JPH06204351A - Package assembly of surface mounting type electronic part - Google Patents
Package assembly of surface mounting type electronic partInfo
- Publication number
- JPH06204351A JPH06204351A JP36074792A JP36074792A JPH06204351A JP H06204351 A JPH06204351 A JP H06204351A JP 36074792 A JP36074792 A JP 36074792A JP 36074792 A JP36074792 A JP 36074792A JP H06204351 A JPH06204351 A JP H06204351A
- Authority
- JP
- Japan
- Prior art keywords
- case
- terminal
- needle
- notch
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、ケースに内蔵された電
子素子の端子を定位置に固定する表面実装型電子部品の
パッケージ組立体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package assembly of surface mount type electronic parts for fixing terminals of an electronic element contained in a case in a fixed position.
【0002】[0002]
【従来の技術】パッケージ内蔵型の電気部品において、
該電子部品の組立ての際に、あわせて素子の端子がパッ
ケージに固定される。従来より、パッケージに端子を固
定する方法として一般に次のような方法が知られてい
る。すなわち、 (1)パッケージ10の樹脂の突起10aを融解して端
子11をパッケージに融着する方法(図3(a)) (2)リベットやアイレット12を用いて端子11をパ
ッケージ10にかしめる方法(図3(b)) (3)端子11の一部を折曲し、その折曲縁13をパッ
ケージ10に係止させる方法(図3(c),(d)) などである。2. Description of the Related Art In a package built-in type electric component,
At the time of assembling the electronic component, the terminals of the device are also fixed to the package. Conventionally, the following method is generally known as a method of fixing a terminal to a package. That is, (1) a method of melting the resin protrusion 10a of the package 10 to fuse the terminal 11 to the package (FIG. 3A) (2) caulking the terminal 11 to the package 10 using a rivet or eyelet 12. Method (FIG. 3B) (3) A method of bending a part of the terminal 11 and locking the bent edge 13 to the package 10 (FIGS. 3C and 3D).
【0003】[0003]
【発明が解決しようとする課題】しかし、上記のいずれ
の方法によるときでも端子固定のために特別の構造を用
いるか、又は組立時に加工処理を要するといった問題が
ある。特に、表面実装型の電子部品においては、高密度
実装の要請から極力小型化が望ましく、そのためには、
部品の構造はできる限り、簡素であることが必要とされ
る。However, in any of the above methods, there is a problem in that a special structure is used for fixing the terminals or a processing is required at the time of assembling. In particular, for surface mount electronic components, miniaturization is desirable because of the demand for high density mounting.
The structure of the parts needs to be as simple as possible.
【0004】本発明の目的は、簡素な構造で端子を容易
に固定できる表面実装型電子部品のパッケージ組立体を
提供することにある。An object of the present invention is to provide a package assembly of surface mount type electronic parts which can easily fix terminals with a simple structure.
【0005】[0005]
【課題を解決するための手段】上記目的を達成するた
め、本発明による表面実装型電子部品のパッケージ組立
体においては、ケースと、底板と、端子とを有する表面
実装型電子部品のパッケージ組立体であって、ケース
は、電子素子を収納するものであり、底板は、ケースを
封止するものであり、ケースと底板とは、一方に、切欠
き、他方に突縁を有し、切欠き内に突縁を係合させて一
体的に結合されるものであり、切欠き内には針が突設さ
れ、突縁上には、前記針を受入れる溝が開口され、端子
は、ケース内の電子素子に接続する弾接片と、外部配線
に接続する端子板とを有し、端子板は、一部に孔を有
し、前記突縁上に着座させてケース外部に張り出させる
ものであり、孔は、前記切欠き内の針を受入れてケース
と底板との結合時に端子を定位置に固定するものであ
る。In order to achieve the above object, in a surface mount type electronic component package assembly according to the present invention, a surface mount type electronic component package assembly having a case, a bottom plate and a terminal is provided. The case is for accommodating an electronic element, the bottom plate is for sealing the case, and the case and the bottom plate have a notch on one side and a projecting edge on the other side, and the notch The needle is projectingly provided in the notch, the groove for receiving the needle is opened on the protruding edge, and the terminal is provided in the case. Which has an elastic contact piece to be connected to the electronic element and a terminal plate to be connected to an external wiring, and the terminal plate has a hole in a part thereof and is seated on the projecting edge so as to project to the outside of the case. The hole is for receiving the needle in the notch and connecting the case and the bottom plate to the terminal. It is intended to fix in place.
【0006】[0006]
【作用】素子をケースに内装し、ケースの切欠きに端子
を嵌め合わせ、端子板の孔に切欠き内の針を挿入し、ケ
ースの開口に底板をあてがい、切欠き内にケースの突縁
を圧入すれば、端子板からの針の突出端が突縁上の溝に
嵌入して端子が固定され、且つケースは底板で封止され
る。[Function] The element is housed in the case, the terminal is fitted in the notch of the case, the needle in the notch is inserted into the hole of the terminal plate, the bottom plate is applied to the opening of the case, and the projecting edge of the case is put in the notch. By press-fitting, the protruding end of the needle from the terminal plate is fitted into the groove on the protruding edge to fix the terminal, and the case is sealed with the bottom plate.
【0007】[0007]
【実施例】以下に本発明の実施例を図によって説明す
る。図1において、本発明は、ケース1と、底板2と、
端子3との組立体であり、端子3は、その弾接片3bに
よって半導体素子その他の素子4と電気的に接続してい
る。以下実施例では、素子4に圧電振動子を用いた発音
体に適用した例について説明する。Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, the present invention includes a case 1, a bottom plate 2,
It is an assembly with the terminal 3, and the terminal 3 is electrically connected to the semiconductor element and other elements 4 by the elastic contact piece 3b. In the following examples, an example in which the element 4 is applied to a sounding body using a piezoelectric vibrator will be described.
【0008】発音体のケース1は、無底の円筒状であ
り、上面に放音孔5が開口され、底部開口縁に切欠き6
の対を向き合わせに有し、切欠き6内には針7を突設し
て合成樹脂により一体成型されたものである。The case 1 of the sounding body has a bottomless cylindrical shape, a sound output hole 5 is opened on the upper surface, and a notch 6 is formed on the opening edge of the bottom.
2 are provided in a face-to-face relationship with each other, and a needle 7 is projectingly provided in the notch 6 and integrally molded with a synthetic resin.
【0009】底板2は、ケース1の開口内に嵌合させる
円盤状をなし、周縁部には、ケース1の切欠き6内に係
合させる角型の突縁8を向き合わせに有し、突縁8の上
面には、前記切欠き6内の針7を嵌入させる溝9が開口
されている。The bottom plate 2 has a disk shape to be fitted in the opening of the case 1, and has a rectangular projecting edge 8 to be engaged with the notch 6 of the case 1 on its peripheral edge. A groove 9 into which the needle 7 in the notch 6 is fitted is opened on the upper surface of the protruding edge 8.
【0010】端子3は、端子板3aに圧電振動子4の電
極に接続する弾接片3bを設けたものであり、端子板3
aは、折曲されて取付部aと、外部配線接続部bとを形
成している。取付部aは、ケース1と底板2間に取付け
る部分であり、板面に、前記針7を挿入する小孔3cが
開口され、外部配線接続部bは、ケース1外部に張り出
して半田接続用端子となる。The terminal 3 comprises a terminal plate 3a provided with an elastic contact piece 3b for connecting to an electrode of the piezoelectric vibrator 4, and the terminal plate 3a
A is bent to form an attachment portion a and an external wiring connection portion b. The mounting portion a is a portion to be mounted between the case 1 and the bottom plate 2, a small hole 3c into which the needle 7 is inserted is opened in the plate surface, and the external wiring connection portion b is projected to the outside of the case 1 for solder connection. It becomes a terminal.
【0011】実施例において、圧電振動子4をケース1
に内装し、圧電振動子4の各電極にそれぞれ端子3の弾
接片3bを接触させ、切欠き6内に端子板3aの取付部
aを係止させるとともに、小孔3c内に針7を挿通す
る。次に、底板2をケース1の開口にあてがい、その突
縁8をケース1の切欠き6に位置合わせをしてケース1
内に圧入すると、圧電振動子4は、ケース1の内周縁段
部と、底板2の立上り縁間に保持され、突縁8は切欠き
6に係合するとともに、溝9内に端子板3aより突出し
た針7が受入れられ、端子板3aを挾んでケース1と底
板2とが一体に結合される。これによって、端子板3a
は、小孔3cに挿通された針7に保持され、図2に示す
ように、外部配線接続部bがケース1の外部に張り出し
て定位置に固定され、外力を受けても脱落しない。In the embodiment, the piezoelectric vibrator 4 is attached to the case 1.
The elastic contact piece 3b of the terminal 3 is brought into contact with each electrode of the piezoelectric vibrator 4, and the mounting portion a of the terminal plate 3a is locked in the notch 6, and the needle 7 is inserted in the small hole 3c. Insert it. Next, the bottom plate 2 is applied to the opening of the case 1, and the projecting edge 8 thereof is aligned with the notch 6 of the case 1 to make the case 1
When pressed in, the piezoelectric vibrator 4 is held between the inner peripheral edge step of the case 1 and the rising edge of the bottom plate 2, the protruding edge 8 engages with the notch 6, and the terminal plate 3 a is inserted into the groove 9. The more protruding needle 7 is received, and the case 1 and the bottom plate 2 are integrally connected by sandwiching the terminal plate 3a. As a result, the terminal board 3a
Is held by the needle 7 inserted through the small hole 3c, and as shown in FIG. 2, the external wiring connection portion b is projected to the outside of the case 1 and fixed at a fixed position, and does not fall off even if an external force is applied.
【0012】以上、実施例においては、発音体のパッケ
ージに適用した例を示したが、これに限らず、一般の半
導体素子,サーミスタ,バリスタはもとより、抵抗器そ
の他の素子のパッケージについても全く同様に適用でき
る。また、切欠きと突縁との関係は逆であってもよい。In the above embodiments, the example applied to the package of the sounding body has been shown, but the present invention is not limited to this, and the same applies not only to general semiconductor elements, thermistors and varistors but also to packages of resistors and other elements. Applicable to The relationship between the notch and the ridge may be reversed.
【0013】[0013]
【発明の効果】以上のように、本発明によるときには、
パッケージのケースと底板とに設けた切欠きと、突縁間
に端子の端子板を挟持させるとともに端子板に針を通し
て保持させるため、端子の位置ずれや、抜け落ちが生ぜ
ず、構造上は、切欠きと突縁とに、それぞれ針および該
針を予め一体形成しておくだけでよく、端子の固定に格
別に付加構造を必要としないため、小型化が要求される
表面実装型電子部品のパッケージに適用して優れた効果
が得られる。As described above, according to the present invention,
Since the terminal plate of the terminal is sandwiched between the projecting edge and the notch provided in the package case and the bottom plate and the needle is held through the terminal plate, there is no displacement of the terminal or dropout, and the structure is cut. Needles and needles need only be integrally formed in advance on the notch and the projecting edge, respectively, and no special additional structure is required to fix the terminals, so miniaturization is required for surface mount electronic component packages. It can be applied to and get excellent effect.
【図1】本発明の一実施例を示す分解斜視図である。FIG. 1 is an exploded perspective view showing an embodiment of the present invention.
【図2】組立てられたパッケージの一部断面拡大図であ
る。FIG. 2 is a partially enlarged cross-sectional view of the assembled package.
【図3】端子の固定方法の従来例を示す図である。FIG. 3 is a diagram showing a conventional example of a terminal fixing method.
1 ケース 2 底板 3 端子 3a 端子板 3b 弾接片 3c 小孔 4 素子(圧電振動子) 5 放音孔 6 切欠き 7 針 8 突縁 9 溝 1 Case 2 Bottom Plate 3 Terminal 3a Terminal Plate 3b Elastic Contact Piece 3c Small Hole 4 Element (Piezoelectric Vibrator) 5 Sound Output Hole 6 Notch 7 Needle 8 Prong Edge 9 Groove
Claims (1)
実装型電子部品のパッケージ組立体であって、 ケースは、電子素子を収納するものであり、 底板は、ケースを封止するものであり、 ケースと底板とは、一方に、切欠き、他方に突縁を有
し、切欠き内に突縁を係合させて一体的に結合されるも
のであり、切欠き内には針が突設され、 突縁上には、前記針を受入れる溝が開口され、 端子は、ケース内の電子素子に接続する弾接片と、外部
配線に接続する端子板とを有し、 端子板は、一部に孔を有し、前記突縁上に着座させてケ
ース外部に張り出させるものであり、 孔は、前記切欠き内の針を受入れてケースと底板との結
合時に端子を定位置に固定するものであることを特徴と
する表面実装型電子部品のパッケージ組立体。1. A package assembly of a surface mount type electronic component having a case, a bottom plate and a terminal, wherein the case houses an electronic element, and the bottom plate seals the case. The case and the bottom plate have a notch on one side and a projecting edge on the other side, and are integrally joined by engaging the projecting edge in the notch, and the needle is provided in the notch. A groove for receiving the needle is opened on the protruding edge, and the terminal has an elastic contact piece for connecting to an electronic element in the case and a terminal plate for connecting to external wiring. There is a hole in a part of the hole that is seated on the protruding edge and protrudes outside the case.The hole receives the needle in the notch and holds the terminal in place when the case and bottom plate are joined. A surface mount type electronic component package assembly, characterized in that it is fixed to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36074792A JPH06204351A (en) | 1992-12-28 | 1992-12-28 | Package assembly of surface mounting type electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36074792A JPH06204351A (en) | 1992-12-28 | 1992-12-28 | Package assembly of surface mounting type electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06204351A true JPH06204351A (en) | 1994-07-22 |
Family
ID=18470747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36074792A Pending JPH06204351A (en) | 1992-12-28 | 1992-12-28 | Package assembly of surface mounting type electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06204351A (en) |
-
1992
- 1992-12-28 JP JP36074792A patent/JPH06204351A/en active Pending
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