できる。本実施例のシ
ョックアブソーバー機構２は、図１に示すように、電極
部１であるカソード部の扉状部外面に取り付け部２３で
取り付けられ、床面に固定部２４で固定されている。The shock absorber mechanism 2 in this embodiment has a cylindrical portion 21 (here, a round pipe having a diameter of about 3 cm) and a rod-shaped portion slidable in the cylindrical portion 21 in a nested manner. 22 (here, a round bar or a round pipe), the shock is absorbed (buffered) when the rod-shaped portion 22 is housed in the tubular portion 21.
This mechanism can be constructed by selecting an appropriate mechanism known as a shock absorber. As shown in FIG. 1, the shock absorber mechanism 2 of the present embodiment is attached to the outer surface of the door-shaped portion of the cathode portion, which is the electrode portion 1, by the attaching portion 23, and is fixed to the floor surface by the fixing portion 24.
【００１６】図１（ａ）は、本実施例においてカソード
部扉（電極部１）が閉の状態を示し、図１（ｂ）はカソ
ード部扉（電極部１）が開の状態を示す。作業者は従来
と同様把手１１を持って開閉の操作を行うが、ショック
アブソーバー機構２があるので、カソード部扉（電極部
１）を開けてこれを前に倒したときの該カソード部扉
（電極部１）の重みは、格段に軽くなる。本実施例で
は、従来の約１／２の重さで開閉できるようになった。FIG. 1A shows a state in which the cathode door (electrode portion 1) is closed in this embodiment, and FIG. 1B shows a state in which the cathode door (electrode portion 1) is open. The operator carries out the opening / closing operation with the grip 11 as in the conventional case, but since there is the shock absorber mechanism 2, the cathode door (the electrode door 1) when the cathode door (electrode 1) is tilted forward ( The weight of the electrode portion 1) is remarkably reduced. In this embodiment, the weight can be opened and closed with about half the weight of the conventional one.
【００１７】具体的な動作は、次のように行うことがで
きる。メンテナンス時にカソード部（電極部１）を開け
る場合を例にとって説明する。 カソード部（電極部１）を取り付けているボルトをは
ずす。通常４本のボルトをはずす。 把手１１を両手で持ってカソード部（電極部１）を水
平に倒す。このときショックアブソーバー機構２が働
く。これで図１（ｂ）に示す状態となる。 メンテナンスを実施する。 メンテナンス終了後、取外し時と同じ要領で逆の操作
を行い、カソード部（電極部１）を垂直にし、取り付け
を行う。The specific operation can be performed as follows. An example will be described in which the cathode part (electrode part 1) is opened during maintenance. Remove the bolt that attaches the cathode part (electrode part 1). Usually remove 4 bolts. Holding the handle 11 with both hands, the cathode part (electrode part 1) is tilted horizontally. At this time, the shock absorber mechanism 2 operates. This brings about the state shown in FIG. Perform maintenance. After the maintenance is completed, the reverse operation is performed in the same manner as the removal to make the cathode portion (electrode portion 1) vertical, and the attachment is performed.
【００１８】本実施例では、ショックアブソーバー機構
２をカソード部（電極部１）の片側（図１の紙面側）に
のみ設けたが、両側に設けて１対にしてもよい。In the present embodiment, the shock absorber mechanism 2 is provided only on one side of the cathode portion (electrode portion 1) (paper surface side in FIG. 1), but it may be provided on both sides to form a pair.
【００１９】本実施例によれば、半導体装置の製造プロ
セスに用いるアルミニウムスパッタ装置のカソード部が
重く、扱いにくいものでも、その開閉を軽く、安全に、
作業性良く行うことができるようになった。According to this embodiment, even if the cathode portion of the aluminum sputtering apparatus used in the semiconductor device manufacturing process is heavy and difficult to handle, it can be opened and closed easily and safely.
It became possible to perform with good workability.
【００２０】[0020]
【発明の効果】本発明のスパッタ装置は、電極部（カソ
ード部等）の開閉時に、危険をなくし、安全に、かつ作
業性良くその開閉を行うことができる。従って、装置メ
ンテナンス時や、ターゲットの交換時等にカソード部等
の電極部を開閉する必要のある時も、これを安全に、か
つ作業性良く遂行することができる。EFFECT OF THE INVENTION The sputtering apparatus of the present invention can open and close the electrode part (cathode part or the like) without risk, safely and with good workability. Therefore, even when it is necessary to open and close the electrode part such as the cathode part at the time of maintenance of the device or when the target is replaced, this can be performed safely and with good workability.
【図１】実施例１のスパッタ装置を示す構成図である。FIG. 1 is a configuration diagram showing a sputtering apparatus according to a first embodiment.
【図２】従来のスパッタ装置を示す構成図である。FIG. 2 is a configuration diagram showing a conventional sputtering apparatus.
１ 電極部（カソード部） １０ 装置本体 １１ 把手１１ ２ ショックアブソーバー機構 ２１ 筒状部 ２２ 棒状部 DESCRIPTION OF SYMBOLS 1 Electrode part (cathode part) 10 Device main body 11 Handle 11 2 Shock absorber mechanism 21 Cylindrical part 22 Rod part
Claims (3)
いて、 該電極部の開閉時のショックアブソーバー機構を設けた
ことを特徴とするスパッタ装置。1. A sputtering apparatus having a structure for opening and closing an electrode portion, comprising a shock absorber mechanism for opening and closing the electrode portion.
のスパッタ装置。2. The sputtering apparatus according to claim 1, wherein the electrode portion is a cathode portion.
請求項１または２に記載のスパッタ装置。3. The sputtering apparatus according to claim 1, which is an aluminum-based material sputtering apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36038892A JPH06200372A (en) | 1992-12-30 | 1992-12-30 | Sputtering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36038892A JPH06200372A (en) | 1992-12-30 | 1992-12-30 | Sputtering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06200372A true JPH06200372A (en) | 1994-07-19 |
Family
ID=18469199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36038892A Pending JPH06200372A (en) | 1992-12-30 | 1992-12-30 | Sputtering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06200372A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0926554A2 (en) | 1997-12-25 | 1999-06-30 | Nec Corporation | Image defect detection apparatus and method |
| US20150075979A1 (en) * | 2012-04-12 | 2015-03-19 | Kba-Notasys Sa | Intaglio printing plate coating apparatus |
-
1992
- 1992-12-30 JP JP36038892A patent/JPH06200372A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0926554A2 (en) | 1997-12-25 | 1999-06-30 | Nec Corporation | Image defect detection apparatus and method |
| US20150075979A1 (en) * | 2012-04-12 | 2015-03-19 | Kba-Notasys Sa | Intaglio printing plate coating apparatus |
| JP2015518521A (en) * | 2012-04-12 | 2015-07-02 | カーベーアー−ノタシ ソシエテ アノニム | Intaglio printing plate coating equipment |
| US9646809B2 (en) * | 2012-04-12 | 2017-05-09 | Kba-Notasys Sa | Intaglio printing plate coating apparatus |
| JP2018058374A (en) * | 2012-04-12 | 2018-04-12 | カーベーアー−ノタシ ソシエテ アノニム | Intaglio printing plate coating device |
| US9970096B2 (en) | 2012-04-12 | 2018-05-15 | Kba-Notasys Sa | Intaglio printing plate coating apparatus |
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