JPH0621032A - Substrate plasma cleaning device - Google Patents

Abstract

(57) [Abstract] [Purpose] A plasma cleaning device that allows a substrate to be quickly put in and taken out of a casing for plasma cleaning the substrate. In a plasma cleaning apparatus that cleans a substrate 10 prior to performing wire bonding, an operation of transferring the substrate 10 from a conveyor 41 to a casing 1 that performs plasma cleaning, and a substrate 10 that has undergone plasma cleaning are transferred to the casing 1. By providing the withdrawing / inserting means 31 to 34 that can perform the operation of transferring the sheet from the conveyor 41 to the conveyor 41 in one operation, the time required for the withdrawal and withdrawal can be greatly shortened.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma cleaning apparatus for a substrate, and more particularly to a plasma cleaning apparatus for a substrate which allows a substrate on which a semiconductor chip is mounted to be taken in and out of a plasma cleaning casing with good workability.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, electrodes of a semiconductor chip mounted on a substrate and electrodes of the substrate are connected by wires. In such a wire bonding process, if impurities adhere to the electrodes of the chip or the substrate, the wires cannot be firmly bonded to the electrodes. The impurities include hand grease adhered when an operator manually handles the substrate, gasified oil floating in the air, an oxide film that is naturally formed on the electrode surface, and gases such as oxygen and nitrogen in the air. There is an adsorption film etc.

Therefore, the applicant of the present invention has previously proposed an apparatus for cleaning a substrate by plasma means prior to wire bonding (Japanese Patent Laid-Open No. 3-159143). In particular, as shown in FIGS. 1 and 2 of the publication, the substrates 20 carried by a conveyor 17 (reference is made to the publication, hereinafter the same) are placed one by one by a transfer means 21. While transferring to the section 10, this mounting section 1
0 is pitch-fed and stored in the casing 1, and the lid member 1
After the opening 2 is shielded by 1, plasma is generated in the casing 1 to clean the surface of the substrate 20, and when the cleaning is completed, the reverse operation to the above is performed to perform the substrate 2
0 was delivered to the conveyor 18 one by one and sent to the next process.

[0004]

However, in the above-mentioned conventional means, the substrate 20 on the conveyor 17 is transferred to the mounting part 10 by the transfer means 21 while advancing the mounting part 10 into the casing 1, and the plasma cleaning is performed. When the process is completed, the substrate 20 is transferred from the placing unit 10 to the conveyor 18 while pulling out the placing unit 10 from the casing 1. Therefore, it takes a lot of time to take the substrate 20 in and out of the casing 1. That is, there was a problem that work efficiency did not increase.

Therefore, an object of the present invention is to provide a plasma cleaning apparatus capable of greatly shortening the time required for taking a substrate in and out of a casing.

[0006]

To this end, the present invention comprises means for loading and unloading a substrate that can simultaneously transfer a substrate on a conveyor to a casing and transfer it from the casing to the conveyor in one operation.

[0007]

According to the above structure, the operation of transferring the substrate on the conveyor to the casing and the operation of transferring the substrate from the casing to the conveyor can be performed at the same time in one operation. Therefore, the time required to take the substrate in and out of the casing can be greatly increased. Can be shortened.

[0008]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is an overall perspective view of a plasma cleaning apparatus for substrates, and FIG. 2 is a side view. In FIG. 1, 1 is a box-shaped casing, and as shown in FIG. 2, a plate-shaped mounting portion 2 is arranged therein. The mounting portion 2 is supported by a shaft 3, and the shaft 3 is connected to a power source 4 that generates a high voltage. The casing 1 is made of a conductive material and is grounded by a ground wire 7. Gas for plasma discharge such as Ar gas is supplied to the casing 1 from the discharge gas supply unit 30 through the pipe 8. Reference numeral 9 is an opening / closing valve.

The mounting portion 2 and the shaft 3 are made of a conductive material, and when a high voltage is applied, plasma is generated in the casing 1. That is, the mounting portion 2 also serves as a discharge electrode. The shaft 3 is supported by the rod 6 of the cylinder 5, and when the rod 6 is projected and retracted, the mounting portion 2 moves up and down.
Reference numeral 11 is an exhaust pipe connected to the casing 1, 12 is an opening / closing valve, and the vacuum pump 19 is driven to exhaust the gas in the casing 1.

1 and 2, the upper surface of the casing 1 has an opening 13. Reference numeral 14 denotes a cover body that opens and closes the opening portion 13, and is connected to a rod 16 of a cylinder 15 serving as an opening / closing means via a stator 17. Reference numeral 18 is a fixed bracket of the cylinder 15. Therefore, when the rod 16 of the cylinder 15 is projected and retracted, the cover body 14 moves forward and backward in the Y direction with respect to the opening 13 to open and close the opening 13. Needless to say, the cover body may be one that rotates and opens the opening 13.

In FIG. 1, reference numeral 21A denotes a first conveyor, which is the substrate 10 conveyed by the conveyor 22A.
The second conveyor 41 provided at the front of the casing 1.
(41A, 41B), the frame 2
3 is provided with an endless rotating belt 24. A rod 28 of a cylinder 27 is coupled to the frame 23, and when the rod 28 is projected and retracted, the conveyor 21A horizontally moves in the Y direction orthogonal to the transport direction X of the substrate 10. Two
5 is a motor for driving the belt 24. Reference numeral 21B denotes a third conveyor provided on the opposite side of the first conveyor 21A, which is the substrate 10 cleaned in the casing 1.
Is carried out to the conveyor 22B. The configuration of the third conveyor 21B is the same as that of the first conveyor 21A, and the same components are designated by the same reference numerals and the description thereof will be omitted.

Two second conveyors 41A and 41B are arranged side by side and are composed of an endless rotating belt 42 and a motor 43. When the rod 28 of the cylinder 27 projects,
The first conveyor 21A and the third conveyor 21B are located on the same straight line as the one conveyor 41A, and the conveyor 21A to the conveyor 41A, or the conveyor 41A.
The substrate 10 can be transported from the conveyor 21B to the conveyor 21B (see the solid line in FIG. 3), and when the rod 28 is retracted, the substrate 10 can be transported from the conveyor 21A to the conveyor 41B and from the conveyor 41B to the conveyor 21B (see FIG. 3).
See the chain line).

Next, with reference to FIGS. 1 and 2, a description will be given of a means for putting the board 10 in the casing 1 and taking it out of the casing 1. Reference numeral 31 is a comb-shaped plate, and is provided with a plurality of suction pads 32 as a pickup means for picking up the substrate 10 by vacuum suction, and in this embodiment, four substrates 10 are vacuum-sucked at the same time. The vacuum suction system of the suction pad 32 is omitted because the drawing becomes complicated. The central portion of the plate 31 is fixed to the rotary shaft 34 of the motor 33, and when the motor 33 is driven, the plate 31 rotates horizontally.

The motor 33 is fixed to a support plate 35, and the support plate 35 is connected to a rod 37 of a vertical cylinder 36. Therefore, when the rod 37 is projected and retracted, the motor 33 and the plate 31 move up and down. The cylinder 36 is fixed to a bracket 38. Therefore, the component parts 31 to 36 constitute a means for taking in and out the substrate 10.

The present apparatus has the above-mentioned structure, and its operation will be described below with reference to FIGS. 4 and 5. Figure 4
As shown in (a), the first conveyor 21A
When the substrates 10 are conveyed onto the conveyors 41A and 41B, the plate 37 descends due to the rod 37 of the cylinder 36 protruding, and the suction pads 32 attract the two substrates 10 on the conveyors 41A and 41B. Then, the substrate 10 is picked up by pulling in the rod 37 next.

Next, as shown in FIG. 4B, the motor 33
Is driven to rotate the plate 31 in the 180 ° θA direction,
The substrate 10 is transferred directly above the casing 1. Further, the rod 6 of the cylinder 5 (see FIG. 2) projects and the mounting portion 2 rises. Then, the rod 37 of the cylinder 36 projects so that the substrate 10 lands on the mounting portion 2 and the vacuum suction state of the suction pad 32 is released there (see the chain line in FIG. 4B). When the substrate 10 is transferred to the mounting portion 2 in this way, the rod 37 retracts and the plate 31 retreats to the raised position, while the rod 6 of the cylinder 5 retracts and the mounting portion 2 descends. Also, the rod 16 of the cylinder 15
The protrusion causes the cover body 14 to move forward to block the opening 13 (see FIG. 4C).

As described above, the two substrates 10 are simultaneously housed in the casing 1. Next, in FIG. 2, after driving the pump 19 to exhaust the air in the casing 1,
Gas for plasma discharge such as Ar gas is supplied into the casing 1 through the pipe 8. Next, the power source 4 is driven and a high voltage is applied to the mounting portion 2, so that the casing 1
Plasma is generated inside, and Ar gas molecules, Ar ions, negative electrons, etc. collide with the surface of the substrate 10 to clean the surface.

When the cleaning is completed, the pipe 1
The gas in the casing 1 is exhausted through 1 to return to normal pressure, and the rod 16 of the cylinder 15 is retracted to open the cover body 14. Next, as shown in FIG. 5A, the rod 6 of the cylinder 5 projects and the mounting portion 2 rises. Then, the rod 37 of the cylinder 36 projects and the two suction pads 32 on the right side pick up the two substrates 10 on the mounting portion 2. At this time, the next substrate 10 has already been conveyed on the conveyors 41A and 41B, and the two suction pads 32 on the left side pick up the substrate 10 on the conveyors 41A and 41B. Next, the motor 33 is driven to rotate the plate 31 by 180 ° in the opposite direction θB (see FIG. 5).
(See (b)) Next, the rod 37 of the cylinder 36 projects, the plate 31 descends, and the left suction pad 32 conveys the two cleaned substrates 10 to the conveyors 41A and 41B.
While being transferred to the upper side, the suction pad 32 on the right side transfers two new substrates 10 to the mounting unit 2. Then in FIG.
Similarly to the case shown in (c), the cover body 14 moves forward to close the opening 13 of the casing 1, and the above operation is repeated. The cleaned substrate 10 transferred onto the conveyors 41A and 41B is conveyed to the third conveyor 21B and further conveyed to the next step by the conveyor 22B.

As described above, the present means is provided with 18 of the plate 31.
The rotation operation of 0 ° transfers the substrate 10 on the conveyors 41A and 41B onto the casing 1, and the cleaned substrate 10 in the casing 1 is conveyed to the conveyors 41A and 4B.
Since the operation of transferring onto the 1B is performed at the same time in one operation, the time required for taking the substrate 10 in and out of the casing 1 can be greatly shortened. In this embodiment, 2
Although the substrates 10 are put in and taken out at the same time, if the number of suction pads 32 provided on the plate 31 is increased,
It is also possible to take out and put in three or more substrates 10 at the same time, and by increasing the number of suction pads 32 in this way, a larger number of substrates 10 can be put in and taken out of the casing 1 at the same time. Can be further shortened. In this embodiment, the plate 31 is a turntable, and the substrate 10 is moved in and out of the casing 1 by a horizontal rotation motion. However, the substrate 10 may be moved in and out by a linear motion or the like. It suffices that the casing can be put in and taken out at the same time by one operation.

[0021]

According to the present invention, the operation of transferring the substrate from the conveyor to the casing and the operation of transferring the substrate from the casing to the conveyor are performed in one operation. Therefore, the time required for taking the substrate in and out of the casing is wide. Shorten,
It is possible to significantly reduce the total time required to perform the plasma cleaning processing on a large number of substrates and improve the work efficiency.

[Brief description of drawings]

FIG. 1 is a perspective view of a plasma cleaning apparatus according to an embodiment of the present invention.

FIG. 2 is a side view of a plasma cleaning device according to an embodiment of the present invention.

FIG. 3 is a plan view of a substrate transfer conveyor of a plasma cleaning apparatus according to an embodiment of the present invention.

4A is a process diagram of plasma cleaning according to an embodiment of the present invention. FIG. 4B is a process diagram of plasma cleaning according to an embodiment of the present invention. FIG. 4C is a process diagram of plasma cleaning according to an embodiment of the present invention. Process chart

5A is a process diagram of plasma cleaning according to an embodiment of the present invention. FIG. 5B is a process diagram of plasma cleaning according to an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Casing 2 Mounting part (electrode) 10 Substrate 13 Opening 14 Cover body 15 Opening / closing means 30 Discharge gas supply part 31 Injecting / removing means 32 Injecting / removing means (suction pad) 33 Injecting / removing means 34 Injecting / removing means 41 Conveyor

Claims (1)

[Claims] 1. A casing provided with an electrode to which a high voltage is applied, a discharge gas supply portion for supplying plasma discharge gas to the casing, a cover body for opening and closing an opening portion of the casing, and an opening and closing of the cover body. A means, a conveyor for conveying the substrate, and a suction pad for vacuum-adsorbing the substrate are provided, and the operation of transferring the substrate on the conveyor to the casing and the operation of transferring the substrate of the casing onto the conveyor are simultaneously performed in one operation. A substrate plasma cleaning apparatus comprising: a substrate loading / unloading means.