JPH06204013A - Manufacture of electronic component - Google Patents

Abstract

PURPOSE:To provide an electronic component manufacture which prevents appearance defects due to the relative deviation of elements, plating defects, peeling at the time of reflow soldering. CONSTITUTION:At the time of aligning a mask which has an prescribed electrode pattern on a substrate 1 whereupon longitudinal slits 10a and horizontal slits 11 are formed, the mask 2 is used. The mask 2 permits the longitudinal length of the unnecessary part 22a of an electrode pattern 22, which is the third from the bottom among the electrode patterns 20 arranged on the outermost longitudinal slit 10a, to be slightly shorter than the interval between the horizontal slits 11 and longer than the longitudinal length of the 20b to be an electrode. The mask 2 is placed on the substrate 1 so as to allow the unnecessary part 22a of the electrode pattern 22 to be in a space between the two horizontal slits 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component, and more particularly to a method for manufacturing an electronic component characterized by a method of aligning a mask on a substrate.

[0002]

2. Description of the Related Art As an electronic component, for example, a chip resistor is a substrate made of alumina or the like, electrodes provided on both sides of the substrate, a resistor formed by connecting to both electrodes, and an underlayer covering the resistor. It consists of a coat, middle coat and overcoat. Such a resistor is generally manufactured as follows. That is, as shown in FIG. 8, a break vertical slit 51 and a horizontal slit 52 are formed on a substrate 50 made of alumina or the like. As can be seen from FIG. 9, which is an enlarged view of a portion surrounded by a circle in FIG. 8, the outermost vertical slits 51a and the horizontal slits 52a extend to the edges of the substrate 50, respectively, and outside the slits 51a and 52a. The outer peripheral portion of is an unnecessary portion.

Then, an electrode is first formed in each unit corresponding to each electronic component partitioned by the slits 51a and 52a and the slits 51 and 52 (however, the electronic components are not usually produced in the upper and lower three rows). . For this, it is necessary to superpose a mask having a predetermined electrode pattern on the substrate 50. An example of the electrode pattern of the mask is shown in FIG.
Shown in. Here, in one unit, the patterns 60 and 61 serving as a pair of electrodes located on both sides of the unit are H-shaped. Then, the outermost vertical slit 51a is generally aligned such that the unnecessary portion 60a of the electrode pattern 60 formed line-wise fits between the two horizontal slits 52, 52. The mask is positioned on the substrate 50 by performing such alignment work at several places. The portions 60b and 61a of the electrode patterns 60 and 61 serve as electrodes of one unit. After the mask is polymerized on the substrate 50, an electrode according to a pattern is formed on the substrate 50 by printing or the like.

Similarly, for resistors, undercoats, middle coats, and overcoats, masks each having a predetermined pattern are aligned on the substrate 50, and electrodes, resistors, undercoats, middle coats, and overcoats are formed on the substrate 50. The coat is formed in order.

[0005]

By the way, when a mask having a pattern of each element such as an electrode or a resistor is overlaid on the substrate 50, a relative positional deviation occurs between the elements depending on the alignment method. That is, for example, in the case of the electrode pattern, there is some margin in the vertical gap h between the horizontal line of the unnecessary portion 60a of the electrode pattern 60 and the horizontal slit 52 in FIG. It can happen that 60 is too close to the top or bottom. This is different from the electrode pattern, but also corresponds to a resistor pattern, an undercoat, a middle coat and an overcoat pattern. Therefore, even if the mask of each pattern is aligned on the substrate and each element is formed at a predetermined portion of the unit, each element may cause a relative positional deviation (longitudinal deviation) after fabrication. Become.
Similarly, the vertical line of the unnecessary portion 60a and the vertical slit 51a
Also in the lateral distance i between and, a relative positional deviation (horizontal deviation) occurs in each element depending on the way of matching each mask.

Such positional deviations in the vertical and horizontal directions are likely to become large, especially between the electrode formed first and the overcoat formed last. For example, in the chip resistor shown in FIG. 11, an electrode, a resistor, an undercoat, a middle coat and an overcoat are sequentially formed,
This indicates that a relative displacement between the electrode 70 and the overcoat 71 has occurred, causing an abnormal appearance. Further, when the relative displacement occurs, there is a problem that a defective adhesion of plating is likely to occur in a plating process performed later. Further, if there is a difference in electrode size, the electronic component may be separated from the circuit board due to reflow heating when the electronic component is reflow-soldered to the circuit board.

Therefore, an object of the present invention is to provide a method of manufacturing an electronic component which prevents appearance defects, plating defects, peeling at the time of reflow soldering, etc. due to relative displacement of each element.

[0008]

In order to achieve the above object, a method of manufacturing an electronic component according to the present invention comprises aligning a mask having a pattern of elements of the electronic component on a substrate having vertical slits and horizontal slits. In a method of manufacturing an electronic component in which each element of the electronic component is sequentially manufactured in one unit of each electronic component partitioned by vertical and horizontal slits, corresponding to an outer peripheral unnecessary portion formed by the outermost vertical slit of the substrate, At least two positions of the mask facing each other between the horizontal slits are formed with a matching pattern having a vertical length slightly smaller than the distance between the horizontal slits and larger than the vertical length of the pattern of each element of the electronic component. However, when aligning the mask on the substrate, the mask is positioned on the substrate so that the alignment pattern fits between the lateral slits.

[0009]

The vertical length of the matching pattern of the mask is slightly smaller than the distance between the horizontal slits of the substrate and larger than the vertical length of the pattern of each element of the electronic component, that is, the vertical direction of the matching pattern. Since the difference between the length and the distance between the horizontal slits becomes small, the positional deviation (vertical deviation) of the mask with respect to the substrate becomes small when the mask is aligned on the substrate, and the relative distance between each element of the electronic component. The gap is reduced. In particular, the relative misalignment between the first formed element and the last formed element on the substrate is significantly reduced. As a result, defective appearance and defective plating can be solved.

Further, in all the masks used for manufacturing the elements of the electronic component, the horizontal gap between the matching pattern and the outermost vertical slit is made equal, so that the relative deviation in the horizontal direction between the elements is also caused. Less. In particular, since there is almost no dimensional difference between the electrodes formed on both sides of the board, it is possible to prevent peeling of the electronic parts due to reflow heating when the electronic parts are reflow-soldered on the circuit board.

The matching pattern provided on the mask is
It may be provided at least at two positions corresponding to the outer peripheral unnecessary portion of the substrate formed by the vertical and horizontal slits and facing between the horizontal slits of the substrate. That is, since there are at least two matching patterns, matching can be performed more accurately than in the case where there is only one pattern. Therefore,
The alignment patterns may be provided at three or more locations, but it is convenient to provide the alignment patterns at the four corners (four locations) of the mask, as described in the following embodiments, in order to minimize the position shift more effectively. Is.

Further, the manufacturing method of the present invention can be applied to any electronic component formed by using a substrate having vertical and horizontal slits such as a chip resistor. Therefore, as an element of the electronic component, for example, a chip resistor is used. Then, the electrode, the resistor, the undercoat, the middle coat, the overcoat, and the like are applicable.

[0013]

EXAMPLES The method for manufacturing an electronic component of the present invention will be described below based on examples. However, in the following embodiments, a chip resistor will be taken up as an electronic component. FIG. 1 shows an enlarged view of a corner in a state where a mask having an electrode pattern is superposed on a substrate and printed, and FIG. 2 shows an overall view. As described above, the vertical slit 10 and the horizontal slit 1 are formed on the substrate 1.
1 is formed, and the outermost vertical slit 10a and horizontal slit 1
1 a extends to the edge of the substrate 1. Slit 10a,
The four outer peripheral portions formed by 11a are unnecessary portions, and the slits 10a, 11a and the slits 10, 1
The part partitioned by 1 becomes a unit corresponding to each electronic component. Also, resistors are not made in the upper and lower three rows of units.

The mask 2 has, for example, a stainless mesh specification and has an electrode pattern as shown in FIG. The electrode pattern 20 along the outermost vertical slit 10a is laterally convex,
The other electrode pattern 21 along the vertical slit 10 is H
It has a letter shape. As can be seen from FIG. 1, the electrode pattern 2
In the 0 column, only the third electrode pattern 22 from the bottom has a different pattern, and this electrode pattern 22 serves as an index for alignment.

The electrode pattern 22 has a shape similar to that of the electrode pattern 21, but as shown in the enlarged view of FIG. 5, the length of the unnecessary portion 22a in the vertical direction is slightly smaller than the distance between the horizontal slits 11, 11. It is set to be smaller and larger than the length of the portion 22b in the vertical direction. One such electrode pattern 22 is provided at each of the four corners of the mask, for a total of 4 electrodes.
Individual pieces are provided (see FIG. 2).

The method of aligning the mask 2 with the substrate 1 is as follows.
This is performed so that the unnecessary portion 22a of the electrode pattern 22 fits between the two lateral slits 11 of the substrate 1. Here, as shown in FIG. 5, the unnecessary portion 2 of the electrode pattern 22 is
Since the vertical length of 2a is larger than the vertical length of the portion 22b and is slightly smaller than the distance between the horizontal slits 11 and 11, the distance a between the horizontal line of the unnecessary portion 22a and the horizontal slit 11 is equal to that of the portion 22b. The distance b is smaller than the distance b between the horizontal line and the horizontal slit 11, and the position shift of the mask during alignment is reduced accordingly. That is, since the interval a is small, the degree of displacement of the mask 2 to the upper side or the lower side is small, and the vertical positioning of the mask 2 can be performed more accurately.

After the mask 2 is aligned, electrodes according to the pattern are formed on the substrate 1 by printing or the like. With the finished electrode, each part 20b and 2 of the patterns 20 and 21
1a serves as a pair of electrodes of one unit. Next, a partially enlarged view of a state in which the mask 3 used for producing the resistor is printed on the substrate 1 by superposition is shown in FIG. 3, and an overall view is shown in FIG. The resistor pattern has a rectangular shape as shown in FIG. 4, and is present at a position facing each other between both electrodes. The matching pattern 32 in the mask 3 is formed at the same position as the unnecessary portion 22a of the matching pattern 22 in the mask 2, but is not connected to the electrodes like the previous electrode pattern, The substrate 1 is separated and independent from the outer peripheral unnecessary portion. Of course, the matching patterns 32 are also provided at the four corners of the mask 3.

The size of the matching pattern 32 is exactly the same as the unnecessary portion 22a of the matching pattern 22 formed on the mask 2, and the distance between the horizontal line of the pattern 32 and the horizontal slit 11 of the substrate 1 is the distance a. be equivalent to. This mask 3
The alignment with the substrate 1 is also performed so that the alignment pattern 32 fits between the two lateral slits 11, 11 in the same manner as described above. At this time, the pattern 32 and the pattern 2 of the mask 2
Since the two unnecessary portions 22a are the same, the vertical positional displacement of the mask 3 hardly occurs at the time of alignment similarly to the above. Therefore, when the resistor is formed by printing or the like after the mask 3 is superposed, the resistor is formed almost exactly at a predetermined position on both electrodes, and the relative displacement between the electrode and the resistor becomes almost zero.

The following undercoat, middle coat, and overcoat may be performed in the same manner. A mask having a pattern of each of these elements is not shown in the drawing, but the mask 2 for electrode production and the mask for resistor production are shown. A matching pattern having the same size is provided at the same position as 3, and the masks for each coat are aligned so that this pattern fits between the lateral slits of the substrate 1. For example, as shown in FIG.
Indicates. The matching pattern 41 is exactly the same as the unnecessary portion 22a of the matching pattern 22 of the mask 2 shown in FIG. Here, by setting the distance c between the horizontal lines of the patterns 40 and 41 and the horizontal slit 11 to be the same as the distance a (a = c), the relative deviation between the electrodes and the overcoat can be further reduced. It is possible and convenient.

Further, in this embodiment, in all the masks for producing the respective elements, the alignment patterns and the vertical slits have the same horizontal interval. That is, in the mask 2 for manufacturing the electrode, as shown in FIG.
The distance d between the vertical line of the second unnecessary portion 22a and the vertical slit 10a, and the distance between the matching pattern of another mask and the vertical slit (for example, the matching pattern 41 in the mask for overcoat production shown in FIG. 6). The interval e) with the vertical slit 10a is set to be the same. Therefore, when the masks are aligned on the substrate 1, paying attention not only to the above-mentioned vertical distance but also to the horizontal distance, it is possible to reduce the positional deviation of each mask in the horizontal direction. It is possible to more effectively suppress the relative deviation between the two.

After alignment, printing or the like is performed to complete a resistor in which an undercoat, a middle coat and an overcoat are sequentially laminated. And the vertical and horizontal slits 10,
Break from 11 and split each chip resistor. Figure 7
In the obtained chip resistor, in particular, the relative displacement between the electrode 7 formed first and the overcoat 8 formed last hardly occurs, and not only the appearance abnormality disappears but also plating failure occurs in the subsequent plating process. Will almost never happen. Moreover, since there is no dimensional difference between the widths f ₁ and f ₂ of the electrodes 7 on both sides, for example, when mounting a completed electronic component on a circuit board by reflow soldering, peeling of the electronic component from the circuit board due to reflow heating is caused. It will not occur.

[0022]

Since the method of manufacturing an electronic component of the present invention is configured as described above, it has the following effects. (1) Since there is almost no difference between the vertical length of the mask alignment pattern and the distance between the horizontal slits of the substrate, the positional deviation of the mask with respect to the substrate (vertical deviation) is reduced,
The relative displacement between the respective elements provided on the substrate, especially the relative displacement between the first manufactured element and the last manufactured element (for example, in the case of a chip resistor, the relative deviation between the electrode and the overcoat) becomes extremely small. (2) Since there is almost no relative deviation between each element, there is almost no appearance defect or plating defect. (3) By making the lateral distance between the matching pattern and the outermost vertical slit equal, it is possible to reduce the positional deviation of the mask in the lateral direction with respect to the substrate. Since there is no dimensional difference in width, peeling of the electronic component due to reflow heating can be prevented when the electronic component is reflow-soldered. (4) Since the substrate and the mask for producing each element can be accurately matched, the relative deviation is found only when the substrate is provided in the step of producing the last element (for example, an overcoat in a chip resistor). You can solve the problem of doing.

[Brief description of drawings]

FIG. 1 is a partially enlarged view of a state in which a mask for electrode production is aligned and printed on a substrate.

FIG. 2 is an overall view of a state in which a mask for electrode production is aligned and printed on a substrate.

FIG. 3 is a partially enlarged view of a state where a mask for producing a resistor is aligned and printed on a substrate.

FIG. 4 is an overall view of a state where a mask for producing a resistor is aligned and printed on a substrate.

5 is an enlarged view of a matching pattern of the mask shown in FIG.

FIG. 6 is an enlarged view showing an overcoat pattern and a matching pattern.

FIG. 7 is an external view of a chip resistor manufactured by the manufacturing method of the present invention.

FIG. 8 is an overall view of a state where a mask for producing a resistor is aligned and printed on a substrate in a conventional manufacturing method.

9 is an enlarged view of a portion surrounded by a circle in FIG.

FIG. 10 is an enlarged view showing an electrode pattern of a conventional mask.

FIG. 11 is an external view of a chip resistor manufactured by a conventional manufacturing method.

[Explanation of symbols]

 1 Substrate 2 Electrode Manufacturing Mask 3 Resistor Manufacturing Mask 10, 10a Vertical Slit 11, 11a Horizontal Slit 20, 21 Electrode Pattern 22 Matching Electrode Pattern 20a, 22a Unnecessary Electrode Pattern 30, 31 Resistor Pattern 32 Matching Resistor pattern

Claims (2)

[Claims] 1. A mask having a pattern of electronic component elements is aligned on a substrate having a break slit (vertical slit) formed in the vertical direction and a break slit (horizontal slit) formed in the horizontal direction, And a method for manufacturing an electronic component in which each element of the electronic component is sequentially manufactured in one unit of each electronic component partitioned by the lateral slit, the lateral slit corresponding to an outer peripheral unnecessary portion formed by the outermost vertical slit of the substrate. At least two positions of the mask facing each other are formed with an alignment pattern having a vertical length slightly smaller than the interval between the horizontal slits and larger than the vertical length of the pattern of each element of the electronic component, When the mask is aligned on the substrate, the mask is positioned on the substrate so that the alignment pattern fits between the lateral slits. Manufacturing method of child parts. 2. The mask according to claim 1, wherein all the masks used for manufacturing the elements of the electronic component have the same horizontal interval between the matching pattern and the outermost vertical slit.
A method for manufacturing the described electronic component.