JPH0621123A - Molded parts manufacturing method - Google Patents

Abstract

(57) [Summary] [Object] It is an object of the present invention to provide a method for manufacturing an electronic component capable of surely resin-molding a substrate. [Structure] As shown in FIG. 1, a molded component 1 is composed of a frame body 2, and a plurality of external connection terminals 5 and 5 are provided on one side surface 2a in a comb-like shape, and the other side surface 2b opposite to each other.
The substrate 3 on which the electronic component 31 is mounted is attached to the lead frame 8 provided with two dummy terminals 7 and 7, and the substrate 3 is covered with a mold, and a resin member (mold member) 6 is filled into the inside of the substrate 3 for molding. After that, the connection portion between the one side surface 2a of the frame body 2 and the external connection terminals 5 and 5 and the unnecessary portions of the dummy terminals 7 and 7 protruding from the mold member 6 are cut to manufacture.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a molded component for molding an electronic component mounted on a small board.

[0002]

2. Description of the Related Art Generally, this type of molded component 20
Is composed of a frame body 10 as shown in FIGS. 3 and 4,
A board 3 having an electronic component 31 mounted thereon is attached to a lead frame 15 having a plurality of external connection terminals 5 and 5 provided in a comb shape on one side surface 10a, the board 3 is covered with a mold, and a resin member (mold member) is provided therein. ) 6 is filled and molded,
The configuration is such that the connection portion between the one side surface 10a of the frame body 10 and the external connection terminals 5 and 5 is cut.

[0003]

However, according to the above-mentioned conventional example, since the substrate 3 is supported by the external connection terminals 5 and 5 only on one side, the substrate 3 is displaced in the mold (see FIG. (Sway in the direction of the middle A) is likely to occur, and in the worst case, the substrate 3 protrudes from the molding member 6 and is molded.

[0004]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for manufacturing a molded component, which is capable of improving the above-mentioned disadvantages of the conventional example and surely resin-molding a substrate.

[0005]

In the present invention, therefore, a frame body is provided, and a plurality of external connection terminals are provided on one side surface,
After mounting a board on which electronic components are mounted on a lead frame having at least two dummy terminals on the other side surface facing each other, the board is molded with a resin member, and unnecessary portions of the dummy terminal are cut after the resin member is cured. By adopting this method, the above-mentioned object is to be achieved.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. Here, the same components as those in the above-mentioned conventional example are designated by the same reference numerals.

Generally, this type of molded component 1 is
The frame body 2 is provided with a plurality of external connection terminals 5 and 5 on one side surface 2a in the shape of a comb, and the other side surface 2 facing each other.
Lead frame 8 having two dummy terminals 7 and 7 provided in b
After mounting the substrate 3 on which the electronic component 31 is mounted, covering it with a mold, and filling the inside with a resin member (mold member) 6 and molding, the one side surface 2a of the frame 2 and the external connection terminal 5 , 5 and the dummy terminals 7, 7 protruding from the mold member 6 are cut off.

In this embodiment, since the electronic parts are molded by the above-described manufacturing method, the substrate 3 is supported on both sides by the external connection terminals 5 and the dummy terminals 7 in the mold, so that the supporting state is maintained. The substrate 3 can be kept satisfactorily, so that it is possible to prevent the accident of the substrate 3 protruding from the mold member 6.

[0009]

Since the present invention employs the manufacturing method as described above, according to this method, it is possible to easily manufacture a molded component capable of surely resin-molding a substrate.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a lead frame according to an embodiment of the present invention.

FIG. 2 is an external explanatory view of an electronic component manufactured by the manufacturing method according to the present invention.

FIG. 3 is an explanatory diagram of a lead frame according to a conventional example.

FIG. 4 is an external explanatory view of an electronic component manufactured by a manufacturing method according to a conventional example.

[Explanation of symbols]

 1 ... Molded part 2 ... Frame 3 ... Substrate 5 ... External connection terminal 6 ... Mold member 7 ... Dummy terminal 8 ... Lead frame

Claims (1)

[Claims] 1. A substrate, on which electronic components are mounted, is attached to a lead frame, which is composed of a frame body and has a plurality of external connection terminals provided on one side surface and at least two dummy terminals provided on the other side surface facing each other. After that, mold the substrate with a resin material,
A method of manufacturing a molded component, comprising cutting an unnecessary portion of the dummy terminal after curing the resin member.