JPH0621129A - Semiconductor molding apparatus - Google Patents

Abstract

(57) [Summary] [Purpose] Statistics on the number of abnormalities in each unit, and
Improves workability by automatically collecting statistics such as the number of defectives by type of defective molded product. [Structure] In a semiconductor molding apparatus composed of various units, an abnormality occurrence number accumulating unit for accumulating the abnormality occurrence number for each unit is provided, and an abnormality occurrence number for displaying an integrated value of the abnormality occurrence numbers for each unit. The display means is provided, and the input means is provided for inputting the number of defects generated for each type of defects when defects are generated in the molded product.
A defect occurrence number accumulating means for accumulating the inputted defect occurrence numbers by type is provided, and a lot occurrence number accumulating means for accumulating the inputted defect occurrence numbers for each lot on a type basis, and a defect occurrence number for each type The defect occurrence number display means for displaying the integrated value of 1 and the integrated value of 1 lot is provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor molding apparatus for molding a semiconductor element with resin.

[0002]

2. Description of the Related Art A semiconductor molding apparatus of this type includes various units such as a frame loader section, a tablet loader section, a preheater section, an inloader section, a mold press section,
……… and so on. FIG. 4 shows an example of a control device that controls the operation of the semiconductor mold device. In FIG. 4, the terminal 1, which is a man-machine interface unit, includes a terminal control unit 2, a display 3, and a keyboard 4. The terminal 1 is a device for an operator to set and input mold forming condition data, and is configured to transmit and receive data to and from a control unit 5 that drives and controls various units. The operation of the molding apparatus can be monitored based on the data from the section 5.

The control unit 5 is composed of a sequencer 6 and a microcomputer 7. The sequencer 6 inputs signals from the push button switch 8 and the sensor 9 and controls the operation of the cylinder 10 which is the drive unit of various units based on these signals, and also gives an operation command signal to the microcomputer 7. , Controls the entire molding apparatus. Further, the microcomputer 7 uses the operation command signal from the sequencer 6 and the sensor 11
In response to signals from, the motor 12 which is the drive unit of various units is controlled in operation through the driver 13,
The present status information is given to the sequencer 6.

In the above structure, if an abnormality occurs during the operation of the molding apparatus, the sequencer 6 detects the abnormality generated by the sensor 9 or the like and outputs an abnormality signal to the terminal control unit 2. When the microcomputer 7 detects an abnormality caused by the sensor 11 or the driver 13, the abnormality is given to the sequencer 6 as status information, and the sequencer 6 outputs an abnormality signal to the terminal control unit 2.

When the terminal control unit 2 receives the abnormal signal from the sequencer 6, the terminal control unit 2 reads the abnormal data in the sequencer 6 and displays the display 3 based on the abnormal data.
In addition, an abnormality / warning message is displayed as shown in FIG.

[0006]

However, in the above-mentioned conventional configuration, the operator can recognize which unit has an abnormality by visually observing the abnormality item of the abnormality / warning message displayed on the display 3. It was possible, but it was not possible to recognize which unit and how often the abnormality occurred. For this reason, when an abnormality occurs, the operator manually performs a task of collecting statistics of the number of abnormality occurrences for each unit while looking at the screen of the display 3 shown in FIG. 5, and this manual task is very troublesome. It was something.

Also, when a defect occurs in the molded product, the operator manually collects the statistics of the number of defects for each type of defect, which is also very troublesome. It was a thing.

Therefore, an object of the present invention is to automatically collect statistics of the number of abnormal occurrences for each unit and statistics of the number of defective occurrences for each type of defective molded product, thereby improving workability. An object is to provide a semiconductor mold device to be obtained.

[0009]

SUMMARY OF THE INVENTION A semiconductor molding apparatus of the present invention is for molding a semiconductor element with a resin, and is a semiconductor molding apparatus composed of various units. An abnormality occurrence number accumulating means for accumulating the number of abnormality occurrences is provided, and an abnormality occurrence number display means for displaying an accumulated value of the abnormality occurrence number for each unit, and when a defect occurs in a molded product. A lot that includes input means for inputting the number of defects generated for each type of defect, and has means for accumulating the number of defects that have been input for each type, and that accumulates the input number of defects for each type in units of one lot It is characterized in that it is provided with a number-of-occurrences accumulating means and with means for displaying the number of defective occurrences for displaying the accumulated value of the number of defective occurrences by type and the accumulated value of one lot.

[0010]

According to the above means, when an abnormality occurs, the number of occurrences of abnormality for each unit is automatically integrated and the integrated value is displayed. When a defect occurs in a molded product, the operator simply inputs the defect occurrence number for each defect type, and the defect occurrence count for each type of molded product defect is automatically integrated and the integrated value is displayed. At the same time, the integrated value of one lot is automatically integrated and the integrated value is displayed. Therefore, it is not necessary for the operator to manually collect statistics, etc., and workability is greatly improved.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. The semiconductor mold device of the present embodiment has the same hardware structure as the conventional structure, and includes various units such as a frame loader unit, a tablet loader unit, a preheater unit, an in loader unit, a mold press unit, ... There is. Further, the hardware configuration of the control device for controlling the operation of the semiconductor mold device is also the same as the conventional configuration shown in FIG. 4, and the same parts are designated by the same reference numerals.

That is, the terminal 1 which is a man-machine interface section is composed of a terminal control section 2, a display 3 and a keyboard 4. The control unit for driving and controlling various units includes a sequencer 6 and a microcomputer 7. The sequencer 6 inputs signals from the push button switch 8, the sensor 9, etc., and controls the operation of the cylinder 10 which is the drive unit of various units based on these signals, and also the microcomputer 7
And an operation command signal to control the entire molding apparatus.

In response to the operation command signal from the sequencer 6 and the signal from the sensor 11, the microcomputer 7 controls the operation of the motor 12 which is the drive unit of various units via the driver 13 and the current status. It is configured to give information to the sequencer 6.

The terminal control section 2 is configured to include a microcomputer and receives an abnormal signal output from the sequencer 6, that is, abnormal data. The terminal control unit 2 incorporates an abnormality counter provided, for example, for each unit as an abnormality occurrence number accumulating means, and accumulates the abnormality occurrence number for each unit based on the abnormality data by each of these abnormality counters. Is configured. Then, the terminal control unit 2 and the display 3 constitute an abnormality occurrence number display means.

On the other hand, the terminal control unit 2, the display 3 and the keyboard 4 constitute an input means, and when the input means causes a defect in the molded product, the number of defects is classified according to the type of defect. Data can be input into a memory built in the terminal control unit 2.

Further, the terminal control unit 2 has a built-in defect accumulation counter provided for each defect type as a defect occurrence number accumulating means, and the data input by each defect accumulation counter, that is, the defect occurrence number. Is configured to be accumulated for each type of defect. Furthermore, the terminal control unit 2
As a lot occurrence number accumulating means, for example, a one-lot defect counter provided for each defect type is built in, and the data input by each one-lot defect counter, that is, the defect occurrence number is accumulated in units of one lot by type. Is configured. Then, the terminal control unit 2 and the display 3
The defect occurrence number display means is constituted by.

Next, the operation of the above structure will be described with reference to FIGS. The flowchart of FIG. 2 schematically shows the content of the control part in the control program stored in the terminal control unit 2, which accumulates the number of abnormalities for each unit and displays the integrated value. Further, the flowchart shown in FIG. 3 shows that, after inputting the defect occurrence count for each defect type in the control program stored in the terminal control unit 2, the integrated value of the defect occurrence count for each defect type and 1
The contents of a control portion for calculating the lot integrated value and displaying each integrated value are schematically shown.

First, the control for accumulating the number of occurrences of abnormality for each unit and displaying the integrated value will be described with reference to FIG. If an abnormality occurs during operation of the semiconductor mold device, the sequencer 6 detects the abnormality generated by the sensor 9 or the like and outputs an abnormality signal to the terminal control unit 2 (step S1). In this case, when the microcomputer 7 detects an abnormality caused by the sensor 11 or the driver 13, the abnormality is given to the sequencer 6 as status information, and the sequencer 6 receives the status information and outputs an abnormality signal to the terminal control unit 2. It is designed to output.

Subsequently, when the abnormal signal is input from the sequencer 6, the terminal control unit 2 reads the abnormal data in the sequencer 6 (step S2). Then, the read abnormality data is judged for each unit (step S3), and the abnormality counter corresponding to the unit in which the abnormality has occurred is counted up (steps S4-1 to S4-n). And
The process proceeds to “NO” in step S5 to determine the unit in which the abnormality has occurred and the process to count up the abnormality counter of the determined unit until the determination of all the abnormal data for each unit and the counting up of the abnormality counter are completed. repeat.

After that, when the judgment for all abnormal data by unit and the counting up of the abnormality counter are completed, the process proceeds to "YES" at step S5 to check whether or not the screen is for displaying the number of abnormalities for each unit. It is determined (step S6). Here, the screen currently displayed on the display 3 is a screen displaying the number of abnormal occurrences by unit,
Specifically, the "abnormality / defective IC by unit" shown in Fig. 1
Screen, go to “YES” in step S6,
Display 3 based on the count value of each abnormality counter
The integrated value of the number of abnormal occurrences for each unit is displayed on (step S7).

In this case, as shown in FIG. 1, the left half of the screen of the display 3 shows the integrated value of the number of occurrences of abnormality for each unit. Specifically, the name of each unit is displayed in the "Abnormal occurrence item by unit" field, and "Number of occurrences" is displayed.
The cumulative value of the number of abnormal occurrences is displayed in the column.

Next, according to the flowchart of FIG. 3, after inputting the number of defects generated for each type of defects of the molded product, the integrated value of the number of defects generated for each type of defect and the integrated value for one lot are calculated, and each of them is calculated. The control for displaying the integrated value will be described.

When a defect occurs in an IC that is a molded product, the operator examines the defective IC to determine the cause of the defect. Subsequently, the operator operates the keyboard 4 to switch the screen of the display 3 to the screen of "abnormality / defective IC by unit" as shown in FIG. Then, the defective IC number input key is turned on by the keyboard 4 (step S11) to enter the defective IC number input state.

Subsequently, the operator selects a defective IC item by using the keyboard 4 (step S1).
2) Input the number of defectives for the selected defective IC item (step S13). Here, when the number of defective occurrences is input, the defective cumulative counter corresponding to the selected defective IC item in the terminal control unit 2 is counted up by the entered number of defective occurrences (step S14) and is selected. The defective 1 lot counter corresponding to the determined defective IC item is counted up by the number of the generated defectives (step S15).

Then, as shown in FIG. 1, the display 3 displays an integrated value of the number of defects generated for each type of defects based on the count value of the defect accumulation counter.
Based on the count value of the defective 1 lot counter, the integrated value of 1 lot for each defective type is displayed (step S1).
6).

In this case, as shown in FIG. 1, the integrated value of the number of defects and the integrated value of one lot for each type of defect are shown in the right half part of the screen of the display 3. In particular,
Each defective factor is displayed in the "bad IC item" column, the cumulative value of the number of defectives is displayed in the "cumulative" column, and the integrated value of one lot is displayed in the "MG" column. Also, "input"
The entered number of defects is displayed in the column.

Thereafter, if the input end key is not turned on, the process proceeds to "NO" in step S17, and the process proceeds to step S17.
In step 12, the process of selecting the defective IC item and inputting the number of defectives for the selected defective IC item is repeated. When the input end key is turned on in step S17, "YE" is displayed in step S17.
S ”and the input process of the number of defective ICs is completed.

When the terminal control unit 2 receives the abnormal signal from the sequencer 6, the terminal control unit 2 reads the abnormal data in the sequencer 6, and based on the abnormal data, displays an abnormality / warning message on the display 3 as in the conventional configuration. (See Figure 5)
It also has a display control function for displaying.

According to this embodiment having such a configuration, as shown in FIG.
As shown in, when an abnormality occurs in the semiconductor mold device, the number of occurrences of abnormality for each unit is automatically integrated and the integrated value is displayed (see FIG. 1). When a defective molded article (IC) occurs, as shown in FIG. 1, if the number of defective occurrences for each type of defective is input, the number of defective occurrences for each type of defective is automatically integrated. The integrated value is displayed, and the integrated value of one lot is automatically integrated and the integrated value is displayed. Therefore, unlike the conventional configuration, it is not necessary for the operator to manually collect statistics such as the number of abnormal occurrences and the number of defective occurrences, and workability can be greatly improved.

[0030]

As is apparent from the above description, the present invention displays the integrated value of the number of occurrences of abnormalities for each unit, and when a defect occurs in a molded product, inputs the number of occurrences of defect by type of defect. However, since it is configured to display the cumulative value of the number of defectives for each type and the integrated value of one lot based on the input number of defectives, the statistics of the number of abnormalities for each unit and the type of defective molded product Another statistical effect such as the number of defective occurrences can be automatically obtained, which has an excellent effect of improving workability.

[Brief description of drawings]

FIG. 1 is a front view showing a screen of a display showing an embodiment of the present invention.

[Fig. 2] In addition to accumulating the number of abnormalities for each unit,
Flowchart showing the contents of control for displaying the integrated value

FIG. 3 is a flowchart showing the content of control for inputting the number of occurrences of defects for each type of defect, calculating the integrated value of the number of occurrences of defects for each type of defect, and the integrated value of one lot, and displaying each integrated value.

FIG. 4 is a block diagram of a control device of a semiconductor molding device showing a conventional configuration.

FIG. 5 is a view equivalent to FIG.

[Explanation of symbols]

1 is a terminal, 2 is a terminal control unit (abnormality number accumulating unit, defect occurrence number accumulating unit, lot occurrence number accumulating unit), 3 is a display, 4 is a keyboard, 5 is a control unit, 6 is a sequencer, 7 is a microcomputer 10 is a cylinder, 12
Is a motor and 13 is a driver.

Claims (1)

[Claims] 1. A semiconductor molding apparatus for molding a semiconductor element with a resin, comprising a variety of units, and an abnormality occurrence number accumulating means for accumulating the number of abnormality occurrences for each unit. An abnormality occurrence number display means for displaying an integrated value of the number of abnormality occurrences for each unit, an input means for inputting the number of defect occurrences for each type of defect when a defect occurs in a molded product, and an input Defect occurrence number accumulating means for accumulating the number of generated defect occurrences by type, lot occurrence number accumulating means for accumulating the inputted defect occurrence number in units of one lot, and accumulated value of defect occurrence number for each type and 1 A semiconductor mold device comprising: a defect occurrence number display means for displaying a lot integrated value.